Dell PowerEdge XE9712 with iDRAC: руководство по обслуживанию

Chassis dimensions

This image shows the dimensions of XE9712 with iDRAC system. — Figure 1. Chassis dimensions

Table 1. PowerEdge XE9712 with iDRAC chassis dimensionsThis table provides the dimensions of the system:
Xa	Xb	Y	Za	Zb	Zc
481.54 mm (18.95 inches)	438 mm (17.24 inches)	43.60 mm (1.71 inches)	75.33 mm (2.96 inches)	765.8 mm (30.14 inches)	836.8 mm (32.9 inches)

System weight

Table 1. XE9712 with iDRAC weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight
8 x E1.S	30 kg (66.14 pounds)

Processor specifications

Table 1. PowerEdge XE9712 with iDRAC processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
NVIDIA Grace with 72 cores per processor	Two

Cooling specifications

The PowerEdge XE9712 with iDRAC supports up to 8 Standard (STD) cooling fans and Liquid cooling.

Table 1. Cooling fan specificationCooling fan specifications
Fan type	Abbreviation	Label image
Standard fans	STD fan	Figure 1. Standard fan

Table 2. Liquid CoolingThis table shows Liquid cooling
Cooling type	Abbreviation	Label image
Direct Liquid Cooling	DLC	Figure 2. Manifold

NOTE:Cooling fans run at reduced speed in standby mode and adjust based on ambient temperature.

NOTE:When an overtemperature condition is detected, the system performs a controlled shutdown as designed. During this event, a Lifecycle Controller log entry (SYS1000, LCS0004, LCS2000) may be generated. This log entry is informational and does not indicate a system fault or abnormal condition.

NOTE:Ensure that cooling equipment is installed correctly to prevent overtemperature shutdowns. If the system shuts down due to an overtemperature condition, recovery requires a physical AC power cycle.

Supported operating systems

The PowerEdge XE9712 with iDRAC supports the following operating systems:

Canonical Ubuntu Server LTS

For specifications and interoperability details, see OS support.

System battery specifications

The PowerEdge XE9712 uses one CR 2032 3.0 V lithium coin cell CR 2032 3.0 V lithium coin-cell battery .

Expansion card riser specifications

The PowerEdge XE9712 with iDRAC supports up to two Gen5 PCI express (PCIe) slots and OSFP NVIDIA ports on front of the system.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Expansion card riser	Processor Connection	Height	Length	Card Width	Slot Width	Power
Slot 1	RF1	Processor 0	Full Height	Half Length	SW	x16	150 W
Slot 2	RF2	Processor 1	Full Height	Half Length	SW	x16	150 W

Memory specifications

The PowerEdge XE9712 with iDRAC system supports the following memory specifications for optimized operation:

480 GB of LP DDR5X memory with error-correction code (ECC) / CPU
288 GB HBM3e / GPU

GPU Specifications

The PowerEdge XE9712 with iDRAC system supports

Up to four NVLInk-C2C: 900GB/s of coherent memory of CPU-GPU interconnection.

Drives

The PowerEdge XE9712 with iDRAC system supports:

Up to 8 x EDSFF E1.S hot-swappable NVMe SSDs

NIC port Specifications

The PowerEdge XE9712 with iDRAC system supports

1G Network Interface Controller (NIC) Printed circuit board (PCB) installed in front of the sled.
One iDRAC mangement RJ45 port.

USB ports specifications

Table 1. PowerEdge XE9712 with iDRAC USB specificationsThe following table shows the USB specifications for the system:
Front
USB port type	Number of ports
USB type-A supporting USB 3.0- compliant port	One
USB type-C supporting USB 2.0 and iDRAC MGMT port	One

Video ports specifications

The XE9712 with iDRAC system support video using the mini-display port.

Video specifications

The PowerEdge XE9712 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, see the Product Environmental Datasheet that are located with the Manuals and Documents on Dell Support.

Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing always)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude derating	Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)

NOTE:Certain system hardware configurations may require operating temperatures to be less than 28°C. For more information, see the Thermal air restrictions section.

Table 2. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and nonoperation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Nonoperational temperature limits	-40 (-5) to 65°C (-40 (23) to 149°F) NOTE:** Liquid filled components, or systems/solutions containing liquid filled components are limited to approximately 5°C above their freeze point. The only authorized liquid coolant is Recochem PG25 with a freeze point between -9°C and -13°C, therefore the lower nonoperational temperature limit is -5°C. Components and systems.solutions that can contain liquid but do not at the time of testing shall be tested to the -40°C lower nonoperational temperature limit.
Nonoperational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum nonoperational altitude	12,000 meters (39,370 ft)
Maximum operational altitude	3,048 meters (10,000 ft)

Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.1 Grms at 5 Hz to 100 Hz (x, y, and z axes). The maximum vibration specification of a nonoperational system is 1.1 Grms at 2 Hz to 500 Hz for 15 min (all six sides tested).
Maximum vibration	Specifications
Operating	0.1 G_rms 5 Hz–100 Hz (x, y, and z axes)
Storage	1.1 G_rms 2 Hz–500 Hz for 15 min (all six sides tested)

Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is 18 consecutively performed half sine shock pulses in the positive and negative x, y, and z axes (three pulses on each side of the system) of six G for up to 11 ms.. The maximum shock specification of a nonoperational system is Six consecutively performed Trapezoidal Shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 30 G for up to 11 ms.
Maximum shock pulse	Specifications
Operating	18 consecutively performed half sine shock pulses in the positive and negative x, y, and z axes (three pulses on each side of the system) of six G for up to 11 ms.
Storage	Six consecutively performed Trapezoidal Shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 30 G for up to 11 ms.

Thermal Restrictions

Table 1. PCIe Configuration RestrictionThis table describes the PCIe Configuration Restriction.
Max PCIe Q’ty/Per Sled	PCIe Slot #1	PCIe Slot #2
1	N/A	BF3 DPU card (NVIDIA B3240)
NOTE: NVIDIA Dual QSFP112 Transceiver (MMA1Z00-NS400) is required for BF3 DPU card. NVIDIA Dual OSFP Transceiver (980-9IAT0-00XM00, MMS4X00-NM-FLT, MMS4X00-NS-FLT, MMA4Z00-NS-FLT) is required for CX8 PCIe card.

Table 2. Thermal restrictionsThis table describes the Thermal restrictions.
XE9712	Configuration
I/O Board Configuration	CX8 x 2
PCIe Configuration	Slot 1: N/A	Slot 2: B3240 x 1
E1.S SSD Configuration	G5 E1.S SSD x 8 (S0 - S7)	Solidigm PS1010 E1.S SSD x 8
BOSS Configuration	960 GB M.2 NVMe x 1

Table 3. TDPThis table describes the TDP supported.
XE9712	TDP	Total TDP	Model	Supported temperature
CPU TDP	300 W per HPM	2900 W per HPM	GB300 HPM 1CPU: 2GPU Board	40°C
GPU TDP	2 x 1400 W per HPM	2900 W per HPM	GB300 HPM 1CPU: 2GPU Board	40°C

NOTE:

CPU can go up to 300 W max by borrowing power from GPUs.
NVIDIA Dual QSFP112 Transceiver (MMA1Z00-NS400) is required for BF3 DPU card.
NVIDIA Dual OSFP Transceiver (980-9IAT0-00XM00, MMS4X00-NM-FLT, MMS4X00-NS-FLT, MMA4Z00-NS-FLT) is required for CX8 OSFP board.

Blank requirement

E1.S drive slots must be fully populated or blanked.

This image shows E1.S blank. — Figure 1. E1.S blank

Thermal solution

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE:The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300A/month per class G1 as defines by ANSI/ISA71.04-2013
Silver coupon corrosion rate	<200A/month as defined by ANSI/ISA71.04-2013