Определяем
Сегодня покупают
ГлавнаяСправочникиDellXR Servers
Dell PowerEdge XR8000r: руководство по обслуживанию
← Вернуться назад
Нужна помощь с конфигурацией?
Пришлите SKU, спецификацию или список требований. Специалист Apltech проверит совместимость компонентов и найдёт актуальные артикулы
Получить консультацию →

Dell PowerEdge XR8000r: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions with bezel

This figure shows the dimensions of the xr8000r chassis with bezel.

Table 1. PowerEdgeXR8000r chassis dimensions with bezelThis table provides the dimensions of the system:
Xa Xb Y Za Zb
482.6 mm (19 inches) 448 mm (17.63 inches) 87.05 mm (3.42 inches) 102 mm (4.01 inches) with bezel 430 mm (16.92 inches)
Figure 2. Chassis dimensions without bezel

This figure shows the dimensions of the xr8000r chassis.

Table 2. PowerEdgeXR8000r chassis dimensions without bezelThis table provides the dimensions of the system:
Xa Xb Y Za1 Za2 Zb1 Zb2 Zb3
482 mm (18.97 inches) includes rack mount ear. 448 mm (17.63 inches) 87.05 mm (3.42 inches) 30.4 mm (1.19 inches) without bezel 89 mm (3.50 inches) with cable management kit included 423 mm (16.65 inches) 343 mm (13.50 inches) 293 mm (11.53 inches)
NOTE:The XR8000r can support racks/cabinets with a minimum space of 30.4 mm between the front post of the rack and the inside surface of the rack door, without the included cable management kit. The minimum front space required might be limited by front cable bending. When using the included cable management kit, the XR8000r can support racks/cabinets with a minimum distance of 89 mm between the front post of the rack and the inside surface of the rack door. Other important parameters in the image are:
  1. Minimum exhaust gap (between chassis rear and cabinet’s rear door) required for thermal performance:
    1. 50 mm minimum for ambient temperatures up to 55°C
    2. 55 mm minimum for ambient temperatures 55 - 65°C
  2. Four post rack.
  3. 19-inch or 23-inch width cabinet boundary and 600 mm (23.62 inches) minimum cabinet depth.

System weight

Table 1. PowerEdge XR8000r system weight The table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
Weight of chassis without sleds 5.82 kg (12.8 pounds)
Weight of chassis with two XR8620t sleds 18.52 kg (40.84 pounds)
Table 2. PowerEdge system weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight Description
40 pounds - 70 pounds Recommend two persons to lift.
70 pounds- 120 pounds Recommend three persons to lift.
≥ 121 pounds Recommend to use a server-lift.
NOTE:If moving the chassis, it is recommended to remove all the sleds from the chassis.

PSU specifications

The PowerEdge XR8000r system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) Voltage AC DC Current (A)
High line 200–240 V Low line 100–120 V
1800 W Mixed Mode Titanium 6750 BTU/hr 50/60 Hz 200–240 V AC 1800 W N/A N/A 10 A
6750 BTU/hr N/A 240 V DC N/A N/A 1800 W 8.2 A
1400 W Mixed Mode Platinum 5250 BTU/hr 50/60 Hz 100–240 V AC 1400 W 1050 W N/A 12 A - 8 A
5250 BTU/hr N/A 240 V DC N/A N/A 1400 W 6.6 A
1400 W DC N/A 5310 BTU/hr N/A -48—( -60) V N/A N/A 1400 W 33.5 A
1100 W DC N/A 4265 BTU/hr N/A -48—( -60) V N/A N/A 1100 W 27 A
800 W DC N/A 3219 BTU/hr N/A -48—( -60) V N/A N/A 800 W 20 A
NOTE:To update PSU firmware successfully, it is necessary to have both PSUs installed in the chassis.
NOTE:All PSUs come in Reverse Airflow (RAF) offerings (Reverse Airflow PSUs).
NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE: For information about DC PSU cabling instructions, see the Cabling instructions for - (48 - 60) V DC power supply Tech sheet that is shipped with your DC PSU or go to https://www.dell.com/poweredgemanuals > XR Servers > PowerEdge XR8000r > Select This Product > Documentation > Manuals and Documents > Cabling instructions for - 48 - 60 V DC power supply
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

Power module assembly

The Dell PowerEdge XR8000r has a power module assembly which consists of two power distribution boards (PDBs) and are connected to each other so either or both power supplies can power the whole chassis. The power distribution board (PDB) at the bottom also has chassis manager board to manage the chassis.

