Сегодня покупают
← Вернуться назад
Нужна помощь с конфигурацией?
Пришлите SKU, спецификацию или список требований. Специалист Apltech проверит совместимость компонентов и найдёт актуальные артикулы
Получить консультацию →

Dell Wyse 5470 All-in-One Thin Client: технические характеристики и спецификации

Physical specifications

Table 1. Physical specificationsThis section describes the physical dimensions of the thin client
DescriptionValues
Height38.53 cm (15.16 inches)
Width57.62 cm (22.68 inches)
Depth5.4 cm (2.12 inches)
Starting weight5.7 kg (12.56 lb) with Easel stand

Processor

Table 1. Processor specificationsThe following table provides information about the supported processors:
FeatureCeleron Quad CoreCeleron Dual Core
Processor nameIntel Celeron J4105Intel Celeron J4005
Cache 4 MB4 MB
Number of cores42
Package25 mm X 24 mm FCBGA 1090 25 mm X 24 mm FCBGA 1090
Processor burst frequency 2.50 GHz 2.70 GHz
Processor base core frequency 1.50 GHz 2.00 GHz
Graphics base frequency 250 MHz 250 MHz
Graphics Executive Unit (EU) 12 12
Graphics maximum dynamic frequency 750 MHz 700 MHz
Supported memory technology DDR4/LPDDR4 up to 2400 MT/s DDR4/LPDDR4 up to 2400 MT/s
Maximum memory size8 GB8 GB
Supported DIMMS per channel2 2
TjMax105 °C 105 °C
Thermal Design Power (TDP) 10 W 10 W

Chipset

Table 1. Chipset specificationsTable shows the chipset specification:
DescriptionValues
TypeIntegrated with the processor (Intel Gemini Lake)
Non-volatile memory on chipsetYes
BIOS configuration Serial Peripheral Interface (SPI) 16 MB onboard SPI flash
Trusted Platform Module (TPM) 2.0 Security Device (Discrete TPM Enabled)24 KB on TPM 2.0 on chipset

Firmware—TPM (Discrete TPM disabled) 

By default, the Platform Trust Technology (PTT) feature is visible to the operating system.

Operating system

  • Wyse ThinOS
  • Wyse ThinOS PCoIP
  • Windows 10 IoT Enterprise

Memory

Table 1. Memory specificationsMemory specifications
DescriptionValues
Minimum memory configuration4 GB (1 x 4 GB module)
Maximum memory configuration8 GB
Number of slots 2 SODIMM
Maximum memory supported per slot8 GB
Memory option

4 GB - 1 x 4 GB

8 GB - 1 x 8 GB

8 GB - 2 x 4 GB

Type

DDR4

Speed

2400 MHz

External ports and connectors

Table 1. Ports and connectorsTable shows the ports and connectors for Wyse 5470 All-In-One thin client
DescriptionValues
NetworkOne RJ45, 10/100/1000
USB
  • One USB 3.1 Gen 1 (side panel)
  • Two USB 3.1 Gen 1 (back panel)
  • One USB 3.1 Gen 1 with PowerShare (back panel)
  • One USB 2.0 (back panel)
  • One USB 2.0 with Smart Power On (back panel)
Audio
  • Line-out jack
  • Global Headset Audio jack
VideoDisplayPort 1.2a
Power adapter portOne
SecurityKensington lock slot

Wireless module

Table 1. Wireless module specificationsTable shows the wireless module specification for Wyse 5470 AlI-in-One thin client
DescriptionValues
Model numberIntel Dual Band Wireless AC 9560 (802.11ac) 2x2 + Bluetooth 5.0
Transfer rate1.73 Gbps
Frequency bands supported2.4/ 5 GHz (160 MHz)
Wireless standardsWiFi 802.11b/g/a/n/ac
Encryption64/128-bit encryption
BluetoothBluetooth 5.0

Audio

Table 1. Audio Audio Specifications
DescriptionValues
High Definition Stereo supportYes
ControllerRealtek ALC3253/ALC1302
External interfaceGlobal headset and line out jack
Number of channels2
Audio Jack Impedance
MicrophoneDigital dual microphone
Internal Speaker Power Rating 3 W

