Dell PowerEdge XE9785L: руководство по обслуживанию

Chassis dimensions

This figure shows the dimensions of the system. — Figure 1. Sled dimensions

Table 1. PowerEdgeXE9785L sled dimensionsThis table provides the dimensions of the system:
Drives	X	Y	Z
All configurations	537 mm (21.14 inches)	140.5 mm (5.53 inches)	1047.95 mm (41.26 inches) with fan 889.65 mm (35.03 inches) without fan

System weight

Table 1. PowerEdge XE9785L system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
MI355X with 16 x E1.S NVMe direct drives	95 kg (209.44 lb)
MI355X with 8 x U.2 NVMe SSD drives + 2 x U.2 CEM card on the PCIe slot	95.4 kg (210.3 lb)
B300 with 16 x E1.S NVMe direct drives	95 kg (209.44 lb)
B300 with 8 x U.2 NVMe SSD drives + 2 x U.2 CEM card on the PCIe slot	95.4 kg (210.3 lb)
B200 with 8 x U.2 NVMe SSD drives	94.6 kgs (212.97 lb)

NOTE:*Expected to be available in future releases. Planned offerings are subject to change and may not be released as originally planned.

Table 2. PowerEdge XE9785L weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight	Description
40–70 lb	Recommend two people to lift
70–120 lb	Recommend three people to lift
≥ 121 lb	Recommend to use a server-lift

WARNING:The system is heavy, so ensure adequate support and balance during movement and installation; a lift is required for loads over 120 lb, as the system can slide and cause damage when being installed or removed from a higher position on the rack.

Processor specifications

Table 1. PowerEdge XE9785L processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
5^th Generation AMD EPYC 9005 Series processor	Up to 192 cores per processor

PSU specifications

The PowerEdge XE9785L system supports the 21-inch, 50 V, 33000 W Power Shelf.

Cooling fan specifications

The PowerEdge XE9785L system supports eight standard fans for the CPU and PCIe expansion slot cooling and four standard fans for GPU cooling.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Also known as	Label color	Label image
Standard Fans	STD	CPU fan	None	Figure 1. Standard CPU Fan NOTE:The touchpoints on the CPU fan is blue in color.
Standard Fan	STD	GPU fan	None	Figure 2. Standard fan

Supported operating systems

The PowerEdge XE9785L system supports the following operating systems:

Canonical Ubuntu Server LTS
Red Hat Enterprise Linux*

NOTE:*Expected to be available in future releases. Planned offerings are subject to change and may not be released as originally planned.

For specifications and interoperability details, see OS support.

System battery specifications

The PowerEdge XE9785L system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge XE9785L system supports up to 12 Gen5 PCI express (PCIe) slots on the PSBB board.

Table 1. MX355I Expansion card slots supported on the PSBB boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Expansion card riser	Processor connection	Height	Length	Slot width
1	N/A	CPU 1	Full-Height	Half-Length	x16
2	N/A	CPU 1	Full-Height	Half-Length	x16
3	N/A	CPU 1	Full-Height	Half-Length	x16
4	N/A	CPU 1	Full-Height	Half-Length	x16
5	N/A	CPU 1	Full-Height	Half-Length	x16
6	N/A	CPU 1	Full-Height	Half-Length	x16
7	N/A	CPU 0	Full-Height	Half-Length	x16
8	N/A	CPU 0	Full-Height	Half-Length	x16
9	N/A	CPU 0	Full-Height	Half-Length	x16
10	N/A	CPU 0	Full-Height	Half-Length	x16
11	N/A	CPU 0	Full-Height	Half-Length	x16
12	N/A	CPU 0	Full-Height	Half-Length	x16
13	N/A	CPU 1	Full-Height	Half-Length	x16

