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Dell EMC PowerEdge T550: технические характеристики и спецификации
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Сервер Dell PowerEdge T550 210-BBRX
Сервер Dell PowerEdge T550 210-BBRX
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Dell EMC PowerEdge T550: технические характеристики и спецификации

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEdge T550 system.
Table 1. Chassis dimension for the systemThis table provides the dimensions of the system:
Drives A B C D E (with Bezel)
24 x 2.5-inch / 8 x 3.5-inch + 8 x 2.5-inch NVMe 446.0 mm (17.60 inches)464.0mm (18.27 inches) 200.0 mm (7.87 inches)663.5 mm (26.12 inches)680.5 mm (26.79 inches)
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. System weight of the PowerEdge T550 systemThe table below shows the maximum weight of the PowerEdge T550 system.
System configuration Maximum weight (with all drives/SSDs)
8 x 3.5-inch + 8 x 2.5-inch NVMe 44.48 kg (98.06 pound)
24 x 2.5-inch SAS/SATA 44.1 kg (97.22 pound)

Processor specifications

Table 1. Processor specifications for the systemThis table provides processor specifications for the system.
Supported processor Number of processors supported
3rd Generation Intel Xeon Scalable processors with up to 32 cores Up to two

PSU specifications

The PowerEdge T550 system supports up to two AC power supply units (PSUs).
Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) Frequency Voltage AC DC Current
High line 200–240 V Low line 100–120 V
600 W Mixed Mode Platinum 2250 BTU/hr 50/60 Hz 100 - 240 V, autoranging 600 W 600 W N/A 7.1 A - 3.6 A
N/A 2250 BTU/hr N/A 240 V DC N/A N/A 600 W 2.9 A
800 W Mixed Mode Platinum 3000 BTU/hr 50/60 Hz 100 - 240 V, autoranging 800 W 800 W N/A 9.2 A - 4.7 A
N/A 3000 BTU/hr N/A 240 V DC N/A N/A 800 W 3.8 A
1100 W DC N/A 4265 BTU/hr N/A -48 VDC – -60 VDC N/A N/A 1100 W 27 A
1100 W Mixed Mode Titanium 4,125 BTU/hr 50/60 Hz 100 - 240 V 1100 W 1050 W N/A 12 A - 6.3 A
N/A 4,125 BTU/hr N/A 240 V DC N/A N/A 1100 W 5.2 A
1400 W Mixed Mode Platinum 5250 BTU/hr 50/60 Hz 100 - 240 V 1400 W 1050 W N/A 12 A - 8 A
N/A 5250 BTU/hr N/A 240 V DC N/A N/A 1400 W 6.6 A
2400 W Mixed Mode Platinum 9000 BTU/hr 50/60 Hz 100 - 240 V 2400 W 1400 W N/A 16 A - 13.5 A
N/A 9000 BTU/hr N/A 240 V DC N/A N/A 2400 W 11.2 A
700 W Mixed Mode Titanium 2,625 BTU/hr 50/60 Hz 200–240 V AC 700 W NA NA 4.1 A
NA 2,625 BTU/hr NA 240 V DC NA NA 700 W 3.4 A
1800 W Mixed Mode Titanium 6,000 BTU/hr 50/60 Hz 200–240 V AC 1800 W NA NA 10 A
NA 6000 BTU/hr NA 240 V DC NA NA 1800 W 8.2 A
NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at Dell.com/calc.

Cooling fan specifications

The PowerEdgeT550 system supports up to eight standard or high performance silver grade (HPR (Silver)) cooling fans connected to the system board directly.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
High-performance fan (Silver grade) fanHPR (Silver) HPR - High Performance N/A
Figure 1. High performance fan
This image shows the high performance fan.
Standard fanSTD STD - Standard N/A
Figure 2. Standard fan
This image shows the standard fan.
NOTE:For more information about the supported fan configuration or matrix, see Thermal restriction matrix.

Supported operating systems

The PowerEdge T550 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Citrix Hypervisor
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi

For more information, go to OS support.

