Dell PowerEdge XR4520c: руководство по обслуживанию

Sled dimensions

This figure shows the dimensions of the XR4520c server sled. — Figure 1. Sled dimensions

Table 1. PowerEdgeXR4520c sled dimensionsThis table provides the dimensions of the sled:
X	Y	Z (handle closed).
167.2 mm (6.58 inches)	83.25 mm (3.27 inches)	342.5 mm (13.48 inches)

System weight

Table 1. PowerEdge XR4520c system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all SSDs)
1 x DIMM, 1 x M.2 NVMe SSDs on M.2 riser, 1 x M.2 NVMe SSD on BOSS-N1	3.15 kg (6.94 pound)
4 x DIMMs, 4 x M.2 NVMe SSDs on M.2 riser, 2 x M.2 NVMe SSDs on BOSS-N1, 1 x Double Width GPU	4.69 kg (10.34 pound)

Processor specifications

Table 1. PowerEdge XR4520c processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
3^rd Generation Intel Xeon D Scalable processor with up to 20 cores	One

Cooling fan specifications

The PowerEdgeXR4520csystem supports up to three Standard (STD) cabled cooling fans for reverse and normal air-flow.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Label color	Label image
3 x Standard (STD) fans (210 mm cable length) on the upper layer	No label

Supported operating systems

The PowerEdge XR4520c system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
Dell NativeEdge OS

For more information, go to OS support.

System battery specifications

The PowerEdge XR4520c system supports CR 2032 3.0-V lithium coin cell system battery.

Memory specifications

The PowerEdge XR4520c system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity
RDIMM	Dual rank	16 GB	16 GB	64 GB
		32 GB	32 GB	128 GB
		64 GB	64 GB	256 GB
LRDIMM	Quad rank	128 GB	128 GB	512 GB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
4, 288-pin	3200 MT/s

NOTE:Memory DIMM slots are not hot swappable.

NOTE:The DIMM memory speed is 3200 MT/s. However, the system memory operating speed is up to 2933 MT/s due to CPU restrictions.

Expansion card riser specifications

WARNING:Consumer-Grade GPU should not be installed or used in the Enterprise Server products.

The PowerEdge XR4520c system supports one PCI express (PCIe) expansion card riser on the upper layer of the sled.

Table 1. Expansion card slots supported on the 2U sledThis table provides information about the expansion card slots that are supported on the 2U sled.
PCIe slots	Expansion card riser	Processor connection	Height	Length	Slot width
Slot 1 and 2	Riser 1C	Processor 1	Full Height	Three-quarter Length	x16 PCIe (Gen 4)

Storage controller specifications

The PowerEdge XR4520c system supports Boot Optimized Storage Subsystem (BOSS-N1): 2 x M.2 SSDs as internal boot.

Drives

The PowerEdge XR4520c system supports 4 x M.2 SSDs (M.2 2280 and M.2 22110) on the M.2 riser and 8 x M.2 NVMe SSDs on the PCIe Add-in card (AIC) installed on the riser module assembly.

GPU specifications

The PowerEdge XR4520c system supports up to two 150W single-width GPUs or one 250W double-width GPU.

NOTE:Systems configured with GPUs will have higher fan acoustics.

USB ports specifications

Table 1. PowerEdge XR4520c USB specificationsThe following table shows the USB specifications for the system:
Front		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports
USB 3.0-compliant port	Two	USB 3.0-compliant port	One
Micro-AB USB 2.0-compliant port for iDRAC Direct	One	USB 3.0-compliant port	One

NIC port specifications

The PowerEdge XR4520c system supports up to four Network Interface Controller (NIC) ports on the Network I/O board.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
Network I/O board	10 GbE SFP x 4 (max 50 Gb), 25 GbE SFP x 4 (max 100 Gb)

NOTE:The Network I/O board throughput depends on the core count of the processor that is used.

10GbE x 4 (max 50Gb) specification is supported on processor with up to 8 cores.
25GbE x 4 (max 100Gb) specification is supported on processor with 12-20 cores or more.

Serial connector specifications

The PowerEdge XR4520c system supports one Micro-USB debug port for Universal Asynchronous Receiver or Transmitter (UART) on the front of the system.

Display port specifications

The PowerEdge XR4520c system supports one Mini-DisplayPort on the front of the system.

iDRAC9 port specifications

The PowerEdge XR4520c system supports one RJ45 port with status LEDs for iDRAC remote management (dedicated port only) on the front of the system.

