Dell EMC PowerEdge XE2420: технические характеристики и спецификации

Table 1. PowerEdge XE2420 system weightsystem weight of PowerEdge XE2420 is as mentioned in the table below:.

System configuration	Maximum weight (with all drives)
2 x 2.5-inch configuration	17.36 kg (38.19 lb)
4 x 2.5-inch configuration	16.65 kg (36.63 lb)
6 x EDSFF E1.L configuration	18.93 kg (41.65 lb)

Table 1. PowerEdge XE2420 PSU specificationsThe table lists the power supply specifications

PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	Current
1100 W DC	N/A	4416 BTU/hr	N/A	-(48 V to 60 V DC),autoranging	32 A
2000 W AC	Platinum	7500 BTU/hr	50/60 Hz	100-240 V AC, autoranging	12 A- 10 A

The PowerEdge XE2420 system supports up to six dual rotor fans.

The PowerEdge XE2420 system supports CR 2032 3.0-V lithium coin cell system battery.

The PowerEdge XE2420 system supports up to two PCI express (PCIe) expansion cards:

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots supported on the PowerEdge XE2420 system

Configurations	PCIe slot	Riser	PCIe slot height	PCIe slot length	Slot width
1A	Cabled riser	Slot 1 Riser	Full-height	Half-length or Full-length	Double-wide x16 (Gen 3) or 2 Single-wide x 8(Gen 3)
2C	Cabled riser	Slot 1 Riser(PERC)	Full-height	Half-length	Single-wide x 8 (Gen 3)
3A	Cabled riser	Slot 1 Riser	Full-height	Half-length or Full-length	Double-wide x16 (Gen 3) or 2 Single-wide x 8(Gen 3)
All	Slot 4	Slot 4 Riser	Full-height	Half-length or Full-height	Double-wide x16 (Gen 3) or 2 Single-wide x 8(Gen 3)

The PowerEdge XE2420 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications for the PowerEdge XE2420 system :

DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processor
			Minimum RAM	Maximum RAM	Minimum RAM	Maximum RAM
RDIMM	Single rank	8 GB	8 GB	64 GB	16 GB	128 GB
	Dual rank	16 GB	16 GB	128 GB	32 GB	256 GB
		32 GB	32 GB	256 GB	64 GB	512 GB
		64 GB	64 GB	512 GB	128 GB	1 TB
LRDIMM	Quad rank	64 GB	64 GB	512 GB	128 GB	1 TB
	Octa rank	128 GB	128 GB	1 TB	256 GB	1792 GB

Table 2. Memory module socketsThe table below shows the memory module sockets for the PowerEdge XE2420 system:

Memory module sockets	Speed
Sixteen 288-pin	2933 MT/s, 2666 MT/s

The PowerEdge XE2420 system supports the following controller cards:

Table 1. PowerEdge XE2420 system controller cardsThis table provides the controller cards supported by PowerEdge XE2420 system:

Internal controllers	External controllers
PERC H740P PERC H730P+ PERC H330+ S140 HBA330 Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs	External controller is not supported.

The PowerEdge XE2420 system supports the following drive configurations:

Table 1. Supported drivesThe following table shows the PowerEdge XE2420 system supports the following drive configurations:

Configuration	Number of drives	Drive types
1A	up to 2 x 2.5-inch	SATA/NVME
2C	up to 4 x 2.5-inch	SATA/NVME/SAS
3A	up to 6 x SSDs	Enterprise and Data Center SSD Form Factor (EDSFF)

Table 1. PowerEdge XE2420 system USB specificationsThe following table shows the USB specifications for the PowerEdge system.

Front		Rear		Internal
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 3.0-compliant port	Two	N/A	N/A	Internal USB 3.0-compliant port	One
Micro USB 2.0-compliant port for iDRAC Direct	One

The PowerEdge XE2420 system supports up to two 1 Gb LAN on motherboard with 10/100/1000 Mbps Network Interface Controller (NIC) ports that are located on the front panel. The system also supports LAN on Motherboard (LOM) on an optional riser card.

The PowerEdge XE2420 system supports one serial connector on the front panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

The PowerEdge XE2420 system supports one 15-pin VGA ports on the front panel.

The PowerEdge XE2420 system supports Internal Dual SD module (IDSDM) with the below storage capacity:

• 16 GB
• 64 GB

The PowerEdge XE2420 system supports integrated Matrox G200eR2 graphics controller with 16 MB of video frame buffer.

Table 1. Supported front video resolution optionsThis table describes the supported front video resolution options.

