Dell PowerEdge XE9685L: руководство по обслуживанию

Table 1. Weight for the PowerEdge XE9685L System With 8 x 2U SSDThe table below shows the maximum weight of the PowerEdge XE9685L system with 8 x 2U SSD.

System Configuration	Maximum Weight (With All drives/SSDs)
Fully populated XE9685L system	94.6 kg ( 208.55 lb)

Table 2. PowerEdge system Weight Handling RecommendationsThis table shows the recommendations in handling the system weight.

Chassis Weight	Description
40–70 pounds	Recommend two persons to lift.
70 pounds- 120 pounds	Recommend three persons to lift.
≥ 121 pounds	Recommend to use a server-lift.

Table 1. Processor specifications for the PowerEdge XE9685L systemThis table provides processor specifications for the system.

Supported processor	Number of processors supported
Two 5th Generation AMD EPYC™ 9005 Series processors with up to 192 cores per processor	Two

Below table lists the power capacity of the PSUs in High/Low line operation mode.

Table 1. PSUs Highline and Low line RatingsThe table lists the power capacity of the PSUs in High or Low line operation mode.

Features	3000 W Titanium
Peak Power (Highline/-72 VDC)	N/A
Highline/-72 VDC	N/A
Peak Power (Lowline/-40 VDC)	N/A
Lowline/-40 VDC	N/A
Highline 240 VDC	3000 W
DC-(48-60) V	N/A

The PowerEdge XE9685L supports six AC or DC power supplies.

Dell PSUs have achieved Titanium efficiency levels as shown in the table below.

Table 2. PSU Efficiency LevelThe table lists the PSU Efficiency level.

Form Factor	Output	Class	10%	20%	50%	100%
Redundant 86mm	3000 W (Input 240AC)	Titanium	90.00%	94.00%	96.00%	94.00%

The PowerEdge XE9685L supports the following operating systems:

• Canonical Ubuntu Server LTS
• Red Hat Enterprise Linux

The PowerEdge XE9685L system supports CR 2032 3.0-V lithium coin cell system battery.

The PowerEdge XE9685L system supports 24 DIMMs (12 per socket), with up to 3 TB of memory and speeds of up to 6400 MT/s.

The PowerEdge XE9685L system supports registered (RDIMMs) which use a buffer to reduce memory loading and provide greater density, allowing for the maximum platform memory capacity. Unbuffered DIMMs (UDIMMs) are not supported.

Table 1. Memory technology comparisonThis table describes the supported memory on the system

Feature	PowerEdge XE9685L (DDR5)
DIMM type	RDIMM
Transfer speed	Supports 1 DPC and up to 6400 MT/s. NOTE:Maximum DIMM transfer speed support dependent on CPU SKU and DIMM population
Voltage	1.1 V

The following table lists the supported DIMMs for the PowerEdge XE9685L.

Table 2. Supported DIMMsThis table provides information about supported DIMMs:

DIMM Speed (MT/s)	DIMM Type	DIMM Capacity (GB)	Ranks per DIMM	Data Width	DIMM Volts (V)
6400	RDIMM	64	2	x4	1.1
6400	RDIMM	96	2	x4	1.1
6400	RDIMM	128	2	x4	1.1

Table 3. Minimum system memory requirementsMinimum System Memory Requirements

8xGPU	B200 GPU
Memory	24 pcs
64	Supported
96	Supported
128	Supported

Table 4. Total System Memory Capacity RequirementThis table provides information about supported DIMM slots in PowerEdge XE9685L.

DIMM capacity	64 GB	96 GB	128 GB
24 x DIMM sockets population	Total memory: 1.5 GB	Total memory: 2.3 TB	Total memory: 3 TB

The PowerEdge XE9685L supports:

• 8 x 2.5-inch hot-swappable NVMe SSD drives

The PowerEdge XE9685L system supports

• 8 x NVIDIA HGX H200 141GB 700W SXM5 GPUs, fully interconnected with NVIDIA NVLink technology
• 8 x NVIDIA HGX B200 180GB 1000W SXM6 GPUs, fully interconnected with NVIDIA NVLink technology

Table 1. PowerEdge XE9685L USB specificationsThe following table shows the USB specifications for the system:

Front		Rear
USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 2.0-compliant ports	One

The PowerEdge XE9685L system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.

Feature	Specifications
LOM card	1 GbE x 2
OCP card (OCP 3.0)	Broadcom 25 GbE x 2

The PowerEdge XE9685L system supports One VGA port on the front of the system.

The PowerEdge XE9685L system supports One RJ45 iDRAC9 ethernet port on the rear of the system.

The system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported front video resolution options for the systemThis table describes the supported front video resolution options for the system.

Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Table 2. Supported rear video resolution options for the systemThis table describes the supported rear video resolution options for the system.

Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Table 1. Continuous operation specifications for ASHRAE A2This table describes the continuous operation specifications for ASHRAE A2.

Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing always)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Shared requirements across all categories This table describes the shared requirements across all categories.

Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40°C to 65°C (-104°F to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 ft)
Maximum operational altitude	3,050 meters (10,006 ft)

Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.38 Grms at 7 Hz to 250 Hz for 15 minutes (bottom side only).

Maximum vibration	Specifications
Operating	0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage	1.38 Grms at 7 Hz to 250 Hz for 15 minutes

Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. The maximum shock specification of a nonoperational system is performed shock pulses in the z axis (one pulse) of 71 G for up to 2 ms.

Maximum shock pulse	Specifications
Operating	Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Performed shock pulses in z axis (one pulse) of 71 G for up to 2 ms

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.

Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHRAE Standard 127
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE:This condition applies to data center and non-data center environments. NOTE: Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.

Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

Table 1. Thermal Restriction Matrix- 5^th Generation AMD servers SKUs The table describes the thermal restriction matrix:

CPU (W)	Heat sink type	Fan Type	8 x 2.5-inch NVMe SSDs
			ASHRAE A2 (Max 35° C)
AMD CPU 9965/ 9755 (500W)	CPU coldplate	High-Performance Gold Fans (CPU Fan)	Supported
AMD CPU 9655/ 9575 (400W)
AMD CPU 9455 (300W)

Table 2. GPU/FPGA Thermal Restriction Matrix The table describes the GPU/FPGA Thermal Restriction Matrix for the system.

TDP (W)	Heat sink type	Fan Type	8 x 2.5-inch NVMe SSDs
			ASHRAE A2 (Max 35° C)
B200 8-GPU (1000 W per GPU)	GPU coldplate	High-Performance Gold Fans (GPU Fan)	Supported

Other restrictions:

• ASHRAE A3/A4 environments are not supported.
• Install a hard drive blank if the slot is not equipped with a hard drive.
• DIMM blank is not required when the DIMM population quantity is 12 pieces or more.