Dell PowerEdge T30: руководство по обслуживанию

Chassis dimensions

Table 1. Dimensions of the PowerEdge T30 systemThis table describes the dimensions of the Dell PowerEdge T30 system
X	Y	Z
175.00 mm (6.88 inches)	360.00 mm (14.17 inches)	454.00 mm (17.87 inches)

Chassis weight

Table 1. Chassis weightThe table below decsribes the minimum and maximum weight of the T30 system.
System	Maximum weight (with all hard drives/SSDs)
PowerEdge T30	11.70 kg (25.70 lb)

Processor specifications

The PowerEdge T30 system supports the following processors:

Intel Xeon E3-1200 v5 processor
Intel Core i3 series processor
Intel Pentium processor

PSU specifications

The PowerEdge T30 system supports a single 290 W AC cabled power supply unit (PSU).

Table 1. PSU specificationsFor 290 W AC power supply unit, the maximum heat dissipation is 989.00 BTU/hr, frequency is rages from 50 to 60 Hz, and voltage range is 100 to 240 V AC autoranging.
PSU	Heat dissipation (maximum)	Frequency	Voltage
290 W AC	989.00 BTU/hr	50 – 60 Hz	100 – 240 V AC, 5.4 A, autoranging

NOTE: Heat dissipation is calculated by using the PSU wattage rating.

NOTE: The PowerEdge T30 system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 230 V.

System battery specification

The PowerEdge T30 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The PowerEdge T30 system supports PCI express (PCIe) generation 3 expansion cards, which must be installed on the system board. The following table provides detailed information about the expansion card specifications:

Table 1. Expansion card specificationsThe table describes about the expansion bus specification.
PCIe slot	Height	Length	Link
1	Full height	Half length	x16
3	Full height	Half length	x4
4	Full height	Half length	x4

NOTE: Slot 2 is a full-height, half-length PCI 32/33 card slot connected to PCIe and PCI Bridge.

Memory specifications

The PowerEdge T30 system supports up to four 2133 MT/s (ECC), 2400 MT/s (Non-ECC), and 2666 MT/s (ECC) single rank or dual rank UDIMMs.

CAUTION: Dell recommends you to use ECC DIMMs to minimize the risk of uncorrectable system error, data loss and/or silent data corruption. Non-ECC DIMM is not used for mission-critical applications.

NOTE: Non-ECC DIMMs are supported only in selected countries, for more information contact your sales representative.

Table 1. Memory specificationsYour system supports 4 memory module sockets of 288-pins each. The minimum RAM is 4 GB and the maximum RAM is up to 64 GB (UDIMM).
Memory module sockets	Memory capacity	Minimum RAM	Maximum RAM
Four 288-pin	4 GB, 8 GB, and 16 GB	4 GB	64 GB

Storage Controller card specifications

The Dell EMC PowerEdgeT30 supports Intel Rapid Storage Controller 12.X software RAID, and hardware RAID from optional storage controller card.

NOTE: The Dell EMC PowerEdge T30 supports only one P-Card (Non_DELL- Two ports SATA 6 Gbps PCI Express SATA controller card) which supports upto four SATA devices.

NOTE: The software RAID modes supported on the onboard Intel Rapid Storage Controller are RAID 0 and 1 only.

Hard drives

The PowerEdge T30 system supports one of the following hard drive configurations:

Table 1. Hard drive configurationsThis table list out the supported hard drive configurations
Number of hard drives	Configuration
Six hard drives	Up to four 3.5-inch hard drive, internal, cabled SATA or SATA SSD drives and two 2.5-inch hard drive (optional), internal, cabled SATA, or SATA SSD drives.
Three hard drives	Up to three 3.5-inch hard drive, internal, cabled SATA or SATA SSD drives and one optical drive (optional), internal, cabled SATA, or SATA SSD drives.
Four hard drives	Up to four 3.5-inch hard drive, internal, cabled SATA or SATA SSD drives.

NOTE: If you install more than four hard drives, you need to get an additional SATA controller card, SATA cables (minimum 1.6 ft) and power extension cables.

Optical drive

The PowerEdge T30 system supports an optional slim 9.5 mm SATA DVD-ROM drive or DVD+/-RW drive.

NOTE: External optical drives can be connected through the USB ports.

USB ports

The PowerEdge T30 system supports up to:

Six USB 2.0-compliant ports
Six USB 3.0-complaint ports

Table 1. USB specificationsThe table describes the number of USB ports in the PowerEdge T30 system
Front panel	Back panel	Internal
Two 4-pin USB 2.0-compliant	Two 4-pin USB 2.0-compliant	Two 4-pin USB 2.0-compliant
Two 4-pin USB 3.0-compliant	Four 4-pin USB 3.0-compliant	-

NIC port

The PowerEdge T30 system supports a Network Interface Controller (NIC) port on the back panel, which is available in 10/100/1000 Mbps NIC configurations.

Video specification

The PowerEdge T30 system supports:

Intel® HD Graphics P530 for Intel Xeon E3-1200 v5 processor
Intel® HD Graphics 510 for Intel Pentium processor
Intel® HD Graphics 530 for Intel Core i3 series processor

Environmental specifications

NOTE: For additional information about environmental measurements for specific system configurations, see Dell.com/environmental_datasheets.

Table 1. Environmental specificationsThe following table contains the temperature, relative humidity, vibration, shock, altitude and particulate contamination specifications.
Type	Condition	Temperature or Specification

Temperature
	Maximum Temperature Gradient (Operating and Storage)	20 °C/h (36 °F/h)
	Storage Temperature Limits	–40 °C to 65 °C (–40 °F to 149 °F)
	Continuous operation (for altitude less than 950 m or 3117 ft)	5 °C to 35 °C (41 °F to 95 °F) with no direct sunlight on the equipment.
Relative Humidity
	Storage	5% to 95% RH with 33 °C (91 °F) maximum dew point. Atmosphere must be non-condensing at all times.
	Operating	10% to 80% Relative Humidity with 29 °C (84.2 °F) maximum dew point.
Maximum Vibration
	Operating	0.26 G_rms at 5 Hz to 350 Hz (operating orientation).
	Storage	1.37 G_rms at 5 Hz to 200 Hz for 15 minutes (all six sides tested).
Maximum Shock
	Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
	Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 105 G for up to 2 ms.
Maximum Altitude
	Operating	3,048 m (10,000 ft)
	Storage	35,000 m (10,688 ft)
Operating Altitude De-rating
	Up to 35 °C (95 °F)	Maximum temperature is reduced by 1 °C/300 m (1 °F/547 ft) above 950 m (3,117 ft).
	35 °C to 40 °C (95 °F to 104 °F)	Maximum temperature is reduced by 1 °C/175 m (1 °F/319 ft) above 950 m (3,117 ft).
	40 °C to 45 °C (104 °F to 113 °F)	Maximum temperature is reduced by 1 °C/125 m (1 °F/228 ft) above 950 m (3,117 ft).

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.

NOTE: This section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous contamination. If it is determined that levels of particulates or gaseous pollution are beyond the limits specified in the following table and are the reason for the damage and/or failures to your equipment, it may be necessary for you to re-mediate the environmental conditions that are causing the damage and/or failures. Re-mediation of environmental conditions will be the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air Filtration NOTE: Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive Dust NOTE: Applies to data center and non-data center environments.	Air must be free of conductive dust, zinc whiskers, or other conductive particles.
Corrosive Dust NOTE: Applies to data center and non-data center environments.	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination	Specifications

Copper Coupon Corrosion Rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver Coupon Corrosion Rate	<200 Å/month as defined by AHSRAE TC9.9.