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Dell PowerEdge XE7740: руководство по обслуживанию
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Dell PowerEdge XE7740: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge XE7745 system.
Table 1. PowerEdgeXE7740 chassis dimensionsThis table provides the dimensions of the system:
Drives Xa Xb Y Za Zb Zc
8 drives 482.0 mm (18.90 inches) 445 mm (17.52 inches) 174.3 mm (6.86 inches) 34.83 mm (1.37 inches) with bezel

22 mm (0.87 inches) without bezel

830.2 mm (32.68 inches)

ear to rear wall

864.73 mm (34.04 inches)

ear to PSU handle

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge XE7740 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
E3.S Gen5 NVMe drives 71.35 Kg (157.30 lb)
Table 2. PowerEdge XE7740 weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight Description
40–70 lb Recommend two people to lift
70–120 lb Recommend three people to lift
≥ 121 lb Recommend to use a server-lift
WARNING:The system is heavy, so ensure adequate support and balance during movement and installation; a lift is required for loads over 120 lb, as the system can slide and cause damage when being installed or removed from a higher position on the rack.
CAUTION: Lift the system by using the provided lifting handles on the chassis and refrain from using clips or other chassis points to lift the system. Nondesignated lift-points on the chassis may cause system damage due to the inability to support the system weight while lifting.

Processor specifications

Table 1. PowerEdge XE7740 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
Intel® Xeon® 6 series processors Two

PSU specifications

The PowerEdgeXE7740system supports up to eight AC or DC power supply units (PSUs).

Table 1. PSU SpecificationsThis table describes PSU specifications for the system.
PSU Power Ratings Class Heat dissipation Frequence (Hz) Input Voltage Current (A)
3200 W Mixed Mode

Multi-capacity

3200 W Titanium 12,000 BTU/hr 50/60 220.1-240 V AC 16
N/A 12,000 BTU/hr N/A 240 Vdc 14.5
2900 W Titanium 12,000 BTU/hr 50/60 200-220 V AC 16
3200 W 277V AC and HVDC3200 W Titanium 12,000 BTU/hr 50/60 277 V AC12.9
N/A 12,000 BTU/hr N/A 336 V DC10.47
2400 W Mixed Mode2400 WTitanium9000 BTU/hr 50/60 200-240 V AC 16 - 13.2
N/A 9000 BTU/hr N/A 240 Vdc 10.9
1400 WN/A9000 BTU/hr 50/60 100-120 V AC 16 - 13.2
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at Enterprise Infrastructure Planning Tool.
Figure 1. PSU power cables

this image shows list of PSU power cords

Figure 2. APP 2006G1 power cord

This image shows APP 2006G1power cord.

Table 2. PSU power cablesThe table lists the PSU power cables list .
Form factor Output Power cable
Redundant 73.5 mm 3200 W mixed modeC19
2400 W mixed modeC19
3200 W 277 V AC & HVDCAPP/Saf-D-Grid
NOTE:The PowerEdge XE7740 does not support power supply units from mixed sub-vendors.

Power Supply Requirements:

There are 2 PSUs installed on the CPU zone and 6 PSUs on the GPU zone.

  • Zone 1 (CPU 1U Zone):
    • PSU 1
    • PSU 2
  • Zone 2 (GPU 3U Zone):
    • PSU 3
    • PSU 4
    • PSU 5
    • PSU 6
    • PSU 7
    • PSU 8
CAUTION:The system requires at least one PSU in the CPU zone and one PSU in the GPU zone to maintain BMC and standby power. If the GPU zone has no PSU installed, the system will remain on hold. To ensure full redundancy, install N+N number of PSUs in each zone, i.e., 1+1 in CPU zone and 3+3 in GPU zone. Removing all PSUs from the CPU zone while system is power on will cause immediate shutdown and potential data loss.
This image shows the PSUs installed in each zone for BMC and standby power support.
NOTE:At least one power supply unit must be installed in each zone for BMC and standby power support.
This image shows all PSUs installed in each zone for maximum performace with full redundancy.
NOTE:All eight power supply units must be installed across both zones for maximum performance with full redundancy.

