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Dell PowerEdge XR8610t: руководство по обслуживанию

Sled dimensions

Figure 1. Sled dimensions

This figure shows the dimensions of the sled XR8610t.

Table 1. PowerEdgeXR8610t sled dimensionsThis table provides the dimensions of the sled:
X Y Z (handle closed)
184.8 mm (7.27 inches) 41.25 (1.62 inches) 433.5 mm (17.06 inches)

System weight

Table 1. PowerEdge XR8610t system weight The table below shows the maximum weight of the system.
System configuration Maximum weight (with all SSDs)
8 x DIMMS, 1 x processor, 2 x 2280 M.2 NVMe SSDs on BOSS-N1 card 3.90 kg (8.59 lb)

Processor specifications

Table 1. PowerEdge XR8610t processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
5th Generation Intel Xeon Scalable and Edge-Enhanced processors with up to 16 cores or 4th Generation Intel Xeon Scalable and Edge-Enhanced processors with up to 32 cores One
NOTE:It is recommended to use a maximum of two add-in cards with SPR EE-LCC CPU. Three add-in cards are supported, but this may result in an overall system performance degradation. .

Cooling fan specifications

The PowerEdge XR8610t system supports up to four cabled cooling fans.

Supported operating systems

The PowerEdge XR8610t system supports the following operating systems:

  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Linux
  • VMware ESXi
  • WindRiver Solution
  • Dell NativeEdge OS

For more information, go to OS support.

System battery specifications

The PowerEdge XR8610t system supports CR 2032 3.0-V lithium coin cell system battery.

Memory specifications

The PowerEdge XR8610t system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor
Minimum RAM Maximum RAM
RDIMM Single rank 16 GB 32 GB 128 GB
Dual rank 32 GB 64 GB 256 GB
Dual rank 64 GB 128 GB 512 GB
Dual rank 96 GB 192 GB 768 GB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
8, 288-pin 6400 MT/s, 5600 MT/s, 4800 MT/s
NOTE:The processor may reduce the performance of the rated DIMM speed.
NOTE:Memory DIMM slots are not hot swappable.

Expansion card riser specifications

WARNING:Consumer-Grade GPU should not be installed or used in the Enterprise Server products.
The PowerEdge XR8610t system supports one PCI express (PCIe) expansion card riser.
Table 1. Expansion card slots supported on the 1U sledThis table provides information about the expansion card slots that are supported on the 1U sled.
PCIe slots Expansion card riser Processor connection Height Length Slot width
Slot 1 R2A Processor 1 Full Height Half Length x16 PCIe (Gen5) Single width

Drives

The PowerEdge XR8610t system supports up to 2 x M.2 NVMe SSDs (M.2 2280) installed BOSS-N1 card.

USB ports specifications

Table 1. PowerEdge XR8610t USB specificationsThe following table shows the USB specifications for the system:
Front
USB port type No. of ports
USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

Network port specifications

The PowerEdge XR8610t system supports two (optional) SFP28 LAN on Motherboard (LOM) ports.
Table 1. Network port specification for the systemThis table describes the Network port specification for the system.
Feature Specifications
LOM 2 x 25 GbE SFP 28 LOM connectors (optional).

Serial connector specifications

The PowerEdge XR8610t system supports one Micro USB Type B serial connector, on front of the system.

Display port

The PowerEdge XR8610t system supports One Mini-DisplayPort on front of the system.

iDRAC port specifications

The PowerEdge XR8610t system supports one RJ45 with port status LEDs for iDRAC remote management (dedicated port only) on front of the system.

RJ-45 dry contact port

The PowerEdgeXR8610tsystem supports 1 x RJ45 for dry contact on front of the system.

To enhance usage in the IoT space, the XR8610t comes with a dry input sensor. Each input is configurable and manageable in the iDRAC interface. These are interruptible inputs to iDRAC. Dry means that no energy is supplied to the contacts. The dry contact connection cable with RJ45 connector on one end is custom to each installation and must be provided by the end user.

Figure 1. iDRAC interface for Dry Input sensors
The image shows the iDRAC interface for dry input sensors
NOTE:The RJ45 for dry contact does not support IP function.

The default states of the dry inputs are off/disabled. The user has seven (one for each dry input) enable/disable (default) control that must be enabled before logging occurs.

