Dell PowerEdge XR5610: руководство по обслуживанию

Chassis dimensions

This image shows chassis dimension for the PowerEge XR11 system. — Figure 1. Chassis dimensions

Table 1. Chassis dimensionsThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za without bezel	Za with bezel	Zb	Zc
Rear Accessed configuration	482.6 mm (19 inches)	434 mm (17 inches)	42.8 mm (1.68 inches)	22.0 mm (0.86 inches)	47 mm (1.85 inches) Back of rack ear to most outer surface of bezel	435 mm (17.12 inches) Back of ear to main IO wall	442 mm (17.40 inches) Back of ear to PSU handle
Front Accessed configuration	482.6 mm (19 inches)	434.0 mm (17 inches)	42.8 mm (1.68 inches)	47.75 mm (1.88 inches) (left ear) 31.35 mm (1.23 inches) (right ear)	148 mm (5.82 inches) Back of rack ear to most outer surface of bezel	409 mm (16.10 inches) Back of ear to chassis face	417 mm (16.41 inches) Back of ear to MIL drive bracket edge

NOTE:Without the front bezel, Rear Accessed configuration support racks with 80 mm spacing from rack post to inside surface of rack door. With the front bezel installed, the Rear Accessed configuration system support racks with 100 mm spacing from rack post to inside surface of the rack door.

System weight

Table 1. PowerEdge XR5610 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs/rails/bezel)
Rear Accessed configuration	11.27 kg (24.8 lb)
Front Accessed configuration	11.37 kg (25.1 lb)

Processor specifications

Table 1. PowerEdge XR5610 processor specificationsThis table provides processor specifications for the system.
Supported processor	Number of processor supported
4^th Generation and 5^th Generation Intel Xeon Scalable and Edge-Enhanced processor and Edge-Enhanced CPUs with up to 32 cores	One

NOTE:It is recommended to use a maximum of two add-in cards with SPR EE-LCC CPU. Three add-in cards are supported, but this may result in an overall system performance degradation. .

PSU specifications

The PowerEdgeXR5610system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specificationsThe table lists the specifications for the power supplies.
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	DC		DC	Current
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	High line 240 V DC	Low line	DC	Current
1800 W Mixed Mode	Titanium	5406 BTU/hr	50/60 Hz	200-240 V AC, autoranging	1800 W	1050 W	N/A	10 A
1800 W Mixed Mode	Titanium	5406 BTU/hr	N/A	240 V DC	N/A	N/A	1400 W	8.2 A
1400 W Mixed Mode	Platinum	5406 BTU/hr	50/60 Hz	100–240 V AC, autoranging	1400 W	1050 W	N/A	12 A-8 A
1400 W Mixed Mode	Platinum	5406 BTU/hr	N/A	240 V DC	N/A	N/A	1400 W	6.6 A
1100 W Mixed Mode	Titanium	4299 BTU/hr	50/60 Hz	100–240 V AC, autoranging	1100 W	1050 W	N/A	12 A-6.3 A
1100 W Mixed Mode	Titanium	4299 BTU/hr	N/A	240 V DC	N/A	N/A	1100 W	5.2 A
1100 W DC	N/A	4265 BTU/hr	N/A	-48-(-60) V	N/A	N/A	1100 W	27 A
800 W Mixed Mode	Platinum	3000 BTU/hr	50/60 Hz	100–240 V AC, autoranging	800 W	800 W	800 W	9.2 A-4.7 A
800 W Mixed Mode	Platinum	3000 BTU/hr	N/A	240 V DC	N/A	N/A	800 W	3.8A

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

NOTE:For information about DC PSU cabling instructions, go to PowerEdge Manuals > XR Servers > PowerEdgeXR5610 > Select This Product > Documentation > Manuals and Documents > Cabling instructions for – 48 – 60 V DC power supply.

Power cords

This image shows the DC PSU power cord — Figure 1. DC PSU power cord

Table 2. PSU power cables typesThe following table lists the AC PSU power cables types.
Form factor	Output	Power cord
Redundant 60 mm	800 W Mixed Mode	C13
	1100 W Mixed Mode	C13
	1100 W -48—(-60) V DC	DC power cable
	1400 W Mixed Mode	C15
	1800 W Mixed Mode	DC power cable

Supported operating systems

The PowerEdge XR5610 system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterpriser Server
VMware ESXi
Dell NativeEdge OS

For more information, go to OS support.

