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Dell PowerEdge XE9780: руководство по обслуживанию
Chassis dimensions
Figure 1. Chassis dimensions
Table 1. Chassis dimension for the PowerEdgeXE9780systemThis table provides the dimensions of the system:
Drives
Xa
Xb
Y
Za
Zb
Zc
16 x E3.s NVMe drives or system
482.3 mm (18.98 inches)
448.0 mm (17.63 inches
439.5 mm (17.30 inches)
43.7 mm (1.72 inches) with bezel
22.0 mm (0.87 inches) without bezel
966 mm (38.03 inches, bottom) Ear to rear GPU fan
1001 mm (39.40 inches) Ear to Fan handle
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.
NOTE:Chassis length is longer than usual, need to consider potential interferences with the rear mounted PDU or the rear rack door when installed on rack.
System weight
Table 1. Weight for the PowerEdgeXE9780 system with 16 x E3.s SSDsThe table below shows the maximum weight of the PowerEdge XE9780
system with16 x E3.s SSDs.
System configuration
Maximum weight (with all drives/SSDs)
XE9780 system with fully populated with B200
163.20 kg (359.04 pounds)
XE9780 system with fully populated with B300
159.65 kg (351.23 pounds)
WARNING:The system is heavy, so ensure adequate support and balance during movement and installation; a lift is required for loads over 120 pounds, as the system can slide and cause damage when being installed or removed from a higher position on the rack.
Processor specifications
Table 1. Processor specifications for the PowerEdgeXE9780systemThis table provides processor specifications for the system.
Supported processor
Number of processors supported
6th Generation Intel® Xeon® Scalable Processors
with up to 86 cores.
Two
PSU specifications
The PowerEdgeXE9780 system supports 12 AC or DC power supply units
(PSUs).
Table 1. PSU specifications for the
PowerEdgeXE9780 systemThis table describes PSU specifications for the system.
PSU
Power Rating
Class
Heat dissipation (maximum)
Frequency
Voltage
Current
3200 W Mixed Mode (Multi-rated)
3200 W
Titanium
11,850 BTU/hr
50/60 Hz
216.1 V AC–240 V AC
16.0 A
3200 W
N/A
11,850 BTU/hr
N/A
240 V DC
14.5 A
2900 W
N/A
10,750 BTU/hr
50/60 Hz
200 V AC–216 V AC
16.0 A
The power consumption of the system depends on its total power requirements,
which vary based on the configuration (as in, number of GPUs, PSUs, and other
components). Each PSU model (3200 W) can deliver power up to its rated capacity, but
the actual power that is delivered will depend on the system’s needs.
To
determine how much power each PSU delivers, the total system power requirement is
divided by the number of PSUs in the system. For detailed power usage information,
please refer to the iDRAC web GUI for real-time power metrics and system
monitoring.
NOTE:The PowerEdgeXE9780 supports up to 12 AC or DC power supplies
with 6+6 redundancy, autosensing, and auto-switching capability.
Figure 1. Power Configuration
NOTE:This system is also designed to
connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
NOTE:Heat dissipation is calculated
using the PSU wattage rating.
NOTE:Do not mix PSUs from different
vendors within a single system configuration to ensure optimal performance and
reliability.
Figure 2. C20 PSU inlet
connector
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at
calc.
Fifteen standard grade hot-swappable GPU fans installed
in the GPU fan sled.
Five standard grade cold-swappable CPU fans installed
in the HPM sled.
Table 1. Cooling fan specificationsCooling fan specifications
Fan type
Abbreviation
Also known as
Label color
Label image
Standard fans
STD
HPM sled fan
N/A
Figure 1. Standard
HPM sled fan
Standard fans
STD
GPU sled fan
N/A
Figure 2. Standard GPU
sled fan
NOTE:For more information about the supported fan
configuration or matrix, see Thermal restriction matrix.
Supported operating systems
The PowerEdgeXE9780 supports the following operating systems.
Table 1. OS-GPU Compatibility
MatrixThis table presents the GPUs supported by various server operating systems
running on XE9780:
Operating System
Supported GPUs
Canonical Ubuntu Server LTS
B300, B200
Red Hat Enterprise Linux
B300
For more information, go to Operating System Manuals.
