Определяем
Сегодня покупают
ГлавнаяСправочникиDellXR Servers
Dell PowerEdge R420xr: руководство по обслуживанию
← Вернуться назад
Нужна помощь с конфигурацией?
Пришлите SKU, спецификацию или список требований. Специалист Apltech проверит совместимость компонентов и найдёт актуальные артикулы
Получить консультацию →

Dell PowerEdge R420xr: руководство по обслуживанию

Technical Specifications

Processor
Processor type One or two Intel Xeon processors E5-2400 v2 product family
Expansion Bus  
Bus type PCI Express Generation 2 and 3
Expansion slots using riser card:  
  Riser 1 (Slot 1) One half-height, half length x4 link (for single processor) or One half-height, half length x16 link (for two processors)
  Riser 2 (Slot 2) One full-height, half-length x16 link
Memory  
Architecture 800 MT/s, 1066 MT/s, 1333 MT/s, or 1600 MT/s DDR3 registered, unbuffered or load-reduced Error Correcting Code (ECC) DIMMs
  Support for advanced ECC or memory optimized operation
Memory module sockets Twelve 240-pin
Memory module capacities  
  RDIMMs 4 GB (single-rank), 8 GB (single- and dual-rank), 16 GB (dual-rank), and 32 GB (quad-rank)
  UDIMMs 4 GB (single- rank) and 8 GB (single- and dual-rank)
Minimum RAM

4 GB with one processor

8 GB with two processors

Maximum RAM 192 GB with one processor
  384 GB with two processors
Drives  
Hard drives

Up to four 2.5 inch hot-swappable SAS or SATA SSDs.

  • NOTE: Four-hard-drive systems support software RAID. For more information on software RAID, see the Dell PowerEdge RAID Controller (PERC) documentation at dell.com/storagecontrollermanuals.
Connectors  
Back  
  NIC Two 10/100/1000 Mbps
  Serial 9-pin, DTE, 16550-compatible
  USB Two 4-pin, USB 2.0-compliant
  Video 15-pin VGA
  iDRAC7 One optional 1 GbE Ethernet
  External vFlash card One flash memory card slot with iDRAC Enterprise card
  • NOTE: The card slot is available for use only if the iDRAC7 Enterprise license is installed on your system.
Front  
  USB Two 4-pin, USB 2.0-compliant
  Video 15-pin VGA
Internal  
  USB One 4-pin, USB 2.0-compliant
  Internal Dual SD Module Two optional flash memory card slots with the internal SD module
  • NOTE: One card slot is dedicated for redundancy.
Video  
Video type Integrated Matrox G200 with iDRAC7
Video memory 16 MB shared with iDRAC application memory
Power
AC Power Supply (per power supply)  
  Wattage 550 W
  Heat dissipation
  • NOTE: Heat dissipation is calculated using the power supply wattage rating.

2132 BTU/hr maximum (redundant, 550 W power supply)
  Voltage
  • NOTE: This system is also designed to be connected to IT power systems with a phase to phase voltage not exceeding 230 V.
100–240 V AC, autoranging, 50/60 Hz
Battery  
  Coin-cell battery 3 V CR2032 Lithium coin cell
Expanded Operating Temperature  
  • NOTE: When operating in the expanded temperature range, system performance may be impacted.
  • NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD and in the System Event Log.
  < 10% of annual operating hours 5 °C to 40 °C at 5% to 85% RH with 26 °C dew point.
  • NOTE: Outside the standard operating temperature (10 °C to 35 °C), the system can operate down to 5 °C or up to 40 °C for a maximum of 10% of its annual operating hours.

For temperatures between 35 °C and 40 °C, de-rate maximum allowable dry bulb temperature by 1 °C per 175 m above 950 m (1 °F per 319 ft).

  < 1% of annual operating hours –5 °C to 45 °C at 5% to 90% RH with 26 °C dew point.
  • NOTE: Outside the standard operating temperature (10 °C to 35 °C), the system can operate down to –5 °C or up to 45 °C for a maximum of 1% of its annual operating hours.