Cooling fans specifications

The PowerEdge XR5610 system supports six standard fans and requires all six fans to be installed.

System battery specifications

The PowerEdge XR5610 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge XR5610 system supports up to two PCI express (PCIe) Gen5 (Intel Xeon Scalable processor)/ PCIe Gen4 (Edge-Enhanced processor) expansion cards.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Risers	PCIe slot height	PCIe slot length	PCIe slot width
Slot 1	Riser 3	Full height	Half Length	x16
Slot 2	Riser 3	Full height	Half length	x16
Slot 3	Riser 1 (FLOP)	N/A	N/A	x16

NOTE:Only use certified Optical Fiber Transceiver Class | Laser Products.

CAUTION: Do not install GPUs, network cards, or other PCIe devices on your system that are not validated and tested by Dell. Damage caused by unauthorized and invalidated hardware installation will null and void the system warranty.

WARNING: Consumer-Grade GPU should not be installed or used in the Enterprise Server products.

Memory specifications

The PowerEdge XR5610 system supports the following memory specifications for optimized operation:

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor
DIMM type	DIMM rank	DIMM capacity	Minimum RAM	Maximum RAM
RDIMM	Single rank	16 GB	16 GB	128 GB
	Dual rank	32 GB	32 GB	256 GB
	Dual rank	64 GB	64 GB	512 GB
	Dual rank	96 GB	96 GB	768 GB
	Quad rank	128 GB	128 GB	1 TB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
8, 288-pin	4800 MT/s

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:The processor may reduce the performance of the rated DIMM speed.

Storage controller specifications

Table 1. PowerEdge XR5610 system storage controller specificationsThis table provides the controller cards that are supported on the system:
Supported storage controller cards
Software RAID S160
Internal controllers PERC H965i PERC H965e PERC H755 PERC H355 NOTE:PERC H965e is not compatible with Intel Ethernet 100G 2P E810-—2C Adapter.
External controllers HBA355e
Internal boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 1, 2 x M.2 SSDs
SAS host bus adapters HBA355i

NOTE:The XR5610 backplane support up to SAS3 speed only for SAS drives.

Drives specifications

ThePowerEdge XR5610 system supports 4 x 2.5-inch SAS, SATA, or NVMe SSD drives.

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

NOTE:Spinning hard drives are not supported in the XR5610.

USB ports specifications

Table 1. PowerEdge XR5610 system USB ports specifications for Rear Accessed configurationThe following table shows the USB specifications :
Front		Rear
USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 3.0-compliant port	One

Table 2. PowerEdge XR5610 system USB ports specifications for Front Accessed configurationThe following table shows the USB specifications :
Front		Rear
USB port type	No. of ports	USB port type	No. of ports
USB 3.0-compliant port	One	None
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	None

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

Display port specifications

The PowerEdge XR5610 system supports 1 x Mini-DisplayPort on the rear of the Rear Accessed configuration and on the front of the Front Accessed configuration.

GPU specifications

The PowerEdge XR5610 system supports up to two 75 W/150 W (single-width, low-profile, and half-length) GPUs.

iDRAC9 port specifications

The PowerEdge XR5610 system supports 1 x RJ45 with port status LEDs for iDRAC remote management (dedicated port only) on rear of the Rear Accessed configuration and on the front of the Front Accessed configurations.

Serial connector specifications

The PowerEdge XR5610 system supports one Micro USB Type B serial connector that is located on the rear of the Rear Accessed configuration and on the front of the Front Accessed configuration.

NOTE:The serial console is disabled when share management is being used.

RJ45 dry contact

The PowerEdgeXR5610system supports 1 x RJ45 for dry contact on rear of the Rear Accessed configuration and on the front of the Front Accessed configuration.

To enhance usage in IoT space, the XR5610 comes with dry input sensor. Each input are configurable and manageable in the iDRAC interface. These are interruptible inputs to iDRAC. Dry means no energy is supplied to the contacts.

The image shows the iDRAC interface for dry input sensors — Figure 1. iDRAC interface for Dry Input sensors

NOTE:The RJ45 for dry contact does not support IP function.

The default state of the dry inputs are off/disabled. User will have 7 (one for each dry input) enable/disable (default) control that must be enabled before logging will occur.

This image shows the dry input connection diagram — Figure 2. Dry input connection diagram

The 7 dry inputs are interruptible inputs to iDRAC.They have the following characteristics:

Monitored by iDRAC for state transition and LC event will be logged for each state transition.
NOT modeled as IPMI sensors but LC event only sensors. The current state of the input is not monitored or displayed anywhere.
Event Log - transitions (Open to close or close to Open) will be logged in LC only.