System battery specifications

The PowerEdge T550 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The system supports up to six PCI express (PCIe) Gen 4 expansion cards.
Table 1. Expansion card slots support matrixThis table provides information about the expansion card slots support matrix.
PCIe slot Processor 1 Platform Controller Hub (PCH) Processor 2
Internal Internal Internal
Slot 1 x16 - -
Slot 2 - - x16
Slot 3 - - x16
Slot 4 - - x16
Slot 5 - x8 -
Slot 6 x16 - -
Table 2. Expansion card slots supported for Riser ConfigurationsThis table provides information about the expansion card slots that are supported on the system for riser configurations.
PCIe slot Riser configuration Riser width PERC supported Rear storage supported
Slot 1 GPU riser x16 PCIe No No
Slot 2 GPU riser x16 PCIe No No

Memory specifications

The system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity DIMM Rated Voltage and supported speed Speed
Single Processor Dual Processor Single Processor Dual Processor
RDIMM Single rank 8 GB 16 GB DDR4 (1.2 V), 3200 3200 2933
16 GB 32 GB DDR4 (1.2 V), 3200 3200 2933
Dual rank 16 GB 32 GB DDR4 (1.2 V), 3200 3200 2933
32 GB 64 GB DDR4 (1.2 V), 3200 3200 2933
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 3200 MT/s, 2933 MT/s,

Storage controller specifications

The PowerEdge T550 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Internal controllers External controllers
  • S150
  • PERC H345
  • H355
  • PERC H755
  • H755N
  • HBA355i
  • Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs
  • HBA355e
  • PERC H840

Drives

The PowerEdge T550 system supports:
  • Up to 8 x 2.5-inch SAS/SATA/ (HDD) drives
  • Up to 16 x 2.5-inch SAS/SATA (HDD) drives
  • Up to 24 x 2.5-inch SAS/SATA/ (HDD) drives
  • Up to 8 x 3.5-inch SAS/SATA/ (HDD/SSD) drives
  • Up to 8 x 3.5-inch SAS/SATA + 8 x 2.5-inch NVMe (HDD/SSD) drives
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

Optical drives

The PowerEdge T550 system supports one Slim SATA DVD-ROM drive.
NOTE:DVD devices support only data.

USB ports specifications

Table 1. USB specificationsThe following table shows the USB specifications :
Front Rear
USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 3.0-compliant port One
USB 3.0-compliant port One USB 2.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One
NOTE:The front micro USB 2.0 compliant port is only available for the upsell configuration.
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
NOTE:The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.
NOTE:The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

NIC port specifications

The system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional OCP cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card 1 GB x 2
OCP card (OCP 3.0) 1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4, 50 GbE x 2, 100 GbE x 2

VGA ports specifications

The system supports One DB-15 VGA port one each on the front and back panels.

Serial connector specifications

The PowerEdge T550 system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

Video specifications

The system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported rear video resolution options for the systemThis table describes the supported rear video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.
Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Operational climatic range category A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
NOTE:Certain system hardware configurations may require operating temperatures to be less than 28°C. For more information, see the Thermal air restrictions section.
Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restriction matrix

Table 1. Thermal restriction matrixThe table describes thermal restriction matrix:
Drive Configuration Processor Fans CPU TDP Fan redundancy CPU HSK GPU support TBU support CPU blank Fan blank Note GPU riser configuration
TDP>150 W TDP<=150 W GPU<=75 W GPU>75 W
8 x 3.5 1 STD x3 <=185 No, upsell option to STDx6 HPR HSK STD HSK No No No Yes Yes at Fan 2 location Fan 1/3/4 Riser 0, 1
1 STD x6 <=220 Yes No No No Yes Fan 1/3/4/5/7/8 Riser 0, 1
1 HPR x3 <=220 No, upsell option to HPRx6 Yes No No Yes Fan 1/3/4 No
1 HPR x5* <=220 Yes Yes/No No Yes Yes Fan 1/3/4/7/8 (GPU riser 1 and 2 not supported) No
1 HPR x6 <=220 Yes Yes Yes No Yes Fan 1/3/4/5/7/8 Yes
2 STD x4 <=185 No, upsell option to STDx8 No No No No No NA Riser 0, 1
2 STD x8 <=220 Yes No No No No NA Riser 0, 1
2 HPR x4 <=220 No, upsell option to HPRx8 Yes No No No NA No
2 HPR x7* <=220 TBD Yes/No No Yes No Fan 1/2/3/4/6/7/8
NOTE:GPU riser 1 and 2 not supported
No
2 HPR x8 <=220 Yes Yes Yes No No NA Yes

