Dell PowerEdge XR7620: руководство по обслуживанию

Chassis dimensions

This image shows chassis dimension for the PowerEge XR7620 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeXR7620 chassis dimensionsThis table provides the dimensions of the system:
Configuration	Xa	Xb	Y	Za	Zb	Zc
Rear Accessed configuration	482.6 mm (19 inches)	447 mm (17.59 inches)	86.8 mm (3.41 inches)	47.5 mm (1.87 inches) with bezel	448.8 mm (17.6 inches) Ear to rear wall	484.3 mm (19.06 inches) Ear to PSU handle)
Front Accessed configuration	482.6 mm (19 inches)	447 mm (17.59 inches)	86.8 mm (3.41 inches)	123 mm (4.84 inches) with bezel	449 mm (17.67) Ear to rear wall	NA

NOTE:Without the front bezel, Rear Accessed configuration support racks with 80 mm spacing from rack post to inside surface of rack door. With the front bezel installed, the Rear Accessed configuration system support racks with 100 mm spacing from rack post to inside surface of the rack door.

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge XR7620 system weight for Rear accessed configurationThe table below shows the maximum weight of the system for Rear accessed configuration.
System configuration	Maximum weight for rear accessed configuration (with all drives/SSDs)
A server with fully populated drives	21.16 kg (46.64 lb)
A server without drives and PSU installed	15.78 kg (34.78 lb)

Table 2. PowerEdge XR7620 system weight for Front accessed configurationThe table below shows the maximum weight of the system for Front accessed configuration.
System configuration	Maximum weight for front accessed configuration (with all drives/SSDs)
A server with fully populated drives	21.16 kg (46.64 lb)
A server without drives and PSU installed	16.94 kg (37.34 lb)

Processor specifications

Table 1. PowerEdge XR7620 processor specifications This table provides processor specifications for the system.
Supported processor	Number of processor supported
4^th and 5^th Gen Intel^® Xeon^® Scalable Processors with up to 32 cores	Two

PSU specifications

The PowerEdgeXR7620system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Voltage	AC		DC	Current (A)
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Voltage	High line wattage (200—240 V AC)	Low line wattage (100—120 V AC)	DC	Current (A)
1800 W Mixed Mode	Titanium	6610	50/60	200—240 V AC	1800	1050 W	N/A	10
1800 W Mixed Mode	N/A	6610	N/A	240 V DC	N/A	N/A	1800 W	8.2
1400 W Mixed Mode	Platinum	5250	50/60	100—240 V AC	1400 W	1050 W	N/A	12—8
	N/A	5250	N/A	240 V DC	N/A	N/A	1400 W	6.6
	Titanium	5250	50/60	100-240 V AC	1400 W	1050 W	N/A	12-8
	N/A	5250	N/A	240 V DC	N/A	N/A	1400 W	6.5
	Titanium	5250	50/60	277 V AC	1400 W	1050 W	N/A	5.8
	N/A	5250	N/A	336 V DC	N/A	N/A	1400 W	5.17
1100 W Mixed Mode	Titanium	4125	50/60	100—240 V AC	1100 W	1050 W	N/A	12—6.3
1100 W Mixed Mode	N/A	4125	N/A	240 V DC	N/A	N/A	1100 W	5.2
1100 W DC	N/A	4265	N/A	-48— -60 V DC	N/A	N/A	1100 W	27

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:If a system with AC 1400W/1100W PSUs operates at low line 100-120 V AC, then the power rating per PSU is derated to 1050 W.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

NOTE:For information about DC PSU cabling instructions, go to PowerEdge Manuals > XR Servers > PowerEdgeXR7620 > Select This Product > Documentation > Manuals and Documents > Cabling instructions for – 48 – 60 V DC power supply.

this image shows list of PSU power cords — Figure 1. PSU power cords

this image shows list of PSU power cord — Figure 2. APP 2006G1 power cable

Table 2. PSU power cordsThe table lists the PSU power cords list .
Form factor	Output	Power cord
Redundant 60 mm	1100 W AC	C13
	1100 W -48 DC	DC inlet/input
	1400 W AC	C13
	1400 W mixed mode 277 Vac and HVDC	APP 2006G1
	1800 W AC	C15

NOTE:C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Supported operating systems

The PowerEdge XR7620 system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
Dell NativeEdge operating system

For more information, go to OS support.

