Dell PowerEdge XE9785: руководство по обслуживанию

Chassis dimensions

This image shows chassis dimension for the PowerEge XE7745 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeXE9785 chassis dimensionsThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za	Zb	Zc
16 x E3.S NVMe drives system U.2 NVMe drives system*	482.3 mm (18.98 inches)	448 mm (17.63 inches)	439.5 mm (17.30 inches)	43.7 mm (1.72 inches)With bezel 22 mm (0.87 inches)Without bezel	966 mm (38.03 inches) Ear to rear GPU fan	1001 mm (39.40 inches) Ear to Fan handle

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

NOTE:Feature not available at initial product launch. Refer to the product configurator page on Dell.com to confirm feature availability.

System Weight

Table 1. PowerEdge XE9785 system weightThe table below shows the maximum weight of the system.
System Configuration	Maximum Weight (with all drives/SSDs)
System fully populated with MI355X GPUs	172.3 kg (379.86 lb)
System fully populated with B300 GPUs	163.65 kg (360.79 lb)

Table 2. PowerEdge XE9785 weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis Weight	Description
40–70 lb	Recommend two people to lift
70–120 lb	Recommend three people to lift
≥ 121 lb	Recommend to use a server-lift

WARNING:The system is heavy, so ensure adequate support and balance during movement and installation; a lift is required for loads over 120 lb, as the system can slide and cause damage when being installed or removed from a higher position on the rack.

CAUTION: Lift the system by using the provided lifting handles on the chassis and refrain from using clips or other chassis points to lift the system. Nondesignated lift-points on the chassis may cause system damage due to the inability to support the system weight while lifting.

Processor specifications

Table 1. PowerEdge XE9785 processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
5^th Generation AMD EPYC 9005 Series processor	Two

PSU Specifications

The PowerEdgeXE9785system supports 12 AC power supply units (PSUs).

Table 1. PSU SpecificationsThis table describes PSU specifications for the system.
PSU	Power Ratings	Class	Heat dissipation	Frequence (Hz)	Input Voltage	Current (A)
3200 W Mixed Mode (Multi-rated)	3200 W	Titanium	11,850 BTU/hr	50/60	216.1-240 VAC	16
	3200 W	N/A	11,850	N/A	240 VDC	14.5
	2900 W	N/A	10,750	50/60	200-216 VAC	16

The power consumption of the system depends on its total power requirements, which vary based on the configuration (as in, number of GPUs, PSUs, and other components). Each PSU model (3200 W) can deliver power up to its rated capacity, but the actual power that is delivered will depend on the system’s needs.

To determine how much power each PSU delivers, the total system power requirement is divided by the number of PSUs in the system. For detailed power usage information, refer to the iDRAC web GUI for real-time power metrics and system monitoring.

NOTE:The PowerEdgeXE9785 supports up to 12 AC power supplies with 6+6 full redundant and A/B grid redundant options. Users can configure the power redundancy policy to PSU redundant or A/B grid redundant based on the data center infrastructure.

This image shows the power configuration option — Figure 1. Power Configuration

The PowerEdgeXE9785 system also supports 6+6 FTR redundancy. When the Redundancy policy is set to PSU redundant, and when the numbers of failed PSUs exceeds the number required for redundancy, a fault-tolerant redundant mode is activated. This mode triggers the GPU power brake, throttling GPU clocks to one-fourth their normal rate, and resulting in a GPU performance drop to around one-fifth. It is important to note that this feature is applicable only when the system is set to PSU redundant mode. In configurations where PSU redundancy is not enabled, the fault-tolerant redundant mode does not automatically trigger GPU Power Brake.

NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:Do not mix PSUs from different vendors within a single system configuration to ensure optimal performance and reliability.

this image shows list of PSU power cords — Figure 2. PSU power cord

Table 2. PSU power cablesThe table lists the PSU power cables list .
Form factor	Output	Power cable
Redundant 73.5 mm	3200 W mixed mode	C19

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

Cooling fan specifications

The PowerEdgeXE9785 system supports up to:

15 standard grade hot-swappable GPU fans installed in the GPU fan sled.
5 Standard grade cold-swappable CPU fans installed in the HPM sled.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Also known as	Label color	Label image
Standard (STD) CPU fan	STD	Mid Compute Fan	N/A	Figure 1. Standard (STD) fan
Standard (STD) GPU fan	STD	Rear GPU Fans	N/A	NOTE:New cooling fans comes with the Rear GPU fans label. Figure 2. Rear GPU Fans

NOTE:For more information about the supported fan configuration or matrix, see Thermal restriction matrix.

System battery specifications

The PowerEdge XE9785 system uses one CR 2032 3.0-V lithium coin cell battery.

Supported operating systems

The PowerEdge XE9785 system supports the following operating system:

Canonical Ubuntu Server LTS
Red Hat Enterprise Linux*

For specifications and interoperability details, see OS support.

NOTE:*Feature not available at initial product launch. Refer to the product configurator page on Dell.com to confirm feature availability.

Expansion Card Specifications

The PowerEdge XE9785 system supports the following:

Up to 12 x 75 W Gen5 x16 FHHL cards (PCIe) installed on the PCIe Switch Base Board (PSBB) for MI355X GPU configuration.
Up to 4 x 150 W Gen5 x16 FHHL cards (PCIe) installed on the PCIe Switch Retimer Base Board (PSRBB) for B300 GPU configuration.

Table 1. Expansion Card Slots - MI355XThis table offers information about the expansion card slots supported on the system.
Platform	Location	Processor Connection	PCIe Slot Height	PCIe Slot Length	Bandwidth
Platform	Location	Processor Connection	PCIe Slot Height	PCIe Slot Length	CPU0 - PCIe SW1	CPU0 - PCIe SW2	CPU1 - PCIe SW3	CPU1 - PCIe SW4
PSBB-MI355X	OCP Slot 1	Processor 2	N/A	Half Length	N/A	N/A	N/A	x16
	PCIe Slot 2	Processor 2	Full Height	Half Length	N/A	N/A	N/A	x16
	PCIe Slot 3	Processor 2	Full Height	Half Length	N/A	N/A	N/A	x16
	PCIe Slot 4	Processor 2	Full Height	Half Length	N/A	N/A	N/A	x16
	PCIe Slot 5	Processor 2	Full Height	Half Length	N/A	N/A	x16	N/A
	PCIe Slot 6	Processor 2	Full Height	Half Length	N/A	N/A	x16	N/A
	PCIe Slot 7	Processor 2	Full Height	Half Length	N/A	N/A	x16	N/A
	PCIe Slot 8	Processor 1	Full Height	Half Length	N/A	x16	N/A	N/A
	PCIe Slot 9	Processor 1	Full Height	Half Length	N/A	x16	N/A	N/A
	PCIe Slot 10	Processor 1	Full Height	Half Length	N/A	x16	N/A	N/A
	PCIe Slot 11	Processor 1	Full Height	Half Length	x16	N/A	N/A	N/A
	PCIe Slot 12	Processor 1	Full Height	Half Length	x16	N/A	N/A	N/A
	PCIe Slot 13	Processor 1	Full Height	Half Length	x16	N/A	N/A	N/A
	GPU Slot 21	Processor 2	N/A	Full Length	N/A	N/A	N/A	x16
	GPU Slot 22	Processor 2	N/A	Half Length	N/A	N/A	x16	N/A
	GPU Slot 23	Processor 1	N/A	Half Length	N/A	x16	N/A	N/A
	GPU Slot 24	Processor 1	N/A	Full Length	x16	N/A	N/A	N/A
	GPU Slot 25	Processor 2	N/A	Full Length	N/A	N/A	N/A	x16
	GPU Slot 26	Processor 2	N/A	Full Length	N/A	N/A	x16	N/A
	GPU Slot 27	Processor 1	N/A	Full Length	N/A	x16	N/A	N/A
	GPU Slot 28	Processor 1	N/A	Half Length	x16	N/A	N/A	N/A

