Dell EMC PowerEdge XR11: технические характеристики и спецификации

Table 1. PowerEdge XR11 system weightThe table below shows the maximum weight of the PowerEdge XR11 system.

System configuration	Maximum weight (with all drives/SSDs/rails/bezel)
4 x 2.5-inch system with Rear Accessed configuration	13.8 kg (30.5 pound)
4 x 2.5-inch system with Front Accessed configuration	13.6 kg (29.9 pound)

The PowerEdge XR11 system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specificationsThe table lists the specifications for 800 W, 1100 W, 1400 W power supplies.

PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	AC		DC	Current
					High line 200–240 V	Low line 100–120 V
1400 W Mixed Mode	Platinum	5459 BTU/hr	50/60 Hz	100–240 V AC, autoranging	1400 W	1050 W	NA	12 A–8 A
	NA	5459 BTU/hr	NA	240 V DC	NA	NA	1400 W	6.6 A
1100 W	NA	4266 BTU/hr	NA	-48-(-60) V DC, autoranging	NA	NA	1100 W	27 A
800 W Mixed Mode	Platinum	3139 BTU/hr	50/60 Hz	100–240 V AC, autoranging	800 W	800 W	NA	9.2 A–4.7 A
	NA	3139 BTU/hr	NA	240 V DC	NA	NA	800 W	3.8 A

The PowerEdge XR11 system supports the following operating systems:

• Canonical Ubuntu Server LTS
• VMware ESXi
• Microsoft Windows Server with Hyper-V
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
• VMware ESXi
• RHEL Realtime

For more information, go to www.dell.com/ossupport.

The PowerEdge XR11 system supports six Very High Performance fans and requires all six fans to be installed.

The PowerEdge XR11 system supports CR 2032 3.0-V lithium coin cell system battery.

The PowerEdge XR11 system supports up to three PCI express (PCIe) Gen 4 expansion cards.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.

PCIe slot	Risers	PCIe slot height	PCIe slot length	PCIe slot width
Slot 1	Riser 1B*	Low Profile	Half Length	x8
Slot 1	Riser 1A**	Low Profile	Half Length	x16
Slot 2	Riser 2	Full height	Half length	x16
Slot 3	Riser 3	Full height	Half length	x16

The PowerEdge XR11 system supports the following memory specifications for optimized operation:

Table 1. Memory specificationsThe table below shows the memory specifications:

DIMM type	DIMM rank	DIMM capacity	Single processor
			Minimum RAM	Maximum RAM
RDIMM	Single rank	8 GB	8 GB	64 GB
	Dual rank	16 GB	16 GB	128 GB
		32 GB	32 GB	256 GB
		64 GB	64 GB	512 GB
LRDIMM	Quad rank	128 GB	128 GB	1024 GB
		256 GB	256 GB	2048 GB
Intel Optane PMem 200 Series	Single rank	128 GB	128 GB	512 GB
		256 GB	256 GB	1024 GB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:

Memory module sockets	Speed
8, 288-pin	3200 MT/s

Table 3. Supported Intel Optane PMem 200 Series for processor configurationsThis table lists the supported Intel Optane PMem 200 Series configurations for processor system.

Configuration	Description	Memory population rules
		RDIMMs	LRDIMM	Intel Optane PMem 200 Series
Configuration 1	4 x RDIMMs, 4 x Intel Optane PMem 200 Series	Processor1 {A1, A2, A3, A4}	-	Processor1 {A5, A6, A7, A8}
	4 x LRDIMMs, 4 x Intel Optane PMem 200 Series	-	Processor1 {A1, A2, A3, A4}	Processor1 {A5, A6, A7, A8}
Configuration 2	6 x RDIMMs, 1 x Intel Optane PMem 200 Series	Processor1 {A1, A2, A3, A4, A5, A6}	-	Processor1 {A7}
	6 x LRDIMMs, 1 x Intel Optane PMem 200 Series	-	Processor1 {A1, A2, A3, A4, A5, A6}	Processor1 {A7}

Table 1. PowerEdge XR11 storage controller specificationsThis table provides the controller cards supported on the system:

Internal controllers	External controllers
PERC H755 PERC H345* PERC H355* HBA355i S150 Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs	PERC H840 HBA355e

The PowerEdge XR11 system supports 4 x 2.5-inch SAS, SATA, or NVMe SSD drives.