Resolution	Refresh rate (Hz)
1600 x 900 (HD+)	60
1366 x 768 (HD)	60
1680 x 1050 (WSXGA+)	60
1280 x 1024 (SXGA)	60
1440 x 900 (WXGA+)	60
1920 x 1080 (FHD)	60
1280 x 800 (WXGA)	60

Operational climatic range category A2

Table 1. Operational climatic range category A2This table describes the Operational climatic range category A2.

Allowable continuous operations
Temperature ranges for altitude <900 meters (<2,953 ft.	10°C–35°C (50°F–95°F) with no direct sunlight on the platform
Humidity percent ranges (Noncondensing always)	8% RH with -12°C minimum dew hover over 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude derating	Maximum temperature is reduced by 1°C/300 meters (1.8°F/984 ft) above 900 meters (2,953 ft)

Operational climatic range category A3

Table 2. Operational climatic range category A3This table describes the Operational climatic range category A3.

Allowable continuous operations
Temperature ranges for altitude <900 meters (<2,953 ft)	5°C–40°C (41°F–104°F) with no direct sunlight on the platform
Humidity percent ranges (Noncondensing always)	8% RH with -12°C minimum dew hover over 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude derating	Maximum temperature is reduced by 1°C/175 meters (1.8°F/574 ft) above 900 meters (2,953 feet)

Thermal restriction for ASHRAE A3/Environment

• CPU TDP greater than 150 W are not supported.

Shared requirements across all categories

Table 3. Shared requirements across all categoriesThis table describes Shared requirements across all categories.

Allowable operations
Maximum temperature gradient (applies to both operation and nonoperation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
Non-operational temperature limits	-40°C to 65°C (-40°F to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point Atmosphere must be noncondensing always.
Maximum Non-operational altitude	12,000 meters (39,370 ft)
Maximum operational altitude	3,048 meters (10,000 ft)

*: Per ASHRAE thermal guidelines, these are not instantaneous rates of temperature change.

Table 4. Temperature specifications When the system is in continuous operation (for altitude less than 950 m or 3117 ft), the temperature specification ranges 10°C–35°C (50–95°F) with no direct sunlight on the equipment. When the system is not in operation, the temperature specification is -40°C to 65°C (-40°F to149°F). For more information about fresh air, see the Expanded operating temperature section. The maximum temperature gradient for both operation and Non-operational systems is 20°C/h (36°F/h). Information about fresh air specification is described in the Expanded operating temperature section.

Temperature	Specifications
Storage	-40–65°C (-40–149°F)
Continuous operation (for altitude less than 900 m or 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Expanded operating temperature	For information about Expanded operating temperature, see the Expanded operating temprature section.
Maximum temperature gradient (operating and storage)	20°C/h (68°F/h)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a Non-operational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).

Maximum vibration	Specifications
Operating	0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage	1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is 24 consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms (4 pulse on each side of the system). The maximum shock specification of a Non-operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.(4 pulse on each side of the system)
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Table 7. Maximum altitude specificationsThe maximum altitude specification for an operational system is 3048 m (10,000 ft). The maximum altitude specification for a Non-operational system is 12,000 m (39,370 ft).

Maximum altitude	Specifications
Operating	3048 m (10,000 ft)
Storage	12,000 m (39,370 ft)

Table 8. Operating temperature derating specificationsIf the operating temperature of a system is up to 35°C (95°F), the maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft). If the operating temperature of a system is 35°C–40°C (95°F–104°F), the maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft). If the operating temperature of a system is 40°C–45°C (104°F–113°F), the maximum temperature is reduced by 1°C/125 m (1°F/228 feet) above 950 m (3,117 feet).

Operating temperature derating	Specifications
Up to 35°C (95°F)	Maximum temperature is reduced by 1°C/300 m (1°F/547 ft), above 900 m (2,953 ft).
35–40°C (95–104°F)	Maximum temperature is reduced by 1°C/175 m (1°F/319 ft), above 900 m (2,953 ft).
40–45°C (104–113°F)	Maximum temperature is reduced by 1°C/125 m (1°F/228 ft), above 900 m (2,953 ft).

Thermal Restriction for ASHRAE A4 Environment

• CPU TDP greater than 150 W are not supported within A4.
• Capacity greater than 128 GB of LRDIMMs are not supported within A4.
• Processor with TDP=150 W and 18 cores is not supported within A4.
• Processor with TDP=130 W and 8 cores is not supported within A4.
• PCIe card with TDP greater than 25 W is not supported.
• Intel N3000 FPGA card is not supported above 35°C ambient temperature.
• NVIDIA V100 is not supported above 40°C ambient temperature.
• Single PSU failure is not supported. Two PSUs are required in redundant mode.