Cooling fan specifications

The PowerEdgeXR7620 system supports six cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Also known as	Label color	Label image
Rear accessed configuration	No label
Front accessed configuration	No label

Expansion card riser specifications

The PowerEdge XR7620 system supports up to five PCI express (PCIe) slots (four full lengths and one low profile) on the system board.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the PowerEdge XR7620 system.
PCIe slot	PCIe slot height and length	R1A	R1B	R2A	R2B	R3
Slot 1	Full height - Half/Full length	x16	x16	-	-	-
Slot 2	Full height - Half/Full length	x16 (Gen5)	x16 (Gen5)	-	-	-
Slot 3	Full heigh - Half/Full length	-	-	x16	x16	-
Slot 4	Full height - Half/Full length	-	-	x16 (Gen5)	x16 (Gen5)	-
Slot 5	Low Profile - Half length	-	-	-	-	x16

NOTE: PCIe length for R1A is Full Length and for R1B it is Half Length.

NOTE:Slot 2 and slot 4 of the five PCIe slots can support both Gen4 and Gen5. Slot 1, slot 3 and slot 5 supports only Gen4.

Memory specifications

The PowerEdge XR7620 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Dual processor
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity
DDR5 RDIMM	Single rank	16 GB	32 GB	256 GB
	Dual rank	32 GB	64 GB	512 GB
	Dual rank	64 GB	128 GB	1 TB
	Quad rank	128 GB	256 GB	2 TB

NOTE:Do not mix DIMM module types within a memory channel. All must be RDIMM, RDIMM 3DS module types, with same ECC configuration.

NOTE:Do not mix x4 and x8 DIMMs within a memory channel.

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
16, 288-pin	4800 MT/s

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:The processor may reduce the performance of the rated DIMM speed.

Storage controller specifications

The PowerEdge XR7620 system supports the following controller card:

Table 1. Storage controller cards This table provides the controller cards that are supported on the system:
Supported storage controller card
Software RAID S160
Internal controllers PERC H965i PERC H755 PERC H355 HBA355i
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 1, 2 x M.2 NVMe SSDs (cold swap) or Optional internal USB 2.0
SAS Host Bus Adapters HBA355i HBA465i

NOTE:BOSS-N1 and Internal USB are mutually exclusive.

Drives

The PowerEdge XR7620 system supports:

8 x E3.s NVMe direct
8 x E3.s NVMe RAID
4 x 2.5-inch SAS\SATA RAID or U.2 NVMe direct
4 x 2.5-inch U.2 NVMe direct

NOTE: The system with E3.S and U.2 NVMe drives can support up to Gen4 only.

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

GPU specifications

The PowerEdge XR7620 system supports up to 5 x 75 W (Single Width Full Height/Half Length, Low Profile) GPU or up to 2 x 300 W (Double Width Full Height/Full Length) GPU based on riser configuration.

NOTE:Systems that are configured with GPUs have higher fan acoustics.

NOTE:Each 300 W GPU requires one additional GPU power cable. These can be purchased individually as an upgrade kit or they can be found in SKUs that are GPU ready , kindly contact a sales representative.

NOTE:GPU power cables have a maximum capacity of 350 W . Risk of damage if GPU power consumption is above 350 W.

NOTE:Riser Configuration 2 offers the XR7620 GPU Ready option.

NOTE:In order to maintain system thermal health, install the GPU blank if the GPU card is not installed.

System battery specifications

The PowerEdge XR7620 system uses one CR 2032 3.0-V lithium coin cell battery.