Video specifications

The PowerEdge XR4520c system supports integrated Matrox G200 graphics controller embedded in the iDRAC (BMC) chip with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
640 x 480	60	8, 16, 32
800 x 600	60	8, 16, 32
1024 x 768	60	8, 16, 32
1152 x 864	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1400 x 1050	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.

Table 1. Operational climatic range ASHRAE category A4The following table shows the operational climatic range ASHRAE category A4
ASHRAE A4	Allowable continuous operations
Temperature Ranges (For Altitude <900 meters or 2953 feet)	5°C-45°C (41°F-113°F) with no direct sunlight on the equipment
Humidity Percent Ranges (Non-Condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational Altitude De-Rating	Maximum temperature is reduced by 1°C/125 meters (1.8°F/410 feet) above 900 meters (2,953 feet)

Table 2. Operational climatic range ASHRAE Rugged (limits available components)The following table shows the operational climatic range ASHRAE Rugged (limits available components).
Rugged	Allowable continuous operations
Temperature Ranges (For Altitude <900 meters or 2953 feet)	-5°C-55°C (23°F-131°F) with no direct sunlight on the equipment
Humidity Percent Ranges (Non-Condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational Altitude De-Rating	Maximum temperature is reduced by 1°C/80 meters (1.8°F/262 feet) above 900 meters (2,953 feet)

Table 3. Shared requirementsThe following table shows the shared requirements,
Allowable continuous operations
Maximum Temperature Gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
Non-Operational Temperature Limits	-40°C-65°C (-40°F-149°F)
Non-Operational Humidity Limits (Non-Condensing at all times)	5% to 95% RH with 27°C (80.6°F) maximum dew point.
Maximum Non-Operational Altitude	12,000 meters (39,370 feet)
Maximum Operational Altitude	3,048 meters (10,000 feet)

Environmental Considerations

The PowerEdge XR4520c system is targeted for edge deployments and it meets all the additional standards for thermal, shock, vibration parameters.

Table 1. Environmental considerationsEnvironmental considerations
Industry	Configuration	Description
Telco	GR-1089-CORE	Electromagnetic Compatibility and Electrical Safety – Generic Criteria for Network Telecommunications Equipment
	GR-63-CORE	NEBS Requirements: Physical Protection
	SR-3580 (NEBS Level 3)	NEBS Criteria Levels
	GR-3108-CORE (Class 1)	Network Equipment in the Outside Plant (OSP). An exception is made for cold boot at 0C instead of -5C.
Military	MILSTD 810H	Environmental engineering considerations and laboratory test
	MILSTD 461G///	Requirements for the control of electromagnetic interference characteristic of subsystems and equipment
	MILSTD 901E	High impact shock test – Shipboard
	MILSTD 1474E	Department of Defense Design Criteria Standard Noise Limits
Marine	IEC-60945	Maritime navigation and radiocommunication equipment and systems – General requirements
Marine	DNV-GL	Environmental Test Specification for Instrumentation and Automation Equipment
Power Industry	IEEE 1613	Environmental and testing requirements for communications networking devices in electric power substations
Power Industry	IEC – 61850-3	Communication networks and systems for power utility automation
Safety	NA	LDV, IEC/EN, CFR, CSA
EMC	NA	EN, CISPR, ES, DTAG, CFR, ICES, VCCI
EMV	NA	RoHS, WEEE, EN, ECE

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. XR4000r RAF Configuration Matrix The table describes RAF configuration matrix for XR4000r chassis type:
CPU Type	HSK type	Fan type	RAF Configurations
CPU Type	HSK type	Fan type	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)
Intel® Xeon® D - 2796NT, 20C,120W	Vaper Chamber (VC) HSK	Standard (STD) fan	Yes	Yes	Yes
Intel® Xeon® D - 2776NT,16C,117W			Yes	Yes	Yes
Intel® Xeon® D - 2753NT,12C,87W			Yes	Yes	Yes
Intel® Xeon® D - 2733NT,8C,80W			Yes	Yes	Yes
Intel® Xeon® D - 2712T,4C,65W			Yes	Yes	Yes

Table 2. XR4000z RAF Configuration Matrix The table describes RAF configuration matrix for XR4000z chassis type:
CPU Type	HSK type	Fan type	RAF Configurations
CPU Type	HSK type	Fan type	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)
Intel® Xeon® D - 2796NT, 20C,120W	Vaper Chamber (VC) HSK	Standard (STD) fan	Yes	Yes	Yes
Intel® Xeon® D - 2776NT,16C,117W			Yes	Yes	Yes
Intel® Xeon® D - 2753NT,12C,87W			Yes	Yes	Yes
Intel® Xeon® D - 2733NT,8C,80W			Yes	Yes	Yes
Intel® Xeon® D - 2712T,4C,65W			Yes	Yes	Yes