Table 1. PowerEdge XR11 USB ports specifications for Rear Accessed configuration The following table shows the USB specifications :

Front		Rear		Internal
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0-compliant port.	One
Micro-USB 2.0-compliant port for iDRAC Direct	One	USB 3.0-compliant ports	One

Table 2. PowerEdge XR11 USB ports specifications for Front Accessed configurationThe following table shows the USB specifications :

Front		Internal
USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	Internal USB 3.0-compliant port	One
USB 3.0-compliant ports	One
Micro-USB 2.0-compliant port for iDRAC Direct	One

The PowerEdge XR11 system supports up to two 70 W (Single Width) GPUs.

The PowerEdge XR11 system supports one 9-pin connector Data Terminal Equipment (DTE) 16550-compliant serial connector located on the rear of the Rear Accessed configuration and on the front of the Front Accessed configuration.

The PowerEdge XR11 system supports 4 embedded LOM ports that provide 4x 25GbE SFP+. These ports support 10GbE and 25GbE.

There is also a dedicated iDRAC management port that supports 1GbE.

The PowerEdge XR11 system supports one DB-15 Video Graphics Array (VGA) port on the rear of the Rear Accessed configuration and one DB-15 VGA port on the front of the Front Accessed configuration.

The PowerEdge XR11 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options for the systemThis table describes the supported front video resolution options for the system.

Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

The PowerEdge XR11 system operates in these environmental categories: ASHRAE A2/A3/A4 and Rugged.

Table 1. Continuous operation specifications for ASHRAE A2 This table describes the operational climatic range for category A2.

	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft).

Table 2. Continuous operation specifications for ASHRAE A3 This table describes the operational climatic range for category A3.

	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft).

Table 3. Continuous operation specifications for ASHRAE A4 This table describes the operational climatic range for category A4.

	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft).

Table 4. Continuous operation specifications for Rugged This table describes the operational climatic range for category A4.

	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	(-5)–55°C (23–131°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/80 m (1.8°F/410 Ft) above 900 m (2953 Ft).

Table 5. Common environmental specifications for ASHRAE A2, A3, A4, and Rugged This table describes the shared requirements across all categories.

	Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation).	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40°C to 65°C (-104°F to 149°F).
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet).
Maximum operational altitude	3,048 meters (10,000 feet).

Table 6. Maximum vibration specifications for the system This table shows the maximum vibration specifications for the system.

Maximum vibration	Specifications
Operating	MIL-STD-810H, Method 514.8, 1.04 Grms, 2-500 Hz, Random Vibration, Figure 514.8D-11
Storage	MIL-STD-810H, Method 514.8, Category 4, Figure 514.8C-2, 10 -500 Hz, 60 minutes/axis MIL-STD-810H, Method 514.8, Category 24, Figure 514.8E-1, 20-2000 Hz, 60 minutes/axis

Table 7. Maximum shock pulse specifications for the systemThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Maximum shock pulse	Specifications
Operating	MIL-STD-810H, Method 516.8, Procedure I, 11ms, 20G MIL-STD-810H, Method 516.8, Procedure I, 11ms, 40G (SSD),
Operating (Navy)	MIL-DTL-901E, Grade A, Class 2, Type A, in approved military transit case
Storage	MIL-STD-810H, Method 516.8, Procedures I, 11 ms, 40G (with SSD). MIL-STD-810H, Method 516.8, Procedures I, 11 ms, 40G

The following table defines the limitations that prevent any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.

Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.

Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

The PowerEdge XR11 supports the rugged environment space for temperatures up to 55°C through custom configurations. These configurations are geared for the Telecom (or Telco) and Military industries and hence meet industry-specific standards in addition to the maximum temperature requirement of 55°C. The Telco configurations will be tested to the NEBS requirements outlined in the GR-63 and GR-1089 Telcordia specifications. The Military configurations will be tested to: MIL-STD-810H, MIL-DTL-901E and MIL-STD-461G.

Table 1. Rugged Certifications and Specifications

Certifications	Specifications
Operating Temps	-5°C to 55°C 55°C continuous operation per MIL 810H Method 501.7 Proc -5°C continuous operation per MIL 810H Method 502.7 Proc
Operational Shock	MIL-STD-810H, Method 516.8, Procedure I, 11ms, 40G (SSD)
Operational Shock (Navy)	MIL-DTL-901E, Grade A, Class 2, Type A, in approved military transit case
Non-Operational Shock	MIL-STD-810H, Method 516.8, Procedures V, 11 ms, 40G (with SSD)
Operational Vibration	MIL-STD-810H, Method 514.8, 1.04 Grms, 2-500Hz, Random Vibration, Figure 514.8D-11 with SSD
Non-Operational Vibration	MIL-STD-810H, Method 514.8, Category 4, Figure 514.8C-2, 5-500 Hz, 60 minutes/axis with SSD MIL-STD-810H, Method 514.8, Category 24, Figure 514.8E-1, 20-2000Hz, 60 minutes/axis with SSD
Operational Altitude	MIL-STD-810H, Method 500.6, Proc. II (Operational, Air carriage) 15,000ft for 1 hour after stabilization
Non-Operational Altitude	MIL-STD-810H, Method 500.6, Proc. I (Storage, Air transport), 40Kft for 1 hour after stabilization
Conductive/Radiative Immunity	MIL-STD-461G
Sand and Dust (tested with filtered bezel)	MIL-STD-810H, Method 510.7, Procedure I, Blowing dust at 25oC, 6 hours, and an additional 6 hours at 49 o C, (Climatic Category A1) MIL-STD-810H, Method 510.7, Procedure II, Blowing sand at 49 o C (Climatic Category A1) window velocity of 29 m/s, sand concentration of 2.2 g/m3, 6 hours
NEBS Level 3	GR-63-CORE and GR-1089-CORE

Table 1. Thermal restriction matrix for processor and fansThis table describes the thermal restriction for processor and fans.

Configuration / Processor TDP	Front and Rear Accessed configuration with filtered bezel	Maximum Ambient Temperature
105 W	VHP fan Std. HSK	55°C
120 W	VHP fan Std. HSK	55°C
135 W	VHP fan Std. HSK	55°C
140 W	VHP fan Std. HSK	55°C
150 W	VHP fan Std. HSK	55°C
165 W	VHP fan Ext. HSK	35°C
185 W	VHP fan Ext. HSK	35°C
205 W	VHP fan Ext. HSK	35°C
225 W	VHP fan Ext. HSK	35°C

Table 2. Label referenceThis table describes the label references used in the restriction tables.

Label	Description
VHP fan	Very High Performance fan
Std.	Standard
Ext.	Extended
HSK	Heat sink

Table 3. Thermal restriction matrix for GPUsThis table describes the thermal restriction for GPUs.

	Rear Accessed Configuration	Front Accessed Configuration
GPU	Maximum Ambient Temperature	Maximum Ambient Temperature
Nvidia T4	40C	50C
Nvidia A2	35C	50C

Thermal restriction for ASHRAE A3 for Rear Accessed configuration

• Do not perform a cold startup below 5°C
• Processor TDP greater than 150 W are not supported except for the following list:
  • 6334, 8 core, 165W
  • 6338T, 24 core, 165W
  • 6330N, 28 core, 165W
  • 6338N, 32 core, 185W
• 128 GB or greater capacity DIMMs and Intel Optane PMem 200 Series are not supported.
• Non-Dell qualified peripheral cards are not supported.
• PCIe SSD is not supported.
• BOSS M.2 is not supported.
• High temperature spec 85°C active optics cables are required.
• PERC adapter with battery is not supported except for H755.
• NVMe drive is not supported.
• CX-6 100GB NIC card is not supported except for CX-6 DX.
• SAS SSD is not supported.

