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Dell PowerEdge T160: руководство по обслуживанию
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Dell PowerEdge T160: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows the chassis dimensions.
Table 1. Chassis dimension for the systemThis table provides the dimensions of the system:
Drives Xa Xb Ya Yb Yc Za (with bezel) Za (without bezel) Zb Zc
3 x 3.5-inch + 2 x 2.5-inch cable SAS/SATA HDD/SSD drives from PERC 125.0 mm (4.92 inches) 132.52 mm (5.21 inches) 329.5 mm (12.97 inches)332.5 mm (13.09 inches)N/A 5 mm (0.19 inches) N/A 403.8 mm (15.89 inches)420.55 mm (16.55 inches)
3 x 3.5-inch cable SAS/SATA HDD/SSD from PERC + 2 x 2.5-inch direct attach NVMe 125.0 mm (4.92 inches) 132.52 mm (5.21 inches) 329.5 mm (12.97 inches)332.5 mm (13.09 inches)N/A 5 mm (0.19 inches) N/A 403.8 mm (15.89 inches)420.55 mm (16.55 inches)

System weight

Table 1. PowerEdge T160 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
A server with fully populated drives 11.64 kg (25.66 lb)
A server without drives and PSU installed 6.31 kg (13.91 lb)

Processor specifications

Table 1. PowerEdge T160 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
Intel® Xeon® 6300 series processor or Intel® Xeon® E-2400 series processor One
Intel® Pentium® G7400/G7400T processor One
NOTE:Intel Xeon® 6300 series CPUs do not support Windows Server 2019.

Power Supply Units

The PowerEdgeT160system supports one AC cabled power supply unit (PSU).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) Frequency Voltage AC DC Current
High line 200–240 V Low line 100–120 V
300 W Bronze 1250 BTU/hr 50/60 Hz 100 V–240 V AC 300 W 300 W N/A 4.6 A - 2.3 A
500 W Platinum 1920 BTU/hr 50/60 Hz 100 V–240 V AC 500 W 500 W N/A 7.0 A - 3.5 A
NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.
Figure 1. PSU power cord
This image shows the C13 power connector
Table 2. PSU power cordsThe table lists the PSU power cords list.
Form factor Output Power cord
Cable PSU 120 mm 300 W AC C13/C14
500 W AC

Cooling fan specifications

The DellPowerEdgeT160 system supports up to one standard (STD) and one High-Performance PCIe (HPR/ PCIe) cooling fan.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
Standard fanSTD STD - Standard N/A Standard fan image
High Performance (HPR) fan/ PCIeHPR (PCIe) HPR - High Performance/ PCIe N/A High Performance (HPR) fan

Supported operating systems

The PowerEdge T160 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
NOTE:Intel Xeon® 6300 series CPUs do not support Windows Server 2019.

For more information, go to OS support.

System battery specifications

The PowerEdge T160 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge T160 system supports up to two PCIe slots on the system board.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Expansion card riser Processor connection Height Length Slot width
Electrical Mechanical
Slot 1 (Gen4) N/A Processor Half Height Half Length x4 x8
Slot 2 (Gen4) N/A Processor Half Height Half Length x16 x16

Memory specifications

The PowerEdge T160 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor
Minimum system capacity Maximum system capacity
DDR5 ECC UDIMM Single rank 16 GB 16 GB 64 GB
Dual rank 32 GB 32 GB 128 GB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
4, 288-pin Up to 6400 MT/s
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The processor may reduce the performance of the rated DIMM speed. For more information, refer T160 Technical Guide at PowerEdge Manuals.

Storage controller specifications

The PowerEdge T160 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H355 Adapter
  • PERC H755 Adapter
  • HBA355i Adapter
External controllers
  • HBA355e Adapter
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 SSDs
Software RAID
  • S160

Drives

The PowerEdge T160 system supports:
  • Up to 3 x 3.5-inch cable SATA HDD/SSD from chipset
  • Up to 3 x 3.5-inch cable SAS/SATA HDD/SSD from PERC
  • Up to 3 x 3.5-inch + 2 x 2.5-inch cable SATA HDD/SSD from chipset
  • Up to 3 x 3.5-inch + 2 x 2.5-inch cable SAS/SATA HDD/SSD drives from PERC
  • Up to 3 x 3.5-inch cable SATA HDD/SSD from chipset + 2 x 2.5-inch direct attach NVMe
  • Up to 3 x 3.5-inch cable SAS/SATA HDD/SSD from PERC + 2 x 2.5-inch direct attach NVMe

