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Dell PowerEdge T330: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions of Dell PowerEdge T330 system
This shows Details the dimensions of Dell powerEdge T330 system
Table 1. Dimensions of Dell PowerEdge T330 systemThe dimensions of 8 x 2.5 inch hard drive systems are as follows: X (with feet open)=304.5 mm, X (with castor)=307.9 mm, Xa=218 mm, Y=471.3mm, Ya=430.3 mm, Yb=443.3 mm, Z=594.82 mm, Za =578.42 mm, Zb=542.2 mm.
SystemX (with feet open) X (with castor)XaYYaYbZZa Zb

PowerEdge T330

304.5 mm (11.99 inches) 307.9 mm ( 12.12 inches)218 mm (8.58 inches)471.3 mm (18.55 inches)430.3 mm (16.94 inches)443.3 mm (17.45 inches)594.82 mm (23.42 inches)578.42 mm (22.77 inches)542.2 mm (21.34 inches)

Chassis weight

Table 1. Chassis weightThe maximum chassis weight is 36 kg.
System Maximum weight
PowerEdge T330

36 Kg (79.36 lb)

Processor specifications

Processor
Specification
Type
The PowerEdge T330 supports any one of the processors listed here:
  • Intel E3-1200 v5 or v6 series
  • Intel Core i3 6100 series
  • Intel Celeron G3900 series
  • Intel Celeron G3930
  • Intel Pentium G4500 series
  • Intel Pentium G4600 series

Expansion bus specifications

PCI Express expansion slots
Specification
Slot 1
One full-height, half-length x8 PCIe Gen3 card slot connected to processor
Slot 2
One full-height, half-length x16 PCIe Gen3 card slot connected to processor
Slot 3
One full-height, half-length x1 PCIe Gen3 card slot connected to Platform Controller Hub (PCH)
Slot 4
One full-height, half-length x8 PCIe Gen3 card slot connected to PCH

Memory specifications

Memory
Specification
Architecture
1600 MT/s, 1866 MT/s, 2133 MT/s, or 2400 MT/s DDR4 Unbuffered DIMMs
Support for advanced ECC or memory optimized operation
Memory module sockets
Four 288-pin sockets
Memory module capacities (UDIMM)
4 GB (single-rank), 8 GB (single- and dual-rank), 16 GB (single- and dual-rank)
Minimum RAM
4 GB
Maximum RAM
64 GB

Power specifications

Power supply unit
Specification
Power rating per hot swappable power supply unit (PSU)
495 W (Platinum) AC (100–240 V, 50/60 Hz, 6.5 A–3 A)
Power rating per cabled PSU
350 W (Bronze) AC (100–240 V, 50/60 Hz, 5.5 A–3 A)
Heat dissipation
NOTE: Heat dissipation is calculated by using the power supply unit wattage rating.
1357 BTU/hr maximum (350 W PSU)
1908 BTU/hr maximum (495 W PSU)
Voltage
NOTE: This system is also designed to be connected to IT power systems with a phase-to-phase voltage not exceeding 230 V.
100–240 V AC, autoranging, 50/60 Hz

Storage controller specifications

Storage controller
Specification
Storage controller type
PERC H730, PERC H330, PERC H830, PERC S130.
NOTE: Your system supports software RAID S130 and a PERC card.

For more information on software RAID, see the Dell PowerEdge RAID Controller (PERC) documentation at Dell.com/storagecontrollermanuals.

NOTE: The upgrade from embedded controller or Software RAID controller to Hardware RAID controller is not supported.

Hard drives

The PowerEdge T330 system supports SAS, SATA, Nearline SAS hard drives and Solid State Drives (SSDs).

Drives
Specification
Eight hard drive systems
Up to eight 3.5-inch hot swappable SATA, or nearline SAS hard drives
NOTE: 2.5-inch hard drives in 3.5-inch carriers are supported for SAS, and SATA SSD hard drives
Four hard drive systems
Up to four 3.5-inch hot swappable SATA, or nearline SAS hard drives
NOTE: 2.5-inch hard drives in 3.5-inch carriers are supported for SAS, and SATA SSD hard drives

Optical drive

The PowerEdge T330 system supports one optional SATA DVD-ROM drive or DVD+/-RW drive.

Tape drives

The PowerEdge T330 system supports up to two optional 5.25-inch tape drives

USB ports

The PowerEdge T330 system supports USB 2.0 and USB 3.0-compliant ports. The following table provides more information about the USB specifications:
Table 1. USB specificationsThe PowerEdge T330 system supports One USB 2.0-compliant port One USB 3.0-compliant port on the front panel. Your system supports Two USB 3.0-compliant port Four USB 2.0-compliant port on the back panel and One USB 3.0-compliant internal port.
System Front panel Back panel Internal
PowerEdge T330

One USB 2.0-compliant port
One USB 3.0-compliant port

Two USB 3.0-compliant port
Four USB 2.0-compliant port

One USB 3.0-compliant port

NIC ports

The PowerEdge T330 system supports two 10/100/1000 Mbps Network Interface Controller (NIC) ports on the back panel.

iDRAC8

The PowerEdge T330 system supports one optional dedicated 1 GbE Ethernet on the iDRAC Enterprise port card.