USB ports specifications

Table 1. PowerEdge XR7620 USB ports specifications for Rear Accessed configuration The following table shows the USB specifications :
Front		Rear		Internal (optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0	One
Micro-USB 2.0-compliant port for iDRAC Direct	One	USB 3.0-compliant ports	One	Internal USB 3.0	One

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NOTE:BOSS-N1 and Internal USB are mutually exclusive.

Table 2. PowerEdge XR7620 USB ports specifications for Front Accessed configurationThe following table shows the USB specifications :
Front		Internal (optional)
USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	Two	Internal USB 3.0	One
USB 3.0-compliant ports	One
Micro-USB 2.0-compliant port for iDRAC Direct	One

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NOTE:BOSS-N1 and Internal USB are mutually exclusive.

NIC port specifications

The PowerEdge XR7620 system supports two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and up to four ports integrated on the Open Compute Project (OCP) cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
LOM	1 Gb x 2
(Optional) OCP card (OCP 3.0)	1GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2 SFP28, 25 GbE x 4 SFP28

NOTE:On the system board, the supported OCP PCIe width is x8; when x16 PCIe width is installed, it is downgraded to x8.

Serial connector specifications

The PowerEdge XR7620 system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge XR7620 system supports One DB-15 VGA port on the rear of the Rear Accessed configuration and one DB-15 VGA port on the front of the Front Accessed configuration.

Video specifications

The PowerEdge XR7620 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

The PowerEdge XR7620 system operates in these environmental categories: ASHRAE A2/A3/A4 and Edge1 (50°C) and Edge2 (55°C).

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation > Regulatory Information on Dell Support.

Table 1. Continuous operation specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
-	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous operation specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
-	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous operation specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
-	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Continuous operation specifications for Edge1 (50°C) and Edge2 (55°C) This table describes the operational climatic range for Edge1 and Edge2.
-	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	(-5)–55°C (23–131°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/80 m (33.8°F/410 Ft) above 900 m (2953 Ft)

NOTE:Do not perform a cold startup below 5°C.

Table 5. Common environmental specifications for ASHRAE A2, A3, A4, Edge1 (50°C) and Edge2 (55°C) This table describes the shared requirements across all categories.
-	Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-104 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

NOTE:Do not perform a cold startup below 5°C

Table 6. Maximum vibration specifications for the systemThis table gives Maximum vibration specifications for the system
Maximum vibration	Specifications
Operating	0.21 Grms at 5 Hz to 500 Hz (all operation orientations) For Military (with Military tool kit), Method 514.8; Category 20(Marine Vehicles) Annex D 2.9a (Wheeled vehicles) Procedure I, 5 Hz to 500 Hz Method 514.8; Category 21(Ground Vehicles) Annex D 2.10, procedure I, 10 Hz to 100 Hz
Storage	1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested) For Military (with Military tool kit), Method 514.6; Category 4. 1 Hour per axis, 3 axes, 5-500 Hz, X@0.76 Grms, Y@0.21 Grms, Z@1.08 Grms , 60 minutes/axis

Table 7. Maximum shock pulse specifications for the systemThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.(4 pulse on each side of the system) For Military (with Military tool kit) Method 516.8 Procedure I, 40G, 11ms, 3 shocks, +-per direction, 3 axes
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms. For Military (with Military tool kit) Method 516.8 Procedure V, 40G, 11ms, 3 shocks, +-per direction, 3 axes

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 8. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles NOTE:This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust Residual dust present in the air must have a deliquescent point less than 60% relative humidity NOTE:This condition applies to data center and non-data center environments.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened 6 times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.

Table 9. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal restriction matrix

Thermal restriction for Front accessed configuration

NOTE: Minimum cold boot temperature at ≥ 5°C.