System battery specifications
The PowerEdgeXE9780 system supports CR 2032 3.0-V lithium coin cell system battery.
Expansion card riser specifications
The PowerEdgeXE9780 system supports up to four PCI express
(PCIe) Gen 5 expansion x16 cards that are installed on PCIe Switch Board (PSRBB) for
B300 GPU configuration and up to 12 (8 x 75 W, 4 x up to 150 W) Gen5 x16 FHHL
cards(PCIe) on PSBB for B200 GPU configuration.
Table 1. Expansion card slots- B300This table provides information about the expansion card slots that are supported on the system.
Platform
Location
Processor Connection
PCIe slot height
PCIe slot length
PCIe slot width
PSRBB-B300
OCP 3.0 SFF - Slot 1
Processor 1
N/A
Half length
x16
Slot 3
Processor 1
Full height
Half length
x16
Slot 6
Processor 1
Full height
Half length
x16
Slot 9
Processor 0
Full height
Half length
x16
Slot 12
Processor 0
Full height
Half length
x16
Table 2. Expansion card slots- B200This table provides information about the expansion card slots
that are supported on the system.
Platform
Location
PCIe slot height
PCIe slot length
CPU0 - PCIe SW1
CPU0 - PCIe SW2
CPU1 - PCIe SW3
CPU1 - PCIe SW4
RS1
RS2
RS3
RS4
PSBB-B200
OCP 3.0 SFF - Slot 1
N/A
Half length
N/A
N/A
N/A
x16
Slot 2
Full height
Half length
N/A
N/A
N/A
x16
Slot 3
Full height
Half length
N/A
N/A
N/A
x16
Slot 4
Full height
Half length
N/A
N/A
N/A
x16
Slot 5
Full height
Half length
N/A
N/A
x16
N/A
Slot 6
Full height
Half length
N/A
N/A
x16
N/A
Slot 7
Full height
Half length
N/A
N/A
x16
N/A
Slot 8
Full height
Half length
N/A
x16
N/A
N/A
Slot 9
Full height
Half length
N/A
x16
N/A
N/A
Slot 10
Full height
Half length
N/A
x16
N/A
N/A
Slot 11
Full height
Half length
x16
N/A
N/A
N/A
Slot 12
Full height
Half length
x16
N/A
N/A
N/A
Slot 13
Full height
Half length
x16
N/A
N/A
N/A
Memory specifications
The PowerEdgeXE9780 system supports the following memory
specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type
DIMM rank
DIMM capacity
Dual processors
Minimum system capacity
Maximum system capacity
RDIMM
Dual rank
64 GB
1 TB
2 TB
Dual rank
96 GB
1.5 TB
3 TB
Dual rank
128 GB
2 TB
4 TB
Quad rank
256 GB
4 TB
8 TB
NOTE:B200 GPU: the minimum total memory capacity
must greater than 1TB per system.
NOTE:B300 GPU: the minimum total memory capacity must greater
than 2TB per system.
Table 2. Supported memory configuration
speedThe table below shows the supported memory configuration speed for
the system:
NOTE:Mandatory ProDeploy Plus or Dell Customer Deployment
services are required for XE-Series. As a part of the deployment Dell executes
mandatory GPU subsystem tests (applicable for most XE-series
models).
USB ports specifications
Table 1. PowerEdgeXE9780 USB specificationsThe following table shows the USB specifications for the system:
Front
Internal
USB port type
No. of ports
USB port type
No. of ports
USB 2.0-compliant port
One
USB 3.1-compliant port
One
USB type C dual-mode host/BMC Direct port
One
NOTE:The Type-C USB compliant port can be used to
connect USB devices or as an iDRAC Direct port.
NOTE:Avoid connecting USB devices to the iDRAC
Direct port of the XE9780 system during system initialization, POST, boot
operations, or GPU firmware updates.
NIC port specifications
The PowerEdgeXE9780 supports up to two 10/100/1000 Mbps Network
Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated
on the optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the
systemThis table describes the NIC port specification for the system.
