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Dell PowerEdge T560: руководство по обслуживанию
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Dell PowerEdge T560: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows the chassis dimensions.
Table 1. Chassis dimension for the systemThis table provides the dimensions of the system:
Drives Xa Xb Ya Yb Yc Za (with bezel) Zb Zc
12 x 3.5-inch SAS/SATA HDD 200.0 mm (7.87 inches) 293.0 mm (11.53 inches) 446.0 mm (17.55 inches)464.0 mm (18.26 inches)508.8 mm (20.03 inches) 17.6 mm (0.69 inches) 660.6 mm (26.00 inches)695.5 mm (27.38 inches)

System weight

Table 1. PowerEdge T560 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
12 x 3.5-inch (SAS/SATA) 48 kg (107.32 pound)
8 x 3.5-inch (SAS/SATA) 43.16 kg (95.15 pound)
8 x 3.5-inch (SAS/SATA) + 8 x 2.5-inch NVMe 46.84 kg (103.26 pound)
8 x 2.5-inch (SAS/SATA) 39.40 kg (86.86 pound)
16 x 2.5-inch (SAS/SATA) 42.02 kg (92.63 pound)
24 x 2.5-inch (SAS/SATA) 44.64 kg (98.41 pound)

Processor specifications

Table 1. PowerEdge T560 processor specifications This table provides processor specifications for the system.
Supported processors Number of processors supported
4th or 5th Generation Intel ® Xeon Scalable processors Up to two

PSU specifications

The PowerEdgeT560system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) AC Voltage DC Voltage Current (A)
100–120 V 200–240 V 277 V 240 V 336 V -48—(-60) V
600 W mixed mode Platinum 2250 50/60 600 W 600 W N/A N/A N/A N/A 7.1 - 3.6
N/A N/A N/A N/A N/A 600 W N/A N/A 2.9
700 W mixed mode HLAC Titanium 2625 50/60 N/A 700 W N/A N/A N/A N/A 4.1
N/A N/A N/A N/A N/A 700 W N/A N/A 3.4
800 W mixed mode Platinum 3000 50/60 800 W 800 W N/A N/A N/A N/A 9.2 - 4.7
N/A N/A N/A N/A N/A 800 W N/A N/A 3.8
1100 W -48 V DC N/A 4265 N/A N/A N/A N/A N/A N/A 1100 W 27.0
1100 W mixed mode Titanium 4125 50/60 1050 W 1100 W N/A N/A N/A N/A 12 - 6.3
N/A N/A N/A N/A N/A 1100 W N/A N/A 5.2
1400 W mixed mode Platinum 5250 50/60 1050 W 1400 W N/A N/A N/A N/A 12 - 8
N/A N/A N/A N/A N/A 1400 W N/A N/A 6.6
Titanium 50/60 1050 W 1400 W N/A N/A N/A N/A 12 - 8
N/A N/A N/A N/A N/A 1400 W N/A N/A 6.5
1400 W 277 Vac and HVDC Titanium 5250 50/60 N/A N/A 1400 W N/A N/A N/A 5.8
5250 N/A N/A N/A N/A N/A 1400 W N/A 5.17
1800 W mixed mode HLAC Titanium 6610 50/60 N/A 1800 W N/A N/A N/A N/A 10.0
N/A N/A N/A N/A N/A 1800 W N/A N/A 8.2
2400 W mixed mode Platinum 9000 50/60 1400 W 2400 W N/A N/A N/A N/A 16 - 13.5
N/A N/A N/A N/A N/A 2400 W N/A N/A 11.2
2800 W mixed mode HLAC Titanium 10500 50/60 N/A 2800 W N/A N/A N/A N/A 15.6
N/A N/A N/A N/A 2800 W N/A N/A 13.6
NOTE:If a system with AC 1400W/1100W PSUs operates at low line 100-120 V AC, then the power rating per PSU is derated to 1050 W.
NOTE:If a system with AC 2400 W PSUs operates at low line 100-120 V AC, then the power rating per PSU is derated to 1400 W.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.
NOTE:The input voltage for the 1400 W mixed mode PSU is 277 V AC (249 V AC - 305 V AC) and 336 V DC (260 V DC - 400 V DC).
Figure 1. PSU power cord connectors
This image shows list of PSU power cord connectorsthis image shows the LOTES APOW0097 connectorThis image shows the anderson power connector
Figure 2. Types of PSU power cords
Table 2. PSU power cablesThe table lists the PSU power cables list.
Form factor Output Power cord
Redundant 60 mm 600 W mixed mode C13
700 W mixed mode HLAC
800 W mixed mode
1100 W mixed mode
1400 W mixed mode
1100 W -48 V DC LOTES APOW0097
1400W 277Vac and HVDC APP 2006G1
1800 W mixed mode HLAC C15
Redundant 86 mm 2400 W mixed mode C19
2800 W mixed mode HLAC C21
NOTE:C13 power cable combined with C14 to C15 jumper power cable can be used to adapt 1800 W PSU.