Figure 1. Power module assembly specifications

This image shows the power module assembly.

Table 1. Power module assemblyThis table shows the components of the power module assembly.
Item Component Description
1 Power distribution board 2/ Chassis Manager (PDB2/CM) This is the power distribution board which provides power to the chassis components. The PSU 2 slot is on the PDB 2. Chassis Manager (CM) is also integrated on this board.
2 Power distribution board 1 (PDB1) This is the power distribution board which provides power to the chassis components. The PSU 1 slot is on the PDB 1.
3 Power Interposer Board (PIB) The power interposer board (PIB) provides power to the 1U and 2U sleds.
4 Power Interposer Board (PIB) The power interposer board (PIB) provides power to the 1U and 2U sleds.
5 Power module tray The power module tray houses the complete power module assembly.

PowerEdge XR8610t

Table 1. PowerEdge XR8610t externally accessible ports and connectorsPowerEdge XR8610t externally accessible connectors
Connector Description
USB ports and connectors
  • One USB 3.0-compliant port on the front of the sled.
  • One Micro-AB USB 2.0-compliant port for iDRAC Direct on the front of the sled.
  • One RJ45 port for iDRAC remote management (dedicated port only) on the front of the sled.
  • One RJ45 with port for dry contact input connection.
  • One Mini-DisplayPort on the front of the sled.
  • Two (optional) 25 GbE SFP 28 embedded LAN on Motherboard (LOM) ports.
  • One Micro-USB connector for RS232 serial port.

PowerEdge XR8620t

Table 1. PowerEdge XR8620t externally accessible ports and connectorsPowerEdge XR8620t externally accessible ports and connectors
Ports and connectors
  • One USB 3.0-compliant port on the front of the sled.
  • One dedicated micro USB 2.0-compliant port for iDRAC Direct on the front of the sled.
  • One RJ45 port for iDRAC remote management (dedicated port only) on the front of the sled.
  • One RJ45 port for dry contact input connection.
  • One Mini-DisplayPort on the front of the sled.
  • Two (optional) 25 GbE SFP 28 embedded LAN on Motherboard (LOM) ports.
  • One Micro-USB connector for RS232 serial port.

Environmental specifications

The PowerEdge XR8000r operates in these environmental categories: ASHRAE A2, NEBS3, GR3108C1+, GR3108C1-L, and NEBS3-H.
NOTE:For additional information about environmental certifications, see the Product Environmental Datasheet located with the Documentation > Regulatory Information on Dell Support.
Table 1. Continuous operation specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Feature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous operation specifications for NEBS3 This table describes the operational climatic range for NEBS3.
Feature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) -5° to 55°C (23 to 131°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/80 m (1.8°F/263 Ft) above 900 m (2953 Ft)
Table 3. Continuous operation specifications for GR3108C1+ This table describes the operational climatic range for GR3108C1+.
Feature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) -20° to 65°C (-4 to 149°F) with no direct sunlight on the equipment. Cold boot support at - 20°C
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/58 m (1.8°F/190 Ft) above 900 m (2953 Ft)
Table 4. Continuous operation specifications for GR3108C1-L This table describes the operational climatic range for GR3108C1-L.
Feature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) -20° to 55°C (-4 to 131°F) with no direct sunlight on the equipment. Cold boot support at - 20°C
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/80 m (1.8°F/263 Ft) above 900 m (2953 Ft)
Table 5. Continuous operation specifications for NEBS3-H This table describes the operational climatic range for NEBS3-H.
Feature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) -5° to 65°C (23 to 149°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/58 m (1.8°F/190 Ft) above 900 m (2953 Ft)
Table 6. Common environmental specifications for ASHRAE A2, NEBS3, GR3108C1+, GR3108C1-L and NEBS3-H This table describes the shared requirements across all categories.
Feature Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation). 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
Non-operational temperature limits -40°C to 65°C (-40°F to 149°F).
Non-operational humidity limits (Non-Condensing at all times) 5% to 95%RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,050 meters (10,006 feet)
Table 7. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 8. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms (4 pulse on each side on the system). The maximum shock specification of a nonoperational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms (4 pulse on each side on the system)
Storage Six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 9. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 10. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013