Table 1. Processor thermal restriction without full-length cards - Front accessed configuration The table describes Processor thermal restriction Front accessed configuration without full-length cards for the PowerEdge XR7620 system.
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)	Edge1 (Max 50°C)	Edge2 (Max 55°C)
Intel® Xeon® Gold 6448Y	225 W	STD heat sink	Not supported
Intel® Xeon® Gold 6442Y	225 W	STD heat sink	Not supported
Intel® Xeon® Gold 5418Y	185 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 6426Y	185 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4416+	165 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 5416S	150 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4410Y	150 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 5415+	150 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4510	150 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4509Y	125 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 6526Y	195 W	STD heat sink	STD heat sink	STD heat sink	Not supported
Intel® Xeon® Silver 4514Y	150 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink

NOTE:The processor may reduce the performance of the rated DIMM speed.

Table 2. Memory thermal restrictions without full-length cards - Front Accessed configurationMemory thermal restrictions- Front Accessed configuration
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)	Edge1 (Max 50°C)	Edge2 (Max 55°C)
Memory	DDR5 RDIMM 4800 MT/s 128 GB	Supported	Not supported	Not supported	Not supported	Not supported
	DDR5 RDIMM 4800 MT/s 64 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 32 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 16 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 128 GB	Supported	Not supported	Not supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 96 GB	Supported	Not supported	Not supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 64 GB	Supported	Supported	Supported	Supported	Not supported
	DDR5 RDIMM 5600 MT/s 32 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 16 GB	Supported	Supported	Supported	Supported	Supported

NOTE:The processor may reduce the performance of the rated DIMM speed.

Table 3. Thermal restrictions without full-length cards - Front accessed configuration The table describes Thermal restrictions Front accessed configuration without full-length cards for the PowerEdge XR7620 system.
Chassis configuration		XR7620 Front accessed configuration - Without full-length cards
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)	Edge1 (Max 50°C)	Edge2 (Max 55°C)
Nvidia GPU A2		Support up to 45°C.			Not supported.
Nvidia GPU L4		Support up to 45°C.			Not supported.
M.2 NVMe (BOSS-N1)	Micron 7400	960 GB support up to 50°C. Only 480 GB can support up to 55°C.
	Micron 7450
	Hynix PE8010	1.92 TB/960 GB only support up to 50°C. 480 GB can support up to 55°C.
	Hynix PE9010
	Hynix PE9030	800 GB support up to 50°C.
EDSFF E3.S		Support up to 45°C.			Not supported.
2.5-inch U.2 NVMe SSD		Support up to 40°C. Hynix PE8010 only supports up to 35°C.		Not supported.
PCIe COMM Card		Non-Dell qualified PCIe COMM cards are not supported.
OCP COMM Card		Non-Dell qualified OCP COMM card is not supported.
Active Optical Cables/Transceivers		QSFP optic cables or transceivers with 70C spec support only up to 50°C. QSFP optic cables or transceivers with 85°C spec support up to 55°C. SFP optic cables or transceivers support up to 55°C.

Table 4. Processor thermal restriction with full-length cards - Front accessed configuration The table describes Processor thermal restriction Front accessed configuration with full-length cards for the PowerEdge XR7620 system.
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)
Intel® Xeon® Gold 6448Y	225 W	Not supported		Not supported
Intel® Xeon® Gold 6442Y	225 W	Not supported
Intel® Xeon® Gold 5418Y	185 W	STD heat sink	STD heat sink
Intel® Xeon® Gold 6426Y	185 W	STD heat sink	STD heat sink
Intel® Xeon® Silver 4416+	165 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 5416S	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4410Y	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 5415+	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4510	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4509Y	125 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 6526Y	195 W	STD heat sink	Not supported
Intel® Xeon® Silver 4514Y	150 W	STD heat sink	STD heat sink	STD heat sink

Table 5. Memory thermal restrictions with full-length cards - Front Accessed configurationMemory thermal restrictions- Front Accessed configuration
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)
Memory	DDR5 RDIMM 4800 MT/s 128 GB	Supported	Not supported	Not supported
	DDR5 RDIMM 4800 MT/s 64 GB	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 32 GB	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 16 GB	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 128 GB	Supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 96 GB	Supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 64 GB	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 32 GB	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 16 GB	Supported	Supported	Supported

NOTE:The processor may reduce the performance of the rated DIMM speed.