Feature
Specifications
Dedicated iDRAC RJ45 ports
Two front dedicated RJ45 ports for
iDRAC connectivity.
The PowerEdgeXE9780 system supports One Mini-DisplayPort on left control panel of the system.
iDRAC10 port specifications
The PowerEdgeXE9780 system supports two iDRAC10 ethernet on the
front of the system.
Video specifications
The system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported front video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution
Name
Refresh rate (Hz)
Horizontal frequency kHz
Pixel clock MHz
640 x 480
VGA
60
31.5 kHz
25.175 MHz
640 x 480
VGA
72
37.9 kHz
31.5 MHz
640 x 480
VGA
75
37.5 kHz
31.5 MHz
640 x 480
VGA
85
43.3 kHz
36.0 MHz
800 x 600
SVGA
60
37.0 kHz
40.0 MHz
800 x 600
SVGA
72
48.1 kHz
50.0 MHz
800 x 600
SVGA
75
46.9 kHz
49.5 MHz
800 x 600
SVGA
85
-
-
1024 x 768
XGA
60
48.4 kHz
65.0 MHz
1024 x 768
XGA
72
57.67 kHz
78.43 MHz
1024 x 768
XGA
75
60.0 kHz
78.75 MHz
1024 x 768
XGA
85
68.7 kHz
94.5 MHz
1152 x 864
XGA+
75
-
-
1280 x 800
WXGA
60 Hz
62.625 kHz
107.21 MHz
1280 x 800
WXGA
75
64.0 kHz
108.0 MHz
1280 x 1024
SXGA
60
64.0 kHz
108.0 MHz
1280 x 1024
SXGA
75
80.0 kHz
135.0 MHz
1280 x 1024
SXGA
85
-
-
1360 x 768
HD
60 Hz
55.9 kHz
106.5 MHz
1440 x 900
WXGA+
60 Hz
55.5 kHz
88.75 MHz
1440 x 900
WXGA+
60 Hz (RB)
-
-
1440 x 900
WXGA+
75 Hz
-
-
1440 x 900
WXGA+
85 Hz
55.54 kHz
97.75 MHz
1600 x 900
HD+
60 Hz (RB)
55.54 kHz
97.75 MHz
1600 x 900
HD+
60 Hz (RB)
60.00 kHz
108.0 MHz
1600 x 1200
UXGA
60 Hz
75.0 kHz
162.0 MHz
1600 x 1200
UXGA
60 Hz (RB)
74.01 kHz
130.25 MHz
1600 x 1200
UXGA
65
-
-
1600 x 1200
UXGA
70
-
-
1600 x 1200
UXGA
75
-
-
1600 x 1200
UXGA
85
-
-
1680 x 1050
WSXGA+
65 Hz (RB)
-
-
1680 x 1050
WSXGA+
70 Hz
-
-
1680 x 1050
WSXGA+
75 Hz
-
-
1680 x 1050
WSXGA+
85 Hz
-
-
1920 x 1080
FHD
60 Hz
67.158 kHz
-
1920 x 1080
FHD
60 Hz (RB)
66.587 kHz
138.5 MHz
1920 x 1200
WUXGA
60 Hz
74.556 kHz
193.25 MHz
1920 x 1200
WUXGA
60 Hz (RB)
74.038 kHz
154.00 MHz
1920 x 1200
WUXGA
75 Hz
-
-
1920 x 1200
WUXGA
85 Hz
74.038 kHz
~220.75 MHz VCO limit is ~244MHz
NOTE:(RB) - Reduced Blanking for Digital Displays requiring less
blank time. This was introduced for Signal Integrity improvements by reducing Pixel
Clock rates for VGA- Analog input devices.
Environmental specifications
NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on
Dell Support.
Table 1. Continuous operation specifications for ASHRAE A2This table describes the continuous operation specifications for ASHRAE A2.
Temperature
Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)
10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)
8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating
Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous operation specifications for ASHRAE A3This table describes the continuous operation specifications for
ASHRAE A3.
