Technical Specifications
| Processor | ||
|---|---|---|
| Processor type |
|
|
| Expansion Bus | Description |
|---|---|
| Bus type | PCI Express Generation 3 and 2 |
| Expansion slots | |
| Slot 1 | (Slot 1) One full-height, half-length x4 PCIe Gen2 card slot connected to Platform Controller Hub (PCH) |
| Slot 2 | (Slot 2) One full-height, full-length x1 PCIe Gen2 card slot connected to PCH |
| Slot 3 | (Slot 3) One full-height, full-length x16 PCIe Gen3 card slot connected to processor |
| Slot 4 | (Slot 4) One full-height, full-length x4 PCIe Gen3 card slot connected to processor |
| Slot 5 | (Slot 5) Not applicable |
| Slot 6 | (Slot 6) One full-height, half-length x4 PCIe Gen3 card slot connected to processor |
| Memory | Description |
|---|---|
| Architecture | 800 MT/s, 1066 MT/s, 1333 MT/s, or 1600 MT/s DDR3 registered or unbuffered Error Correcting Code (ECC) DIMMs |
| Support for advanced ECC or memory optimized operation | |
| Memory module sockets | Six 240-pin |
| Memory module capacities | |
| RDIMMs | 2 GB (single-rank), 4 GB (single- and dual-rank), 8 GB (single- and dual-rank), 16 GB (dual-rank), and 32 GB (quad-rank) |
| UDIMMs | 2 GB (single-rank) and 4 GB (single- and dual-rank) |
| Minimum RAM | 2 GB |
| Maximum RAM | |
| RDIMMs | 192 GB |
| UDIMMs | 24 GB |
| Drives | Description |
|---|---|
| Four hard-drive systems | Up to four 3.5 inch, internal, cabled SATA, nearline SAS, or SAS hard drives. |
| Eight hard-drive systems | Up to eight 3.5 inch, internal,
hot-swappable SATA, nearline SAS, SAS hard drives. NOTE:2.5 inch drives
in 3.5 inch carriers are supported for SAS, SATA SSD or SAS SSD
drives. |
| Sixteen hard-drive systems | Up to sixteen 2.5 inch, internal, hot-swappable SATA, nearline SAS, SAS , SAS SSD, or SATA SSD drives. |
| Optical drive | Up to two optional SATA DVD-ROM drive or
DVD+/-RW drive. NOTE:If your system is installed with a double-width GPU card, the
system supports only one 5.25 inch removable media storage
device. |
| Tape drive | One optional 5.25 inch tape drive. NOTE:If your system is
installed with a double-width GPU card, the system supports only
one 5.25 inch removable media storage device. |
| Connectors | Description |
|---|---|
| Back | |
| NIC | Two 10/100/1000 Mbps |
| Serial | 9-pin, DTE, 16550-compatible |
| USB | Six 4-pin USB 2.0-compliant |
| Video | 15-pin VGA |
| iDRAC 7 | One iDRAC 7 port |
| SD vFlash | One SD vFlash card slot |
| Front | |
| USB | Two 4-pin USB Host |
| Video | 15-pin VGA, for systems in rack mode only |
| Internal | |
| USB | One 4-pin, USB 2.0-compliant |
| Internal Dual SD Module | Two optional flash memory card slots with
the internal SD module NOTE:One card slot is
dedicated for redundancy. |
| Video | Description | |
|---|---|---|
| Video type | Integrated Matrox G200 | |
| Video memory | 16 MB shared | |
| Expanded Operating Temperature | Description |
|---|---|
|
NOTE:When operating
in the expanded temperature range, system performance may be
impacted.