Table 2. B300 Expansion card slots supported on the PSBB boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Expansion card riser	Processor connection	B300 UBB connection	Height	Length	Slot width
1	N/A	N/A	N/A	Full-Height	Half-Length	N/A
2	N/A	N/A	N/A	Full-Height	Half-Length	N/A
3	N/A	N/A	OSFP	Full-Height	Half-Length	x16
4	N/A	N/A	OSFP	Full-Height	Half-Length	x16
5	N/A	CPU 1	N/A	Full-Height	Half-Length	x16
6	N/A	CPU 1	N/A	Full-Height	Half-Length	x16
7	N/A	CPU 0	N/A	Full-Height	Half-Length	x16
8	N/A	CPU 0	N/A	Full-Height	Half-Length	x16
9	N/A	N/A	OSFP	Full-Height	Half-Length	x16
10	N/A	N/A	OSFP	Full-Height	Half-Length	x16
11	N/A	N/A	N/A	Full-Height	Half-Length	N/A
12	N/A	N/A	N/A	Full-Height	Half-Length	N/A
13	N/A	CPU 1	N/A	Full-Height	Half-Length	x16

Table 3. B200 Expansion card slots supported on the PSBB boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Expansion card riser	Processor connection	Height	Length	Slot width
1	N/A	CPU 1	Full-Height	Half-Length	x16
2	N/A	CPU 1	Full-Height	Half-Length	x16
3	N/A	CPU 1	Full-Height	Half-Length	x16
4	N/A	CPU 1	Full-Height	Half-Length	x16
5	N/A	CPU 1	Full-Height	Half-Length	x16
6	N/A	CPU 1	Full-Height	Half-Length	x16
7	N/A	CPU 0	Full-Height	Half-Length	x16
8	N/A	CPU 0	Full-Height	Half-Length	x16
9	N/A	CPU 0	Full-Height	Half-Length	x16
10	N/A	CPU 0	Full-Height	Half-Length	x16
11	N/A	CPU 0	Full-Height	Half-Length	x16
12	N/A	CPU 0	Full-Height	Half-Length	x16
13	N/A	CPU 1	Full-Height	Half-Length	x16

Memory specifications

The PowerEdge XE9785L system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity
RDIMM	Dual rank	96 GB	192 GB	2.3 TB
		128 GB	256 GB	3 TB
		256 GB*	512 GB*	6.14 TB*

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
32, 288-pin	6400 MT/s

NOTE:*Expected to be available in future releases. Planned offerings are subject to change and may not be released as originally planned.

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:The processor may reduce the performance of the rated DIMM speed.

Drives

The PowerEdge XE9785L system supports:

16 x E1.S NVMe direct drives.
8 x U.2 NVMe SSD drives.

NOTE:The system supports two U.2 CEM on the PCIe expansion slot.

NOTE:*Expected to be available in future releases. Planned offerings are subject to change and may not be released as originally planned.

NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

GPU Specifications

The PowerEdge XE9785L system supports the following GPU configuration:

8 x AMD Instinct™ MI355X 288GB 1400W OAM with AMD Infinity Fabric connectivity
8 x NVIDIA HGX B300 NVL8 270 GB 1100W SXM6 GPUs, fully interconnected with NVIDIA NVLink technology
8 x NVIDIA HGX B200 180 GB 1000 W SXM6 GPUs, fully interconnected with NVIDIA NVLink technology

USB ports specifications

Table 1. Systems USB SpecificationsThe below table shows systems USB specifications.
Front		Rear		Internal
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 3.0 - compliant port	1	N/A	N/A	USB 3.0 - compliant port	1
USB 2.0 Type_C compliant port	1	N/A	N/A	N/A	N/A

NIC port specifications

The PowerEdge XE9785L system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports on the front I/O card and an optional Open Compute Project (OCP) card.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
Ethernet ports on the Front I/O board	2 x 1 Gb
OCP NIC 3.0 card	2 x 10 GbE, 2 x 25 GbE, 2 x 100 GbE, 4 x 25 GbE

NOTE:*Expected to be available in future releases. Planned offerings are subject to change and may not be released as originally planned.

