Определяем
Сегодня покупают
ГлавнаяСправочникиDellXE Servers
Dell PowerEdge XE8640: руководство по обслуживанию
← Вернуться назад
Нужна помощь с конфигурацией?
Пришлите SKU, спецификацию или список требований. Специалист Apltech проверит совместимость компонентов и найдёт актуальные артикулы
Получить консультацию →

Dell PowerEdge XE8640: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the powerege xe8640 system.
Table 1. PowerEdgeXE8640 chassis dimensionsThis table provides the dimensions of the system:
Drives Xa Xb Y Za Zb Zc
8 x 2.5-inch481.91 mm (18.97 in.)447 mm (17.6 in.)174.3 mm (6.86 in.)34.70 mm (1.366 in.)With bezel830.7 mm (32.7 in.)Ear to rear wall865.54 mm (34.07 in.)Ear to PSU handle
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge XE8640 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
8 x 2.5 inch 61.4 kg (135.36 lb)
Table 2. PowerEdge system weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight Description
40 lb - 70 lb Recommend two person to lift
70 lb- 120 lb Recommend three person to lift
≥ 121 lb Recommend to use a server-lift

Processor specifications

Table 1. PowerEdge XE8640 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
4th Generation Intel Xeon Scalable processors with up to 56 cores or 5th Generation Intel Xeon Scalable processors with up to 64 cores Two

PSU specifications

The PowerEdgeXE8640system supports supports four AC or DC power supply units (PSUs).

NOTE:
  1. The wattage capacities of any two PSUs that are present during POST are compared. The larger of the two PSUs is activated if the PSU wattages do not match. A PSU mismatch alert is also visible in the BIOS, iDRAC, or on the system LCD.
  2. If a second PSU is installed during runtime, its wattage capacity must match that of the first PSU in order for it to be enabled. If not, the second PSU will not be activated and the PSU will be marked as mismatched in iDRAC.
  3. PowerEdge XE8640 system supports minimum of 3 PSUs for full performance.
  4. PowerEdge XE8640 system supports 3+1 PSU redundancy which means only one PSU is redundant (for full performance). A/B Grid Redundant setting in iDRAC is not supported.
  5. PowerEdge XE8640 system also supports 2+2 PSU redundancy. When two or more PSUs are down, this fault tolerant redundant mode triggers GPU power brake and GPU clocks are throttled to one-fourth and GPU performance will drop to around one-fifth.
  6. This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
  7. Heat dissipation is calculated using the PSU wattage rating.
  8. Do not mix PSUs from different vendors within a single system configuration to ensure optimal performance and reliability.
Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) Voltage Current (A)
2800 W Mixed Mode Titanium 10500 BTU/hr 50/60 200–240 V AC 15.6 A
N/A 10500 BTU/hr N/A 240 V DC 13.6 A
3200 W Mixed Mode Titanium 12000 BTU/hr 50/60 277 V AC 13 A
N/A 12000 BTU/hr N/A 336 V DC 11.5 A
Figure 1. PSU power cord
this image shows list of PSU power cords
Figure 2. PSU power cord
this image shows list of PSU power cords
Table 2. PSU power cordThe table lists the PSU power cord .
Form factor Output Power cord
Redundant 86 mm 2800 W AC C22/C21
Redundant 86 mm 3200 W AC APP 2006G1
NOTE:2800W 54V PSU has a C22 input socket that requires C21 to C20 jumper cord to connect it to PDU in the rack. Traditional high amperage power cords C20/C19 cannot be inserted into the PSU.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

Cooling fan specifications

The PowerEdgeXE8640system supports up to six high performance 60 mm fans in the mid fan frame and five high performance 80 mm fans in the front for GPU cooling.

Each fan is enclosed in a mechanical assembly to make up the module. The fan modules are hot-swappable with one rotor fan fail. The system should always be populated with the full set of fans to support the airflow requirements of the chassis

For more information about the supported fan configuration or matrix, see Thermal restriction matrix.
Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Label color Label image
Standard (STD) 60 mm fan STD No labelThis image shows standard cooling fan
High performance (HPR) Gold 80 mm fan HPR Gold Replace Fan in 3 minutesThis image shows high performance cooling fan

Supported operating systems

The PowerEdge XE8640 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Red Hat Enterprise Linux

System battery specifications

The PowerEdge XE8640 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge XE8640 system supports up to four PCI express (PCIe) slots (Gen5 full-height, half-length cards) on the system board.
Table 1. Expansion card riser slotsThe following table shows details of the expansion card riser slots
Expansion card risers PCIe slot Processor connection Height Length Slot width
Riser 1A Slot 1 Processor 1 Full Height Half Length x16
Slot 2 Processor 1 Full Height Half Length x16
Riser 4A Slot 3 Processor 2 Full Height Half Length x16
Slot 4 Processor 2 Full Height Half Length x16

Memory specifications

The PowerEdge XE8640 system supports the following memory specifications for optimized operation.
NOTE:Up to 16 DIMM per processor and up to 32 DIMMs in a dual- processor configuration. XE8640 supports RDIMM only.
NOTE: For best performance, populate all memory channels equally, 16 DIMMs per CPU using identical DIMMs.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
RDIMM Dual rank 32 GB 32 GB 512 GB 64 GB 1 TB
Dual rank 64 GB 64 GB 1 TB 128 GB 2 TB
Dual rank 96 GB 96 GB 1.5 TB 192 GB 3 TB
Quad rank 128 GB 128 GB 2 TB 256 GB 4 TB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
32, 288-pin 5600 MT/s, 4800 MT/s, 4400 MT/s
NOTE:Memory DIMM slots are not hot pluggable.

