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Dell PowerEdge XE9680: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge XE9680 system.
Table 1. Chassis dimension for the PowerEdgeXE9680 systemThis table provides the dimensions of the system:
Drives Xa Xb Y Za Zb Zc
8 x 2.5-inch SATA/SAS/NVMe SSD drives configuration

16 x E3.S NVMe drives configuration

482.0 mm (18.97 in.)

447.0 mm (17.59 in., top)
  

434.0 mm (17.08 in., bottom)

263.2 mm (10.36 in.)

35.77 mm (1.4 in.)With bezel
  

22.0 mm (0.87 in. Without bezel

855.5 mm (33.68 in., top) Ear to rear wall
  

966 mm (38.03 in., bottom) Ear to rear GPU fan
  

973 mm (38.30 in.) Ear to Fan latch
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.
NOTE:Chassis length is longer than usual, need to consider potential interferences with rear mounted PDU or the rear rack door when installed on rack.

System weight

Table 1. Weight for the PowerEdge XE9680 system with 8 x 2U SSDsThe table below shows the maximum weight of the PowerEdge XE9680 system with 8 x 2U SSDs.
System configuration Maximum weight (with all drives/SSDs)
XE9680 system with fully populated with H100/H200/H20/H800 107 kg (235.89 lb)
XE9680 system with fully populated with A100 105 kg (231.48 lb)
XE9680 system with fully populated with MI300X 113.3 kg (249.78 lb)
XE9680 system with fully populated with Gaudi3 111.7 kg (246.26 lb)
XE9680 system L10, without 8 x U2 SSDs, 6 x PSUs, 1 x GPU module, 10 x PCIe cards, 1 x BOSS module 70.19 kg (154.74 lb)
Table 2. Weight for the PowerEdge XE9680 system with 16 x E3.s SSDsThe table below shows the maximum weight of the PowerEdge XE9680 system with 16 x E3.s SSDs.
System configuration Maximum weight (with all drives/SSDs)
XE9680 system with fully populated with H100/H200/H20/H800 107.75 kg (237.55 lb)
XE9680 system with fully populated with A100 106 kg (233.69 lb)
XE9680 system with fully populated with MI300X 114.05 kg (251.44 lb)
XE9680 system L10, without 16 x E3.s SSDs, 6 x PSUs, 1 x GPU module, 10 x PCIe cards, 1 x BOSS module 70.76 kg (155.99 lb)
NOTE:The 16 x E3.s SSDs configuration is not supported by the XE9680 system with Gaudi3 GPUs.
Table 3. PowerEdge system weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight Description
40 lb - 70 lb Recommend two person to lift
70 lb- 120 lb Recommend three person to lift
≥ 121 lb Server lift is required
WARNING:The system is heavy, so ensure adequate support and balance during movement and installation; a lift is required for loads over 120 lb, as the system can slide and cause damage when being installed or removed from a higher position on the rack.
CAUTION: Lift the system by using the provided lifting handles on the chassis and refrain from using clips or other chassis points to lift the system. Non-designated lift-points on the chassis may cause system damage due to the inability to support the system weight while lifting.

Processor specifications

Table 1. Processor specifications for the PowerEdge XE9680 systemThis table provides processor specifications for the system.
Supported processor Number of processors supported
5th Generation Intel® Xeon® Scalable Processors with up to 64 cores or 4th Generation Intel® Xeon® Scalable Processors with up to 56 cores Two

PSU specifications

The PowerEdgeXE9680 system supports six AC or DC power supply units (PSUs).
Table 1. PSU specifications for the PowerEdgeXE9680 systemThis table describes PSU specifications for the system.
PSUPower Rating Class Heat dissipation (maximum) Frequency Voltage Current
2800 W Mixed Mode2800 W Titanium 10500 BTU/hr 50/60 Hz 200 - 240 V AC 15.6 A
N/A 10500 BTU/hr N/A 240 V DC 13.6 A
3200 W Mixed Mode3200 W Titanium 12000 BTU/hr 50/60 Hz 277 V AC 13 A
N/A 12000 BTU/hr N/A 336 V DC 11.5 A
3000 W Mixed Mode

(Multi-rated)

3000 WTitanium 10900 BTU/hr 50/60 Hz 209.1 - 240 V AC16 A
N/A 11000 BTU/hr N/A 240 V DC14.6 A
2800 WN/A 10500 BTU/hr 50/60 Hz 200 - 209 V AC16 A

The power consumption of the system depends on its total power requirements, which vary based on the configuration (e.g., number of GPUs, PSUs, and other components). Each PSU model (2800W, 3000W, 3200W) is capable of delivering power up to its rated capacity, but the actual power delivered will depend on the system’s needs.

To determine how much power each PSU delivers, the total system power requirement is divided by the number of PSUs in the system. For detailed power usage information, please refer to the iDRAC web GUI for real-time power metrics and system monitoring.

NOTE:3000 W (Multi-rated) PSUs are only supported by the PowerEdge XE9680 system with Gaudi3 GPUs.
NOTE:PowerEdgeXE9680 system supports 5+1 PSU redundancy which means only one PSU is redundant. A/B Grid Redundant setting in iDRAC is not supported.
The PowerEdge XE9680 system also supports 3+3 FTR redundancy. When the Redundancy policy is set to PSU redundant, and two or more PSUs fail, a fault-tolerant redundant mode is activated. This mode triggers the GPU power brake, throttling GPU clocks to one-fourth their normal rate, and resulting in a GPU performance drop to around one-fifth. It's important to note that this feature is applicable only when the system is set to PSU redundant mode. In configurations where PSU redundancy is not enabled, the fault-tolerant redundant mode does not automatically trigger GPU Power Brake.
Figure 1. Power Configuration

This image shows the power configuration option

NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:Do not mix PSUs from different vendors within a single system configuration to ensure optimal performance and reliability.
Figure 2. PSU inlet connector
This image shows list of PSU inlet connector
Figure 3. PSU power cord
This image shows list of PSU power cords
Table 2. PSU power cordThe table lists the PSU power cord .
Form factor Output Power cord
Redundant 86 mm

2800 W 54 VDC

3000 W 54 VDC

C21
Redundant 86 mm 3200 W 54 VDC APP 2006G1 Power Cords
NOTE:2800W 54V PSU has a C22 input socket that requires C21 to C20 jumper cord to connect it to PDU in the rack. Traditional high amperage power cords C20/C19 cannot be inserted into the PSU.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

Cooling fan specifications

The PowerEdgeXE9680 system supports up to:

  • six high performance (HPR GOLD) gold fans installed in mid tray and
  • ten high performance (HPR GOLD) gold fans installed on the rear of the system.
NOTE:Twelve high performance (HPR GOLD) gold fans installed on the rear of the PowerEdge XE9680 system with Gaudi3 GPUs.
Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
High performance (HPR GOLD) gold fans HPR GOLD Mid Compute Fan Gold
Figure 1. High performance (Gold grade) fan
This image shows the high performance fan.
High performance (HPR GOLD) gold fans HPR GOLD Rear GPU Fans N/A
NOTE:New cooling fans comes with the Rear GPU fans label.
Figure 2. Rear GPU Fans
This image shows the very high performance fan.
High performance (HPR GOLD) gold fans with Intel Gaudi3 HPR GOLD Rear GPU Fans N/A
NOTE:New cooling fans comes with the rear GPU fans label for Gaudi3 GPU.
Figure 3. Rear GPU Fans
This image shows the high performance gold rear fan.
NOTE:For more information about the supported fan configuration or matrix, see Thermal restriction matrix.

Supported operating systems

The PowerEdge XE9680 supports the following operating systems.
Table 1. OS-GPU Compatibility MatrixThis table presents the GPUs supported by various server operating systems running on XE9680:
Operating System Supported GPUs
Canonical Ubuntu Server LTS A100, H100, H800, H200, H20, MI300X, Gaudi3
Red Hat Enterprise Linux A100, H100, H800, H200, H20, MI300X, Gaudi3
SUSE Linux Enterprise Server A100, H100, H800, H200, H20, MI300X, Gaudi3
VMware ESXi H100

For more information, go to Operating System Manuals.

System battery specifications

The PowerEdge XE9680 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge XE9680 system supports up to eight PCI express (PCIe) Gen 5 expansion cards installed on PCIe Switch Board (PSB) and two PCI express (PCIe) Gen 5 expansion cards installed on PCIe Base Board (PBB).

NOTE:Slots 31 and 40 are present on PCIe Base Board and can be used to install NICs/high power consumption SmartNIC/DPUs.
Table 1. Expansion card slotsThis table provides information about the expansion card slots that are supported on the system.
Expansion card riser PCIe slot Processor Connection PCIe slot height PCIe slot length PCIe slot width
Riser 4 32 Processor 2 Full height Half length x16
33 Processor 2 Full height Half length x16
Riser 3 34 Processor 2 Full height Half length x16
35 Processor 2 Full height Half length x16
Riser 2 36 Processor 1 Full height Half length x16
37 Processor 1 Full height Half length x16
Riser 1 38 Processor 1 Full height Half length x16
39 Processor 1 Full height Half length x16
NOTE:PowerEdge XE9680 system with Gaudi3 GPUs supports 8 PCIe slots, as slots 33 and 38 are blocked to improve airflow and address thermal concerns.
Table 2. NIC/SmartNIC/DPU slotsThis table provides information about the expansion slots that are supported on the system.
PCIe slot Processor Connection PCIe slot height PCIe slot length PCIe slot width
31 Processor 2 Full height Half length x16
40 Processor 1 Full height Half length x16
NOTE:SmartNIC/DPUs with high power consumption (> 75W), should be installed in slots 31 and 40. SmartNIC/DPUs with normal power consumption (<75W), can also be installed in slots 32-39.
NOTE:PowerEdge XE9680 system with MI300X GPUs does not support SmartNIC/DPU.

Memory specifications

The PowerEdge XE9680 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Dual processors
Minimum system capacity Maximum system capacity
RDIMM Dual rank 32 GB Not Supported 1 TB
Dual rank 64 GB 1 TB 2 TB
Dual rank 96 GB 1.5 TB 3 TB
Quad rank 128 GB 2 TB 4 TB
NOTE:The PowerEdge XE9680 with MI300X GPUs supports memory capacities of 2TB and above. Configurations with 1TB memory are not supported.
Table 2. Minimum System Memory RequirementsThis table provides information about minimum system memory requirements in PowerEdge XE9680.
8xGPU A100/H100/H800 H200 H20 MI300X Gaudi3
Memory 16pcs 32pcs 16pcs 32pcs 16pcs 32pcs 16pcs 32pcs 16pcs 32pcs
32 GB Not Supported Supported Not Supported Supported Not Supported Supported Not Supported Not Supported Not Supported Not Supported
64 GB Supported Supported Supported Supported Supported Supported Not Supported Supported Not Supported Supported
96 GB Supported Supported Supported Supported Supported Supported Not Supported Supported Not Supported Supported
128 GB Supported Supported Supported Supported Supported Supported Supported Supported Supported Supported
Table 3. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets CPUs Speed GPUs
32, 288-pin5th Generation Intel® Xeon® Scalable Processors

5600 MT/s 1DIMM per channel,

4400 MT/s 2DIMMs per channel

A100/H100/H200/H20/H800
MI300X
Gaudi3
4th Generation Intel® Xeon® Scalable Processors

4800 MT/s 1DIMM per channel,

4400 MT/s 2DIMMs per channel

A100/H100/H200/H20/H800
MI300X
Gaudi3

Storage controller specifications

The PowerEdge XE9680 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H965i
Internal Boot
  • Boot Optimized Storage Subsystem (NVMe BOSS-N1): HWRAID 1, 2 x M.2 SSDs
Software RAID
  • S160 NVMe
NOTE:The PowerEdge XE9680 does not support PERC H965i and Software RAID configurations with Gaudi3 GPUs.

Drives

The PowerEdge XE9680 system supports:
  • 8 x 2.5-inch hot-swappable NVMe SSD drives
  • 8 x 2.5-inch hot-swappable SAS/SATA SSD drives
  • 16 x E3.S hot-swappable EDSFF direct drives
NOTE:The PowerEdge XE9680 with Gaudi3 GPUs supports only 8 x 2.5-inch hot-swappable NVMe SSD drives .

GPU Specifications

The PowerEdge XE9680 system supports
  • 8 NVIDIA HGX H100/H800 80GB 700W SXM5 GPUs, fully interconnected with NVIDIA NVLink technology or
  • 8 NVIDIA HGX H200 141GB 700W SXM5 GPUs, fully interconnected with NVIDIA NVLink technology or
  • 8 NVIDIA HGX H20 96GB 500W SXM5 GPUs, fully interconnected with NVIDIA NVLink technology or
  • 8 NVIDIA HGX A100 80GB 500W SXM4 GPUs, fully interconnected with NVIDIA NVLink technology or
  • 8 AMD Instinct MI300X 192GB 750W OAM accelerator with AMD Infinity Fabric connectivity or
  • 8 INTEL Gaudi3 128GB 900W OAM accelerator with embedded RoCE ports for ethernet connectivity.
NOTE:Mandatory ProDeploy Plus or Dell Customer Deployment services are required for XE-Series. As a part of the deployment Dell executes mandatory GPU subsystem tests (applicable for most XE-series models).

USB ports specifications

Table 1. PowerEdge XE9680 USB specificationsThe following table shows the USB specifications for the system:
Front Rear
USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One USB 2.0-compliant ports One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
NOTE:Avoid connecting USB devices to the iDRAC Direct port of the XE9680 system during system initialization, POST, boot operations, or GPU firmware updates.

NIC port specifications

The PowerEdge XE9680 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card 1 GbE x 2
OCP card (OCP 3.0) Intel 25 GbE x 4, Intel 25 GbE x 2 , Intel 10 GbE x 4, Broadcom 25 GbE x 4, Broadcom 10 GbE x 4, Broadcom 25 GbE x 2

VGA ports specifications

The PowerEdge XE9680 system supports One DB-15 VGA port one each on the front and back of the system.

iDRAC9 port specifications

The PowerEdge XE9680 system supports One RJ45 iDRAC9 ethernet port on the rear of the system.

Video specifications

The system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported front video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32
Table 2. Supported rear video resolution options for the systemThis table describes the supported rear video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.
Table 1. Continuous operation specifications for ASHRAE A2This table describes the continuous operation specifications for ASHRAE A2.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40°C to 65°C (-104°F to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.38 Grms at 7 Hz to 250 Hz for 15 minutes (bottom side only).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage 1.38 Grms at 7 Hz to 250 Hz for 15 minutes
Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. The maximum shock specification of a nonoperational system is executed shock pulses in the z axis (one pulse) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Executed shock pulses in z axis (one pulse) of 71 G for up to 2ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHRAE Standard 127
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE:This condition applies to data center and non-data center environments.
NOTE: Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE:Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal restriction matrix

Table 1. Thermal Restriction Matrix- 4th Generation Intel® Xeon® Processors The table describes thermal restriction matrix:
CPU (W) Heat sink type Fan Type 8 x 2.5-inch SAS/SATA/NVMe or 16 x E3.s
ASHRAE A2 (Max 35° C)
Intel SPR 56C 8480+ CPU

(350W)

2U CPU HPR HSK High Performance Gold Fan

(CPU Fan)

Supported
Intel SPR 52C 8470 CPU

(350W)

Intel SPR 48C 8468 CPU

(350W)

Intel SPR 32C 6448Y CPU

(225W)

Intel SPR 24C 6442Y CPU

(225W)

Intel SPR 36C 8452Y CPU

(300W)

Intel SPR 32C 8462Y+ CPU

(300W)

Intel SPR 40C 8460Y+ CPU

(300W)

NOTE:The XE9680-Gaudi3 configuration supports only 8 x 2.5-inch NVMe SSD drives.
Table 2. Thermal Restriction Matrix- 5th Generation Intel® Xeon® Scalable ProcessorsThe table describes thermal restriction matrix:
CPU (W) Heat sink type Fan Type 8 x 2.5-inch SAS/SATA/NVMe or 16 x E3.s
ASHRAE A2 (Max 35° C)
Intel EMR 64C 8592+ CPU

(350W)

2U CPU HPR HSK High Performance Gold Fan

(CPU Fan)

Supported
Intel EMR 60C 8580 CPU

(350W)

Intel EMR 48C 8568Y+ CPU

(350W)

Intel EMR 32C 8562Y+ CPU

(300W)

Intel EMR 32C 6548Y+ CPU

(250W)

Intel EMR 24C 6542Y CPU

(250W)

NOTE:The XE9680-Gaudi3 configuration supports only 8 x 2.5-inch NVMe SSD drives.

Other Restrictions:

Table 3. GPU/FPGA Thermal Restriction Matrix The table describes GPU/FPGA Thermal Restriction Matrix for the system.
TDP (W) Heat sink type Fan Type 8 x 2.5-inch SAS/SATA/NVMe or 16 x E3.s
ASHRAE A2 (Max 35° C)
Nvidia Delta Board

(8x A100 500 W)

4U GPU HSK+NVLink HSK High Performance Gold Fan

(GPU Fan)

Supported
Nvidia Delta-Next Board

(8x H100 700 W)

(8x H200 700 W)

(8x H800 700 W)

(8x H20 500 W)

NA
AMD INSTINCT

(8x MI300X 750W)

NA
Intel Gaudi3 UBB

(8x Gaudi3 900W)

NA High Performance Gold Fan

(GPU Fan)

Supported
NOTE:The XE9680-Gaudi3 configuration supports only 8 x 2.5-inch NVMe SSD drives.
NOTE:Note: When GPUs are installed, the iDRAC sets the thermal warning threshold to 38°C for NVIDIA and AMD GPUs. If the System Board Inlet Temperature reaches this threshold, a warning message is logged, and the GPUs may reduce power consumption to prevent thermal damage, leading to decreased performance. For Intel GPUs, the thermal warning threshold is set to 33°C. Similar to NVIDIA and AMD GPUs, reaching this temperature may also trigger power reduction and impact performance.
Table 4. Processor and heat sink matrixThe table describes processor and heat sink matrix for the system.
Heatsink Processor TDP
2U HPR HSK Supports all TDP
  • ASHRAE A3/A4 environments are not supported.
  • Install an HDD blank if the slot is not equipped with an HDD.
  • DIMM blank is not required when the DIMM population quantity is 16 pieces or more.
  • All NVIDIA and AMD configurations support ambient temperatures of 35°C without any performance degradation.
  • The GPU fan service time should be limited to 30 seconds.
  • GPU fan service time must be within 5 minutes to prevent component overheating.
  • The system does not support net airflow display in the iDRAC WebGUI.
  • PCIe slots 33 and 38 are not supported for the optimized arrangement.