Table 2. Expansion Card Slots - B300This table offers information about the expansion card slots supported on the system.
Platform	Location	Processor Connection	PCIe Slot Height	PCIe Slot Length	Bandwidth
Platform	Location	Processor Connection	PCIe Slot Height	PCIe Slot Length	CPU0 - PCIe SW1	CPU1 - PCIe SW2
PSRBB-B300	OCP Slot 1	Processor 2	Full Height	Half Length	N/A	x16
	Slot 3	Processor 2	Full Height	Half Length	N/A	x16
	Slot 6	Processor 2	Full Height	Half Length	N/A	x16
	Slot 9	Processor 1	Full Height	Half Length	x16	N/A
	Slot 12	Processor 1	Full Height	Half Length	x16	N/A

Memory Specification

The XE9785 supports up to 24 DIMMs (12 per socket), with up to 6 TB of memory and speeds of up to 6400 MT/s.

The XE9785 support registered (RDIMMs) which use a buffer to reduce memory loading and provide greater density, allowing for the maximum platform memory capacity. Unbuffered DIMMs (UDIMMs) are not supported.

Table 1. Memory Technology ComparisonThis table shows Memory technology comparison.
Feature	PowerEdge XE9785 (DDR5)
DIMM type	RDIMM
Transfer speed	Up to 6400 MT/s NOTE: Maximum DIMM transfer speed support dependent on CPU SKU and DIMM population.
Voltage	1.1 V

Table 2. Supported DIMMsThis table provides information about supported DIMMs in PowerEdge XE9785.
Rated DIMM Speed (MT/s)	DIMM Type	DIMM Capacity (GB)	Ranks per DIMM	Data Width	DIMM Volts (V)
6400	RDIMM	96	2	x4	1.1
6400	RDIMM	128	2	x4	1.1
6400	RDIMM	256	8	x4	1.1

NOTE:Some CPUs/SKUs may reduce the performance of the rated DIMM speed.

NOTE:256 GB DIMM supported only with B300 GPU configuration.

Storage controller specifications

The PowerEdge XE9785 system supports the following controller cards:

Table 1. Storage controller cards This table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS): HWRAID 1, 2 x M.2 NVMe SSDs or USB

Drives

The PowerEdge XE9785 system supports:

16 x EDSFF E3.S NVMe (SSD) hot-swappable drives
10 x U.2 NVMe (SSD) hot-swappable drives*

NOTE:*Feature not available at initial product launch. Refer to the product configurator page on Dell.com to confirm feature availability.

NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

GPU Specifications

The PowerEdge XE9785 system supports:

8 AMD Instinct™ MI355X 288 GB 1400 W OAM with AMD Infinity Fabric connectivity GPUs or
8 NVIDIA HGX B300 NVL8 270 GB 1100 W SXM6 GPUs, fully interconnected with NVIDIA NVLink technology GPUs

Power Capping Configuration with MI355X GPU

The PowerEdge XE9785 system with MI355X GPU, with a standard thermal design power (TDP) of 1.4 kW per GPU, can be permanently power capped at 1 kW per GPU by the Dell factory upon request. Power capping is implemented through Dell firmware on systems that are ordered as power-limited systems.

CAUTION:Dell strongly advises against modifying or removing the power capping configuration on power-limited systems. Reverting a power-limited system from 1 KW TDP to 1.4 KW TDP per GPU can pose significant risks, including system failures and data center outages, which may result in downtime and data loss.

USB Ports Specifications

This image shows the front USB ports — Figure 1. Front USB Ports

Table 1. PowerEdgeXE9785 USB SpecificationsThe following table shows the USB specifications for the system:
Front		Internal
USB port type	No. of ports	USB port type	No. of ports
USB Type A	One	USB 3.1-compliant port	One
USB type C dual-mode host/BMC Direct port	One	USB 3.1-compliant port	One

NOTE:The Type C USB compliant port can only be used as an iDRAC Direct or a management port.