Table 1. Proposed EEMI messagesProposed EEMI messages
Message ID	Message	RRA	DD	Severity
DCI1000	Dry input <input index> is transitioned to Open state.	None.	None	Severity -3 (Info)
DCI1001	Dry input <input index> is transitioned to Close state.	None.	None	Severity -3 (Info)

NIC port specifications

The PowerEdge XR5610 system supports four embedded LOM ports that provide 4 x 25 GbE SFP28.

There is also a dedicated iDRAC management port that supports 1GbE.

Table 1. Network port specificationsNetwork port specifications.
Feature	Specifications
LOM	10 GbE, 25 GbE NOTE:The lowest connection speed for LOM is 10 GbE.
RJ45 for iDRAC	1 GbE
OCP card (3.0)	1 GbE, 10 GbE, 25 GbE

NOTE:The system allows either NIC card or OCP card or both to be installed in the system.

NOTE:Shared management of iDRAC is capable through the embedded LOM, OCP ports, and PCIe slots 1 from riser 3.

Video specifications

The PowerEdge XR5610 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution	Refresh Rate	Color depth (Bits)
1024 x 768	60 Hz	8, 16, 32
1280 x 800	60 Hz	8, 16, 32
1280 x 1024	60 Hz	8, 16, 32
1360 x 768	60 Hz	8, 16, 32
1440 x 900	60 Hz	8, 16, 32
1600 x 900	60 Hz	8, 16, 32
1600 x 1200	60 Hz	8, 16, 32
1680 x 1050	60 Hz	8, 16, 32
1920 x 1080	60 Hz (RB)	8, 16, 32
1920 x 1200	60 Hz (RB)	8, 16, 32

NOTE:Use a certified Mini-DisplayPort to DisplayPort cable complying with VESA DisplayPort standards for video output with a monitor.

NOTE:Mini-DisplayPort to VGA or Mini-DisplayPort to HDMI adapters are not recommended.

Environmental specifications

The PowerEdge XR5610 system operates in these environmental categories: ASHRAE A2/A3/A4 and Edge1 (50°C) and Edge2 (55°C).

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation > Regulatory Information on Dell Support.

Table 1. Continuous operation specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Feature	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous operation specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Feature	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous operation specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Feature	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Continuous operation specifications for Edge1 (50°C) and Edge2 (55°C) This table describes the operational climatic range for category A4.
Feature	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	(-5)–55°C (23–131°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/80 m (33.8°F/410 Ft) above 900 m (2953 Ft)

NOTE:Do not perform a cold startup below 5°C.

Table 5. Common environmental specifications for ASHRAE A2, A3, A4, Edge1 (50°C) and Edge2 (55°C) This table describes the shared requirements across all categories.
Feature	Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-104 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

NOTE:Do not perform a cold startup below 5°C

Table 6. Maximum vibration specifications for the systemThis table gives Maximum vibration specifications for the system
Maximum vibration	Specifications
Operating	0.21 Grms at 5 Hz to 500 Hz (all operation orientations) For Military (with Military tool kit), Method 514.8; Category 20(Marine Vehicles) Annex D 2.9a (Wheeled vehicles) Procedure I, 5 Hz to 500 Hz Method 514.8; Category 21(Ground Vehicles) Annex D 2.10, procedure I, 10 Hz to 100 Hz
Storage	1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested) For Military (with Military tool kit), Method 514.6; Category 4. 1 Hour per axis, 3 axes, 5-500 Hz, X@0.76 Grms, Y@0.21 Grms, Z@1.08 Grms , 60 minutes/axis

Table 7. Maximum shock pulse specifications for the systemThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.(4 pulse on each side of the system) For Military (with Military tool kit) Method 516.8 Procedure I, 40G, 11ms, 3 shocks, +-per direction, 3 axes
Operating (Navy)	MIL-STD-901E, Grade A, Class 2, Type A, in approved military transit case
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms. For Military (with Military tool kit) Method 516.8 Procedure V, 40G, 11ms, 3 shocks, +-per direction, 3 axes

Particulate and gaseous contamination specifications

The following table defines the limitations that prevent any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened 6 times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

NOTE:Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Rugged certifications and specifications

The PowerEdge XR5610 supports the rugged environment space for temperatures up to 55°C through custom configurations. These configurations are geared for the Telecom (or Telco) and Military industries and hence meet industry-specific standards in addition to the maximum temperature requirement of 55°C. The Telco configurations will be tested to the NEBS requirements outlined in the GR-63 and GR-1089 Telcordia specifications. The Military configurations will be tested to: MIL-STD-810H, MIL-DTL-901E and MIL-STD-461G.