8 x 2.5
16 x 2.5
24 x 2.5

 1 or 2 STD x4 <=185 No, upsell option to STDx8 HPR HSK STD HSK No No No Yes for 1 processor No NA Riser 0, 1
1 or 2 STD x8 <=220 Yes No No No NA Riser 0, 1
1 or 2 HPR x4 <=220 No, upsell option to STDx8 Yes No No NA No
1 or 2 HPR x7* <=220 Yes Yes/No No Yes Fan 1/2/3/4/6/7/8
NOTE:GPU riser 1 and 2 not supported
No
1 or 2 HPR x8 <=220 Yes Yes Yes No NA Yes
8 x 3.5 + 8 x 2.5 (NVMe) 1 or 2 HPR x4 <=220 No, upsell option to HPRx8 HPR HSK STD HSK Yes No No Yes for 1 processor No NA No or Riser 0, 1, 2
1 or 2 HPR x7* <=220 Yes Yes/No No Yes Fan 1/2/3/4/6/7/8
NOTE:GPU riser 1 and 2 not supported
No
1 or 2 HPR x8 <=220 Yes Yes Yes No NA Yes
NOTE:OCP shroud are required for all drive configurations, even if the OCP card is not installed.
NOTE:DIMM blanks are required for CPU TDP>185 W, but are not required for CPU TDP<=185 W.
NOTE:GPU blank is required at GPU riser slot 2, when a GPU>75 W is installed at GPU riser slot 1.
NOTE:HDD blanks are required for empty HDD slots.
NOTE:*x5 and x7 fan count is applicable only for TBU configuration. Systems without TBU should not use x5 and x7 fan counts. For TBU configuration, ambient temperature is < 35C.
NOTE:When GPU is selected, HPR fan must be required.
NOTE:GPU>75W must require fan redundancy (Fan quantity = 6 or 8).
NOTE:GPU>75 W does not support TBU.
NOTE:STD fans can also be upgraded to HPR fans.

Thermal matrix for all configurations

Table 2. Thermal matrix for all configurationsThe table describes thermal matrix for all configurations:
- 8x, 16x, 24x 2.5-inch SAS/SATA Configuration 1 8x 3.5-inch Configuration 2 8x 3.5-inch + 8x 2.5-inch NVMe Configuration 3
Fan STDx4 STDx8 HPRx4 HPRx7 x8 STDx3 x4 STDx6 x8 HPRx3 x4 HPRx5 x6 x7 x8 HPRx4 HPRx7 x8
Fan redundancy No Yes No Yes No Yes No Yes No Yes
Maximum DIMM power 12 W 12 W 12 W 12 W 12 W 12 W 12 W 12 W 12 W 12 W
CPU TDP 105 W STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK
120 W STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK
125 W STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK
135 W STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK
150 W STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK STD HSK
165 W HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK
185 W HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK
205 W Not supported HPR HSK HPR HSK HPR HSK Not supported HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK
220 W Not supported HPR HSK HPR HSK HPR HSK Not supported HPR HSK HPR HSK HPR HSK HPR HSK HPR HSK

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications This table shows the particulate contamination specifications.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications This table shows the gaseous contamination specifications.
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE:Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal air restrictions