PSU-GPU Configuration Matrix

Below table lists the PSU-GPU Configuration Matrix.

Table 1. PSU-GPU Configuration Matrix - 3200 W PSUsThe below table lists the PSU-GPU Configuration Matrix for 3200W PSUs.
GPU Card PBT-GPU 3200 W
Zone Area Side A Side B Zone Area Side A Side B
CPU Zone 1 0 CPU Zone 1 1
GPU Zone 3 0 GPU Zone 3 3
Not Redundant (4+0) PSU Redundant (3+1) A/B Grid (4+0) Not Redundant (8+0) PSU Redundant (7+1) A/B Grid (4+4)
GPU Zone (3+0) GPU Zone (2+1) GPU Zone (3+0) GPU Zone (6+0) GPU Zone (5+1) GPU Zone (3+3)
Full GPUs 8x Nvidia H200 NVL (600W) 1200 Supported Not Supported SKU not supported Supported Supported Supported
8x Nvidia RTX Pro 6000 (600W) 1200 Supported Not Supported SKU not supported Supported Supported Supported
8x Intel Gaudi3 (600W) 1224 Supported Not Supported SKU not supported Supported Supported Supported
8x Nvidia H100 NVL (400W) 720 Supported Not Supported SKU not supported Supported Supported Supported
8x Nvidia L40S (350W) 550 Supported Not Supported SKU not supported Supported Supported Supported
16x Nvidia L4 (72W) 175 Supported Not Supported SKU not supported Supported Supported Supported
Half GPUs 4x Nvidia H200 NVL (600W) 1200 Supported Not Supported SKU not supported Supported Supported Supported
4x Nvidia RTX Pro 6000 (600W) 1200 Supported Not Supported SKU not supported Supported Supported Supported
4x Intel Gaudi3 (600W) 1224 Supported Not Supported SKU not supported Supported Supported Supported
4x Nvidia H100 NVL (400W) 720 Supported Not Supported SKU not supported Supported Supported Supported
4x Nvidia L40S (350W) 550 Supported Not Supported SKU not supported Supported Supported Supported
8x Nvidia L4 (72W) 175 Supported Not Supported SKU not supported Supported Supported Supported
2x GPUs Nvidia H200 NVL (600W) 1200 Supported Not Supported SKU not supported Supported Supported Supported
Nvidia RTX Pro 6000 (600W) 1080 Supported Not Supported SKU not supported Supported Supported Supported
6x GPUs Nvidia H200 NVL (600W) 1200 Supported Not Supported SKU not supported Supported Supported Supported
Nvidia RTX Pro 6000 (600W) 1200 Supported Not Supported SKU not supported Supported Supported Supported
Table 2. PSU-GPU Configuration Matrix - 2400 W PSUsThe below table lists the PSU-GPU Configuration Matrix for 2400 W PSUs.
GPU Card PBT-GPU 2400 W
Zone Area Side A Side B Zone Area Side A Side B
CPU Zone 1 0 CPU Zone 1 1
GPU Zone 3 0 GPU Zone 3 3
Not Redundant (4+0) PSU Redundant (3+1) A/B Grid (4+0) Not Redundant (8+0) PSU Redundant (7+1) A/B Grid (4+4)
GPU Zone (3+0) GPU Zone (2+1) GPU Zone (3+0) GPU Zone (6+0) GPU Zone (5+1) GPU Zone (3+3)
Full GPUs 8x Nvidia H200 NVL (600W) 1200 Not Supported Not Supported SKU not supported Supported Supported Not Supported
8x Nvidia RTX Pro 6000 (600W) 1200 Not Supported Not Supported SKU not supported Supported Supported Not Supported
8x Intel Gaudi3 (600W) 1224 Not Supported Not Supported SKU not supported Supported Supported Not Supported
8x Nvidia H100 NVL (400W) 720 Supported Not Supported SKU not supported Supported Supported Supported
8x Nvidia L40S (350W) 550 Supported Not Supported SKU not supported Supported Supported Supported
16x Nvidia L4 (72W) 175 Supported Not Supported SKU not supported Supported Supported Supported
Half GPUs 4x Nvidia H200 NVL (600W) 1200 Supported Not Supported SKU not supported Supported Supported Supported
4x Nvidia RTX Pro 6000 (600W) 1200 Supported Not Supported SKU not supported Supported Supported Supported
4x Intel Gaudi3 (600W) 1224 Supported Not Supported SKU not supported Supported Supported Supported
4x Nvidia H100 NVL (400W) 720 Supported Not Supported SKU not supported Supported Supported Supported
4x Nvidia L40S (350W) 550 Supported Not Supported SKU not supported Supported Supported Supported
8x Nvidia L4 (72W) 175 Supported Not Supported SKU not supported Supported Supported Supported
2x GPUs Nvidia H200 NVL (600W) 1200 Supported Not Supported SKU not supported Supported Supported Supported
Nvidia RTX Pro 6000 (600W) 1080 Supported Not Supported SKU not supported Supported Supported Supported
6x GPUs Nvidia H200 NVL (600W) 1200 Supported Not Supported SKU not supported Supported Supported Not Supported
Nvidia RTX Pro 6000 (600W) 1200 Supported Not Supported SKU not supported Supported Supported Not Supported
Table 3. Total Power Consumption - Other ComponentsThe below table lists the Total Power Consumption - Other Components.
Components Quantity Total Power Consumption
GPU Fans 12 2160
Baseboard 1 200
NIC 8 1000

