Dell EMC PowerEdge XE7420: характеристики и спецификации

Dimensions of the PowerEdge XE7420 sled

This image shows dimensions of sled — Figure 1. Dimensions of the PowerEdge XE7420 sled

Table 1. Dimensions of the PowerEdge XE7420 sledThe dimensions of the PowerEdge XE7440 sled are as follows: X = 187 mm (7.36 inches), Y = 56.65 mm (2.23 inches), Z = 691 mm (27.20 inches).
X	Y	Z
187 mm (7.36 inches)	56.65 mm (2.23 inches)	691 mm (27.20 inches)

Chassis weight

Table 1. Chassis weight of the PowerEdge XE7100 enclosure with PowerEdge XE7440 and XE7420 sledsFor PowerEdge XE7100 enclosure with PowerEdge XE7440 and XE7420 sleds systems, the maximum chassis weight is 132.26 Kg — 142.81 Kg.
System	Maximum weight (with all sleds and drives)
Chassis weight without sled	132.26 Kg (291.58 lb)
Chassis weight with half-width sled (XE7420)	137.12 Kg (302.29 lb)
Chassis weight with full- width full-height sled (XE7440).	140.93 Kg (310.69 lb)
Chassis weight with full- width low-profile sled (XE7440)	142.81 Kg (341.84 lb)

Processor specifications

The PowerEdge XE7420 sled supports up to two Intel Xeon Scalable processor in each independent sled. Each processor supports up to 26 cores.

Cooling specifications

The PowerEdge XE7100 chassis with two PowerEdge XE7420 nodes/sleds or one PowerEdge XE7440 node/sled has 18 fans. These are divided into three fan zones (Chassis, Node_A, and Node_B), and each zone has six fans.

The chassis fans are single rotor fans, and sled fans are dual rotor fans.

For Half-Width (HW) sled, sled 1 is Node 1 and sled 2 is Node 2.

Table 1. Fan numberingThe following table shows the fan numbering for the PowerEdge systems:
PowerEdge systems	Fan numbering
XE7100 - Chassis	1–6
XE7440 (Single sled)	7–12 , 13-18
XE7420 (Dual sleds)	Node_A: 7–12 , Node_B: 13-18

NOTE The reading and reporting of fan sensors are in the order of chassis fans, Node_A and Node_B fans, and sensors numbering is 1-6, 7-12 and 13-18 respectively.

For XE7420, the sled 1/ node 1 reports six chassis fan sensors (1-6) and sled 1 fan sensors (7-12).
For XE7420, the sled 2/ node 2 reports six chassis fan sensors (1-6) and sled 2 fan sensors (13-18).

Cooling fan-mapping

Table 2. Cooling fan-mappingThe Fan sensor numbers that are defined in the iDRAC are as shown in the table below:
Fan name and configuration	iDRAC sensor number
(Chassis) FAN 1	38
FAN 2	39
FAN 3	3A
FAN 4	3B
FAN 5	3C
FAN 6	3D
(Node_A) FAN 7	3E
FAN 8	3F
FAN 9	40
FAN 10	41
FAN 11	42
FAN 12	43
(Node_B) FAN 13	44
FAN 14	45
FAN 15	46
FAN 16	47
FAN 17	E2
FAN 18	E3

NOTE All the numbering are embossed on each fan.

Thermal recommendations

After one fan rotor failure, you must estimate the fan service time while the system is under steady state.
It is recommended to limit the minimum service time under 500 seconds.

NOTE For PSU and hard drive no limit is required for the service time.

Supported operating systems

The PowerEdge XE7420 supports the following operating systems:

Canonical® Ubuntu®
VMware® ESXi®
Microsoft® Windows Server®
Red Hat® Enterprise Linux
SUSE® Linux Enterprise Server

NOTE For more information about the specific versions and additions, see https://www.dell.com/ossupport.

System battery

The PowerEdge XE7420 sled uses a CR 2032 3V replaceable lithium coin cell battery.

NOTE There is a system battery in each of the sleds.

Expansion bus specifications

The PowerEdge XE7420 sled supports four Generation 3 capable PCIe slots.

Table 1. Expansion bus specificationsThe table below shows the supported expansion bus:
PCIe Slots	Description	Form factor
x8 DCS Mezz PCIe riser	Slot 1: x8 PCIe Gen3 from processor 1	Mini PERC form factor
x8+x8 OCP Mezz riser	Slot 2: x8 PCIe Gen3 from processor 1	Standard Open Compute Project (OCP) form factor
x8+x8 OCP Mezz riser	Slot 3: x8 PCIe Gen3 from processor 1	Standard Open Compute Project (OCP) form factor
x16 PCIe main riser	Slot 4: x16 PCIe Gen3 processor 1 (for FWFH configuration)	Standard PCIe form factor
	Slot 7: x16 PCIe Gen3 processor 1 (for FWLP configuration)
	Slot 8: x16 PCIe Gen3 processor 1 (for FWLP configuration)
	Slot 9: x16 PCIe Gen3 processor 1 (for FWLP configuration)
	Slot 10: x16 PCIe Gen3 processor 1 (for FWLP configuration)
x16 M.2 riser	Slot 5 and 6: x16 PCIe Gen3 from processor 2	Custom form factor (PERC card)

Memory specifications

Table 1. Memory specifications The table below shows the memory specifications.
Memory module sockets	DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
Memory module sockets	DIMM type	DIMM rank	DIMM capacity	Minimum RAM	Maximum RAM	Minimum RAM	Maximum RAM
Sixteen 288-pins	LRDIMM	Octal rank	128 GB	128 GB	1024 GB	256 GB	2048 GB
	RDIMM	Single rank	8 GB	8 GB	64 GB	16 GB	128 GB
		Dual rank	16 GB	16 GB	128 GB	32 GB	256 GB
			32 GB	32 GB	256 GB	64 GB	512 GB
			64 GB	64 GB	512 GB	128 GB	1024 GB

Drives and storage specifications

The PowerEdge XE7420 enclosure supports SAS and SATA hard drives and Solid State Drives (SSDs).

