Dell PowerEdge XE9680L: руководство по обслуживанию

Table 1. Weight for the PowerEdge XE9680L System With 8 x 2U SSDThe table below shows the maximum weight of the PowerEdge XE9680L system with 8 x 2U SSD.

System Configuration	Maximum Weight (With all drives/SSDs)
Fully populated XE9680L system with H200 GPUs	91.63 kg (202.00 lb)
Fully populated XE9680L system with B200 GPUs	95.6 kg (210.76 lb)

Table 2. PowerEdge system Weight Handling RecommendationsThis table shows the recommendations in handling the system weight.

Chassis Weight	Description
40–70 lb	Recommend two persons to lift.
70 lb- 120 lb	Recommend three persons to lift.
≥ 121 lb	Recommend to use a server-lift.

Table 1. Processor specifications for the PowerEdge XE9680L systemThis table provides processor specifications for the system.

Supported processor	Number of processors supported
5th Generation Intel® Xeon® Scalable Processors with up to 64 cores	Two

The PowerEdge XE9680L supports the following operating system:

• Canonical Ubuntu Server LTS
• Red Hat Enterprise Linux

The PowerEdge XE9680L system supports CR 2032 3.0-V lithium coin cell system battery.

The PowerEdge XE9680L system supports the following memory specifications for optimized operation.

Table 1. Supported DIMMsThis table provides information about supported DIMMs in the PowerEdge XE9680L.

DIMM Speed (MT/s)	DIMM Type	DIMM Capacity (GB)	Ranks per DIMM	Data Width	DIMM Volts (V)
5600	RDIMM	64	2	x4	1.1
		96	2	x4	1.1
		128	4	x4	1.1

Table 2. Memory technologyThis table provides information about memory technology in the PowerEdge XE9680L.

Feature	PowerEdge XE9680L (DDR5)
DIMM type	RDIMM
Transfer speed	Up to 5600 MT/s (1 DPC) Up to 4400 MT/s (2 DPC)
Voltage	1.1 V
Memory module socket	32, 288-pin

The PowerEdge XE9680L supports:

• 8 x 2.5-inch hot-swappable NVMe SSD drives

The PowerEdge XE9680L system supports

• 8 x NVIDIA HGX H200 141GB 700W SXM5 GPUs, fully interconnected with NVIDIA NVLink technology
• 8 x NVIDIA HGX B200 180GB 1000W SXM6 GPUs, fully interconnected with NVIDIA NVLink technology

Table 1. PowerEdge XE9680L USB specificationsThe following table shows the USB specifications for the system:

Front		Rear
USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 2.0-compliant ports	One

The PowerEdge XE9680L system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.

Feature	Specifications
LOM card	1 GbE x 2
OCP card (OCP 3.0)	Intel 10 GbE x 4, Broadcom 25 GbE x 2

The PowerEdge XE9680L system supports One DB-15 VGA port one each on the front and back of the system.

The PowerEdge XE9680L system supports One RJ45 iDRAC9 ethernet port on the rear of the system.

The system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported front video resolution options for the systemThis table describes the supported front video resolution options for the system.

Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Table 2. Supported rear video resolution options for the systemThis table describes the supported rear video resolution options for the system.

Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Table 1. Continuous operation specifications for ASHRAE A2This table describes the continuous operation specifications for ASHRAE A2.

Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing always)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Shared requirements across all categories This table describes the shared requirements across all categories.

Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40°C to 65°C (-104°F to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 ft)
Maximum operational altitude	3,050 meters (10,006 ft)

Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.38 Grms at 7 Hz to 250 Hz for 15 minutes (bottom side only).

Maximum vibration	Specifications
Operating	0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage	1.38 Grms at 7 Hz to 250 Hz for 15 minutes

Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. The maximum shock specification of a nonoperational system is performed shock pulses in the z axis (one pulse) of 71 G for up to 2 ms.

Maximum shock pulse	Specifications
Operating	Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Performed shock pulses in z axis (one pulse) of 71 G for up to 2 ms

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.

Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHRAE Standard 127
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE:This condition applies to data center and non-data center environments. NOTE: Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.

Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

Table 1. Thermal Restriction Matrix- 5^th Generation Intel® Xeon® Scalable ProcessorsThe table describes the thermal restriction matrix:

CPU (W)	Heat sink type	Fan Type	8 x 2.5-inch NVMe SSDs
			ASHRAE A2 (Max 35° C)
Intel EMR 56C 8570, 8592+, 8580, 8568Y+ CPU (350W) Intel EMR 56C 8562Y+ CPU (300W)	DLC coldplates	High-Performance Gold Fans (CPU Fan)	Supported

Table 2. GPU/FPGA Thermal Restriction Matrix for H200 GPUThe table describes the GPU/FPGA Thermal Restriction Matrix for the system.

TDP (W)	Heat sink type	Fan Type	8 x 2.5-inch NVMe SSDs
			ASHRAE A2 (Max 35° C)
H200 8-GPU (700 W per GPU)	DLC coldplates	High-Performance Gold Fans (GPU Fan)	Supported

Table 3. GPU/FPGA Thermal Restriction Matrix for B200 GPUThe table describes the GPU/FPGA Thermal Restriction Matrix for the system.

TDP (W)	Heat sink type	Fan Type	8 x 2.5-inch NVMe SSDs
			ASHRAE A2 (Max 35° C)
B200 8-GPU (1000 W per GPU)	DLC coldplates	High-Performance Gold Fans (GPU Fan)	Supported

Other restrictions:

• ASHRAE A3/A4 environments are not supported.
• Install a hard drive blank if the slot is not equipped with a hard drive.
• DIMM blank is not required when the DIMM population quantity is 16 pieces or more.