Figure 2. Dry input connection diagram
This image shows the dry input connection diagram

The seven dry inputs are interruptible inputs to iDRAC. They have the following characteristics:

  • Monitored by iDRAC for state transition and LC event are for each state transition.
  • NOT modeled as IPMI sensors but LC event only sensors. The current state of the input is not monitored or displayed anywhere.
  • Event log - transitions (Open to close or close to Open) are logged in LC only.

Debounce — A debounce of 100mseconds is provided on all inputs.

Table 1. Event and Error Messages Event and Error Messages
Message ID Message RRA DD Severity
DCI1000 Dry input <input index> is transitioned to Open state. None. None Severity -3 (Info)
DCI1001 Dry input <input index> is transitioned to Close state. None. None Severity -3 (Info)

Video specifications

The PowerEdge XR8610t system supports integrated Matrox G200 graphics controller embedded in the iDRAC(BMC) chip, with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
640 x 480 60 8, 16, 32
800 x 600 60 8, 16, 32
1024 x 768 60 8, 16, 32
1152 x 864 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1400 x 1050 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

The PowerEdge XR8610t operates in these environmental categories: ASHRAE A2 and NEBS3.
NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation > Regulatory Information on Dell Support.
Table 1. Continuous operation specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Feature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous operation specifications for NEBS3 This table describes the operational climatic range for NEBS3.
Feature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) -5° to 55°C (23 to 131°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/80 m (1.8°F/263 Ft) above 900 m (2953 Ft)
Table 3. Common environmental specifications for ASHRAE A2 and NEBS3 This table describes the shared requirements across all categories.
Feature Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation). 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
Non-operational temperature limits -40 to 65°C (-40 to 149°F).
Non-operational humidity limits (Non-Condensing at all times) 5% to 95%RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,050 meters (10,006 feet)
Table 4. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 5. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms (4 pulse on each side on the system). The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms (4 pulse on each side on the system)
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 6. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 7. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013

Environmental considerations

The PowerEdge system is targeted for edge deployments and it meets all the additional standards for thermal, shock, vibration parameters.

Table 1. Environmental considerationsThis table describes environmental considerations.
Industry Configuration Description
Telco GR-1089-CORE Electromagnetic Compatibility and Electrical Safety – Generic Criteria for Network Telecommunications Equipment
GR-63-CORE NEBS Requirements: Physical Protection
SR-3580 (NEBS Level 3) NEBS Criteria Levels
GR-3108-CORE (Class 1) Network Equipment in the Outside Plant (OSP). An exception is made for cold boot at +5C instead of -5C for systems without the heater subsystem enabled.
Military N/A
Marine N/A
Power Industry N/A
Safety N/A LDV, IEC/EN, CFR, CSA
EMC N/A EN, CISPR, ES, DTAG, CFR, ICES, VCCI
EMV N/A RoHS, WEEE, EN, ECE

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. XR8610t Thermal Restriction - CPU and Memory The table describes Thermal Restriction - XR8610t - CPU and Memory:
Config Thermal Restriction
Ambient Temperature ASHARE A2 (Max 35°C) NEBS3 (Max 55°C)
CPU Intel® Xeon® Gold 4514Y 150 W Supported Supported
CPU Intel® Xeon® Gold 6433N 205 W Supported Supported
Intel® Xeon® Gold 6423N 195 W Supported Supported
Intel® Xeon® Gold 6403N 185 W Supported Supported
Intel® Xeon® Gold 4510 150 W Supported Supported
Intel® Xeon® Gold 5423N 145 W Supported Supported
Intel® Xeon® Gold 4509Y 125 W Supported Supported
CPU Intel® Xeon® Gold 6438N 205 W Supported Supported
Intel® Xeon® Gold 6421N 185 W Supported Supported
Intel® Xeon® Gold 5411N 165 W Supported Supported
Memory DDR5 RDIMM 4800 MT/s 64G Supported Supported
DDR5 RDIMM 4800 MT/s 32G Supported Supported
DDR5 RDIMM 4800 MT/s 16G Supported Supported
DDR5 RDIMM 5600 MT/s 96G Supported Supported
DDR5 RDIMM 5600 MT/s 64G Supported Supported
DDR5 RDIMM 5600 MT/s 32G Supported Supported
DDR5 RDIMM 5600 MT/s 16G Supported Supported
NOTE:Do not perform a cold startup below 5°C.
Table 2. XR8610t Thermal Restriction - BOSS-N1 The table describes Thermal Restriction - Storage for XR8610t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