Table 1. Hardened certifications and specificationsHardened certifications and specifications.
Industry	Configuration	Description
Telco	GR-1089-CORE	Electromagnetic Compatibility and Electrical Safety – Generic Criteria for Network Telecommunications Equipment
	GR-63-CORE	NEBS Requirements: Physical Protection
	SR-3580 (NEBS Level 3)	NEBS Criteria Levels
	GR-3108-CORE (Class 1)	Network Equipment in the Outside Plant (OSP). An exception is made for cold boot at 0C instead of -5C.
Military	MILSTD 810H	Environmental engineering considerations and laboratory test
	MILSTD 461G///	Requirements for the control of electromagnetic interference characteristic of subsystems and equipment
	MILSTD 901E	High impact shock test – Shipboard
	MILSTD 1474E	Department of Defense Design Criteria Standard Noise Limits

Thermal restriction matrix

Table 1. Processor thermal restrictions- Front Accessed configurationProcessor thermal restrictions- Front Accessed configuration
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)	Edge1 (Max 50°C)	Edge2 (Max 55°C)
Intel Xeon Silver 4514Y	150 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	HPR heat sink
Intel Xeon Gold 6433N	205 W	STD heat sink	STD heat sink	STD heat sink	HPR heat sink	HPR heat sink
Intel Xeon Gold 6423N	195 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	HPR heat sink
Intel Xeon Gold 6403N	185 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	HPR heat sink
Intel Xeon Silver 4510	150 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Gold 5423N	145 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Silver 4509Y	125 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Gold 6438N	205 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	HPR heat sink
Intel Xeon Gold 6421N	185 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Gold 5411N	165 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Gold 5412U	185 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	HPR heat sink
Intel Xeon Gold 5416S	150 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Gold 3408U	125 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink

NOTE:The processor may reduce the performance of the rated DIMM speed.

Table 2. Memory thermal restrictions- Front Accessed configurationMemory thermal restrictions- Front Accessed configuration
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)	Edge1 (Max 50°C)	Edge2 (Max 55°C)
Memory	DDR5 RDIMM 4800 MT/s 128 GB	Supported	Not supported	Not supported	Not supported	Not supported
	DDR5 RDIMM 4800 MT/s 64 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 32 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 16 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 128 GB	Supported	Not supported	Not supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 96 GB	Supported	Not supported	Not supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 64 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 32 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 16 GB	Supported	Supported	Supported	Supported	Supported

Table 3. Commodities thermal restrictions - Front Accessed configurationCommodities thermal restrictions - Front Accessed configuration
Chassis configuration
Ambient temperature	ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)	Edge1 (Max 50°C)	Edge2 (Max 55°C)
Qualcomm X100	Supported
Dell 100GbE QSFP28	Supported
Nokia Cloud RAN SmartNIC 2x QSFP56-DD	Supported				Not supported
NVIDIA GPU A2	A2 supports up to 50°C.				Not supported
NVIDIA GPU L4	L4 supports up to 50°C.				Not supported
2.5-inch NVMe SSD	NVMe supports up to 35°C.	Not supported	Not supported	Not supported	Not supported
2.5-inch SAS SSD	SAS SSD supports up to 45°C.	SAS SSD supports up to 45°C.	SAS SSD supports up to 45°C.	Not supported	Not supported
PCIe COMM Card	Non-Dell qualified PCIe COMM cards are not supported.
OCP COMM Card	Non-Dell qualified OCP cards are not supported.
Active Optical Cables/Transceivers	SFP transceiver above 2.5 W only with 85°C spec is supported.
PSU	Dual PSU in redundant mode is required while ambient > 50°C, single PSU is not supported.

NOTE:Nokia Rinline traffic simulated up to 200G per port with non-Nokia QSFP module.

