Dell PowerEdge XE8712: руководство по обслуживанию

Chassis dimensions

This image shows the dimensions of XE8712 system. — Figure 1. Chassis dimensions

Table 1. XE8712 chassis dimensionsThis table provides the dimensions of the system:
Xa	Xb	Y	Za	Zb	Zc
560.07 mm (22.05 inches)	537 mm (21.14 inches)	46.45 mm (1.83 inches)	27.7 mm (1.10 inches) NOTE:The front bezel is not supported.	788.53 mm (31.05 inches) Hook to chassis rear	840.85 mm (33.10 inches) Hook to IMM module alignment cup

System weight

Table 1. XE8712 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight
Fully loaded system configuration	33.07 kg (72.90 lb)

Processor specifications

Table 1. PowerEdge XE8712 system processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
NVIDIA Grace with 72 cores per processor	Two

Cooling fan specifications

The PowerEdgeXE8712system supports up to four sets of high-performance gold (HPR Gold) cabled fan modules, along with liquid cooling.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Label image
High Performance	HPR Gold	HPR GOLD fan
Direct Liquid Cooling	DLC	Internal Manifold Module

Supported operating systems

The XE8712 system supports the following operating systems:

Red Hat Enterprise Linux
Canonical Ubuntu Server LTS

For specifications and interoperability details, see OS support.

Expansion card riser specifications

The PowerEdge XE8712 supports four Full Height, Half Length (FH-HL) cards. The XE8712 supports up to four risers, with one PCIe slot on each riser.

Table 1. Expansion card slots supported on the XE8712 systemThe table contains information regarding supported expansion cards.
PCIe slot	Expansion card riser	Processor Connection	Height	Length	Card Width	Slot Width	Power
Slot 1	RF1	Processor 0	Full Height	Half Length	SW	x16	75W
Slot 2	RF2	Processor 0	Full Height	Half Length	SW	x16/x32	150W
Slot 3	OCP Slot (RF5)	Processor 0	NA	NA	NA	x16	86W
Slot 4	RF3/RF3a	Processor 1	Full Height	Half Length	SW	x16/x32	75W
Slot 5	M.2 Interposer	Processor 1	NA	NA	SW	x4	24W
Slot 6	RF4/RF4a/RF4b	Processor 1	Full Height	Half Length	NA	x16	150W

NOTE:Slots 1 and 4 have a power limit of 75W, while slot 6 can support up to 150W, making it suitable for DPUs with higher power requirements.

NOTE:Slots 2 and 4 can support 32-lane AICs by reallocating lanes from adjacent slots. If BF3 is not supported, both slots 1 and 6 remain unpopulated. If BF3 is supported, only slot 1 remains unpopulated.

NIC port specifications

The XE8712 system supports OCP NIC.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
OCP NIC	1x OCP 3.0 Gen5 x16

USB ports specifications

Table 1. XE8712 USB specificationsThe following table shows the USB specifications for the system:
Front
USB port type	No. of ports
USB 3.0-compliant port on Front I/O	One

Video ports specifications

The PowerEdge XE8712 system supports one Mini-DisplayPort on the Front I/O module.

Video specifications

The PowerEdge XE8712 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, see the Product Environmental Datasheet that are located with the Manuals and Documents on Dell Support.

Table 1. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing always)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude derating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

NOTE:Certain system hardware configurations may require operating temperatures to be less than 28°C. For more information, see the Thermal air restrictions section.

Table 2. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and nonoperation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Nonoperational temperature limits	-40 (-5) to 65°C (-40 (23) to 149°F) NOTE:** Liquid filled components, or systems/solutions containing liquid filled components are limited to approximately 5°C above their freeze point. The only authorized liquid coolant is Recochem PG25 with a freeze point between -9°C and -13°C, therefore the lower nonoperational temperature limit is -5°C. Components and systems.solutions that can contain liquid but do not at the time of testing shall be tested to the -40°C lower nonoperational temperature limit.
Nonoperational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum nonoperational altitude	12,000 meters (39,370 ft)
Maximum operational altitude	3,048 meters (10,000 ft)

Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.1 Grms at 5 Hz to 100 Hz (x, y, and z axes). The maximum vibration specification of a nonoperational system is 1.1 Grms at 2 Hz to 500 Hz for 15 min (all six sides tested).
Maximum vibration	Specifications
Operating	0.1 G_rms 5 Hz–100 Hz (x, y, and z axes)
Storage	1.1 G_rms 2 Hz–500 Hz for 15 min (all six sides tested)

Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is 18 consecutively performed half sine shock pulses in the positive and negative x, y, and z axes (three pulses on each side of the system) of six G for up to 11 ms.. The maximum shock specification of a nonoperational system is Six consecutively performed Trapezoidal Shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 30 G for up to 11 ms.
Maximum shock pulse	Specifications
Operating	18 consecutively performed half sine shock pulses in the positive and negative x, y, and z axes (three pulses on each side of the system) of six G for up to 11 ms.
Storage	Six consecutively performed Trapezoidal Shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 30 G for up to 11 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE:The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300A/month per class G1 as defines by ANSI/ISA71.04-2013
Silver coupon corrosion rate	<200A/month as defined by ANSI/ISA71.04-2013

Thermal restrictions

Thermal limitations, applicable cooling parts, and configuration dependencies for the PowerEdge XE8712 system.

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
HPR GOLD	High-performance Gold (HPR Gold) fan
LP	Low Profile
FH	Full Height
DLC	Direct Liquid Cooling

Thermal Restrictions

No dedicated thermal restriction for CPU/GPU because the platform uses liquid cooling.
The system supports ambient temperatures up to 40°C.

Table 2. Thermal Parts MatrixThe table lists the thermal parts matrix for the PowerEdge XE8712 system.
Component	Part Type	Quantity	Applicable Configuration
Fan	HPR GOLD Fan	Four pairs (eight fans)	All configuration
Direct Liquid Cooling (DLC)	Inner Manifold - Left	1	All configuration
	Inner Manifold - Right	1	All configuration
	Cold plate - Left	1	All configuration
	Cold plate - Right	1	All configuration
Blanks and Fillers	LP Filler	-	Used when a Low Profile (LP) card is installed on a Full Height (FH) riser cage
	FH Filler	-	Used with riser cage when no card is installed
	Riser Blank	-	Used when the Full Height (FH) riser is unpopulated
	E3.S Blank	-	Used when the E3.S backplane is empty