PCI-E Card Support

Table 3. XR4000r PCI-E Card Support Thermal Limitation (RAF Configurations) The table describes PCI-E Card Support Thermal Limitation (RAF Configurations) for XR4000r chassis:
PCI-E Type	RAF Configurations
PCI-E Type	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)
nvidia GPGPU A2	Not Supported		Yes
nvidia GPGPU A30	Not Supported		Yes

Table 4. XR4000z PCI-E Card Support Thermal Limitation (RAF Configurations) The table describes PCI-E Card Support Thermal Limitation (RAF Configurations) for XR4000z chassis:
PCI-E Type	RAF Configurations
PCI-E Type	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)
nvidia GPGPU A2	Not Supported		Yes
nvidia GPGPU A30	Not Supported		Yes

Table 5. M.2 Support Thermal Limitation for XR4000r Chassis (RAF Configurations) M.2 Support Thermal Limitation for XR4000r Chassis (RAF Configurations)
M.2 Type	Riser Module			BOSS Module			AIC Card
M.2 Type	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)
Micron 480GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Micron 800GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Micron 960GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Micron 1.92TB	Throttling Active	Yes	Yes	No	No	No	Yes	Yes	Yes
Micron 3.84TB	Throttling Active	Yes	Yes	No	No	No	Yes	Yes	Yes
Hynix 480GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Hynix 800GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Hynix 960GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Hynix 1.92TB	Yes	Yes	Yes	No	No	No	Yes	Yes	Yes
Hynix 3.84BT	Yes	Yes	Yes	No	No	No	Yes	Yes	Yes

Table 6. M.2 Support Thermal Limitation for XR4000z Chassis (RAF Configurations)M.2 Support Thermal Limitation for XR4000z Chassis (RAF Configurations)
M.2 Type	Riser Module			BOSS Module			AIC Card
M.2 Type	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)
Micron 480GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Micron 800GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Micron 960GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Micron 1.92TB	Throttling Active	Yes	Yes	No	No	No	Yes	Yes	Yes
Micron 3.84TB	Throttling Active	Yes	Yes	No	No	No	Yes	Yes	Yes
Hynix 480GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Hynix 800GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Hynix 960GB	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Hynix 1.92TB	Yes	Yes	Yes	No	No	No	Yes	Yes	Yes
Hynix 3.84BT	Yes	Yes	Yes	No	No	No	Yes	Yes	Yes

Table 7. XR4000r NAF Configuration Matrix The table describes NAF configuration matrix for XR4000r chassis type:
CPU Type	HSK type	Fan type	RAF Configurations
CPU Type	HSK type	Fan type	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)
Intel® Xeon® D - 2796NT, 20C,120W	Vaper Chamber (VC) HSK	Fan	No	No	Yes
Intel® Xeon® D - 2776NT,16C,117W			No	No	Yes
Intel® Xeon® D - 2753NT,12C,87W			No	No	Yes
Intel® Xeon® D - 2733NT,8C,80W			No	No	Yes
Intel® Xeon® D - 2712T,4C,65W			No	No	Yes

PCI-E Card Support

Table 8. PCI-E Card Support Thermal Limitation (NAF Configurations) for XR4000r The table describes PCI-E Card Support Thermal Limitation (RAF Configurations) for XR4000r chassis:
TDP (W)	NAF Configurations
TDP (W)	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)
nvidia GPGPU A2	Not Supported		Yes
nvidia GPGPU A30	Not Supported		Yes

Table 9. M.2 Support Thermal Limitation for XR4000r Chassis (RAF Configurations) The table describes PCI-E Card Support Thermal Limitation (NAF Configurations) for XR4000r chassis:
M.2 Type	Riser Module			BOSS Module			AIC Card
M.2 Type	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)	Edge 2 (Max 55°C)	Edge 1 (Max 50°C)	ASHRAE A4 (Max 45°C)
Micron 480GB	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes
Micron 800GB	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes
Micron 960GB	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes
Micron 1.92TB	Not Supported	Not Supported	Yes	No	No	No	Not Supported	Not Supported	Yes
Micron 3.84TB	Not Supported	Not Supported	Yes	No	No	No	Not Supported	Not Supported	Yes
Hynix 480GB	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes
Hynix 800GB	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes
Hynix 960GB	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes	Not Supported	Not Supported	Yes
Hynix 1.92TB	Not Supported	Not Supported	Yes	No	No	No	Not Supported	Not Supported	Yes
Hynix 3.84BT	Not Supported	Not Supported	Yes	No	No	No	Not Supported	Not Supported	Yes