Environmental considerations

The PowerEdge system is targeted for edge deployments and it meets all the additional standards for thermal, shock, and vibration parameters.

Table 1. Environmental considerationsThis table describes environmental considerations.
Industry Configuration Description
Telco GR-1089-CORE Electromagnetic Compatibility and Electrical Safety – Generic Criteria for Network Telecommunications Equipment
GR-63-CORE NEBS Requirements: Physical Protection
SR-3580 (NEBS Level 3) NEBS Criteria Levels
GR-3108-CORE (Class 1) Network Equipment in the Outside Plant (OSP). An exception is made for cold boot at +5C instead of -5C for systems without the Heater Manager subsystem enabled.
Military N/A
Marine N/A
Power Industry N/A
Safety N/A LDV, IEC/EN, CFR, CSA
EMC N/A EN, CISPR, ES, DTAG, CFR, ICES, VCCI
EMV N/A RoHS, WEEE, EN, ECE

Environmental Requirements for installing XR8000

A proper installation of XR8000 protects the system and its components from damage that is caused by external environmental conditions. So, to ensure normal operation and avoid any unplanned downtime and maintenance activity it is highly imperative that there is a proper planning and preparation of the site before installing the XR8000 . Also, it is to be noted that the same site sanity must be maintained during the entire life cycle of the XR8000 server to ensure smooth operations.

General guidelines for maintaining the XR8000:

  1. It is recommended to keep the system from heat sources and obstructions blocking the airflow.
  2. It is recommended not to allow spillage of liquid into the system and not to operate when the system is wet.
  3. If there are any openings in the system, it is recommended not to insert any objects into those points.
  4. It is highly advised not to tamper and modify any power cables or PSUs as it could potentially damage the systems.

Site Planning Recommendation:

  1. The site should have proper cooling facilities to take care of the operating temperature range of the server.
  2. The rack or cabinet where the server is going to be installed should have adequate space for cable routing.
  3. The Rack or cabinet should have enough strength to hold the weight of the server.
  4. For Conductive dust, the air must be free of conductive dust, zinc whiskers, or other conductive particles. This protects the system from any contamination.
  5. For corrosive dust, the air must be free from any corrosive dust and the Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note this condition applies for both data center and non-data center environments.
  6. The system is best found to operate at -5C to 55C and for some conditions from -20C to 65C , so the site conditions could maintain the optimum operating condition.
  7. For protection of the system from humidity it is expected to have an environment with a humidity percent range of 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point.
  8. For seismic zones , the maximum operating vibration is 0.21 G rms at 5 Hz to 500 Hz (all operation orientations).

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal restriction matrix

XR8610t Sled

Table 1. XR8610t Thermal Restriction - CPU and Memory The table describes Thermal Restriction - XR8610t - CPU and Memory:
Config Thermal Restriction
Ambient Temperature ASHARE A2 (Max 35°C) NEBS3 (Max 55°C)
CPU Intel® Xeon® Gold 4514Y 150 W Supported Supported
CPU Intel® Xeon® Gold 6433N 205 W Supported Supported
Intel® Xeon® Gold 6423N 195 W Supported Supported
Intel® Xeon® Gold 6403N 185 W Supported Supported
Intel® Xeon® Gold 4510 150 W Supported Supported
Intel® Xeon® Gold 5423N 145 W Supported Supported
Intel® Xeon® Gold 4509Y 125 W Supported Supported
CPU Intel® Xeon® Gold 6438N 205 W Supported Supported
Intel® Xeon® Gold 6421N 185 W Supported Supported
Intel® Xeon® Gold 5411N 165 W Supported Supported
Memory DDR5 RDIMM 4800 MT/s 64G Supported Supported
DDR5 RDIMM 4800 MT/s 32G Supported Supported
DDR5 RDIMM 4800 MT/s 16G Supported Supported
DDR5 RDIMM 5600 MT/s 96G Supported Supported
DDR5 RDIMM 5600 MT/s 64G Supported Supported
DDR5 RDIMM 5600 MT/s 32G Supported Supported
DDR5 RDIMM 5600 MT/s 16G Supported Supported
NOTE:Do not perform a cold startup below 5°C.
NOTE:5600 RDIMM thermal qualification with limited speed 4000MT~4800MT which depends on CPU SKU from support list.
Table 2. XR8610t Thermal Restriction - BOSS-N1 The table describes Thermal Restriction - Storage for XR8610t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