NOTE:When operating
in the expanded temperature range, ambient temperature warnings
may be reported on the LCD and in the System Event Log.
|
|
| < 10% of annual operating hours | 5 °C to 40 °C at 5% to 85% RH with 26 °C
dew point. NOTE:Outside the standard operating temperature (10 °C to 35 °C),
the system can operate down to 5 °C or up to 40 °C for a maximum
of 10% of its annual operating hours. For temperatures between 35 °C and 40 °C, de-rate maximum allowable dry bulb temperature by 1 °C per 175 m above 950 m (1 °F per 319 ft). |
| < 1% of annual operating hours | –5 °C to 45 °C at 5% to 90% RH with 26 °C
dew point. NOTE:Outside the standard operating temperature (10 °C to 35 °C),
the system can operate down to –5 °C or up to 45 °C for a
maximum of 1% of its annual operating hours. For temperatures between 40 °C and 45 °C, de-rate maximum allowable dry bulb temperature by 1 °C per 125 m above 950 m (1 °F per 228 ft). |
| Expanded Operating Temperature Restrictions |
|
| Environmental | Description |
|---|---|
|
NOTE:For additional
information about environmental measurements for specific system
configurations, see dell.com/environmental_datasheets.
|
|
| Temperature | |
| Maximum Temperature Gradient (Operating and Storage) | 20 °C/h (36 °F/h) |
| Storage Temperature Limits | –40 °C to 65 °C (–40 °F to 149 °F) |
| Relative Humidity | |
| Storage | 5% to 95% RH with 33 °C (91 °F) maximum dew point. Atmosphere must be non-condensing at all times. |
| Temperature (Continuous Operation) | |
| Temperature Ranges (for altitude less than 950 m or 3117 ft) | 10 °C to 35 °C (50 °F to 95 °F) with no direct sunlight on the equipment. |
| Humidity Percentage Range | 10% to 80% Relative Humidity with 26 °C (78.8 °F) maximum dew point. |
| Maximum Vibration | |
| Operating | 0.26 Grms at 5 Hz to 350 Hz (all operation orientations). |
| Storage | 1.87 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested). |
| Maximum Shock | |
| Operating | One shock pulse in the positive z axis of 31 G for 2.6 ms in all operational orientations. |
| Storage | Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms. |
| Maximum Altitude | |
| Operating |
3,0482000 m (10,0006560 ft) |
| Storage | 12,000 m (39,370 ft). |
| Operating Altitude De-rating | |
| Up to 35 °C (95 °F) | Maximum temperature is reduced by 1 °C/300 m (1 °F/547 ft) above 950 m (3,117 ft). |
| 35 °C to 40 °C (95 °F to 104 °F) | Maximum temperature is reduced by 1 °C/175 m (1 °F/319 ft) above 950 m (3,117 ft). |
| 40 °C to 45 °C (104 °F to 113 °F) | Maximum temperature is reduced by 1 °C/125 m (1 °F/228 ft) above 950 m (3,117 ft). |
| Particulate
Contamination NOTE:This
section defines the limits to help avoid IT equipment damage
and/or failure from particulates and gaseous contamination. If
it is determined that levels of particulates or gaseous
pollution are beyond the limits specified below and are the
reason for the damage and/or failures to your equipment, it may
be necessary for you to re-mediate the environmental conditions
that are causing the damage and/or failures. Re-mediation of
environmental conditions will be the responsibility of the
customer. |
|
| Air Filtration NOTE:Applies to data
center environments only. Air filtration requirements do not
apply to IT equipment designed to be used outside a data center,
in environments such as an office or factory
floor. |
Data center air filtration as defined by ISO Class 8 per ISO
14644-1 with a 95% upper confidence limit. NOTE:Air entering the
data center must have MERV11 or MERV13
filtration. |
| Conductive Dust NOTE:Applies to data
center and non-data center environments. |
Air must be free of conductive dust, zinc whiskers, or other conductive particles. |
| Corrosive Dust NOTE:Applies to data
center and non-data center environments. |
|
| Gaseous
Contamination NOTE:Maximum corrosive
contaminant levels measured at ≤50% relative
humidity. |
|
| Copper Coupon Corrosion Rate | <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. |
| Silver Coupon Corrosion Rate | <200 Å/month as defined by AHSRAE TC9.9. |




