Serial connector

The serial connector connects a serial device to the system. The PowerEdge T330 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge T330 system supports two 15-pin VGA ports one each on the front and back panels.

SD vFlash

The PowerEdge T330 system supports one optional SD vFlash memory card on the iDRAC Enterprise port card.
NOTE: The card slot is available for use only if the iDRAC8 Enterprise license is installed on your system.

Internal Dual SD Module

The PowerEdge T330 system supports two optional flash memory card slots with an internal dual SD module.
NOTE: One card slot is dedicated for redundancy.

Video specifications

The PowerEdge T330 system supports Integrated Matrox G200 with iDRAC8 and 16 MB application memory.

Table 1. Supported video resolution optionsFor 640 x 480 resolution, the refresh rate is 60 to 70 Hz and the color depth is 8, 16, 24 bit. For 800 x 600 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 24 bit. For 1024 x 768 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 24 bit. For 1152 x 864 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 24 bit. For 1280 x 1024 resolution, the refresh rate is 60, 75 Hz and color depth is 8, 16, 24 bit.
Resolution Refresh Rate (Hz) Color Depth (bit)

640 x 480

60, 70

8, 16, 24

800 x 600

60, 75, 85

8, 16, 24

1024 x 768

60, 75, 85

8, 16, 24

1152 x 864

60, 75, 85

8, 16, 24

1280 x 1024

60, 75

8, 16, 24

Expanded operating temperature

NOTE: When operating in the expanded temperature range, system performance may be impacted.
NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD and in the System Event Log.
Expanded operating temperature
Specifications
Continuous operation
5°C to 40°C (40°F to 104°F) at 5% to 85% RH with 29°C (84.2°F)dew point.
NOTE: Outside the standard operating temperature (10°C to 35°C(50°F to 95°F)), the system can operate continuously down to 5°C (40°F) or as high as 40°C (104°F).

For temperatures between 35°C( 95°F) and 40°C(104°F), de-rate maximum allowable temperature by 1°C per 175 m (33.8°F per 574.14 ft) above 950 m (3116.8 ft).

≤ 1% of annual operating hours
–5°C to 45°C (23°F to 113°F) at 5% to 90% RH with 29°C (84.2°F) dew point.
NOTE: Outside the standard operating temperature (10°C to 35°C(50°F to 95°F)),, the system can operate down to –5°C (23°F)or up to 45°C (113°F) for a maximum of 1% of its annual operating hours.

For temperatures between 40°C (104°F) and 45°C (113°F), de-rate maximum allowable temperature by 1°C per 125 m (33.8°F per 410.105ft) above 950 m (3116.8 ft).

Expanded Operating Temperature Restrictions
  • The operating temperature specified is for a maximum altitude of 3048 m (10,000 ft).
  • Non-redundant power supply units are not supported.
  • Cabled power supply units are not supported.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • Internal Tape backup drive (TBU) is not supported.
  • Do not perform a cold startup below 5°C (40°F).
  • Enable processor performance degrade.

Environmental specifications

NOTE: For additional information about environmental measurements for specific system configurations, see Dell.com/environmental_datasheets.
Temperature
Specifications
Storage
–40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft)
10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Fresh air
For information on fresh air, see Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage)
20°C/h (68°F/h)
Relative humidity
Specifications
Storage
5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating
10% to 80% Relative Humidity with 29°C (84.2°F) maximum dew point.
Maximum vibration
Specifications
Operating
0.26 Grms at 5 Hz to 350 Hz (operation orientation).
Storage
1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum shock
Specifications
Operating
Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 40 G for up to 2.3 ms.
Storage
Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum altitude
Specifications
Operating

30482000 m (10,0006560 ft).

Storage
12,000 m (39,370 ft).
Operating temperature de-rating
Specifications
Up to 35 °C (95 °F)
Maximum temperature is reduced by 1°C/300 m (33.8°F/984.25 ft) above 950 m (3,117 ft)
35 °C to 40 °C (95 °F to 104 °F)
Maximum temperature is reduced by 1°C/175 m (1°F/574.14 ft) above 950 m (3,117 ft).
40 °C to 45 °C (104 °F to 113 °F)
Maximum temperature is reduced by 1°C/125 m (1°F/410.1 ft) above 950 m (3,117 ft).

The following section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution are beyond the specified limits and cause equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Particulate contamination
Specifications
Air filtration
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE: Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust
Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE: Applies to data center and non-data center environments.
Gaseous contamination
Specifications
Copper coupon corrosion rate
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate
<200 Å/month as defined by AHSRAE TC9.9.
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.