Dell PowerEdge XE9640: руководство по обслуживанию

Chassis dimensions

Table 1. Chassis dimension for the PowerEdgeXE9640 systemThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za	Zb	Zc
4 x 2.5-inch NVMe drives configuration	482 mm (18.97 inches)	444 mm (17.48 inches)	86.8 mm (3.41 inches)	35.77 mm (1.4 inches)With bezel 22.0 mm (0.87 inches Without bezel	850 mm (33.46 inches) Ear to rear wall	890.8 mm (35.07 inches) Ear to PSU handle

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. Weight for the PowerEdge XE9640 system The table below shows the maximum weight of the PowerEdge XE9640 system.
System configuration	Maximum weight (with all drives/SSDs)
XE9640 system with Intel GPUs	43.2 kg (95.23 pounds)
XE9640 system with NVIDIA GPUs	46.3 kg (102.07 pounds)

Table 2. PowerEdge system weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight	Description
40 pounds - 70 pounds	Recommend two person to lift
70 pounds- 120 pounds	Recommend three person to lift
≥ 121 pounds	Recommend to use a server-lift

NOTE:The system is heavy therefore can slide over and cause damage during installation and removal from a higher position on the rack.

Processor specifications

Table 1. PowerEdge XE9640 processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
Two 5th Generation Intel Xeon Scalable Processors with up to 64 cores per processor or 4^th Generation Intel Xeon Scalable processors with up to 56 cores per processor	Two

PSU specifications

The PowerEdge XE9640 system supports up to 4 AC or DC power supply units (PSUs) with 2+0 Non redundant, full power with 2x PSUs, 2+1 - N+1 redundancy, 2+2 - N+N redundancy.

NOTE:

The wattage capacities of any two PSUs that are present during POST are compared. The larger of the two PSUs is activated if the PSU wattages don't match. A PSU mismatch alert is also visible in the BIOS, iDRAC, or on the system LCD.
If a second PSU is installed during runtime, its wattage capacity must match that of the first PSU in order for it to be enabled. If not, the second PSU won't be activated and the PSU will be marked as mismatched in iDRAC.

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Voltage	High line 240 VDC	Low line 100–120 V	DC Current (A)	AC Current (A)
2800 W AC	Titanium	10165 BTU/hr	50/60	200-240 V AC	2800 W	NA	NA	15.6 - 12.7 A
2800 W HVDC	NA	10220 BTU/hr	NA	240 V DC	2800 W	NA	13.6 A	NA

NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

Table 2. PSU Efficiency Levels Dell PSUs have achieved Titanium efficiency levels as shown in the table below.
Efficiency Targets by Load PSU Efficiency Levels
Form Factor	Output	Class	10%	20%	50%	100%
Redundant 86 mm	2800 W (Input 230 AC)	Titanium	90.00%	94.00%	96.00%	94.00%

Cooling fan specifications

The PowerEdgeXE9640system supports up to four sets of high-performance gold (HPR) hot-swappable cooling fans.

NOTE: XE9640 includes dual fan module form factor. One set of fan module includes two fan body with one fan connector.

Table 1. Cooling fan specificationsCooling fan specifications:
Fan type	Abbreviation	Also known as	Label color	Label image
High Performance Gold fan	HPR	Very High Performance	High Performance Gold Grade	Figure 1. HPR fan

NOTE:For more information about the supported fan configuration or matrix, see Thermal Restriction Matrix.

Supported operating systems

The PowerEdge XE9640 supports the following operating systems:

Canonical Ubuntu Server LTS
Red Hat Enterprise Linux

System battery specifications

The PowerEdge XE9640 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge XE9640 system supports up to four PCI express (PCIe) slots (Gen5 full-height, half-length cards) on the system board.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
Expansion card riser	PCIe slot	Processor Connection	PCIe slot height	PCIe slot length	PCIe slot width
Riser 1A (R1A) for Intel GPU configurations	1	Processor 1	Full height	Half length	x16
Riser 1A (R1A) for Intel GPU configurations	2	Processor 1	Low Profile	Half length	x16
Riser 4A (R4A) for Intel GPU configurations	3	Processor 2	Low Profile	Half length	x16
Riser 4A (R4A) for Intel GPU configurations	4	Processor 2	Full height	Half length	x16
Riser 1B (R1B) for NVIDIA GPU configurations	1	Processor 1	Full height	Half length	x16
Riser 1B (R1B) for NVIDIA GPU configurations	2	Processor 1	Low Profile	Half length	x16
Riser 4B (R4B) for NVIDIA GPU configurations	3	Processor 2	Low Profile	Half length	x16
Riser 4B (R4B) for NVIDIA GPU configurations	4	Processor 2	Full height	Half length	x16

Memory specifications

The PowerEdge XE9640 system supports the following memory specifications for optimized operation.

Table 1. Total System Memory Capacity Requirement for Intel GPUsThis table provides information about supported DIMM slots in the PowerEdge XE9640 for Intel GPUs.
DIMM capacity	64 GB
16 x DIMM sockets population	Total memory: 1 TB

NOTE:The XE9640 with Intel GPUs only supports 8 DIMM population per CPU. The restriction is to limit 16 DIMM per system.