Temperature
Specifications
Allowable continuous
operations
Temperature ranges for altitudes <= 900 m (<=
2953 ft)
5 to 40°C (41 to 104°F) with no direct sunlight on
the equipment
Humidity percent ranges (non-condensing at all times)
8%RH with -12°C minimum dew point to 85%RH with 24°C (75.2°F)
maximum dew point
Operational altitude de-rating
Maximum temperature is reduced by 1°C/300 m
(1.8°F/984 Ft) above 900 m (2953 Ft)
Table 3. Continuous operation specifications for ASHRAE A4This table describes the continuous operation specifications for
ASHRAE A4.
Temperature
Specifications
Allowable continuous
operations
Temperature ranges for altitudes <= 900 m (<=
2953 ft)
5 to 45°C (41 to 113°F) with no direct sunlight on
the equipment
Humidity percent ranges (non-condensing at all times)
8%RH with -12°C minimum dew point to 85%RH with 24°C (75.2°F)
maximum dew point
Operational altitude de-rating
Maximum temperature is reduced by 1°C/125 meters (1.8°F/410 feet)
above 900 meters (2,953 feet)
Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature
Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)
20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits
-40°C to 65°C (-104°F to 149°F)
Non-operational humidity limits
5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude
12,000 meters (39,370 feet)
Maximum operational altitude
3,048 meters (10,000 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.38 Grms at 7 Hz to 250 Hz for 15 minutes (bottom side only).
Maximum vibration
Specifications
Operating
0.21Grms at 5Hz to 500Hz for 10min (all x, y, and z axes)
Storage
1.38 G1.88Grms at 10Hz to 500Hz for 15min (all six sides tested) at 7 Hz to
250 Hz for 15 minutes
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. The maximum shock specification of a nonoperational system is executed shock pulses in the z axis (one pulse) of 71 G for up to 2 ms.
Maximum shock pulse
Specifications
Operating
Six consecutively executed shock pulses in the positive and
negative x, y, and z axes of 6G for up to 11ms
Storage
Six consecutively executed shock pulses in the positive and
negative x, y, and z axes (one pulse on each side of the system) of
71 G for up to 2 ms.
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination
Specifications
Air filtration: Conventional Data Center only
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)
Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments
Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination
Specifications
Notes
Copper coupon corrosion rate
ISA-71 Class G1: <300 Å/month
Per ANSI/ISA71.04
Silver coupon corrosion rate
ISA-71 Class G1: <200 Å/month
Per ANSI/ISA71.04
Thermal restriction matrix
Table 1. Thermal Restriction Matrix-
6th Generation Intel® Xeon® Processors The table describes the thermal restriction matrix:
Configuration
E3.S x16
Component
Processor
cTDP
Cores
Part number
B300 + 4 x PCIe card + 8 x OSFP
B200 +12 x PCIe card
CPU
Intel GNR-SP 6787P
350 W
86
7FRX4
2U-Ext HSK/STD Fan
2U-Ext HSK/STD Fan
Intel GNR-SP 6767P
350 W
64
KJWD6
2U-Ext HSK/STD Fan
2U-Ext HSK/STD Fan
Intel GNR-SP 6747P
330 W
48
92C7P
2U-Ext HSK/STD Fan
2U-Ext HSK/STD Fan
Memory
64GB RDIMM 6400
MT/s
2U-Ext HSK/STD Fan
2U-Ext HSK/STD Fan
96GB RDIMM 6400
MT/s
2U-Ext HSK/STD Fan
2U-Ext HSK/STD Fan
128GB RDIMM 6400
MT/s
2U-Ext HSK/STD Fan
2U-Ext HSK/STD Fan
DPU
B3220
STD fan
-
GPU
NVIDIA B300 1100W
8-way
STD Fan
-
NVIDIA B200 1000W
8-way
-
STD Fan
Other Thermal Restrictions
Configurations that support ASHRAE A3 and A4 are not available.
A PCIe blank (DPN: GYP32) is required if no PCIe card is installed in any slot.
A low-profile block is required when installing a low-profile card.
DIMM blanks are required if fewer than 16 DIMMs are installed.
M.2, OCP, and HDD blanks are required if the corresponding components are not
installed.
GPU fans are hot-swappable and must be reinstalled within 30 seconds.
