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Dell EMC PowerEdge XE8545: технические характеристики и спецификации
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Dell EMC PowerEdge XE8545: технические характеристики и спецификации

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge R7525 system.
Table 1. Chassis dimension for the systemThis table provides the dimensions of the system:
Drives Xa Xb Y Za Zb Zc
10 drives482.0 mm (18.97 inches)447.0 mm (15.59 inches)174.8 mm (6.88 inches) 35.84 mm (1.4 inches)With bezel22.0 mm (0.87 inches)Without bezel810 mm (31.88 inches)Ear to rear wall845.59 mm (33.29 inches)Ear to PSU handle
NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. System weight of the PowerEdge XE8545 systemThe table below shows the maximum weight of the PowerEdge XE8545 system.
System configuration Maximum weight (with all drives/SSDs)
10 x 2.5-inch 48.61 kg (107.17 lb)

Processor specifications

Table 1. Processor specifications for the systemThis table provides processor specifications for the system.
Supported processor Number of processors supported
AMD EPYC 7003 Series processorwith up to 64 cores Two

PSU specifications

The system supports up to four AC or DC power supply units (PSUs).
WARNING: Instructions for the qualified electricians only:

System using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations in accordance with Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70.

240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units if applicable in country of use.

Power supply cords/jumper cords and the associated plugs/inlets/connectors shall have appropriate electrical ratings referencing the rating label on the system when used for connection.

Table 1. PSU specifications for the systemThis table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) Frequency Voltage Current
2800 W Mixed Mode Titanium 10500 BTU/hr 50/60 Hz 240 V AC 15.6 A
N/A 10500 BTU/hr N/A 240 V DC 13.6 A
2400 W Mixed Mode AC/HVDC Platinum 9000 BTU/hr 50/60 Hz 100 - 240 VAC autoranging 16 - 13.5 A
2400 W Mixed Mode AC/HVDC N/A 9000 BTU/hr DC 240 V DC 11.2 A
NOTE: If the system with AC 2400 W PSU operate at low line 100-120 V AC, then the power rating per PSU is derated to 1400 W.
NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Cooling fan specifications

The PowerEdgeXE8545 system supports up to six very high performance gold grade (HPR (Gold)) cooling fans connected to the system board directly. The system also supports 12 very high performance fans in the front, for GPU cooling.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
High-performance fan (Gold grade) fanHPR (Gold) VHP - Very High Performance Gold
NOTE: New cooling fans comes with the High Performance Gold Grade label. While the older cooling fans has the High Performance label.
Figure 1. Very high performance fan
This image shows the very high performance fan.
Figure 2. High performance (Gold grade) fan
This image shows the high performance fan.
NOTE: For more information about the supported fan configuration or matrix, see Thermal restriction matrix.

Supported operating systems

The PowerEdge XE8545 supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • VMware ESXi
  • CentOS

System battery specifications

The PowerEdge XE8545 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The system supports up to four PCI express (PCIe) Gen 4 expansion cards.
Table 1. Expansion card slots supported for Riser Configuration 1This table provides information about the expansion card slots that are supported on the system for riser configuration 1.
PCIe slot Risers Riser width PCIe slot height PCIe slot length PCIe slot width
Slot 2 R1A x16 PCIe Full height Half length x16
Slot 6 R2C x16 PCIe Low profile Half length x16
Slot 7 R4B x8 PCIe Full height Half length x8
Slot 8 R4B x8 PCIe Full height Half length x8
Table 2. Expansion card slots supported for Riser Configuration 2This table provides information about the expansion card slots that are supported on the system for riser configuration 2.
PCIe slot Risers Riser width PCIe slot height PCIe slot length PCIe slot width
Slot 2 R1A x16 PCIe Full height Half length x16
Slot 6 R2C x16 PCIe Low profile Half length x16
Slot 7 R4A x16 PCIe Full height Half length x16

Memory specifications

The system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity DIMM Rated Voltage and supported speed Speed
Single Processor Dual Processor
RDIMM Dual rank 32 GB, 64 GB DDR4 (1.2 V), 3200 3200 2933
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
32, 288-pin 3200 MT/s, 2933 MT/s, 2666 MT/s

Storage controller specifications

The system supports the following controller cards:
Table 1. Storage controller cards for the systemThis table provides the controller cards supported on the system:
Internal controllers
PERC H745 , H755

Drives

The PowerEdge XE8545 system supports:
  • 10 x 2.5-inch hot-swappable SAS, SATA drives.
  • 8 x 2.5-inch hot-swappable NVMe drives.
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at https://www.dell.com/support Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. USB specificationsThe following table shows the USB specifications :
Front Rear
USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 3.0-compliant port One
Micro-USB 2.0 compliant port One USB 2.0-compliant port One
NOTE: The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
NOTE: The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.
NOTE: The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

NIC port specifications

The system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional OCP cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card 1 GB x 2
OCP card (OCP 3.0) 1

VGA ports specifications

The system supports One DB-15 VGA port one each on the front and back panels.

Video specifications

The system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported front video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32
Table 2. Supported rear video resolution options for the systemThis table describes the supported rear video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/support/home.
Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)
NOTE: Certain system hardware configurations may require operating temperatures to be less than 28°C. For more information, see the Thermal air restrictions section.
Table 2. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE: * - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restriction matrix

Table 1. Thermal restriction matrixThe table describes thermal restriction matrix:
TDP (W) Heat sink type Fan Type 2 x 2.5" SAS + 8 x 2.5" NVMe
- ASHRAE A2 (Max 35° C) Ambient Limit (Max 30° C) Ambient Limit (Max 25° C) Ambient Limit (Max 20° C)
AMD Milan 64C 280W 2.5-2.6 GHz 256 MB 2U CPU Heat sink Very High Performance Fan Supported
AMD Milan 24C 240W 3.15 GHz 256 MB
AMD Milan 64C 225W 2.05-2.15 GHz 256 MB
AMD Milan 32C 225W 2.7-2.8 GHz 256 MB
AMD Milan 64C 225W 2.0 GHz 256 MB
AMD Milan 48C 225W 2.2-2.3 GHz 256 MB
AMD Milan 24C 180W 2.55-2.65 GHz 128 MB
Table 2. GPU/FPGA thermal restriction matrix The table describes GPU/FPGA thermal restriction matrix for the system.
TDP (W) Heat sink type Fan Type ASHRAE A2 (Max 35° C) Ambient Limit (Max 30° C) Ambient Limit (Max 25° C) Ambient Limit (Max 20° C)
Nvidia 500 W A100 80 GB GPU 2.5U GPU Heat sink Very High Performance Fan Not supported Not supported (Max ambient support limit = 28° C) Supported Supported
Nvidia 400 W A100 40 GB GPU Supported Supported Supported Supported
NOTE: When the 80 GB GPUs are installed, the iDRAC sets the thermal warning threshold to 28° C instead of the normal 38° C.
NOTE: If System Board Inlet Temp reaches 28° C - 32° C, a warning message is logged. It is possible the GPUs may lower power consumption to avoid thermal damage. This results in lower GPU performance.
Table 3. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
2U HPR (Silver) HSK Supports all TDP

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
NOTE: Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHRAE Standard 127
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
NOTE: Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal air restrictions

ASHRAE A2 environment

  • CPU TDP > 280 W are not supported.
  • PCIe card TDP > 25 W is not supported.
  • Nvidia A100 80 GB GPU (Max TDP with 500 W) is not supported within ASHRAE A2. Maximum Ambient temperature supported is 28°C.