Table 1. Supported drive options for the PowerEdge XE7420 sled with enclosure This table lists out the supported drive options for the PowerEdge XE7420 sled.
Maximum number of drives in the enclosure	Maximum number of drives assigned per sled
100 x 3.5-inch drive systems	50 SAS or SATA hard drives and SSDs per sled
4 x 2.5-inch drive systems	Four SAS or SATA hard drives or SSDs per sled
4 x 2.5-inch drive systems with NVMe	The NVMe backplane supports either of these configurations: Two NVMe drives and two SAS or SATA hard drives or SSDs per sled
M.2 SATA drive (optional)	The supported capacity of the M.2 SATA card is up to 240 GB NOTE The M.2 SATA card can be installed on the x8 (slot 1) mezzanine riser or the x16 riser slot (slot 5).
Micro-SD card (optional) for boot (up to 64 GB)	One on each PCIe riser of each sled

Video specifications

The PowerEdge XE7420 sled supports a Matrox G200 integrated graphics card with 16 MB RAM.

Table 1. Supported video resolution optionsFor 1024 x 768 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1280 x 800 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1280 x 1024 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1360 x 768 resolution, the refresh rate is 60 Hz and the color depth is up to 24. For 1440 x 900 resolution, the refresh rate is 60 Hz and the color depth is up to 24.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	up to 24
1280 x 800	60	up to 24
1280 x 1024	60	up to 24
1360 x 768	60	up to 24
1440 x 900	60	up to 24

Environmental specifications

The sections below contains information about the environmental specifications of the system.

NOTE For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/poweredgemanuals.

Standard operating temperature specifications

NOTE All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with sufficient thermal margin if the ambient temperature is equal to or below to the maximum continuous operating temperature listed in these tables except for the Mellanox DP LP card and Intel Rush Creek card.

Table 1. Standard operating temperature specificationsThe following table shows the standard operating temperature specifications:
Standard operating temperature	Specifications
Temperature ranges (for altitude less than 900 m or 2953 ft)	10°C–35°C (50°F–95°F) with no direct sunlight on the equipment.

Expanded operating temperature specifications

NOTE When operating in the expanded temperature range, system performance may be impacted.

NOTE When operating in the expanded temperature range, ambient temperature warnings may be reported in the System Event Log.

Operating temperature derating specifications

Table 1. Operating temperatureThe following table shows the operating temperature derating specifications:
Operating temperature derating	Specifications
≤ 35°C (95°F)	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 ft) above 900 meters (2953 ft).
35°C–40°C (95°F–104°F)	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 ft) above 900 meters (2953 ft).
40°C–45°C (104°F–113°F)	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 ft) above 900 meters (2953 ft).

Relative humidity specifications

Table 1. Relative humidity specificationsThe following table shows the humidity specifications:
Relative humidity	Specifications
Storage	5% to 95% RH with 27°C (80.6°F) maximum dew point. Atmosphere must be noncondensing always.
Operating	< 35°C (95°F): 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point. 35°C–40°C (95°F–104°F): 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point. 40°C- 45°C(104°F–113°F): 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point

Temperature specifications

Table 1. Temperature specificationsThe following table shows the temperature specifications:
Temperature	Specifications
Storage	–40°C–65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft)	10°C–35°C (50°F to 95°F) with no direct sunlight on the equipment.
Expanded operating temperature	For information about expanded operating temperature, see Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage)	20°C/h (68°F/h)

NOTE Some configurations require a lower ambient temperature for more information, see the Standard operating temperature specifications.

Particulate and gaseous contamination specifications

Table 1. Particulate contamination specificationsThe following table shows the particulate contamination specifications:
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe following table shows the gaseous contamination specifications:
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate	<200 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Maximum vibration specifications

Table 1. Maximum vibration specificationsThe following table shows the maximum vibration specifications:
Maximum vibration	Specifications
Operating	0.26 Grms at 5 Hz to 350 Hz (all operation orientations).
Storage	1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Maximum shock specifications

Table 1. Maximum shock specificationsThe following table shows the maximum shock specifications:
Maximum shock	Specifications
Operating	24 executed shock pulses 6 G in the positive and negative x, y, z axis for up to 11 ms (four pulses on each side of the system).
Storage	6 consecutively executed shock pulses of 71 G in the positive and negative x, y, z axes for up to 2 ms (one pulse on each side of the system).

Maximum altitude specifications

Table 1. Maximum altitude specificationsThe following table shows the maximum altitude specifications:
Maximum altitude	Specifications
Operating	3048 m (10,000 ft)
Storage	12,000 m (39,370 ft)

Dell EMC PowerEdge XE7420: технические характеристики и спецификации