Cooling fan specifications

The DellPowerEdgeT560 system supports up to eight standard (STD) or High Performance (HPR) cooling fans that are connected to the system board directly.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
Standard fanSTD STD - Standard N/A Standard fan
High Performance (HPR) fanHPR HPR - High Performance N/A High Performance (HPR) fan

Supported operating systems

The PowerEdge T560 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi

For more information, go to OS support.

System battery specifications

The PowerEdge T560 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge T560 system supports up to four PCIe x16 slots (3 Gen4 with x16 lanes, 1 Gen4 x16 slot with x8 lanes) on the system board. Additionally, the system supports two Gen5 x16 GPU riser slots.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Expansion card riser Processor connection Height Length Slot width
Slot 1 GPU riser Processor 2 Full Height Full Length x16
Slot 2 GPU riser Processor 1 Full Height Full Length x16
Slot 3 NA Processor 2 Full Height Half Length x16
Slot 4 NA Processor 2 Full Height Half Length x16
Slot 5 NA Processor 1 Full Height Half Length x16 (with x8 lanes)
Slot 6 NA Processor 1 Full Height Half Length x16

Memory specifications

The PowerEdge T560 system supports the following memory specifications for optimized operation.
Table 1. Memory specifications for 4 th Generation Intel ® Xeon Scalable processorsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
DDR5 RDIMM Single rank 16 GB 16 GB 128 GB 32 GB 256 GB
Dual rank 32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Rated DIMM Speed
16, 288-pin 4000 MT/s, 4400 MT/s, 4800 MT/s
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The processor may reduce the performance of the rated DIMM speed.
Table 3. Memory specifications for 5 th Generation Intel ® Xeon Scalable processorsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
DDR5 RDIMM Single rank 16 GB 16 GB 128 GB 32 GB 256 GB
Dual rank 32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
96 GB 96 GB 768 TB 192 GB 1.5 TB
Table 4. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Rated DIMM Speed
16, 288-pin 4000 MT/s, 4400 MT/s, 4800 MT/s, 5200 MT/s, 5600 MT/s
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The processor may reduce the performance of the rated DIMM speed.

Storage controller specifications

The PowerEdge T560 system supports the following controller cards:
Table 1. Storage controller cards
NOTE: The size of the RAID 1 drives must be less than the second RAID container.
This table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal controllers
  • HBA465i fPERC
  • HBA355i fPERC
  • H355 fPERC
  • H755 fPERC
  • H755N fPERC
  • H965i fPERC
External controllers
  • HBA355e
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 0/1 (2x M.2 NVMe SSDs)
Software RAID
  • S160
SAS Hot Bus Adapters (HBA)
  • 22.5 Gbps SAS Ext. HBA

Drives

The PowerEdge T560 system supports:
  • Up to 12 x 3.5-inch SAS/SATA HDD drives
  • Up to 8 x 3.5-inch SAS/SATA HDD drives
  • Up to 8 x 3.5-inch SAS/ SATA HDD + 8 x 2.5-inch NVMe SSD drives
  • Up to 8 x 2.5-inch SAS/SATA HDD drives
  • Up to 16 x 2.5-inch SAS/SATA HDD drives
  • Up to 24 x 2.5-inch SAS/SATA HDD drives
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

GPU specifications

The PowerEdge T560 system supports one of the following GPU configurations:

  • Up to two 300 W double-width GPUs on PCIe slot 1.
  • Up to six 75 W single-width GPUs on PCIe slot 2.
NOTE:Systems that are configured with GPUs have higher fan acoustics.