BOSS-N1 Hynix M.2 480G PE8010 2280 Supported Supported
480G PE9010 2280 Supported Supported
800G PE8030 2280 Supported Supported
960G PE8010 2280 Supported Supported
960G PE9010 2280 Supported Supported
1.92T PE9010 2280 Supported Supported
Micron M.2 480G 7400 2280 Supported Supported
480G 7450 2280 Supported Supported
800G 7400 2280 Supported Supported
960G 7400 2280 Supported Supported
960G 7450 2280 Supported Supported
NOTE:BOSS-N1 only supports 2280 form factor M.2 SSDs.
Table 3. XR8610t Thermal Restriction - Dual M.2 riser The table describes Thermal Restriction - Storage for XR8610t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

Dual M.2 riser Hynix M.2 480G PE8010 2280 Supported Supported
800G PE8030 2280 Supported Supported
960G PE8010 2280 Supported Supported
1.92T PE8110 22110 Supported Supported
3.84T PE8110 22110 Supported Supported
Micron M.2 480G 7400 2280 Supported Supported
800G 7400 2280 Supported Supported
960G 7400 2280 Supported Supported
960G 7450 2280 Supported Supported
1.92T 7400 22110 Supported Supported
1.92T 7450 22110 Supported Supported
3.84T 7400 22110 Supported Supported
3.84T 7450 22110 Supported Supported
NOTE:M.2 drives have performance degradation if there is a fan failure at 55°C.
Table 4. XR8610t Thermal Restriction - Dual M.2 riser + Single M.2 riser The table describes Thermal Restriction - Storage for XR8610t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

Dual M.2 riser + Single M.2 riser Hynix M.2 480G PE8010 2280 Supported Supported
800G PE8030 2280 Supported Supported
960G PE8010 2280 Supported Supported
1.92T PE8110 22110 Supported Supported
3.84T PE8110 22110 Supported Supported
Micron M.2 480G 7400 2280 Supported Supported
800G 7400 2280 Supported Supported
960G 7400 2280 Supported Supported
960G 7450 2280 Supported Supported
1.92T 7400 22110 Supported Not supported
1.92T 7450 22110 Supported Supported
3.84T 7400 22110 Supported Not supported
3.84T 7450 22110 Supported Supported
NOTE:BOSS-N1 only supports 2280 form factor M.2 SSDs.
NOTE:M.2 drives have performance degradation if there is a fan failure at 55°C.
Table 5. XR8610t Thermal Restriction - BOSS-N1 + Single M.2 riser The table describes Thermal Restriction - Storage for XR8610t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

BOSS-N1 + Single M.2 riser Hynix M.2 480G PE8010 2280 Supported Supported
800G PE8030 2280 Supported Supported
960G PE8010 2280 Supported Supported
Micron M.2 480G 7400 2280 Supported Supported
800G 7400 2280 Supported Supported
960G 7400 2280 Supported Supported
960G 7450 2280 Supported Supported
NOTE:BOSS-N1 and single M.2 riser only supports 2280 form factor M.2 SSDs.
NOTE:M.2 drives have performance degradation if there is a fan failure at 55°C.
Table 6. XR8610t Thermal Restriction - Commodities The table describes Thermal Restriction - Commodities for XR8610t:
Config Thermal Restriction
Ambient Temperature ASHARE A2 (Max 35°C) NEBS3 (Max 55°C)
PCIe Card Non-Dell PCIe cards are not supported
PSU Dual PSUs are required for NEBS3
Table 7. XR8610t Thermal Restriction - RAN DPU The table describes Thermal Restriction - RAN DPU for XR8620t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

Qualcomm X100 DPU Supported Supported
Nokia Rinline 2 DPU Supported Supported
Minerva 3 DPU Supported Supported
NOTE:Do not perform a cold startup below 5°C.