Table 6. Thermal restrictions with full-length cards - Front accessed configuration The table describes Thermal restrictions Front accessed configuration with full-length cards for the PowerEdge XR7620 system.
Chassis configuration	XR7620 Front accessed configuration - With full-length cards
Ambient temperature	ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)
Nvidia GPU A2	Only support up to 35°C with CPU ≤ 185 W.	Not supported.
Nvidia GPU L4	Only support up to 35°C with CPU ≤ 185 W.	Not supported.
Nvidia GPU L4	Support up to 45°C.
Nvidia GPU A100 80G
Nvidia GPU A30
Nvidia GPU A800
Intel Ponte Vecchio (PVC) 300 W
Nvidia GPU L40S 350 W	Support up to 40°C.
2.5-inch U.2 NVMe SSD	Support up to 40°C. Hynix PE8010 only supports up to 35°C.		Not supported.
PCIe COMM Card	Non-Dell qualified PCIe COMM cards are not supported.
OCP COMM Card	Non-Dell qualified OCP COMM card is not supported.

Processor thermal restriction for Rear accessed configuration

NOTE: Minimum cold boot temperature at ≥ 5°C.

Table 7. Processor thermal restriction without full-length cards - Rear accessed configuration The table describes Thermal restriction Rear accessed configuration with full-length cards for the PowerEdge XR7620 system.
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)
Intel® Xeon® Gold 6448Y	225 W	STD heat sink	Not supported	Not supported
Intel® Xeon® Gold 6442Y	225 W	STD heat sink	Not supported	Not supported
Intel® Xeon® Gold 5418Y	185 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 6426Y	185 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4416+	165 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 5416S	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4410Y	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 5415+	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4510	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4509Y	125 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 6526Y	195 W	STD heat sink	Not supported
Intel® Xeon® Silver 4514Y	150 W	STD heat sink	STD heat sink	STD heat sink

Table 8. Memory thermal restrictions without full-length cards - Rear Accessed configurationMemory thermal restrictions- Rear Accessed configuration
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)
Memory	DDR5 RDIMM 4800 MT/s 128 GB	Supported	Not supported	Not supported
	DDR5 RDIMM 4800 MT/s 64 GB	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 32 GB	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 16 GB	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 128 GB	Supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 96 GB	Supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 64 GB	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 32 GB	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 16 GB	Supported	Supported	Supported

Table 9. Thermal restriction without full-length cards - Rear accessed configuration The table describes Thermal restriction Rear accessed configuration with full-length cards for the PowerEdge XR7620 system.
Chassis configuration		XR7620 Rear accessed configuration - Without full-length cards
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4(Max 45°C)
Nvidia GPU A2		Only support up to 35°C with CPU ≤ 205 W	Not supported.
Nvidia GPU L4		Only support up to 35°C with CPU ≤ 205 W
M.2 NVMe (BOSS-N1)	Micron 7400	Max 960 GB support up to 35°C.
	Micron 7450	Max 960 GB support up to 35°C.
	Hynix PE8010	Max 1.2 TB support up to 35°C.
	Hynix PE9010	Max 1.2 TB support up to 35°C.
	Hynix PE9030	Max 800 GB support up to 35°C.
2.5-inch NVMe SSD		Support up to 35°C.
PCIe COMM Card		Non-Dell qualified PCIe COMM cards are not supported.
OCP COMM Card		Non-Dell qualified OCP COMM card is not supported.
Active Optical Cables/Transceivers		Not support optic cables or transceivers with 70°C spec. Optic cables or transceivers with 85C spec support up to 45°C.