NIC port specifications

The PowerEdge T160 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM).
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM on Planar 2 x 1 GbE
Network Card 1 GbE x 4, 10 GbE x 2, 10 GbE x 4

Serial connector specifications

The PowerEdge T160 system supports one serial port on the system board, which is Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

Ports specifications

Table 1. PowerEdge T160 port specificationsThe following table shows the port specifications for the system:
Front Rear Internal
Port type No. of ports Port type No. of ports Port type No. of ports
USB 3.2 Gen1 One USB 2.0 Three USB 3.2 Gen1 One
iDRAC Direct (Micro-AB USB) port One
USB 3.2 Gen1 Three
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

Video specifications

The PowerEdge T160 system supports integrated Matrox G200eW graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
640 x 480 60 Hz 32
640 x 480 72 Hz 32
640 x 480 75 Hz 32
640 x 480 85 Hz 32
800 x 600 60 Hz 32
800 x 600 72 Hz 32
800 x 600 75 Hz 32
800 x 600 85 Hz 32
1024 x 768 60 Hz 32
1024 x 768 72 Hz 32
1024 x 768 75 Hz 32
1024 x 768 85 Hz 32
1280 x 800 60 Hz 32
1280 x 800 75 Hz 32
1280 x 1024 60 Hz 32
1280 x 1024 75 Hz 32
1360 x 768 60 Hz 32
1440 x 900 60 Hz 32
1440 x 900 60 Hz (RB) 32
1600 x 900 60 Hz (RB) 32
1600 x 900 60 Hz (RB) 32
1600 x 1200 60 Hz 32
1600 x 1200 60 Hz (RB) 32
1680 x 1050 60 Hz (RB) 32
1680 x 1050 60 Hz 32
1920 x 1080 60 Hz 32
1920 x 1080 60 Hz (RB) 32
1920 x 1200 60 Hz 32
1920 x 1200 60 Hz (RB) 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on support.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft).
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft).
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft).
Table 4. Continuous Operation Specifications for Rugged Environment This table describes the operational climatic range for category A4.
Temperature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–55°C (41–131°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft).
Table 5. Common Environmental Specifications for ASHRAE A2, A3, A4, and Rugged This table describes the shared requirements across all categories.
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation). 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-40 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 ft)
Maximum operational altitude 3,048 meters (10,000 ft)
Table 6. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 7. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal air restrictions

ASHRAE A3/A4 environment

  • BOSS-N1 is not supported
  • Non-Dell qualified peripheral cards and /or peripheral cards greater than 25 W are not supported​

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR High performance
HSK Heat sink
Table 2. Thermal restriction matrixThe table describes the thermal restriction matrix:
- TDP Number of Cores 3x 3.5 inch Chip SATA 3x 3.5 inch PERC SAS/SATA 3x 3.5 inch + 2x 2.5 inch Chip SATA 3x 3.5 inch + 2x 2.5 inch PERC SAS/SATA
HSK/FAN type HSK/FAN type HSK/FAN type HSK/FAN type
CPU TDP 95 W 8 HPR/STD HPR/STD and HPR (PCIe) HPR/STD and HPR (PCIe) HPR/STD and HPR (PCIe)
95 W 6 HPR/STD HPR/STD and HPR (PCIe) HPR/STD and HPR (PCIe) HPR/STD and HPR (PCIe)
80 W 8 STD/STD STD/STD and HPR (PCIe) STD/STD and HPR (PCIe) STD/STD and HPR (PCIe)
80 W 6 STD/STD STD/STD and HPR (PCIe) STD/STD and HPR (PCIe) STD/STD and HPR (PCIe)
65 W 8 STD/STD STD/STD and HPR (PCIe) STD/STD and HPR (PCIe) STD/STD and HPR (PCIe)
65 W 6 STD/STD STD/STD and HPR (PCIe) STD/STD and HPR (PCIe) STD/STD and HPR (PCIe)
55 W 4 STD/STD STD/STD and HPR (PCIe) STD/STD and HPR (PCIe) STD/STD and HPR (PCIe)
46 W 2 STD/STD STD/STD and HPR (PCIe) STD/STD and HPR (PCIe) STD/STD and HPR (PCIe)
35 W 2 STD/STD STD/STD and HPR (PCIe) STD/STD and HPR (PCIe) STD/STD and HPR (PCIe)
NOTE:If a BOSS or a PCIe card is installed or a 2.5 inch drive is installed in the 2.5 inch drive bay, an HPR PCI fan is needed for all the configurations.