NIC port specifications

The PowerEdge T560 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM on Planar 2 x 1 GbE
OCP card 1 x OCP x8 3.0

Serial connector specifications

The PowerEdge T560 system supports one serial port on the system board, which is Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

Ports specifications

Table 1. PowerEdge T560 port specificationsThe following table shows the port specifications for the system:
Front Rear Internal (Optional)
Port type No. of ports Port type No. of ports Port type No. of ports
1 x USB 2.0-compliant port One 1 x Dedicated iDRAC (RJ45) port One Internal USB 3.0-compliant port One
1 x USB 3.0-compliant port One 1 x USB 2.0-compliant port One
1 x iDRAC Direct (Micro-AB USB) port One 1 x USB 3.0-compliant port One
DB-15 VGA port One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

Video specifications

The PowerEdge T560 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Description Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Description Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Description Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Continuous Operation Specifications for Rugged Environment This table describes the operational climatic range for category A4.
Description Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–55°C (41–131°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)
Table 5. Common Environmental Specifications for ASHRAE A2, A3, A4 and Rugged This table describes the shared requirements across all categories.
Description Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 6. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 7. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
STD HSK ≤ 150 W
HPR HSK > 150 W
Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR High performance
HSK Heat sink
Table 3. Thermal restriction matrixThe table describes thermal restriction matrix:
Drive Configuration Processor Fans CPU TDP Fan redundancy CPU HSK GPU support TBU support GPU riser configuration
TDP>150 W TDP<=150 W GPU<=75 W GPU>75 W
8 x 3.5 1 STDx3 <=185 No HPR HSK STD HSK No No No Riser 0,2
1 or 2 STDx4 <=185 No No No No Riser 0,1,2
1 or 2 STDx8 <=250 Yes No No No Riser 0,1,2
1 or 2 HPRx4 <=250 No Yes/No No No Riser 0,1,2
1 or 2 *HPRx7 <=250 Yes ***Yes/No No Yes Riser 0
**No ** Yes /No **Yes Yes Riser 1,2
1 or 2 HPRx8 <=250 Yes Yes/No Yes No Riser 1,2