Storage controller specifications

. The PowerEdge XE8640 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller card
Internal Boot
  • Boot Optimized Storage Subsystem (NVMe BOSS-N1): HWRAID 1, 2 x M.2 SSDs
Software RAID
  • S160

Drives

The PowerEdge XE8640 system supports:
  • 8 x 2.5 inch hot-swappable NVMe SSD drives.
  • 8 x E3.S hot-swappable NVMe SSD drives.

GPU Specifications

The PowerEdge XE8640 system supports 4 NVIDIA HGX H100 80GB 700W SXM5 GPUs, fully interconnected with NVIDIA NVLink technology.
NOTE:Mandatory ProDeploy Plus or Dell Customer Deployment services are required for XE-Series. As a part of the deployment Dell executes mandatory GPU subsystem tests (applicable for most XE-series models).

NIC port specifications

The PowerEdge XE8640 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card 1 GbE x 2
OCP card (OCP 3.0) 10 GbE x 4, 25 GbE x 2, 25 GbE x 4

USB ports specifications

Table 1. PowerEdge XE8640 USB specificationsThe following table shows the USB specifications for the system:
Front Rear
USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One USB 3.0-compliant ports One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

iDRAC port specifications

The PowerEdge XE8640 system supports One RJ45 iDRAC9 ethernet port on the rear of the system.

VGA ports specifications

The PowerEdge XE8640 system supports One DB-15 VGA port one each on the front and back of the system.

Video specifications

The PowerEdge XE8640 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Operational climatic Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Common Environmental Specifications for ASHRAE A2, A3, A4 and Rugged This table describes the shared requirements across all categories.
Shared requirements Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal restrictions

  • ASHRAE A3/A4 environment is not supported.
  • Required to constrain the GPU fan service time to maximum 3 minutes once the environment temp is up to 32°C.
  • LAAC Pump failure or absence:
    • Any one of pump failure or absence: PDB CPLD record the status for iDRAC to log the failure and drive all fans to full speed.
    • Any two of pump failure: PDB CPLD record the status for iDRAC to log the failure and trigger pFAULT to shut down the system for system protection.
    • Any two of pump absence during the initial system power-on process: iDRAC checks the pump presence status from PDB CPLD MM to gate the power on process and log the message.
  • LAAC Leak detected: Once the coolant leak is detected, CPLD proceeds the pFAULT process to perform system shutdown.
  • LAAC Coolant loss by evaporation: There is no indicator to detect the percentage of coolant loss.
    • The failure symptom would be GPU throttling/overheat or pump RPM warning.
  • Hard drive blank is required if the slot does not install hard drive.
  • DIMM blank is not required to be install if the total memory populated is more or equal to16.
  • Do not support net system airflow display in iDRAC WebGUI.
  • BCME 100G_2P FH card (FPM6F) requires 85C active optics transceiver/4WGYD. (NOT support MFS1S00-H003E cable.)
  • MLNX 100G_2P FH card (8P2T2) requires 85C active optics transceiver/4WGYD. (NOT support MFS1S00-H003E cable.)
  • Broadcom 25GbE_4P OCP 3.0 card (3Y64D) require 85C active optics transceiver/M14MK. (NOT support 0YR96 cable.)
  • MLNX 200GbE_SP_CX6 FH card (1GK7G) requires 85C active optics transceiver/4WGYD. (NOT support MFS1S00-H003E cable.)
  • MLNX 100GbE_SP_CX6 FH card (Y1T43) requires 85C active optics transceiver/4WGYD. (NOT support MFS1S00-H003E cable.)
  • MLNX 100GbE_2P OCP 3.0 card (FD63G) requires 85C active optics transceiver/4WGYD. (NOT support MFS1S00-H003E cable.)
  • Broadcom 100GbE_2P OCP 3.0 card (2VY37) require 85C active optics transceiver/4WGYD. (NOT support MFS1S00-H003E cable.)
  • PCIe riser board is required to be in place all the time. (I2C failure is triggered if the PCIe riser board is not in place.)
  • Do not support dual fan or pump rotor failure including "one GPU fan or HPR GOLD fan rotor failure plus one pump rotor failure scenario".

Thermal restriction matrix

Table 1. Thermal restriction matrixThe table describes thermal restriction matrix:
XE8640
Front configuration 8x 2.5" U.2 / NVMe 8x 2.5" E.3 8x 2.5" U.2 /SAS SSD
Additional attributes 4 x Nvidia H100 700W 4 x Nvidia H100 700W 4 x Nvidia H100 700W
Rear configuration 4xFH 4xFH 4xFH
Fan type HPR Gold fan HPR Gold fan HPR Gold fan
Heatsink type Standard heatsink for CPU and LAAC for GPU Standard heatsink for CPU and LAAC for GPU Standard heatsink for CPU and LAAC for GPU
CPU TDP Processor TDP Core count 35°C 35°C 35°C
5418Y 185W 24 35°C 35°C 35°C
6448Y/6442Y 225W 32/24 35°C 35°C 35°C
8462Y+ 300W 32 35°C 35°C 35°C
8460Y+ 300W 40 35°C 35°C 35°C
8452Y 300W 36 35°C 35°C 35°C
8480+/8470/8468 350W 56/52/48 35°C 35°C 35°C
Table 2. Memory Thermal restriction matrixThe table describes memory thermal restriction matrix:
XE8640 1 DPC 2DPC temperature
DIMM 128GB RDIMM 4800 13.8W 10.7W 35°C
64GB RDIMM 4800 12.0W 8.5W 35°C
32GB RDIMM 4800 NA NA 35°C
Table 3. GPU Thermal restriction matrixThe table describes GPU thermal restriction matrix:
XE8640
GPU Nvidia H100(4x GPU SKU) 35°C
NOTE:All configurations support 35°C environment w/o performance degradation.