XR8620t sled

Table 8. XR8620t Thermal Restriction - CPU and Memory The table describes Thermal Restriction - CPU and Memory for XR8620t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

GR3108C1-L

(Max 55°C)

NEBS3-H

(Max 65°C)

GR3108C1+

(Max 65°C)

CPU Intel® Xeon® Gold 4514Y 150 W Supported Supported Supported Not Supported Not Supported
CPU Intel® Xeon® Gold 6433N 205 W Supported Supported Supported Not Supported Not Supported
Intel® Xeon® Gold 6423N 195 W Supported Supported Supported Supported Supported
Intel® Xeon® Gold 6403N 185 W Supported Supported Supported Supported Supported
Intel® Xeon® Gold 4510 150 W Supported Supported Supported Supported Supported
Intel® Xeon® Gold 5423N 145 W Supported Supported Supported Supported Supported
Intel® Xeon® Gold 4509Y 125 W Supported Supported Supported Supported Supported
CPU Intel® Xeon® Gold 6438N 205 W Supported Supported Supported Not Supported Not Supported
Intel® Xeon® Gold 6421N 185 W Supported Supported Supported Supported Supported
Intel® Xeon® Gold 5411N 165 W Supported Supported Supported Supported Supported
Memory DDR5 RDIMM 4800 MT/s 64G Supported Supported Supported Not Supported Not Supported
DDR5 RDIMM 4800 MT/s 32G Supported Supported Supported Supported Supported
DDR5 RDIMM 4800 MT/s 16G Supported Supported Supported Supported Supported
DDR5 RDIMM 5600 MT/s 96G Supported Supported Supported Not Supported Not Supported
DDR5 RDIMM 5600 MT/s 64G Supported Supported Supported Not Supported Not Supported
DDR5 RDIMM 5600 MT/s 32G Supported Supported Supported Supported Supported
DDR5 RDIMM 5600 MT/s 16G Supported Supported Supported Supported Supported
NOTE:The heater Manager subsystem is required for “GR3108C1L” and “GR3108C1+” environment class.
NOTE:The heater Manager subsystem is required for the system to perform a cold startup below 5°C.
NOTE:5600 RDIMM thermal qualification with limited speed 4000MT~4800MT which depends on CPU SKU from support list.
Table 9. XR8620t Thermal Restriction - Raid Controller and Storage (ROR-N1) The table describes Thermal Restriction - Raid Controller and Storage (ROR-N1) for XR8620t:
Sled Config XR8620t Thermal Restriction
Ambient temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

GR3108C1-L

(Max 55°C)

NEBS3-H

(Max 65°C)

GR3108C1+

(Max 65°C)

ROR-N1 Hynix M.2 480G PE8010 2280 Supported Supported Supported Supported Supported
480G PE9010 2280 Supported Supported Supported Supported Supported
800G PE8030 2280 Supported Supported Supported Not Supported Not Supported
960G PE8010 2280 Supported Supported Supported Not Supported Not Supported
960G PE9010 2280 Supported Supported Supported Not Supported Not Supported
1.92T PE9010 2280 Supported Supported Supported Not Supported Not Supported
1.92T PE8110 22110 Supported Supported Supported Not Supported Not Supported
3.84T PE8110 22110 Supported Supported Supported Not Supported Not Supported
Micron M.2 480G 7400 2280 Supported Supported Supported Supported Supported
480G 7450 2280 Supported Supported Supported Supported Supported
800G 7400 2280 Supported Supported Supported Not Supported Not Supported
960G 7400 2280 Supported Supported Supported Not Supported Not Supported
960G 7450 2280 Supported Supported Supported Not Supported Not Supported
1.92T 7400 22110 Supported Supported Supported Not Supported Not Supported
1.92T 7450 22110 Supported Supported Supported Not Supported Not Supported
3.84T 7400 22110 Supported Supported Supported Not Supported Not Supported
3.84T 7450 22110 Supported Supported Supported Not Supported Not Supported
NOTE:The heater manager subsystem is required for “GR3108C1L” and “GR3108C1+” environment class.
Table 10. XR8620t Thermal Restriction - Raid Controller and Storage(Non-Raid Riser) The table describes Thermal Restriction - Raid Controller and Storage (Non-Raid Riser) for XR8620t:
Sled Config XR8620t Thermal Restriction
Ambient temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