12x3.5 &
****8x2.5
16x2.5
24x2.5

 1 or 2 STDx4 <=185 No HPR HSK STD HSK No No No Riser 0,1,2
1 or 2 STDx8 <=250 Yes No No No Riser 0,1,2
1 or 2 HPRx4 <=250 No Yes/No No No Riser 0,1,2
1 or 2 *HPRx7 <=250 Yes ***Yes/No No Yes Riser 0
**No ** Yes /No ** Yes Yes Riser 1,2
1 or 2 HPRx8 <=250 Yes Yes/No Yes No Riser 1,2
8 x 3.5 + 8 x 2.5 (NVMe) 1 or 2 HPRx4 <=250 No HPR HSK STD HSK Yes/No No No Riser 0,1,2
1 or 2 *HPRx7 <=250 Yes *** Yes/No No Yes Riser 0
**No ** Yes /No ** Yes Yes Riser 1,2
1 or 2 HPRx8 <=250 Yes Yes/No Yes No Riser 1,2
NOTE:STD and HPR fans support DIMM capacity of less than or equal to 64 GB. Memory capacity of greater than/equal to 96 GB or less than/equal to 128 GB is supported by HPR fan only.
NOTE:*HPRx7 counts are only for with TBU configuration. System without TBU configuration does not support HPRx7 counts.
NOTE:**HPRx7 with TBU configuration:
  • Riser 1 does not support GPU >75W. GPU <75W support Nvidia A2 and does not support Nvidia L4..
  • Riser 2 GPU <75 W supports Nvidia A2 and Nvidia L4. For GPU >150 W supports Nvidia A30 (165 W) only.
  • Fan redundance is not supported with riser installed.
NOTE:***HPRx7 with TBU configuration supports fan redundancy when GPUs <75W are installed on PCIe slot 3,4,5,6.
NOTE:**** SAS4 configuration requires minimum STDx8 fans.
Table 4. Thermal matrix for all configurationsThe table describes thermal matrix for all configurations:
System Configuration Configuration 1: 8 x 2.5-inch, 16 x 2.5-inch and 24 x 2.5-inch SAS/SATA Configuration 2: 8x3.5-inch SAS/SATA Configuration 3: 8x3.5-inch + 8 x NVMe Configuration 4: 12 x 3.5-inch SAS/SATA
Fan STD STD HPR HPR STD STD HPR HPR HPR HPR STD STD HPR HPR
Fan count x4 x8 x4 x8 x3, x4 x8 x4 x8 x4 x8 x4 x8 x4 x8
CPU TDP 125 W STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK
135 W STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK
150 W STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK
165 W HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK
185 W HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK
205 W Not Supported: Requires < 25°C HPR HSK HPR HSK HPR HSK Not Supported: Requires < 25°C HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK Not Supported: Requires < 25°C HPR HSK HPR HSK HPR HSK
HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK
225 W HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK
250 W HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK
Table 5. GPU thermal restriction matrix
NOTE:Standard (STD) and High Performance (HPR) fans support DIMM capacity of less than or equal to 64 GB. Memory capacity of greater than/equal to 96 GB or less than/equal to 128 GB is supported by HPR fan only.
This table describes the GPU thermal restriction matrix.
GPU TDP Supported GPU Fan configuration Maximum supported quantity Note
300 W Nvidia A40, L40 HPRx8 2 NA
165 W Nvdia A30 HPRx8 2 NA
HPRx7 (with TBU only) 1 Only supported on Riser 2 and does not support fan redundancy.
< 75 W Nvidia A2 HPRx8 6 NA
HPRx7 (with TBU only) 6 Does not support fan redundancy when installed on Riser
HPRx4 6 Does not support fan redundancy
Nvidia L4 HPRx8 5 NA
HPRx7 (with TBU only) 4 Only supported on Riser 2 and does not support fan redundancy.
HPRx4 4 Does not support fan redundancy
NOTE:Nvidia L4 GPU is not supported on Riser 1 in HPRx7 and HPRx4 configurations due to thermal constraint and is not supported at PCIe slot 5 as Nvidia L4 is a PCIe x16 GPU card.