NOTE:The iDRAC direct Type C USB port can be used by connecting Dell USB-C to 2.5 Gbps Ethernet Adapter dongle (DP/N : HYRGV). Once connected, laptop would be assigned IP 169.254.0.4 automatically and user will now be able to access iDRAC webGUI/ssh.

NOTE:Avoid connecting USB devices to the iDRAC Direct port of the XE9785 system during system initialization, POST, boot operations, or GPU firmware updates.

NIC port specifications

The PowerEdge XE9785 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports on the front I/O card and an optional Open Compute Project (OCP) card.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
Ethernet ports on the Front I/O board	2 x 1 Gb
OCP NIC 3.0 card	200 GbE x 2, 100 GbE x 2, 25 GbE x 4, 25 GbE x 2, 10 GbE x 4, 10G x 2
DPU card	400 GbE x 2*, 200 GbE x 2
PCIe Add-in Card (AIC) NIC	400 GbE x 1, 200 GbE x 2, 100 GbE x 2

NOTE:Feature not available at initial product launch. Refer to the product configurator page on Dell.com to confirm feature availability.

Mini-DisplayPort specifications

The PowerEdge XE9785 system supports One Mini-DisplayPort on left control panel of the system.

iDRAC10 port specifications

The PowerEdge XE9785 system supports two iDRAC10 ethernet on the front of the system.

Video specifications

The PowerEdge XE9785 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
640 x 480	60	8, 16, 32
800 x 600	60	8, 16, 32
1024 x 768	60	8, 16, 32
1152 x 864	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1400 x 1050	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Parameters	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Common Environmental Specifications for all categories This table describes the shared requirements for all categories.
Parameters	Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40°C to 65°C (-40°F to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 ft)
Maximum operational altitude	3,048 meters (10,000 ft)

Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.38 Grms at 7 Hz to 250 Hz for 15 minutes.
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz (all operation orientations)
Storage	1.38 G_rms at 7 Hz to 250 Hz for 15 minutes

Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a non-operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Executed shock pulses in z axis (one pulse) of 71G for up to 2ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Thermal Restriction Matrix - 5^th Generation AMD EPYC 9005 Series processorsThe table describes the thermal restriction matrix.
Configuration					STD HSK; CPU STD Fan
Configuration					16 x E3.S		10 x U.2*
Component	Processor	cTDP (W)	Max cTDP (W)	Cores	12 x PCIe	4 x PCIe	12 x PCIe	4 x PCIe
CPU	9965	500	500	192	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C
	9755	500	500	128	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C
	9655	400	400	96	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C
	9575F	400	400	64	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C
	9845	390	400	160	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C
	9825	390	400	144	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C
	9475F	360	400	48	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C
	9455	300	300	48	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C	STD HSK / STD Fan Max 35°C
Memory			96GB RDIMM		STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C
			128GB RDIMM		STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C
			256GB RDIMM		STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C
DPU*			B3220*		STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C
			B3140H*		STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C
			B3240*		STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C
GPU			AMD MI355X		STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C
GPU			NVIDIA B300		STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C	STD Fan Max 35°C

NOTE:Feature not available at initial product launch. Refer to the product configurator page on Dell.com to confirm feature availability.

Other Thermal Restrictions

Configurations that support ASHRAE A3 and A4 are not available.

A PCIe blank (DPN: GYP32) is required if no PCIe card is installed in any slot.

A low-profile block is required when installing a low-profile card.

DIMM blanks are required if fewer than 16 DIMMs are installed.

M.2, OCP, and HDD blanks are required if the corresponding components are not installed.

GPU fans are hot-swappable and must be reinstalled within 30 seconds.

Ambient Temp support of max 35°C.