Table 2. Total System Memory Capacity Requirement for NVIDIA GPUsThis table provides information about supported DIMM slots in the PowerEdge XE9640 for NVIDIA GPUs.
DIMM capacity	16 GB			32 GB			64 GB
DIMM's population	Total memory	80 GB GPU	94 GB GPU	Total memory	80 GB GPU	94 GB GPU	Total memory	80 GB GPU	94 GB GPU
8 x DIMM sockets population	64 GB	Not supported	Not supported	256 GB	Not supported	Not supported	512 TB	Support	Support
16 x DIMM sockets population	256 GB	Not supported	Not supported	512 GB	Support	Support	1 TB	Support	Support
32 x DIMM sockets population	512 GB	Support	Support	1 TB	Support	Support	2 TB	Support	Support

Table 3. Minimum and recommended memory for NVIDIA GPUsThis table provides information about system memory size restriction for the PowerEdge XE9640 with NVIDIA GPUs.
System memory size restriction	80 GB	94 GB
Minimum system memory size	480 GB	564 GB
Recommended memory size	640 GB	752 GB

Table 4. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
Only 16 DIMM slots (288-pin) are supported out of 32 DIMMs (with 8 DIMMs per processor) for XE9640 Intel GPU supported systems. 8 DIMMS, 16 DIMMs, and 32 DIMMs (288-pin) for XE9640 NVIDIA GPU supported systems.	5600 MT/s (1 DIMM Per Channel)4800 MT/s (1 DIMM Per Channel), 4400 MT/s (2 DIMMs Per Channel)

NOTE:XE9640 supports RDIMM only.

NOTE:Memory DIMM slots are not hot pluggable.

Storage controller specifications

The PowerEdge XE9640 system supports the following controller cards:

Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller card
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 1, 2 x M.2 SSDs
Software RAID S160 pre boot UEFI only

Drives

The PowerEdge XE9640 system supports:

Up to 4 x 2.5-inch NVMe SSDs for XE9640 Intel GPU and NVIDIA GPU supported systems.

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

GPU Specifications

The PowerEdge XE9640 system supports:

NVIDIA H100 SXM 700W NVLINK GPUs
Intel Data Center Max GPU Series 1550 OAM 600W Xelink GPUs

Leakage behavior specifications

There are built in leak sensors for the liquid cooling elements in the XE9640. At launch, the platform will provide the appropriate action upon any leak detection in the system Dell recommended action when leak:

Processor leakage behavior spec - system report leakage event. Recommend customers to power off the system, unplug that system's cooling hose from the rack manifold immediately. Then call Tech support
GPU leakage behavior spec – system reports leakage event and server shuts down automatically. Recommend customers to power off the system, unplug that system’s cooling hose from the rack manifold immediately. Then call Tech support.

USB ports specifications

Table 1. PowerEdge XE9640 USB specificationsThe following table shows the USB specifications for the system:
Front		Rear
USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 2.0-compliant ports	One

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

Optional LOM and OCP NIC 3.0 specifications

The PowerEdge XE9640 system supports the shared LOM feature (iDRAC port redirect) on optional 2x1GbE LOM and on optional OCP NIC 3.0 adapters.

NOTE:LOM and OCP are optional and one has to be selected for any configuration.

VGA ports specifications

The PowerEdge XE9640 system supports One DB-15 VGA port on the front panel.

iDRAC9 port specifications

The PowerEdge XE9640 system supports One RJ45 iDRAC9 ethernet port on the rear of the system.

Video specifications

The PowerEdge XE9640 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution and refresh rates for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60 *(RB)	8, 16, 32
1920 x 1200	60 *(RB)	8, 16, 32

NOTE: *(RB) - Reduced Blanking for Digital Displays requiring less blank time. This was introduced for Signal Integrity improvements by reducing Pixel Clock rates for VGA- Analog input devices.

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.

Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)

NOTE:Certain system hardware configurations may require operating temperatures to be less than 28°C. For more information, see the Thermal air restrictions section.

Table 2. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-104 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides test).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms (4 pulse on each side of the system). The maximum shock specification of a nonoperational system is Six consecutiveky executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side o f the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutiveky executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side o f the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal restriction matrix

Restriction for OCP and PCIe adapter Card for NVIDIA H100 GPU chassis

Table 1. Commodities thermal restrictionsThe following table shows the commodities thermal restrictions.
Commodities	Configuration		2 x NVMe	4 x NVMe	8 x E.3
Components	GPUs		Intel Max 1550 GPU	Nvidia H100 GPU chassis	Nvidia H100 GPU chassis
Processors	8468	350 W	35° C	35° C	35° C
	8480+	350 W	N/A	35° C	35° C
	8470Q	350 W	N/A	35° C	35° C
	8470	350 W	N/A	35° C	35° C
	8460+	300 W	N/A	35° C	35° C
	8452Y	300 W	N/A	35° C	35° C
	6458Q	350 W	N/A	35° C	35° C
	8462Y+	300 W	N/A	35° C	35° C
	6448Y	225 W	N/A	35° C	35° C
	6442Y	225 W	N/A	35° C	35° C
	5418Y	185 W	N/A	35° C	35° C
	8592+	350 W	N/A	35° C	35° C
	8580	350 W	N/A	35° C	35° C
	8568+	350 W	N/A	35° C	35° C
	8562Y+	250 W	N/A	35° C	35° C
	6548Y+	250 W	N/A	35° C	35° C
	6542Y	250 W	N/A	35° C	35° C
Memory	128 GB RDIMM 5600 MT/s / 64 GB RDIMM 4800 MT/s	1 DPC/ 2 DPC	35° C	35° C	35° C
BOSS			35° C	35° C	35° C
PCIe			35° C	35° C	35° C
OCP			35° C	35° C	35° C

85C optical transceiver is required for below cards:
1. Mellanox Starlord CX6 100G
2. Mellanox Mantis HDR100
3. Mellanox Gale 100G OCP card