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HPE ProLiant DL110 Gen10 Plus - Carrier Grade Supplement: технические характеристики и документация

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HPE ProLiant DL110 Gen10 Plus - Carrier Grade Supplement

Overview

HPE ProLiant DL110 Gen10 Plus Server - Carrier Grade Supplement

 NEBS Level 3 and ETSI Certified 

This section lists some of the steps required to configure a Factory Integrated Model compliant with typically requested telecom carrirer NEBS and ETSI requirements. In addition to the worldwide compliance criteria applied to the commercial version of the product, all components listed in this document have been evaluated to the following criteria: SR-3580, Level 3, NEBS Criteria Levels

  •   SR-3580, Level 3, NEBS Criteria

- GR-1089-CORE, EMC & Electrical Safety

- GR-63-CORE, Physical Protections

  • GR-3108, Class 1, Network Equipment in the Outside Plant (OSP)
  • ETSI EN 300 386, Class A, EMC
  • ETSI EN 300 019-2-1, Class 1.2, Storage
  • ETSI EN 300 019-2-2, Class 2.3, Transportation
  • ETSI EN 300 019-2-3, Class 3.1 & 3.1E, Stationiary Use at Weather protected locations
  • ETSI 300 132, Power Suppply Interface to Telecom Equipment, -48VDC
  • ETSI ETS 300 753, Acoustic Noise

To ensure only valid configurations are ordered, Hewlett Packard Enterprise recommends the use of an HPE approved configurator. Contact your local sales representative for information on configurable product offerings and requirements.  

Factory Integrated Models must start with a CTO Server. FIO indicates that this option is only available as a factory installable option. 

All Factory Integrated Models will be populated with sufficient hard drive blanks based on the number of initial hard drives ordered with the server. Some options may not be integrated at the factory. Contact your local sales representative for additional information. 

Notes:To yield a carrier grade server that is compliant with all the required technical criteria, the product content is limited to what is listed in this document. In addition to this, system maintenance switch #10 must be turned to the "ON" position to enable the expanded operating temperature range Select HPE NEBS-compliant FIO Trigger System Setting PN:P40010-B21 for factory integration.


Configuration Information

This section lists some of the steps required to configure a Factory Integrated Model. To ensure only valid configurations are ordered, Hewlett Packard Enterprise recommends the use of an HPE approved configurator. Contact your local sales representative for information on configurable product offerings and requirements.

 

  • Factory Integrated Models must start with a CTO Server.
  • FIO indicates that this option is only available as a factory installable option.
  • Some options may not be integrated at the factory. Contact your local sales representative for additional information.

Step 1: Base Configuration

 

CTO Server

HPE ProLiant DL110 Gen10 Plus Front Cabled Telco Configure-to-order Server

SKU Number

P39478-B21

Processor

Not included as standard; 1 supported

Heatsink

Included

DIMM Slots

8-DIMM slots

Storage Controller

Embedded SW RAID with Intel VROC SATA for HPE, choice of Intel VROC NVMe for HPE

PCIe

X16/x16 FHHL riser included

Fans

7- hot plug

Management

HPE iLO with Intelligent Provisioning (standard), iLO Advances and OneView (optional)

USB

iLO Front Service Port

Rail Kit*

N/A- Mounting via front ears only

Notes HPE rail kits are designed to work with HPE racks in compliance with industry standard EIA-310-E.  In the event a customer elects to purchase a third-party rack for use with an HPE rail kit, any such use is at customer's own risk. HPE makes no express or implied warranties with respect to such third-party racks and specifically disclaims any implied warranties of merchantability and fitness for a particular purpose. Furthermore, HPE has no obligation and assumes no liability for the materials, design, specifications, installation, safety, and compatibility of any such third-party racks with any rail kits, including HPE rail kits.


Step 2: Choose Required Options

Please select one processor required below.

Notes: Processors with 185W TDP or higher will require DIMM Blank kit (P43725-B21) to be selected when all DIMM slots are not fully populated

Step 2a: Choose Processors  

Processor Option Kits

3rd Generation Intel Xeon-Gold  

Notes: All SKUs below ship with processor only. Fans and heatsink are included in the CTO server.

 

 

Intel Xeon-Gold 6338N 2.2GHz 32-core 185W Processor for HPE

P37603-B21

Intel Xeon-Gold 6330N 2.2GHz 28-core 165W Processor for HPE

P37604-B21

Intel Xeon-Gold 5318Y 2.1GHz 24-core 165W Processor for HPE

P36924-B21

Intel Xeon-Gold 5320 2.2GHz 26-core 185W Processor for HPE

P36925-B21

Intel Xeon-Gold 5318N 2.1GHz 24-core 150W Processor for HPE

P37605-B21

Intel Xeon-Gold 6338T 2.1GHz 24-core 165W Processor for HPE

P37607-B21

  

Step 2b: Choose Memory Options

Please select one or more memory from below.

For new Gen10 Plus memory population rule whitepaper and optimal memory performance guidelines, please go to:

https://www.hpe.com/docs/memory-population-rules

For Gen10 Plus memory speed table, please go to: https://www.hpe.com/docs/memory-speed-table

Notes:

­  The maximum memory speed and capacity is a function of the memory type, memory configuration, and processor model.