Storage

Your computer supports one of the following configurations:
  • M.2 2230 solid-state drive
  • M.2 2280 solid-state drive
  • eMMC Storage (soldered on the system board)
Table 1. Storage specificationsThis table contains the storage specifications.
TypeForm factorInterfaceCapacityOperating system
M.2 2230 128GB PCIe NVMe Solid-State DriveM.2 SSD 2230/2280PCIe Gen 2x2 NVMe, up to 8 Gbps128 GBWindows 10 IoT Enterprise
M.2 2230 32 GB SATA Solid-State DriveM.2 SSD 2230/2280SATA AHCI, up to 6 Gbps32 GBWindows 10 IoT Enterprise
eMMC Storage Soldered on the system board eMMC v5.1, up to HS400 mode16 GBThinOS and ThinOS with PCoIP
eMMC Storage Soldered on the system board eMMC v5.1, up to HS400 mode32 GBWindows 10 IoT Enterprise

NOTE: : If shipped with the system, the M.2 SSD is the default primary drive.

Web camera

Table 1. Web camera Web camera
DescriptionValues
Number of camerasOne
Maximum Resolution1 MP
Camera type

HD without IR support

Video Resolution

1280 x 720 P @ 30 fps (maximum), 720 P @ 30 fps

Power

Table 1. PowerPower
Description Values
Power Supply Wattage 90 W
AC input Voltage Range 100 Vac–240 Vac
AC input current (low AC range/high AC range) 1.70 A / 2.50 A
AC input Frequency 50 Hz–60 Hz
Output current 4.62 A
Rated output voltage 19.50 VDC
Temperature range: Operating 0 °C–40 °C (32 °F–104 °F)
Temperature range: Storage –40 °C–70 °C (–40 °F–158 °F)

Display

Table 1. Display specificationsDisplay specifications
DescriptionValues
Type

Full HD (FHD) Non-Touch

Screen size (diagonal)

23.8 in.

Screen technologyIPS
Native resolution

1920 x 1080

High definition

Full HD

Luminance

250 cd/m2

Height

385.33 mm

Width

576.62 mm

Megapixels

2M

Pixels per inch (PPI)

82

Color depth

16.7 M

Contrast ratio (min)

700:1

Contrast ratio (typical)

1000:1

Response time (max)

25 mil sec

Typical Response time

14 mil sec

Refresh rate

60 Hz

View angle

178°

89°

Intel UHD 600 graphics

Table 1. Intel UHD 600 graphicsGraphics specifications
Intel UHD 600 graphics
Bus Type Integrated with Intel CPU
Shaders/TMUs/ROPs 96/12/3
Frame Buffer Memory SizeShares system memory for graphics data. Up to 1.7 GB with 4-GB system memory.
Multiple display supports - Using DP 1.2a One DisplayPort, 1.2a
Internal Panel display resolution 1920 x 1080 @ 60 Hz
Operating system graphics/API support
  • DX 12
  • OpenCL 2.1
  • OpenGL 4.6
  • Shader 6.4
External Display resolution 4096 x 2160 @ 60 Hz
Video outputsNo direct output ports. UHD 600 can optionally drive all ports on the system from the Intel chipset.
GPU clock frequency 200 Mhz with boost to 750 Mhz
Performance
  • Compute - 288 GFlops
  • 3DMark11 Performance - 710
  • Pixel rate - 1.5 GPixels/sec

System level environment and operating conditions

Airborne contaminant level: G1 as defined by ISA-S71.04-1985

Table 1. Computer environmentThe following table provides your computer environment information:

Operating

Storage

Temperature range0 °C to 35 °C (32 °F to 95 °F)–40 °C to 65 °C (–40 °F to 149 °F)
Relative humidity (maximum)10% to 90% (non-condensing)0% to 95% (non-condensing)
Vibration (maximum)0.66 GRMS1.30 GRMS
Shock (maximum)110 G 160 G
Altitude (maximum)-15.2 m to 3048 m (-50 ft to 10,000 ft)-15.2 m to 10,668 m (-50 ft to 35,000 ft)

* Measured using a random vibration spectrum that simulates user environment.

† Measured using a 2-ms half-sine pulse when the hard drive is in use.

‡ Measured using a 2-ms half-sine pulse when the hard drive head is in parked position.