GR3108C1-L

(Max 55°C)

NEBS3-H

(Max 65°C)

GR3108C1+

(Max 65°C)

Non RAID Riser Hynix M.2 480G PE8010 2280 Supported Supported Supported Supported Supported
480G PE9010 2280 Supported Supported Supported Supported Supported
800G PE8030 2280 Supported Supported Supported Not Supported Not Supported
960G PE8010 2280 Supported Supported Supported Not Supported Not Supported
960G PE9010 2280 Supported Supported Supported Not Supported Not Supported
1.92T PE9010 2280 Supported Supported Supported Not Supported Not Supported
1.92T PE8110 22110 Supported Supported Supported Not Supported Not Supported
3.84T PE8110 22110 Supported Supported Supported Not Supported Not Supported
Micron M.2 480G 7400 2280 Supported Supported Supported Supported Supported
480G 7450 2280 Supported Supported Supported Supported Supported
800G 7400 2280 Supported Supported Supported Not Supported Not Supported
960G 7400 2280 Supported Supported Supported Not Supported Not Supported
960G 7450 2280 Supported Supported Supported Not Supported Not Supported
1.92T 7400 22110 Supported Supported Supported Not Supported Not Supported
1.92T 7450 22110 Supported Supported Supported Not Supported Not Supported
3.84T 7400 22110 Supported Supported Supported Not Supported Not Supported
3.84T 7450 22110 Supported Supported Supported Not Supported Not Supported
NOTE:The heater manager subsystem is required for “GR3108C1L” and “GR3108C1+” environment class.
Table 11. XR8620t Thermal Restriction - Raid Controller and Storage(Mancini BOSS-N1) The table describes Thermal Restriction - Raid Controller and Storage (Mancini BOSS-N1) for XR8620t:
Sled Config XR8620t Thermal Restriction
Ambient temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

GR3108C1-L

(Max 55°C)

NEBS3-H

(Max 65°C)

GR3108C1+

(Max 65°C)

BOSS-N1 Hynix M.2 480G PE8010 2280 Supported Supported Not Supported Supported Not Supported
480G PE9010 2280 Supported Supported Not Supported Not Supported Not Supported
800G PE8030 2280 Supported Supported Not Supported Not Supported Not Supported
960G PE8010 2280 Supported Supported Not Supported Not Supported Not Supported
960G PE9010 2280 Supported Supported Not Supported Not Supported Not Supported
1.92T PE9010 2280 Supported Supported Not Supported Not Supported Not Supported
Micron M.2 480G 7400 2280 Supported Supported Not Supported Supported Not Supported
480G 7450 2280 Supported Supported Not Supported Not Supported Not Supported
800G 7400 2280 Supported Supported Not Supported Not Supported Not Supported
960G 7400 2280 Supported Supported Not Supported Not Supported Not Supported
960G 7450 2280 Supported Supported Not Supported Not Supported Not Supported
NOTE:The BOSS-N1 only supports 2280 form factor M.2 SSD.
Table 12. XR8620t Thermal Restriction - Raid Controller and Storage(Non-Raid Riser) + Single M.2 riser The table describes Thermal Restriction - Raid Controller and Storage (Non-Raid Riser) + Single M.2 riser for XR8620t:
Sled Config XR8620t Thermal Restriction
Ambient temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