­  Quantity of memory DIMMs selected must be 1, 2, 4, 6, or 8

­  For additional information, please see the HPE DDR4 Smart Memory QuickSpecs

Registered DIMMs (RDIMMs)

 

HPE 16GB (1x16GB) Dual Rank x8 DDR4-3200 CAS-22-22-22 Registered Smart Memory Kit

P06031-B21

HPE 16GB (1x16GB) Single Rank x4 DDR4-3200 CAS-22-22-22 Registered Smart Memory Kit

P06029-B21

HPE 32GB (1x32GB) Dual Rank x4 DDR4-3200 CAS-22-22-22 Registered Smart Memory Kit

P06033-B21

HPE 64GB (1x64GB) Dual Rank x4 DDR4-3200 CAS-22-22-22 Registered Smart Memory Kit

P06035-B21

Step 2c: Choose Power Supplies

Select one or two power supplies from below.

HPE Flex Slot Power Supplies

 

HPE ProLiant DL110 700W Flex Slot -48VDC Hot Plug Low Halogen Power Supply Kit

P43150-B21

Notes: Reverse airflow to support front cabled design of DL110

 


Step 3: Choose Additional Factory Integratable Options

One of the following from each list may be selected if desired at time of factory integration

Factory Instructions and Server Settings

 

HPE NEBS-compliant FIO Trigger System Setting

P40010-B21

Notes:  Selecting this will enable NEBS expanded operating temperature range by turning ON system maintenance switch #10

 

HPE Legacy FIO Mode Setting

758959-B22

Notes: Selecting this option will change the default UEFI BIOS setting into Legacy BIOS setting

 

HPE iLO Common Password FIO Setting

P08040-B21

Notes:

­  Replaces iLO default randomized password by an HPE defined common password. HPE highly recommends changing this password immediately after the initial onboarding process.

­  Customers who want to choose their own custom iLO default password should use the HPE Factory Express Integration Services

 


Step 4: Choose additional options for Factory Integration from Core and Additional Options sections below


Core Options

Some options may not be integrated at the factory. To ensure only valid configurations are ordered, Hewlett Packard Enterprise recommends the use of an HPE approved configurator. Contact your local sales representative for additional information.

HPE Unique Options

 

Risers

 

HPE ProLiant DL110 Gen10 Plus x16 FHHL PCIe Secondary FIO Riser Kit

P41828-B21

Notes: Factory integrated only. Enables slot 3.  

 

HPE ProLiant DL110 Gen10 Plus x16 FHHL PCIe Secondary Riser Kit

P41827-B21

Notes: For field upgrade only

 

DDR4 DIMM Blank

 

HPE ProLiant DL110 Gen10 Plus DDR4 DIMM FIO Blank Kit

P43725-B21

Notes: Required when processor with 185W or greater TDP is selected and all DIMM slots are not fully populated

 


Memory Selection

For new Gen10 memory population rule whitepaper and optimal memory performance guidelines, please go to:

https://www.hpe.com/docs/memory-population-rules

For Gen10 memory speed table, please go to: https://www.hpe.com/docs/memory-speed-table

Notes:

­  The maximum memory speed and capacity is a function of the memory type, memory configuration, and processor model.

­  Quantity of memory DIMMs selected must be 1, 2, 4, 6, or 8

­  For additional information, please see the HPE DDR4 Smart Memory QuickSpecs

Registered DIMMs (RDIMMs)

 

HPE 16GB (1x16GB) Dual Rank x8 DDR4-3200 CAS-22-22-22 Registered Smart Memory Kit

P06031-B21

HPE 16GB (1x16GB) Single Rank x4 DDR4-3200 CAS-22-22-22 Registered Smart Memory Kit

P06029-B21

HPE 32GB (1x32GB) Dual Rank x4 DDR4-3200 CAS-22-22-22 Registered Smart Memory Kit

P06033-B21

HPE 64GB (1x64GB) Dual Rank x4 DDR4-3200 CAS-22-22-22 Registered Smart Memory Kit

P06035-B21


HPE Networking

 

Notes: The DL110 Gen10 Plus CTO chassis does not come with embedded networking. A PCIe or OCP networking adapter must be selected. 

 

25 Gigabit Ethernet adapters

 

Intel E810-XXVDA4 Ethernet 10/25Gb 4-port SFP28 Adapter for HPE

P08458-B21

100 Gigabit Ethernet Adapters

 

Intel E810-CQDA2 Ethernet 100Gb 2-port QSFP28 Adapter for HPE

P21112-B21

OCP adapters

 

Mellanox MCX562A-ACAI Ethernet 10/25Gb 2-port SFP28 OCP3 Adapter for HPE

P10112-B21

Intel E810-XXVDA4 Ethernet 10/25Gb 4-port SFP28 OCP3 Adapter for HPE

P41614-B21

HPE Computation and Graphics Accelerators

 

NVIDIA T4 16GB Computational Accelerator for HPE

R0W29C

Notes: Max Qty=1 per server


HPE Power Supplies

 

HPE ProLiant DL110 700W Flex Slot -48VDC Hot Plug Low Halogen Power Supply Kit

P43150-B21

Notes: Reverse airflow to support front cabled design of DL110

 


Summary of Changes

Date

Version History

Action

Description of Change

18-Mar-2024

Version 3

Changed

Configuration Information section was updated.

07-Sep-2021

Version 2

Changed

Configuration Information, Core Options and Additional Options sections were updated.

06-Jul-2021

Version 1

New

New Quick Specs

Copyright

 

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© Copyright 2024 Hewlett Packard Enterprise Development LP. The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.

 

Intel® and Xeon® are registered trademarks of Intel Corporation in the U.S. and other countries.

Microsoft®, Windows®, and Windows Server® are U.S. registered trademarks of the Microsoft group of companies.

For hard drives, 1GB = 1 billion bytes. Actual formatted capacity is less

 

a50002576enw - 16731 - Worldwide  - V3 - 18-March-2024