Thermal air restrictions

Thermal air restrictions for different configurations

Table 1. 8 x 3.5-inch drive configurationThis table shows the thermal air restrictions for the system with 8 x 3.5-inch drive configuration.
Standard Operating Support (ASHRAE A2 compliant)
NOTE:All options supported unless otherwise noted.
Extended ambient 40° C Operating Support (ASHRAE A3 compliant) Extended ambient 45° C Operating Support (ASHRAE A4 compliant)
  • 3x or 4x STD Fan config only support CPU Base TDP<=185W
  • 3x STD Fans config does Does not support BOSS module
  • HPR fan is required to support 96GB <= DDR5 DIMM <= 128GB
  • With STD Fans, the following OCP3.0 & PCIe cards only support optic cable with thermal Spec 85C and power <=1.2W
    • Mellanox CX6 Lx 25GB 2P PCIe card
    • Broadcom 25GB 4P SPF 57504 PCIe card
    • Intel 25GB 4P E810-CCV PCIe card
    • Intel 25GB 2P XXV710 PCIe card
    • Intel 25GB 4P E810-XXV OCP card
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
  • Does not support 3x or 4x STD Fans configs
  • Does not support 8x STD fans configurations with CPU Base TDP > 125W
  • HPRx8 Fans configuration is required to support BOSS M.2 Module
  • Does not support TBU
  • Does not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Does not support PCIe card consuming power >= 25W and Mellanox CX6 Lx 25GB 2P PCIe card
  • Does not support OCP transfer rate >25G or cooling tier > 10
  • Does not support GPU card
  • Optic Cable with spec 85C is required.
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
  • Does not support STD fans configs
  • Does not support 4x HPR fans config with CPU Base TDP > 150W
  • Does not support 8x HPR fans configs with CPU Base TDP > 225W
  • Does not support TBU
  • Does not support BOSS M.2 Module
  • Does not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Does not support PCIe card consuming power >= 25W and Mellanox CX6 Lx 25GB 2P PCIe card
  • Does not support OCP transfer rate >25G or cooling tier > 10
  • Does not support GPU card
  • Optic Cable with spec 85C is required.
Table 2. 8 x 2.5-inch, 16 x 2.5-inch, 24 x 2.5-inch and 12 x 3.5-inch drive configurationThis table shows the thermal air restrictions for the system with 8 x 2.5-inch, 16 x 2.5-inch, 24 x 2.5-inch and 12 x 3.5-inch drive configuration.
Standard Operating Support (ASHRAE A2 compliant) Extended ambient 40° C Operating Support (ASHRAE A3 compliant) Extended ambient 45° C Operating Support (ASHRAE A4 compliant)
  • 4x STD fans support only processor with TDP<=185W
  • Does not support 2.5" SAS4 drives with STDx4 Fans
  • With STD Fans, the following OCP3.0 & PCIe cards only support optic cable with thermal Spec 85C and power <=1.2W
    • Mellanox CX6 Lx 25GB 2P PCIe card
    • Broadcom 25GB 4P SPF 57504 PCIe card
    • Intel 25GB 4P E810-CCV PCIe card
    • Intel 25GB 2P XXV710 PCIe card
    • Intel 25GB 4P E810-XXV OCP card
    • HPR fan is required to support 96GB <= DDR5 DIMM <= 128GB
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
  • Does not support 3x or 4x STD Fans configs
  • Does not support 8x STD fans configurations with CPU Base TDP > 125W
  • HPRx8 Fans configuration is required to support BOSS M.2 Module
  • Does not support TBU
  • Does not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Does not support PCIe card consuming power >= 25W and Mellanox CX6 Lx 25GB 2P PCIe card
  • Does not support OCP transfer rate >25G or cooling tier > 10
  • Does not support GPU card
  • Optic Cable with spec 85C is required.
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
  • Does not support STD fans configs
  • Does not support 4x HPR fans config with CPU Base TDP > 150W
  • Does not support 8x HPR fans configs with CPU Base TDP > 225W
  • Does not support TBU
  • Does not support BOSS M.2 Module
  • Does not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Does not support PCIe card consuming power >= 25W and Mellanox CX6 Lx 25GB 2P PCIe card
  • Does not support OCP transfer rate >25G or cooling tier > 10
  • Does not support GPU card
  • Optic Cable with spec 85C is required.
Table 3. 8 x 3.5-inch + 8 x 2.5-inch NVMe drive configurationThis table shows the thermal air restrictions for the system with 8 x 3.5-inch + 8 x 2.5-inch NVMe drive configuration.
Standard Operating Support (ASHRAE A2 compliant) Extended ambient 40° C Operating Support (ASHRAE A3 compliant) Extended ambient 45° C Operating Support (ASHRAE A4 compliant)
HPR fans are required.
  • Two PSUs are required
  • System performance may be reduced in the event of a PSU failure
  • Does not support TBU
  • HPRx8 Fans configuration is required to support BOSS M.2 Module
  • Does not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Does not support PCIe card consuming power >= 25W and Mellanox CX6 Lx 25GB 2P PCIe card
  • Does not support OCP transfer rate >25G or cooling tier > 10
  • Does not support GPU card
  • Optic Cable with spec 85C is required
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
  • Does not support 4x HPR fans config with CPU Base TDP > 150W
  • Does not support 8x HPR fans configs with CPU Base TDP > 225W
  • Does not support TBU
  • Does not support BOSS M.2 Module
  • Does not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Does not support PCIe card consuming power >= 25W and Mellanox CX6 Lx 25GB 2P PCIe card
  • Does not support OCP transfer rate >25G or cooling tier > 10
  • Does not support GPU card
  • Optic Cable with spec 85C is required.