Redundancy Policy Options

Users can select from various redundancy policies based on system requirements and power availability. Each policy determines how the system behaves during PSU failures and ensures optimal power distribution.

Table 4. Redundancy Policy DetailsThe below table lists the supported redundancy policies
Redundancy Policy GPU Power Brake Trigger Point (Zone 2 GPU) Status
Not Redundant Not supported System shuts down if PSU is insufficient All PSUs actively support the system power requirement
PSU Redundant Supported Depends on iDRAC calculation when PSU drops iDRAC calculates FTR value based on system power requirement
A/B Grid Supported Four PSUs lost within a single grid Splits PSUs into two grids (A and B), each with its own power source

Not Redundant:

  • No failover capability.
  • If PSU power is insufficient, the system shuts down immediately.
  • All PSUs work together to meet power demand.

PSU Redundant:

  • Provides failover capability.
  • iDRAC dynamically calculates the required power and adjusts based on PSU availability.
  • Ensures system stability during PSU failure.

A/B Grid:

  • High-availability configuration.
  • PSUs are divided into two independent grids (A and B), each with its own power source.
  • Maintains system operation when multiple PSUs fail (up to four PSU drops), with reduced performance.

Cooling fan specifications

The PowerEdgeXE7740 system supports up to:

  • four sets of high performance (HPR) platinum grade fans (dual fan module) installed in mid tray
  • twelve high performance (HPR) platinum grade fans installed on the front of the system
Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
High performance (HPR) platinum fans HPR PLATINUM Mid Compute Fan N/A
Figure 1. High performance (Platinum grade) fan
This image shows the high performance (Platinum grade) fan
High performance (HPR) platinum fans HPR PLATINUM Front GPU Fans N/A
NOTE:New cooling fans comes with the Front GPU fans label.
Figure 2. Front GPU Fans
This image shows the front GPU fan

Supported operating systems

The PowerEdge XE7740 system supports the following operating system:

  • Canonical Ubuntu Server LTS
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
For specifications and interoperability details, see OS support.