Thermal air restrictions for different configurations

Table 1. 8 x 3.5-inch drive configurationThis table shows an 8 x 3.5-inch drive configuration.
Standard Operating Support (ASHRAE A2 compliant)
NOTE:All options supported unless otherwise noted.
Extended ambient 40° C Operating Support (ASHRAE A3 compliant) Extended ambient 45° C Operating Support (ASHRAE A4 compliant)
  • 3x or 4x STD fans support only processor with TDP<=185 W
  • With STD fans, the following OCP 3.0 and NIC support only optic cable with thermal spec 85C and power <=1.2 W
    • Broadcom OCP 3.0 QP 25G SFP28
    • Broadcom PCIe QP 25G
    • NVIDIA CX6-LX PCIe Dual Port 25G SFP28 at slot 6
  • 3x or 4x STD fans configurations not supported.
  • 6x or 8x STD fans configurations with processor TDP > 120 W are not supported.
  • TBU is not supported.
  • Non-Dell qualified peripheral cards and Channel devices (FW) cards are not supported.
  • NIC consuming power >= 25 W not supported. For example: CX6 card.
  • OCP transfer rate > 25G or cooling tier>10 is not supported.
  • Optic cable with spec 85C is required.
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure.
  • STD fans configurations are not supported.
  • 3x or 4x HPR fans configurations with CPU TDP > 165 W are not supported.
  • TBU is not supported.
  • BOSS M.2 module not supported.
  • Non-Dell qualified peripheral cards and Channel devices (FW) cards are not supported.
  • NIC consuming power >= 25 W. For example: CX6 card.
  • OCP transfer rate >25G or cooling tier > 10 are not supported.
  • Optic cable with spec 85C is required.
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure.
Table 2. 8 x 2.5-inch, 16 x 2.5-inch, 24 x 2.5-inch drive configurationThis table shows an 8 x 2.5-inch, 16 x 2.5-inch, 24 x 2.5-inch drive configuration.
Standard Operating Support (ASHRAE A2 compliant) Extended ambient 40° C Operating Support (ASHRAE A3 compliant) Extended ambient 45° C Operating Support (ASHRAE A4 compliant)
  • 4x STD fans support only processor with TDP<=185 W
  • With STD fans, the following OCP 3.0 and NIC support only optic cable with thermal Spec 85C and power <=1.2 W
    • Broadcom OCP 3.0 QP 25G SFP28
    • Broadcom PCIe QP 25G
    • NVIDIA CX6-LX PCIe Dual Port 25G SFP28 at slot 6
  • 4x STD fans configurations not supported.
  • 8x STD fans configurations with CPU TDP > 120 W is not supported.
  • TBU is not supported.
  • Non-Dell qualified peripheral cards and Channel devices (FW) cards are not supported.
  • NIC consuming power >= 25 W not supported. For example: CX6 card.
  • OCP transfer rate > 25G or cooling tier > 10 are not supported.
  • Optic cable with spec 85C is required.
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure.
  • STD fans configurations are not supported.
  • 4x HPR fans configurations with processor TDP > 165 W are not supported.
  • TBU is not supported.
  • BOSS M.2 module is not supported.
  • Non-Dell qualified peripheral cards and Channel devices (FW) cards are not supported.
  • NIC consuming power >= 25 W. For example: CX6 card.
  • OCP transfer rate >25G or cooling tier > 10 are not supported.
  • Optic cable with spec 85C is required.
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure.
Table 3. 8 x 3.5-inch x 8 x NVMe drive configurationThis table shows an 8 x 2.5-inch, 16 x 2.5-inch, 24 x 2.5-inch drive configuration.
Standard Operating Support (ASHRAE A2 compliant) Extended ambient 40° C Operating Support (ASHRAE A3 compliant) Extended ambient 45° C Operating Support (ASHRAE A4 compliant)
HPR fans are required.
  • TBU is not supported.
  • Non-Dell qualified peripheral cards and Channel devices (FW) cards are not supported.
  • NIC consuming power >= 25 W not supported. For example: CX6 card.
  • OCP transfer rate > 25G or cooling tier > 10 are not supported.
  • Optic cable with spec 85C is required.
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure.
  • 4x HPR fans configurations with CPU TDP > 165 W are not supported.
  • TBU is not supported.
  • BOSS M.2 module is not supported.
  • Non-Dell qualified peripheral cards and Channel devices (FW) cards are not supported.
  • NIC consuming power >= 25 W. For example: CX6 card.
  • OCP transfer rate >25G or cooling tier > 10 are not supported.
  • Optic cable with spec 85C is required.
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure.