Chassis dimensions

| Drives | Xa | Xb | Y | Za | Zb | Zc |
|---|---|---|---|---|---|---|
| 8 x 2.5-inch SATA/SAS/NVMe SSD drives configuration 16 x E3.S NVMe drives configuration | 482.0 mm (18.97 in.) | 447.0 mm (17.59 in., top) 434.0 mm (17.08 in., bottom) | 263.2 mm (10.36 in.) | 35.77 mm (1.4 in.)With bezel 22.0 mm (0.87 in. Without bezel | 855.5 mm (33.68 in., top) Ear to rear wall 966 mm (38.03 in., bottom) Ear to rear GPU fan | 973 mm (38.30 in.) Ear to Fan latch |
System weight
| System configuration | Maximum weight (with all drives/SSDs) |
|---|---|
| XE9680 system with fully populated with H100/H200/H20/H800 | 107 kg (235.89 lb) |
| XE9680 system with fully populated with A100 | 105 kg (231.48 lb) |
| XE9680 system with fully populated with MI300X | 113.3 kg (249.78 lb) |
| XE9680 system with fully populated with Gaudi3 | 111.7 kg (246.26 lb) |
| XE9680 system L10, without 8 x U2 SSDs, 6 x PSUs, 1 x GPU module, 10 x PCIe cards, 1 x BOSS module | 70.19 kg (154.74 lb) |
| System configuration | Maximum weight (with all drives/SSDs) |
|---|---|
| XE9680 system with fully populated with H100/H200/H20/H800 | 107.75 kg (237.55 lb) |
| XE9680 system with fully populated with A100 | 106 kg (233.69 lb) |
| XE9680 system with fully populated with MI300X | 114.05 kg (251.44 lb) |
| XE9680 system L10, without 16 x E3.s SSDs, 6 x PSUs, 1 x GPU module, 10 x PCIe cards, 1 x BOSS module | 70.76 kg (155.99 lb) |
| Chassis weight | Description |
|---|---|
| 40 lb - 70 lb | Recommend two person to lift |
| 70 lb- 120 lb | Recommend three person to lift |
| ≥ 121 lb | Server lift is required |
Processor specifications
| Supported processor | Number of processors supported |
|---|---|
| 5th Generation Intel® Xeon® Scalable Processors with up to 64 cores or 4th Generation Intel® Xeon® Scalable Processors with up to 56 cores | Two |
PSU specifications
| PSU | Power Rating | Class | Heat dissipation (maximum) | Frequency | Voltage | Current |
|---|---|---|---|---|---|---|
| 2800 W Mixed Mode | 2800 W | Titanium | 10500 BTU/hr | 50/60 Hz | 200 - 240 V AC | 15.6 A |
| N/A | 10500 BTU/hr | N/A | 240 V DC | 13.6 A | ||
| 3200 W Mixed Mode | 3200 W | Titanium | 12000 BTU/hr | 50/60 Hz | 277 V AC | 13 A |
| N/A | 12000 BTU/hr | N/A | 336 V DC | 11.5 A | ||
| 3000 W Mixed Mode
(Multi-rated) | 3000 W | Titanium | 10900 BTU/hr | 50/60 Hz | 209.1 - 240 V AC | 16 A |
| N/A | 11000 BTU/hr | N/A | 240 V DC | 14.6 A | ||
| 2800 W | N/A | 10500 BTU/hr | 50/60 Hz | 200 - 209 V AC | 16 A |
The power consumption of the system depends on its total power requirements, which vary based on the configuration (e.g., number of GPUs, PSUs, and other components). Each PSU model (2800W, 3000W, 3200W) is capable of delivering power up to its rated capacity, but the actual power delivered will depend on the system’s needs.
To determine how much power each PSU delivers, the total system power requirement is divided by the number of PSUs in the system. For detailed power usage information, please refer to the iDRAC web GUI for real-time power metrics and system monitoring.



| Form factor | Output | Power cord |
|---|---|---|
| Redundant 86 mm | 2800 W 54 VDC 3000 W 54 VDC | C21 |
| Redundant 86 mm | 3200 W 54 VDC | APP 2006G1 Power Cords |
Cooling fan specifications
The PowerEdgeXE9680 system supports up to:
- six high performance (HPR GOLD) gold fans installed in mid tray and
- ten high performance (HPR GOLD) gold fans installed on the rear of the system.
| Fan type | Abbreviation | Also known as | Label color | Label image |
|---|---|---|---|---|
| High performance (HPR GOLD) gold fans | HPR GOLD | Mid Compute Fan | Gold | ![]() |
| High performance (HPR GOLD) gold fans | HPR GOLD | Rear GPU Fans | N/A | NOTE:New cooling fans comes with the Rear GPU fans label. ![]() |
| High performance (HPR GOLD) gold fans with Intel Gaudi3 | HPR GOLD | Rear GPU Fans | N/A | NOTE:New cooling fans comes with the rear GPU fans label for Gaudi3 GPU. ![]() |
Supported operating systems
| Operating System | Supported GPUs |
|---|---|
| Canonical Ubuntu Server LTS | A100, H100, H800, H200, H20, MI300X, Gaudi3 |
| Red Hat Enterprise Linux | A100, H100, H800, H200, H20, MI300X, Gaudi3 |
| SUSE Linux Enterprise Server | A100, H100, H800, H200, H20, MI300X, Gaudi3 |
| VMware ESXi | H100 |
For more information, go to Operating System Manuals.
System battery specifications
The PowerEdge XE9680 system supports CR 2032 3.0-V lithium coin cell system battery.
Expansion card riser specifications
The PowerEdge XE9680 system supports up to eight PCI express (PCIe) Gen 5 expansion cards installed on PCIe Switch Board (PSB) and two PCI express (PCIe) Gen 5 expansion cards installed on PCIe Base Board (PBB).
| Expansion card riser | PCIe slot | Processor Connection | PCIe slot height | PCIe slot length | PCIe slot width |
|---|---|---|---|---|---|
| Riser 4 | 32 | Processor 2 | Full height | Half length | x16 |
| 33 | Processor 2 | Full height | Half length | x16 | |
| Riser 3 | 34 | Processor 2 | Full height | Half length | x16 |
| 35 | Processor 2 | Full height | Half length | x16 | |
| Riser 2 | 36 | Processor 1 | Full height | Half length | x16 |
| 37 | Processor 1 | Full height | Half length | x16 | |
| Riser 1 | 38 | Processor 1 | Full height | Half length | x16 |
| 39 | Processor 1 | Full height | Half length | x16 |
| PCIe slot | Processor Connection | PCIe slot height | PCIe slot length | PCIe slot width |
|---|---|---|---|---|
| 31 | Processor 2 | Full height | Half length | x16 |
| 40 | Processor 1 | Full height | Half length | x16 |
Memory specifications
The PowerEdge XE9680 system supports the following memory specifications for optimized operation.
| DIMM type | DIMM rank | DIMM capacity | Dual processors | |
|---|---|---|---|---|
| Minimum system capacity | Maximum system capacity | |||
| RDIMM | Dual rank | 32 GB | Not Supported | 1 TB |
| Dual rank | 64 GB | 1 TB | 2 TB | |
| Dual rank | 96 GB | 1.5 TB | 3 TB | |
| Quad rank | 128 GB | 2 TB | 4 TB | |
| 8xGPU | A100/H100/H800 | H200 | H20 | MI300X | Gaudi3 | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| Memory | 16pcs | 32pcs | 16pcs | 32pcs | 16pcs | 32pcs | 16pcs | 32pcs | 16pcs | 32pcs |
| 32 GB | Not Supported | Supported | Not Supported | Supported | Not Supported | Supported | Not Supported | Not Supported | Not Supported | Not Supported |
| 64 GB | Supported | Supported | Supported | Supported | Supported | Supported | Not Supported | Supported | Not Supported | Supported |
| 96 GB | Supported | Supported | Supported | Supported | Supported | Supported | Not Supported | Supported | Not Supported | Supported |
| 128 GB | Supported | Supported | Supported | Supported | Supported | Supported | Supported | Supported | Supported | Supported |
| Memory module sockets | CPUs | Speed | GPUs |
|---|---|---|---|
| 32, 288-pin | 5th Generation Intel® Xeon® Scalable Processors | 5600 MT/s 1DIMM per channel, 4400 MT/s 2DIMMs per channel | A100/H100/H200/H20/H800 |
| MI300X | |||
| Gaudi3 | |||
| 4th Generation Intel® Xeon® Scalable Processors | 4800 MT/s 1DIMM per channel, 4400 MT/s 2DIMMs per channel | A100/H100/H200/H20/H800 | |
| MI300X | |||
| Gaudi3 |
Storage controller specifications
| Supported storage controller cards | |
|---|---|
Internal controllers
|
|
Internal Boot
|
|
Software RAID
|
Drives
- 8 x 2.5-inch hot-swappable NVMe SSD drives
- 8 x 2.5-inch hot-swappable SAS/SATA SSD drives
- 16 x E3.S hot-swappable EDSFF direct drives
GPU Specifications
- 8 NVIDIA HGX H100/H800 80GB 700W SXM5 GPUs, fully interconnected with NVIDIA NVLink technology or
- 8 NVIDIA HGX H200 141GB 700W SXM5 GPUs, fully interconnected with NVIDIA NVLink technology or
- 8 NVIDIA HGX H20 96GB 500W SXM5 GPUs, fully interconnected with NVIDIA NVLink technology or
- 8 NVIDIA HGX A100 80GB 500W SXM4 GPUs, fully interconnected with NVIDIA NVLink technology or
- 8 AMD Instinct MI300X 192GB 750W OAM accelerator with AMD Infinity Fabric connectivity or
- 8 INTEL Gaudi3 128GB 900W OAM accelerator with embedded RoCE ports for ethernet connectivity.
USB ports specifications
| Front | Rear | ||
|---|---|---|---|
| USB port type | No. of ports | USB port type | No. of ports |
| USB 2.0-compliant port | One | USB 3.0-compliant port | One |
| iDRAC Direct port (Micro-AB USB 2.0-compliant port) | One | USB 2.0-compliant ports | One |
NIC port specifications
| Feature | Specifications |
|---|---|
| LOM card | 1 GbE x 2 |
| OCP card (OCP 3.0) | Intel 25 GbE x 4, Intel 25 GbE x 2 , Intel 10 GbE x 4, Broadcom 25 GbE x 4, Broadcom 10 GbE x 4, Broadcom 25 GbE x 2 |
VGA ports specifications
The PowerEdge XE9680 system supports One DB-15 VGA port one each on the front and back of the system.
iDRAC9 port specifications
Video specifications
| Resolution | Refresh rate (Hz) | Color depth (bits) |
|---|---|---|
| 1024 x 768 | 60 | 8, 16, 32 |
| 1280 x 800 | 60 | 8, 16, 32 |
| 1280 x 1024 | 60 | 8, 16, 32 |
| 1360 x 768 | 60 | 8, 16, 32 |
| 1440 x 900 | 60 | 8, 16, 32 |
| 1600 x 900 | 60 | 8, 16, 32 |
| 1600 x 1200 | 60 | 8, 16, 32 |
| 1680 x 1050 | 60 | 8, 16, 32 |
| 1920 x 1080 | 60 | 8, 16, 32 |
| 1920 x 1200 | 60 | 8, 16, 32 |
| Resolution | Refresh rate (Hz) | Color depth (bits) |
|---|---|---|
| 1024 x 768 | 60 | 8, 16, 32 |
| 1280 x 800 | 60 | 8, 16, 32 |
| 1280 x 1024 | 60 | 8, 16, 32 |
| 1360 x 768 | 60 | 8, 16, 32 |
| 1440 x 900 | 60 | 8, 16, 32 |
| 1600 x 900 | 60 | 8, 16, 32 |
| 1600 x 1200 | 60 | 8, 16, 32 |
| 1680 x 1050 | 60 | 8, 16, 32 |
| 1920 x 1080 | 60 | 8, 16, 32 |
| 1920 x 1200 | 60 | 8, 16, 32 |
Environmental specifications
| Temperature | Specifications |
|---|---|
| Allowable continuous operations | |
| Temperature ranges for altitudes <= 900 m (<= 2953 ft) | 10–35°C (50–95°F) with no direct sunlight on the equipment |
| Humidity percent ranges (non-condensing at all times) | 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point |
| Operational altitude de-rating | Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft) |
| Temperature | Specifications |
|---|---|
| Allowable continuous operations | |
| Maximum temperature gradient (applies to both operation and non-operation) | 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
|
| Non-operational temperature limits | -40°C to 65°C (-104°F to 149°F) |
| Non-operational humidity limits | 5% to 95% RH with 27°C (80.6°F) maximum dew point |
| Maximum non-operational altitude | 12,000 meters (39,370 feet) |
| Maximum operational altitude | 3,048 meters (10,000 feet) |
| Maximum vibration | Specifications |
|---|---|
| Operating | 0.21 Grms at 5 Hz to 500 Hz (all operation orientations) |
| Storage | 1.38 Grms at 7 Hz to 250 Hz for 15 minutes |
| Maximum shock pulse | Specifications |
|---|---|
| Operating | Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. |
| Storage | Executed shock pulses in z axis (one pulse) of 71 G for up to 2ms |
Particulate and gaseous contamination specifications
| Particulate contamination | Specifications |
|---|---|
| Air filtration | Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHRAE Standard 127
|
| Conductive dust | Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE:This condition applies to data center and non-data center environments.
NOTE: Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles
|
| Corrosive dust |
NOTE:This condition applies to data center and non-data center environments.
|
| Gaseous contamination | Specifications |
|---|---|
| Copper Coupon Corrosion rate | <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013 |
| Silver Coupon Corrosion rate | <200 Å/month as defined by ANSI/ISA71.04-2013 |
Thermal restriction matrix
| CPU (W) | Heat sink type | Fan Type | 8 x 2.5-inch SAS/SATA/NVMe or 16 x E3.s | |||
|---|---|---|---|---|---|---|
| ASHRAE A2 (Max 35° C) | ||||||
| Intel SPR 56C 8480+ CPU
(350W) |
2U CPU HPR HSK | High Performance Gold Fan
(CPU Fan) |
Supported | |||
| Intel SPR 52C 8470 CPU
(350W) |
||||||
| Intel SPR 48C 8468 CPU
(350W) |
||||||
| Intel SPR 32C 6448Y CPU
(225W) |
||||||
| Intel SPR 24C 6442Y CPU
(225W) |
||||||
| Intel SPR 36C 8452Y CPU
(300W) |
||||||
| Intel SPR 32C 8462Y+ CPU
(300W) |
||||||
| Intel SPR 40C 8460Y+ CPU
(300W) |
||||||
| CPU (W) | Heat sink type | Fan Type | 8 x 2.5-inch SAS/SATA/NVMe or 16 x E3.s | |||
|---|---|---|---|---|---|---|
| ASHRAE A2 (Max 35° C) | ||||||
| Intel EMR 64C 8592+ CPU
(350W) |
2U CPU HPR HSK | High Performance Gold Fan
(CPU Fan) |
Supported | |||
| Intel EMR 60C 8580 CPU
(350W) |
||||||
| Intel EMR 48C 8568Y+ CPU
(350W) |
||||||
| Intel EMR 32C 8562Y+ CPU
(300W) |
||||||
| Intel EMR 32C 6548Y+ CPU
(250W) |
||||||
| Intel EMR 24C 6542Y CPU
(250W) |
||||||
Other Restrictions:
| TDP (W) | Heat sink type | Fan Type | 8 x 2.5-inch SAS/SATA/NVMe or 16 x E3.s | |||
|---|---|---|---|---|---|---|
| ASHRAE A2 (Max 35° C) | ||||||
| Nvidia Delta Board
(8x A100 500 W) |
4U GPU HSK+NVLink HSK | High Performance Gold Fan
(GPU Fan) |
Supported | |||
| Nvidia Delta-Next Board (8x H100 700 W) (8x H200 700 W) (8x H800 700 W) (8x H20 500 W) |
NA | |||||
| AMD INSTINCT
(8x MI300X 750W) |
NA | |||||
| Intel Gaudi3 UBB
(8x Gaudi3 900W) |
NA | High Performance Gold Fan
(GPU Fan) |
Supported | |||
| Heatsink | Processor TDP |
|---|---|
| 2U HPR HSK | Supports all TDP |
- ASHRAE A3/A4 environments are not supported.
- Install an HDD blank if the slot is not equipped with an HDD.
- DIMM blank is not required when the DIMM population quantity is 16 pieces or more.
- All NVIDIA and AMD configurations support ambient temperatures of 35°C without any performance degradation.
- The GPU fan service time should be limited to 30 seconds.
- GPU fan service time must be within 5 minutes to prevent component overheating.
- The system does not support net airflow display in the iDRAC WebGUI.
- PCIe slots 33 and 38 are not supported for the optimized arrangement.