Table 10. Processor thermal restriction with full-length cards - Rear accessed configuration The table describes Processor thermal restriction Rear accessed configuration with full-length cards for the PowerEdge XR7620 system.
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)
Intel® Xeon® Gold 6448Y	225 W	Not supported		Not supported
Intel® Xeon® Gold 6442Y	225 W	Not supported
Intel® Xeon® Gold 5418Y	185 W	STD heat sink	STD heat sink
Intel® Xeon® Gold 6426Y	185 W	STD heat sink	STD heat sink
Intel® Xeon® Silver 4416+	165 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 5416S	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4410Y	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 5415+	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4510	150 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Silver 4509Y	125 W	STD heat sink	STD heat sink	STD heat sink
Intel® Xeon® Gold 6526Y	195 W	STD heat sink	Not supported
Intel® Xeon® Silver 4514Y	150 W	STD heat sink	STD heat sink	STD heat sink

Table 11. Memory thermal restrictions with full-length cards - Rear Accessed configurationMemory thermal restrictions- Rear Accessed configuration
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)
Memory	DDR5 RDIMM 4800 MT/s 128 GB	Supported	Not supported	Not supported
	DDR5 RDIMM 4800 MT/s 64 GB	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 32 GB	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 16 GB	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 128 GB	Supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 96 GB	Supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 64 GB	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 32 GB	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 16 GB	Supported	Supported	Supported

Table 12. Thermal restrictions with full-length cards - Rear accessed configurationThe table describes Thermal restrictions Rear accessed configuration with full-length cards for the PowerEdge XR7620 system.
Chassis configuration	XR7620 Rear accessed configuration - With full-length cards
Ambient temperature	ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)
Nvidia GPU A2	Not supported.
Nvidia GPU L4	Not supported.
Nvidia GPU A30	Support up to 40°C.		Not supported.
Nvidia GPU L40S 350 W
Nvidia GPU A100 80G
Nvidia GPU A800
Intel Ponte Vecchio (PVC) 300 W	PVC support up to 40°C.
BOSS M.2	Support up to 35°C.	Not supported.
2.5-inch NVMe SSD	Support up to 35°C.	Not supported.
PCIe COMM Card	Mellanox CX6 100 G low profile only support up to 35°C. Non-Dell qualified PCIe COMM cards are not supported.
OCP COMM Card	Non-Dell qualified OCP COMM cards are not supported.
Active Optical Cables/Transceivers	Not support optic cables or transceivers with 70°C spec. Optic cables or transceivers with 85°C spec support up to 45°C.

Other Thermal Restrictions

Rear accessed configuration supports only up to 45°C.
On Front accessed configuration chassis, when 1U CPU HSK XTCC1 is installed, above 45°C ambient is not supported.
Full-length cards and half-length cards cannot be mixed on PCIe slot 1~4 in configuration.
At least 1x full-length card is needed for 1U HS configuration, no cards configuration only support with 2U height CPU Heat sink.
Minimum cold boot temperature at ≥ 5°C.
SAS/SATA SSD minimum operating temperature ≥ 0°C
Two PSUs are needed in redundancy mode over 50°C ambient. In the event of a PSU failure, system performance may be reduced.
Hot swap fan is not supported.
DIMM Blank is required for any empty slot.
HDD blank is required for any empty slot.
E3.S blank is required for any empty slot.
PSU blank is required for any empty slot.
OCP blank is required for any empty slot.
GPU internal blank is required for any empty slot on full-length configuration.
Full-height PCIe blank is required for any empty slot (PCIe slot 1~4).
Low profile PCIe blank is required for any empty slot (PCIe slot 5).

NOTE:Fan speed may increase at ambient < 0°C with SAS/SATA SSD. This indicates that the fan is working as design for overall system stability.

Military tool kits (MIL kits) supported

Table 13. Military tool kits supportedThis table describes the Military tool kits (MIL kits) supported in the system.
MIL kits	Supported/Not supported
461 MIL thermals	Supported
810MIL thermals	Supported
810 MIL sand and dust	Supported
810 MIL shock and vibrations	Not supported
901 MIL	Not supported

NOTE:To support the 461 & 810 Military tool kits requirement, the customer must acquire the Military tool kit SKU Chassis and Military tool kit..