Thermal restriction for ASHRAE A4 for Rear Accessed configuration

• Do not perform a cold startup below 5°C
• Processor TDP greater than 150 W are not supported except for the following list:
  • 6334, 8 core, 165W
  • 6338T, 24 core, 165W
  • 6330N, 28 core, 165W
  • 6338N, 32 core, 185W
• 128 GB or greater capacity DIMMs and Intel Optane PMem 200 Series are not supported.
• Non-Dell qualified peripheral cards are not supported.
• PCIe SSD is not supported.
• BOSS M.2 is not supported.
• High temperature spec 85°C active optics cables are required.
• PERC adapter with battery is not supported.
• NVMe drive is not supported.
• CX-6 100GB NIC card is not supported except for CX-6 DX.
• SAS SSD is not supported.

Thermal restriction for Rugged for Rear Accessed configuration

• Do not perform a cold startup below 5°C
• Processor TDP greater than 150 W are not supported except for the following list:
  • 6338T, 24 core, 165W
  • 6330N, 28 core, 165W
• 128 GB or greater capacity DIMMs and Intel Optane PMem 200 Series are not supported.
• Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
• Non-Dell qualified peripheral cards are not supported.
• PCIe SSD is not supported.
• BOSS M.2 is not supported.
• High temperature spec 85°C active optics cables are required.
• PERC adapter with battery is not supported.
• NVMe drive is not supported.
• CX-6 100GB NIC card is not supported except for CX-6 DX.
• SAS SSD is not supported.

Thermal restriction for ASHRAE A3 for Front Accessed configuration

• Do not perform a cold startup below 5°C
• Processor TDP greater than 150 W are not supported except for the following list:
  • 6334, 8 core, 165W
  • 6338T, 24 core, 165W
  • 6330N, 28 core, 165W
  • 6338N, 32 core, 185W
• 128 GB or greater capacity DIMMs and Intel Optane PMem 200 Series are not supported.
• Non-Dell qualified peripheral cards are not supported.
• PCIe SSD is not supported.
• BOSS M.2 greater than 480 GB is not supported.
• NVMe drive is not supported.
• SAS SSD is not supported.

Thermal restriction for ASHRAE A4 for Front Accessed configuration

• Do not perform a cold startup below 5°C
• Processor TDP greater than 150 W are not supported except for the following list:
  • 6334, 8 core, 165W
  • 6338T, 24 core, 165W
  • 6330N, 28 core, 165W
  • 6338N, 32 core, 185W
• 128 GB or greater capacity DIMMs and Intel Optane PMem 200 Series are not supported.
• Non-Dell qualified peripheral cards are not supported.
• PCIe SSD is not supported.
• BOSS M.2 greater than 480 GB is not supported.
• NVMe drive is not supported.
• SAS SSD is not supported.

Thermal restriction for Rugged for Front Accessed configuration

• Do not perform a cold startup below 5°C
• Processor TDP greater than 150 W are not supported except for the following list:
  • 6338T, 24 core, 165W
  • 6330N, 28 core, 165W
  • 6338N, 32 core, 185W
• 128 GB or greater capacity DIMMs and Intel Optane PMem 200 Series are not supported.
• Non-Dell qualified peripheral cards are not supported.
• PCIe SSD is not supported.
• BOSS M.2 greater than 480 GB is not supported.
• NVMe drive is not supported.
• SAS SSD is not supported.
• PERC adapter with battery is not supported except for H755.

Other Thermal Restrictions

• DIMM blanks are required on empty slots.
• HDD blanks are required on empty slots.
• PCIe blank is required on empty slot 1.
• Processor TDP greater than 150 W are not supported for Riser 1A configuration except for 6338N, 32 core, 185W processor.