For temperatures between 40 °C and 45 °C, de-rate maximum allowable dry bulb temperature by 1 °C per 125 m above 950 m (1 °F per 228 ft).

  Expanded Operating Temperature Restrictions
  • Do not perform a cold startup below 5 °C.
  • Allow processor performance degrade.
  • Non-redundant power supplies are not supported.
  • Non Dell qualified peripheral cards and/or peripheral cards are not supported.
  • Maximum altitude for the operating temperature must be 3050 m (10,000 ft).
Environmental  
  • NOTE: For additional information about environmental measurements for specific system configurations, see dell.com/environmental_datasheets.
Temperature  
  Maximum Temperature Gradient (Operating and Storage) 20 °C/h (36 °F/h)
  Storage Temperature Limits –40 °C to 65 °C (–40 °F to 149 °F)
Temperature (Continuous Operation)
  Temperature Ranges (for altitude less than 950 m or 3117 ft) 10 °C to 45 °C (50 °F to 113 °F) with no direct sunlight on the equipment.
  Humidity Percentage Range 10% to 80% Relative Humidity with 26 °C (78.8 °F) maximum dew point.
Relative Humidity  
  Storage 5% to 95% RH with 33 °C (91 °F) maximum dew point. Atmosphere must be non-condensing at all times.
Vibration  
  Operating MIL-STD-810G, Method 514.6, Figure 514.6D-9, 0.00220783 g2/Hz at 10-500 Hz (overall 1.04 Grms), 1 hour per axis
  Non-operating MIL-STD-810G, Method 514.6, Figure 514.6, Procedure I, Category 4, Figure 514.6C-1 (US highway truck vibration), Vertical: 5-500 Hz at 1.04 Grms, Transverse: 5-500 Hz at 0.204 Grms, Longitudinal: 5-500 Hz at 0.740 Grms, 1 hour per axis
Shock  
  Operating MIL-STD-810G, Method 516.6, Procedure I, 20G for rotational hard drives and 40G for solid state drives, 11 ms, saw tooth, 3 shocks, +/- per axis
  Non-operating MIL-STD-810G, Method 516.6, Procedure V, 40G, 11 ms, saw tooth, 3 shocks, +/- per axis
Maximum Altitude  
  Operating

3048 m ( 10,000 ft) per IEC 60950-1.

4572 m (15,000 ft) per MIL-STD-810G, Method 500.5, Procedure II

  Storage 12,192 m (40,000 ft).
Operating Altitude De-rating
  Up to 35 °C (95 °F) Maximum temperature is reduced by 1 °C/300 m (1 °F/547 ft) above 950 m (3,117 ft).
  35 °C to 40 °C (95 °F to 104 °F) Maximum temperature is reduced by 1 °C/175 m (1 °F/319 ft) above 950 m (3,117 ft).
  40 °C to 45 °C (104 °F to 113 °F) Maximum temperature is reduced by 1 °C/125 m (1 °F/228 ft) above 950 m (3,117 ft).
Particulate Contamination
  • NOTE: This section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous contamination. If it is determined that levels of particulates or gaseous pollution are beyond the limits specified below and are the reason for the damage and/or failures to your equipment, it may be necessary for you to re-mediate the environmental conditions that are causing the damage and/or failures. Re-mediation of environmental conditions will be the responsibility of the customer.
  Air Filtration
  • NOTE: Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
  • NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
  Conductive Dust
  • NOTE: Applies to data center and non-data center environments.
Air must be free of conductive dust, zinc whiskers, or other conductive particles.
  Corrosive Dust
  • NOTE: Applies to data center and non-data center environments.
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
Gaseous Contamination
  • NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
  Copper Coupon Corrosion Rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
  Silver Coupon Corrosion Rate <200 Å/month as defined by AHSRAE TC9.9.