Thermal Restriction for ASHRAE A3 Environment

• CPU TDP greater than 150 W are not supported within A3.
• Greater than 128 GB capacity LRDIMMs are not supported within A3.
• Processor with TDP=150 W and 24 cores is not supported within A3.
• Processor with TDP=150 W and 8 cores is not supported within A3.
• PCIe card with TDP greater than 25 W is not supported.
• Intel N3000 FPGA card is not supported above 35°C ambient temperature.
• Single PSU failure is not supported. Two PSUs are required in redundant mode.

Thermal Restriction for ASHRAE A2 Environment

• CPU TDP greater than 150 W are not supported within A2.
• Greater than 128 GB capacity LRDIMMs are not supported within A2.
• Processor with TDP=150 W and 8 cores is supported to ASHRAE A2 when turbo boost is disabled.
• Processor with TDP=150 W and 8 cores, with turbo boost will have over temperature event at 35°C ambient temperature. This is because the CPU's power consumption is instantly raised up to 160 W to 170 W.
• PCIe card with TDP greater than 25 W is not supported.
• Single PSU failure is not supported. Two PSUs are required in redundant mode.

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.

Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration. NOTE: Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHARE Standard 127.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments. NOTE: Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles.
Corrosive dust	Air must be free of corrosive dust. Any remaining dust present in the air shall have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.

Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

Table 1. Thermal restriction matrix for processor and fansThis table describes the thermal restriction for processor and fans for XE2420

Features, processor type and specifications	Configuration type, and ambient temperature support
Storage configuration	2 x 2.5-inch drives	4 x 2.5-inch drives	6 x SSDs (EDSFF E1.L)
	Fan type: Very High Performance fan (VHP fan)
TDP (W)	Ambient = 35°C	Ambient = 35°C
150	Yes (VHP fan)	Yes (VHP fan)

Table 2. Thermal restriction matrix for GPGPU This table describes the thermal restriction for GPGPU for XE2420

Riser configurations	Configuration type and ambient temperature support
	2 x 2.5-inch drives	4 x 2.5-inch drives	6 x SSDs (EDSFF E1.L)
	Fan type: Very High Performance fan (VHP fan)
	Ambient = 30°C
1A (Slot 1 Riser)	VHP fan	VHP fan
2C (Slot 1 Riser_PERC)	VHP fan	VHP fan
3A (Slot 1 Riser)	VHP fan	VHP fan
All (Slot 4 Riser)	VHP fan	VHP fan

Table 3. Thermal limitations of supported processorsThis table describes the thermal limitations of supported processors for XE2420

CPU TDP	HSK type	Fan type	Config 1A			Config 2C			Config 3A
			ASHARE A4	ASHARE A3	ASHARE A2	ASHARE A4	ASHARE A3	ASHARE A2	ASHARE A4	ASHARE A3	ASHARE A2
6525 N, 24 Core, 150 W	High performance	Very high performance	Not supported		Max 35°C	Not supported		Max 35°C	Not supported		Max 35°C
6244, 8 Core, 150 W
6240 Y, 18 Core, 150 W			Not supported	Max 40°C		Not supported	Max 40°C		Not supported	Max 40°C
6252, 24 Core, 150 W			Max 45°C			Max 45°C			Max 45°C
6238, 22 Core, 140 W
6262 V, 8 Core, 135 W
6234, 8 Core, 130 W			Not supported			Not supported			Not supported
125 W			Max 45°C			Max 45°C			Max 45°C
110 W
100 W
85 W

Table 4. Thermal limitations of PCI-E cardsThis table describes the thermal limitations of PCI-E cards for XE2420

PCI-E card type	Config 1A			Config 2C			Config 3A
	ASHARE A4	ASHARE A3	ASHARE A2	ASHARE A4	ASHARE A3	ASHARE A2	ASHARE A4	ASHARE A3	ASHARE A2
nVIDIA V100 GPU	Not supported	Max 40°C	Max 35°C	Not supported	Max 40°C	Max 35°C	Not supported	Max 40°C	Max 35°C
nVIDIA T4 GPU	Max 45°C			Max 45°C			Max 45°C
nVIDIA RTX6000 passive GPU
Intel N3000 FPGA	Not supported		Max 35°C	Not supported		Max 35°C	Not supported		Max 35°C
U200 FPGA	Max 45°C	Max 40°C		Max 45°C	Max 40°C		Max 45°C	Max 40°C