System battery specifications

The PowerEdge XE7740 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card specifications

The PowerEdge XE7740 system supports multiple PCI express (PCIe) slots (Gen5 slots), one OCP NIC and one BOSS on the system.
Table 1. Expansion card slots supported on the systemThis table provides information about the expansion card slots that are supported on the system.
Category PCIe slot Width Processor connection Height Length Slot width Power
GPU Slot 21 DW/SW Processor 0 Full Height Full Length x16 75 W
Slot 22 SW Processor 0 Full Height Full Length x16 75 W
Slot 23 DW/SW Processor 0 Full Height Full Length x16 75 W
Slot 24 SW Processor 0 Full Height Full Length x16 75 W
Slot 25 DW/SW Processor 0 Full Height Full Length x16 75 W
Slot 26 SW Processor 0 Full Height Full Length x16 75 W
Slot 27 DW/SW Processor 0 Full Height Full Length x16 75 W
Slot 28 SW Processor 0 Full Height Full Length x16 75 W
Slot 29 DW/SW Processor 1 Full Height Full Length x16 75 W
Slot 30 SW Processor 1 Full Height Full Length x16 75 W
Slot 31 DW/SW Processor 1 Full Height Full Length x16 75 W
Slot 32 SW Processor 1 Full Height Full Length x16 75 W
Slot 33 DW/SW Processor 1 Full Height Full Length x16 75 W
Slot 34 SW Processor 1 Full Height Full Length x16 75 W
Slot 35 DW/SW Processor 1 Full Height Full Length x16 75 W
Slot 36 SW Processor 1 Full Height Full Length x16 75 W
PBB (PCIe Base Board) Slot 1 SW Processor 1 Full Height Full Length x16 75 W
Slot 2 SW Processor 1 Full Height Full Length x16 75 W
Slot 3 SW Processor 1 Full Height Full Length x16 75 W
Slot 4 SW Processor 1 Full Height Full Length x16 75 W
Slot 6 SW Processor 0 Full Height Full Length x16 75 W
Slot 7 SW Processor 0 Full Height Full Length x16 75 W
Slot 8 SW Processor 0 Full Height Full Length x16 75 W
Slot 9 SW Processor 0 Full Height Full Length x16 75 W
OCP Slot 5 NA Processor 0 NA NA x8 75 W
BOSS Slot 41 NA Processor 0 NA NA x4 75 W

Memory specifications

The PowerEdge XE7740 supports up to 32 DIMMs (16 per socket), with up to 4 TB of memory and speeds of up to 6400 MT/s.

The PowerEdge XE7740 supports registered (RDIMMs) which use a buffer to reduce memory loading and provide greater density, allowing for the maximum platform memory capacity. Unbuffered DIMMs (UDIMMs) are not supported.

Table 1. Memory technology comparisonThe table below shows the memory technology comparison:
Feature PowerEdge XE7740 (DDR5)
DIMM type RDIMM
Transfer speed 6400 MT/s (1DPC) and 5200 MT/s (2DPC)
NOTE:Maximum DIMM transfer speed support dependent on CPU SKU and DIMM population
Voltage 1.1 V
Table 2. Supported DIMMsThis table provides information about supported DIMMs:
DIMM Capacity (GB) Rated DIMM Speed (MT/s) DIMM Type Ranks per DIMM Data Width DIMM Volts (V)
32 6400 RDIMM 2 x8 1.1
64 6400 RDIMM 2 x4 1.1
96 6400 RDIMM 2 x4 1.1
128 6400 RDIMM 2 x4 1.1
Table 3. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
32, 288-pin 6400 MT/s (1DPC) and 5200 MT/s (2DPC)
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The processor may reduce the performance of the rated DIMM speed.

Storage controller specifications

The PowerEdge XE7740 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS): HWRAID 1, 2 x M.2 NVMe SSDs or USB

Drives

The PowerEdge XE7740 system supports:
  • 8 x EDSFF E3.S NVMe (SSD) hot-swappable drives
NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

GPU Specifications

The PowerEdge XE7740 system supports:
  • 8x PCIe Gen 5 x16 DW-FHFL up to 600W or
  • 16x PCIe Gen 5 x16 SW-FHFL up to 75W

The PowerEdge XE7740 system supports the following GPU PCIe cards:

Table 1. Supported GPU PCIe cardsThe table outlines the supported GPU PCIe cards for the XE7745 system.
GPUs Width Height Length Number of cards supported
NVIDIA H100 DW Full Height Full Length 2x or 4x or 8x
NVIDIA H200 DW Full Height Full Length 2x or 4x or 8x
NVIDIA L40S DW Full Height Full Length 4x or 8x
NVIDIA L4 SW Full Height Full Length 8x or 16x
NVIDIA RTX Pro 6000 DW Full Height Full Length 2x or 4x or 8x
Intel Gaudi3 DW Full Height Full Length 4x or 8x

NIC port specifications

The PowerEdge XE7740 system supports one 10/100/1000 Mbps BMC Ethernet, optional Open Compute Project (OCP) card, DPU card, and PCIe Add-in card NIC.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
Datacenter-Secure Control Module (DC-SCM) 1 GbE x 1
OCP NIC 3.0 card 100 GbE x 2, 25 GbE x 4, 25 GbE x 2, 10G x 2
DPU card 200 GbE x 2
PCIe Add-in Card (AIC) NIC 400 GbE x 1, 200 GbE x 2, 100 GbE x 2

USB ports specifications

Table 1. PowerEdge XE7740 USB specificationsThe following table shows the USB specifications for the system:
Front Rear Internal
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0 Type-C dual mode (Host/iDRAC Direct port) One USB 3.1-compliant Type-A port Two USB 3.1-compliant Type-A portOne
USB 2.0-compliant Type-A port (optional) One

VGA ports specifications

The PowerEdge XE7740 system supports 1x DB-15 port for VGA on the rear I/O board of the Datacenter Secure Control Module (DC-SCM).

Video specifications

The PowerEdge XE7740 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
640 x 480 60 8, 16, 32
800 x 600 60 8, 16, 32
1024 x 768 60 8, 16, 32
1152 x 864 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1400 x 1050 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32
NOTE: *(RB) - Reduced Blanking for Digital Displays requiring less blank time. This was introduced for Signal Integrity improvements by reducing Pixel Clock rates for VGA- Analog input devices.

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Parameters Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Common Environmental Specifications for all categories This table describes the shared requirements for all categories.
Parameters Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40°C to 65°C (-40°F to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 ft)
Maximum operational altitude 3,048 meters (10,000 ft)
Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.38 Grms at 7 Hz to 250 Hz for 15 minutes.
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10 min (all operation orientations)
Storage 1.38 Grms at 7 Hz to 250 Hz for 15 minutes
Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a non-operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Executed shock pulses in z axis (one pulse) of 71G for up to 2ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label Description
HPR PLATINUM High-performance Platinum (HPR PLTM) fan
HSK Heat sink
LP Low profile
FH Full height
FL Full length
Table 2. Thermal restriction matrix - Intel Xeon 6 Series processorsThe table describes the thermal restriction matrix - Intel Xeon 6 Series processors:
Configuration 8 x EDSFF E3.S NVMe
Processor TDP Cores Fan Type Ambient temperature
6787P 350 W 86 HPR PLATINUM 35°C
6767P 350 W 64
6747P 330 W 48
Table 3. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
CPU HSK Supports all TDP
Table 4. Thermal restriction matrix - Memory and GPU/FPGAThe table describes the thermal restriction matrix - Memory and GPU/FPGA:
Configuration 8 x EDSFF E3.S NVMe
Rear storage No rear drives
Memory/GPU HPR PLATINUM fans with CPU HSK
Ambient temperature
Memory 128GB RDIMM 6400 35°C
96GB RDIMM 6400 35°C
64GB RDIMM 6400 35°C
32GB RDIMM 6400 35°C
GPU

8x GPU

 NVIDIA H200 NVL 30°C
NVIDIA H100 NVL 35°C
NVIDIA L40S 35°C
NVIDIA L4 35°C
NVIDIA RTX Pro 6000 30°C*
Intel Gaudi3 35°C
NOTE:*When four NVIDIA RTX Pro 6000 GPUs are installed in the middle PCIe slots, the maximum supported ambient temperature is 35 °C.

Other Restrictions

  • 100 Gb and higher OCP cards require an 85°C optical cable or DAC.
  • DPU B3220:
    • The DAC cable has a maximum ambient temperature limit of 30°C for supported operation.
    • AOC cable is not supported.