NOTE:The PowerEdge XE9785L supports OCP x16.

iDRAC9 port specifications

The PowerEdge XE9785L system supports one USB 2.0 Type-C for iDRAC10 on the front I/O.

Video specifications

The PowerEdge XE9785L system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Pixel clock (MHz)
1024 x 768	60	65.0
1280 x 800	60	83.5
1280 x 1024	60	108.0
1360 x 768	60	85.5
1440 x 900	60	106.5
1600 x 900	60	97.75
1600 x 1200	60	162.0
1680 x 1050	60	119.0
1920 x 1080	60	173.0
1920 x 1200	60	193.25

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Operational/non-operational conditions	Allowable operations
Maximum temperature gradient (applies to both operation and non-operation)	20 °C in an hour* (36 °F in an hour) and 5 °C in 15 minutes (9 °F in 15 minutes), 5 °C in an hour* (9 °F in an hour) for tape hardware.
Non-operational temperature limits	-5°C ** to 65°C (23°F to 149°F)
Non-operational humidity limits (non-condensing at all times)	5% to 95% RH with 27 °C (80.6 °F) maximum dew point.
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3050 meters (10,006 feet)
Battery storage	See appendix C

NOTE:* Per ASHRAE thermal guidelines, these are not instantaneous rates of temperature change.

NOTE:** Liquid filled components, or systems/solutions containing liquid filled components are limited to approximately 5 °C above their freeze point. At this time, the only authorized liquid coolant is Recochem PG25 with a freeze point between -9 °C and -13 °C, therefore the lower non-operational temperature limit is -5 °C.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE:The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04-2013
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04-2013

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
HPR (Silver)	High-performance Silver (HPR SLVR) fan
HPR (Gold)	High-performance Gold (HPR GOLD) fan
HSK	Heat sink
LP	Low profile
FH	Full height
DLC	Direct Liquid Cooling

Table 2. MI355X GPU configuration: Thermal restriction matrixThe following table shows the thermal restriction matrix.
Configuration	Processor number	TDP (W)	Core count	Fan type
16 x E1.S NVMe direct drives/8 x U.2 NVMe SSD drives, AMD MI355X, and 12 x FH PCIe cards	9965	500	192	STD fan, supported at 35°C
	9755	500	128	STD fan, supported at 35°C
	9655	400	96	STD fan, supported at 35°C
	9575F	400	64	STD fan, supported at 35°C

Table 3. MI355X GPU configuration: Thermal restriction matrix for DIMMsThe following table shows the thermal restriction matrix for DIMMs.
Configuration	DIMM capacity (GB)	Fan type
16 x E1.S NVMe direct drives/8 x U.2 NVMe SSD drives, AMD MI355X, and 12 x FH PCIe cards	128	STD fan, supported at 35°C
	96	STD fan, supported at 35°C

Table 4. B300 GPU configuration: Thermal restriction matrixThe following table shows the thermal restriction matrix.
Configuration	Processor number	TDP (W)	Core count	Fan type
16 x E1.S NVMe direct drives/8 x U.2 NVMe SSD drives, Nvidia B300, and 4 x FH PCIe cards	9965	500	192	STD fan, supported at 35°C
	9755	500	128	STD fan, supported at 35°C
	9655	400	96	STD fan, supported at 35°C
	9575F	400	64	STD fan, supported at 35°C

Table 5. B300 GPU configuration: Thermal restriction matrix for DIMMsThe following table shows the thermal restriction matrix for DIMMs.
Configuration	DIMM capacity (GB)	Fan type
16 x E1.S NVMe direct drives/8 x U.2 NVMe SSD drives, Nvidia B300, and 4 x FH PCIe cards	128	STD fan, supported at 35°C
	96	STD fan, supported at 35°C

NOTE:E1.S NVMe direct drive blanks, OCP NIC card blank, and PCIe blanks are required if they are not installed.

NOTE:DPU card support up to ASHRAE A2.