GR3108C1-L

(Max 55°C)

NEBS3-H

(Max 65°C)

GR3108C1+

(Max 65°C)

Non-RAID riser + Single M.2 riser Hynix M.2 480G PE8010 2280 Supported Supported Not Supported Not Supported Not Supported
800G PE8030 2280 Supported Supported Not Supported Not Supported Not Supported
960G PE8010 2280 Supported Supported Not Supported Not Supported Not Supported
1.92T PE8110 22110 Supported Supported Not Supported Not Supported Not Supported
3.84T PE8110 22110 Supported Supported Not Supported Not Supported Not Supported
Micron M.2 480G 7400 2280 Supported Supported Not Supported Not Supported Not Supported
800G 7400 2280 Supported Supported Not Supported Not Supported Not Supported
960G 7400 2280 Supported Supported Not Supported Not Supported Not Supported
960G 7450 2280 Supported Supported Not Supported Not Supported Not Supported
1.92T 7400 22110 Supported Supported Not Supported Not Supported Not Supported
1.92T 7450 22110 Supported Supported Not Supported Not Supported Not Supported
3.84T 7400 22110 Supported Supported Not Supported Not Supported Not Supported
3.84T 7450 22110 Supported Supported Not Supported Not Supported Not Supported
Table 13. XR8620t Thermal Restriction - Raid Controller and Storage BOSS-N1 + Single M.2 riser The table describes Thermal Restriction - Raid Controller and Storage BOSS-N1 + Single M.2 riser for XR8620t:
Sled Config XR8620t Thermal Restriction
Ambient temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

GR3108C1-L

(Max 55°C)

NEBS3-H

(Max 65°C)

GR3108C1+

(Max 65°C)

BOSS-N1 + Single M.2 riser Hynix M.2 480G PE8010 2280 Supported Supported Not Supported Not Supported Not Supported
800G PE8030 2280 Supported Supported Not Supported Not Supported Not Supported
960G PE8010 2280 Supported Supported Not Supported Not Supported Not Supported
Micron M.2 480G 7400 2280 Supported Supported Not Supported Not Supported Not Supported
800G 7400 2280 Supported Supported Not Supported Not Supported Not Supported
960G 7400 2280 Supported Supported Not Supported Not Supported Not Supported
960G 7450 2280 Supported Supported Not Supported Not Supported Not Supported
NOTE:The heater manager subsystem is required for “GR3108C1L” and “GR3108C1+” environment class.
NOTE:The single M.2 riser only supports 2280 form factor M.2 SSD.
NOTE:The heater manager subsystem is not supported when a single M.2 riser is installed.
Table 14. XR8620t Thermal Restriction - Raid Controller and Storage ROR-N1 riser + Single M.2 riser The table describes Thermal Restriction - Raid Controller and Storage ROR-N1 riser for XR8620t:
Sled Config XR8620t Thermal Restriction
Ambient temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

GR3108C1-L

(Max 55°C)

NEBS3-H

(Max 65°C)

GR3108C1+

(Max 65°C)

ROR-N1 riser + Single M.2 riser

2280/22110 M.2 SSDs

 Hynix M.2 480G PE8010 2280 Supported Supported Not Supported Not Supported Not Supported
800G PE8030 2280 Supported Supported Not Supported Not Supported Not Supported
960G PE8010 2280 Supported Supported Not Supported Not Supported Not Supported
1.92T PE8110 22110 Supported Supported Not Supported Not Supported Not Supported
3.84T PE8110 22110 Supported Supported Not Supported Not Supported Not Supported
Micron M.2 480G 7400 2280 Supported Supported Not Supported Not Supported Not Supported
800G 7400 2280 Supported Supported Not Supported Not Supported Not Supported
960G 7400 2280 Supported Supported Not Supported Not Supported Not Supported
960G 7450 2280 Supported Supported Not Supported Not Supported Not Supported
1.92T 7400 22110 Supported Supported Not Supported Not Supported Not Supported
1.92T 7450 22110 Supported Supported Not Supported Not Supported Not Supported
3.84T 7400 22110 Supported Supported Not Supported Not Supported Not Supported
3.84T 7450 22110 Supported Supported Not Supported Not Supported Not Supported
NOTE:The heater Manager subsystem is required for “GR3108C1L” and “GR3108C1+” environment class.
NOTE:The single riser only supports 2280 form factor M.2 SSD.
NOTE:The heater Manager subsystem is not supported when a single M.2 riser is installed.
Table 15. XR8620t Thermal Restriction - RAN DPU The table describes Thermal Restriction - RAN DPU for XR8620t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