Table 4. Processor thermal restrictions- Rear Accessed configurationProcessor thermal restrictions- Rear Accessed configuration
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)	Edge1 (Max 50°C)	Edge2 (Max 55°C)
Intel Xeon Silver 4514Y	150 W	STD heat sink	STD heat sink	STD heat sink	HPR heat sink	Not supported
Intel Xeon Gold 6433N	205 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	HPR heat sink
Intel Xeon Gold 6423N	195 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Gold 6403N	185 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Silver 4510	150 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Bronze 5423N	145 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Silver 4509Y	125 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Gold 6438N	205 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Gold 6421N	185 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Gold 5412U	185 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	HPR heat sink
Intel Xeon Gold 5411N	165 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Gold 5416S	150 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink
Intel Xeon Bronze 3408U	125 W	STD heat sink	STD heat sink	STD heat sink	STD heat sink	STD heat sink

NOTE:The processor may reduce the performance of the rated DIMM speed.

Table 5. Memory thermal restrictions- Rear Accessed configurationMemory thermal restrictions- Rear Accessed configuration
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)	Edge1 (Max 50°C)	Edge2 (Max 55°C)
Memory	DDR5 RDIMM 4800 MT/s 128 GB	Supported	Not supported	Not supported	Not supported	Not supported
	DDR5 RDIMM 4800 MT/s 64 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 32 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 4800 MT/s 16 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 128 GB	Supported	Not supported	Not supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 96 GB	Supported	Not supported	Not supported	Not supported	Not supported
	DDR5 RDIMM 5600 MT/s 64 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 32 GB	Supported	Supported	Supported	Supported	Supported
	DDR5 RDIMM 5600 MT/s 16 GB	Supported	Supported	Supported	Supported	Supported

Table 6. Commodities thermal restrictions - Rear Accessed configurationCommodities thermal restrictions - Rear Accessed configuration
Chassis configuration
Ambient temperature		ASHARE A2 (Max 35°C)	ASHARE A3 (Max 40°C)	ASHARE A4 (Max 45°C)	Edge1 (Max 50°C)	Edge2 (Max 55°C)
Qualcomm X100		Supported	Supported	Supported	Supported	Not supported
Dell 100GbE QSFP28		Supported	Supported	Supported	Supported	Not supported
Nokia Cloud RAN SmartNIC 2x QSFP56-DD		Supported	Supported	Supported	Not supported	Not supported
M.2 NVMe (BOSS-N1)	Micron 7400	Support up to 35°C.	Not supported	Not supported	Not supported	Not supported
	Micron 7450	Support up to 35°C.	Not supported	Not supported	Not supported	Not supported
	Hynix PE8010	Support up to 35°C.	Not supported	Not supported	Not supported	Not supported
	Hynix PE9010	Support up to 35°C.	Not supported	Not supported	Not supported	Not supported
NVIDIA GPU A2		A2 supports up to 40°C.		Not supported	Not supported	Not supported
NVIDIA GPU L4		L4 supports up to 40°C.		Not supported	Not supported	Not supported
2.5-inch NVMe SSD		NVMe supports up to 35°C.	Not supported	Not supported	Not supported	Not supported
2.5-inch SAS SSD		SAS SSD supports up to 45°C.			Not supported	Not supported
PERC card with battery		PERC card with battery supports up to 45°C.			Not supported	Not supported
PCIe COMM Card		Non-Dell qualified PCIe COMM cards are not supported.
OCP COMM Card		OCP card support up to 35°C. Non-Dell qualified OCP cards are not supported.	Not supported	Not supported	Not supported	Not supported
Active Optical Cables/Transceivers		Optic cables/transceivers with 70°C spec support up to 35°C. Optic cables/transceivers with 85°C spec support up to 45°C. Transceiver above 2.5W is only supported with 85°C spec up to 35°C.			Not supported	Not supported
PSU		Dual PSU in redundant mode is required while ambient > 50°C, single PSU is not supported.

NOTE:Nokia Rinline traffic simulated up to 200G per port with non-Nokia QSFP module.

Other Restrictions

Hot swap fan is not supported on the XR5610.
Min. cold boot temperature at ≥ 5°C. System operating temperature is -5°C—55°C.
DIMM Blank is required on empty slots.
OCP blank is required while empty slot.
OCP is not supported with high TDP Edge-Enhanced CPU.
PCIE blank is required on empty slots.
PSU blank is required on empty slots.
2.5-inch drive blank is required on empty slots.
Notice that the fan speed may increase at ambient <0°C with SAS/SATA SSD. This indicates that the fan is working as design for overall system stability.
With Nokia Cloud RAN SmartNIC 2x QSFP56-DD on Rear Accessed Configuration chassis, fan speed may be higher under normal operating temperature.