BOSS-N1 Hynix M.2 480G PE8010 2280 Supported Supported
480G PE9010 2280 Supported Supported
800G PE8030 2280 Supported Supported
960G PE8010 2280 Supported Supported
960G PE9010 2280 Supported Supported
1.92T PE9010 2280 Supported Supported
Micron M.2 480G 7400 2280 Supported Supported
480G 7450 2280 Supported Supported
800G 7400 2280 Supported Supported
960G 7400 2280 Supported Supported
960G 7450 2280 Supported Supported
NOTE:BOSS-N1 only supports 2280 form factor M.2 SSDs.
Table 3. XR8610t Thermal Restriction - Dual M.2 riser The table describes Thermal Restriction - Storage for XR8610t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

Dual M.2 riser Hynix M.2 480G PE8010 2280 Supported Supported
800G PE8030 2280 Supported Supported
960G PE8010 2280 Supported Supported
1.92T PE8110 22110 Supported Supported
3.84T PE8110 22110 Supported Supported
Micron M.2 480G 7400 2280 Supported Supported
800G 7400 2280 Supported Supported
960G 7400 2280 Supported Supported
960G 7450 2280 Supported Supported
1.92T 7400 22110 Supported Supported
1.92T 7450 22110 Supported Supported
3.84T 7400 22110 Supported Supported
3.84T 7450 22110 Supported Supported
NOTE:The dual M.2 riser supports both 2280 and 22110 M.2 SSDs.
NOTE:M.2 drives have performance degradation if there is a fan failure at 55°C.
Table 4. XR8610t Thermal Restriction - Dual M.2 riser + Single M.2 riser The table describes Thermal Restriction - Storage for XR8610t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

Dual M.2 riser + Single M.2 riser Hynix M.2 480G PE8010 2280 Supported Supported
800G PE8030 2280 Supported Supported
960G PE8010 2280 Supported Supported
1.92T PE8110 22110 Supported Supported
3.84T PE8110 22110 Supported Supported
Micron M.2 480G 7400 2280 Supported Supported
800G 7400 2280 Supported Supported
960G 7400 2280 Supported Supported
960G 7450 2280 Supported Supported
1.92T 7400 22110 Supported Not supported
1.92T 7450 22110 Supported Supported
3.84T 7400 22110 Supported Not supported
3.84T 7450 22110 Supported Supported
NOTE:The dual M.2 riser supports both 2280 and 22110 M.2 SSDs.
NOTE:The single M.2 riser only supports 2280 form factor M.2 SSDs.
NOTE:M.2 drives have performance degradation if there is a fan failure at 55°C.
Table 5. XR8610t Thermal Restriction - BOSS-N1 + Single M.2 riser The table describes Thermal Restriction - Storage for XR8610t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

BOSS-N1 + Single M.2 riser Hynix M.2 480G PE8010 2280 Supported Supported
800G PE8030 2280 Supported Supported
960G PE8010 2280 Supported Supported
Micron M.2 480G 7400 2280 Supported Supported
800G 7400 2280 Supported Supported
960G 7400 2280 Supported Supported
960G 7450 2280 Supported Supported
NOTE:BOSS-N1 and single M.2 riser only supports 2280 form factor M.2 SSDs.
NOTE:M.2 drives have performance degradation if there is a fan failure at 55°C.
Table 6. XR8610t Thermal Restriction - Commodities The table describes Thermal Restriction - Commodities for XR8610t:
Config Thermal Restriction
Ambient Temperature ASHARE A2 (Max 35°C) NEBS3 (Max 55°C)
PCIe Card Non-Dell PCIe cards are not supported.
PSU Dual PSUs are required for NEBS3
Table 7. XR8610t Thermal Restriction - RAN DPU The table describes Thermal Restriction - RAN DPU for XR8620t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

Qualcomm X100 DPU Supported Supported
Nokia Rinline 2 DPU Supported Supported
Minerva 3 DPU Supported Supported
NOTE:Do not perform a cold startup below 5°C.

XR8610t- Other Restrictions

NOTE:Do not perform a cold startup below 5°C.
  • Hot-swap fans are not supported.
  • Minimum cold boot temperature +5°C.
  • Do not perform a cold startup below 5°C.
  • DIMM Blank is required in empty slots.
  • Sled blank is required in empty slots.
  • PCIE blank is required in the empty slot (slot 1).
  • PSU blank is required in empty slots.
  • Air baffle is required while single M.2 riser is not installed.