GR3108C1-L

(Max 55°C)

NEBS3-H

(Max 65°C)

GR3108C1+

(Max 65°C)

Nvidia GPU L4 Supported Supported Not Supported Not Supported Not Supported
Qualcomm X100 DPU Supported Supported Not Supported Not Supported Not Supported
Minerva 3 DPU Supported Supported Not Supported Not Supported Not Supported
Nokia Rinline 2 DPU Supported Supported Not Supported Not Supported Not Supported
Table 16. XR8620t Thermal Restriction - Commodities The table describes Thermal Restriction - Commodities for XR8620t:
Sled Config XR8620t Thermal Restriction
Ambient Temperature ASHRAE A2

(Max 35°C)

NEBS3

(Max 55°C)

GR3108C1-L

(Max 55°C)

NEBS3-H

(Max 65°C)

GR3108C1+

(Max 65°C)

PCIe Card
  • Above 55°C only PCIe cards with Extended Operating Temperature (EOT) Range is supported for “NEBS3-H” & “GR3108C1+”.
  • Non-Dell PCIe cards are not supported.
Active Optical Cables/ Transceivers
  • Optic cables/transceivers with 70C spec is not supported for “NEBS3-H” & “GR3108C1+”.
  • Optic cables/transceivers with 85C spec can support up to 65°C.
PSU -
  • Dual PSUs are required.
  • Only eTemp range PSU is supported for NEBS3-H, GR3108C1L and GR3108C1+
NOTE:The heater Manager subsystem is required for “GR3108C1L” and “GR3108C1+” environment class.

XR8610t- Other Restrictions

  • Hot-swap fans are not supported.
  • Minimum cold boot temperature +5°C.
  • Do not perform a cold startup below 5°C.
  • DIMM Blank is required in empty slots.
  • Sled blank is required in empty slots.
  • PCIE blank is required in the empty slot (slot 1).
  • PSU blank is required in empty slots.
  • Air baffle is required while single M.2 riser is not installed.

XR8620t- Other Restrictions

  • Hot-swap fans are not supported.
  • Minimum cold boot temperature +5°C w/o Heater Manager subsystem.
  • Minimum cold boot temperature -20°C with Heater Manager subsystem.
  • Dual PSUs are required while ambient ≥ 55°C.
  • Only PSU with eTemp range is supported for NEBS3 H, GR3108C1 L & GR3108C1+ environment class.
  • Non-Dell PCIe Cards are not supported.
  • DIMM Blank is required in empty slots.
  • Sled blank is required in empty slots.
  • PCIE blank is required in empty slots for slot-1&2.
  • PCIE blank is required in the empty slot for slot-3.
  • PSU blank is required in an empty slot.
  • The heater Module is not supported with Intel Ethernet 100G 2P E810-2C.

Heater Manager subsystem

  • Telco systems are deployed in remote locations where the systems need to operate in extended (-20C to 39 65C) or extreme (-20C to 55C) temperature ranges. As many of the hardware components (such as iDRAC, 40 CPU, DIMM, SSD, etc.) used in the system cannot operate below 0C, the system needs to be pre-heated to above 5C before the system can power on Heater Manager subsystem (HM) will pre-heat the system, make sure all the heater zones (9 zones total) are above 5C. The HM heats the system as needed such that the temperatures of all zones are above 5°C.
  • The heater Manager subsystem (HM) is only supported in 2U XR8620t.
  • Heater Manager subsystem (HM) heating from -20°C to system start booting: ~4 minutes.
  • The max power draw per 2U HM sled is about 750 W during the preheat process.