Определяем
Сегодня покупают
ГлавнаяСправочникиDellTower Servers
Dell EMC PowerEdge T440: технические характеристики и спецификации
← Вернуться назад
Сервер Dell PowerEdge T440 210-AMEI-103-000
Сервер Dell PowerEdge T440 210-AMEI-103-000
1 130 836 ₸
Смотреть в магазине

Dell EMC PowerEdge T440: технические характеристики и спецификации

System dimensions

Figure 1. Dell EMCPowerEdgeT440system dimensions

Details the dimensions of the system.PowerEdgeT440

Table 1. Dimensions of Dell EMCPowerEdgeT440systemThe dimensions of the Dell EMCPowerEdgeT440system are as follows:
XaXbYaYbYcZaZbZc
218 mm (8.58 in) 307.9 mm (12.12 in) 430.3 mm (16.94 in) 443.3 mm (17.45 in) 471.333 mm (17.37 in)

(with bezel) 37.065 mm (1.45 in)

(without bezel) 21.165 mm (0.83 in)

538.4 mm (21.19 in) 573.636 mm (22.58 in)

Chassis weight

Table 1. Dell EMC PowerEdge T440 Chassis weightChassis weight of Dell EMC PowerEdge T440 system is as follows:
System configuration Maximum weight

4 x 3.5-inch drive system (no longer offering)

23 Kg (50.71 lb)

8 x 3.5-inch drive system

29.3 Kg (64.60 lb)

16 x 2.5-inch drive system

27.7 Kg (61.06 lb)

Processor specifications

The Dell EMC PowerEdge T440 system supports up to two Intel Xeon Scalable Processor, up to 16 cores per processor.

Supported operating systems

The Dell EMC PowerEdge T440 system supports the following operating systems:

  • Canonical Ubuntu LTS
  • Citrix XenServer
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
NOTE For more information, go to www.dell.com/ossupport.

Cooling fan specifications

The Dell EMC PowerEdge T440 system supports the following:
  • An internal cooling fan
  • An optional external cooling fan at the back of the chassis
NOTE When selecting or upgrading your system configuration, verify the system power consumption with the Dell Energy Smart Solution Advisor at Dell.com/ESSA to ensure optimum power utilization.

PSU specifications

The Dell EMC PowerEdge T440 system supports the following AC redundant power supply units (PSU):
Table 1. Dell EMC PowerEdge T440 system PSU specificationsThe table below are the specifications for power supplies.
PSU Class Heat dissipation (maximum) Frequency Voltage
1100 W AC Platinum 4100 BTU/hr 50/60 Hz  100–240 V AC
750 W AC Platinum 2891 BTU/hr 50/60 Hz  100–240 V AC, autoranging
750 W mixed mode HVDC (For China only) Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, autoranging
NA 240 V DC
750 W AC Titanium 2843 BTU/hr 50/60 Hz 200-240 V AC
495 W AC Platinum 1908 BTU/hr 50/60 Hz  100–240 V AC, autoranging
450 W (no longer offering) Bronze 1871 BTU/hr 50/60 Hz  100–240 V AC, cabled PSU

This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 230 V.

System battery specifications

The Dell EMC PowerEdge T440 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The Dell EMC PowerEdge T440 system supports five PCI express (PCIe) generation 3 expansion cards.

Memory specifications

Table 1. Memory specificationsThe table below shows the memory specifications of Dell EMC PowerEdge T440 system:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
RDIMM Single rank 8 GB 8 GB 80 GB 16 GB 128 GB
RDIMM Dual rank 16 GB 16 GB 160 GB 32 GB 256 GB
RDIMM Dual rank 32 GB 32 GB 320 GB 64 GB 512 GB
LRDIMMQuad rank 64 GB 64 GB640 GB128 GB1024 GB

Storage controller specifications

The Dell EMC PowerEdge T440 system supports:
  • Software RAID: S140
  • Internal controllers: H750, H350, H740p, H730p, H330
  • Boot Optimized Storage Subsystem (BOSS): HWRAID 2 x M.2 SSDs 120 GB, 240 GB with 6 Gb/s
    • x8 connector using PCIe Gen 2.0 x2 lanes, available only in the low-profile and half-height form factor.
  • External controller: HBA355e, H840, 12 Gbps Ext SAS HBA
  • SAS Hot Bus Adapters: HBA350i, HBA330
NOTE The new generation PERC 11 H750, H350, and HBA350i adapters cannot be mixed with the PERC H740P, H730P, H330, HBA330 adapters of the previous generations in one system.
NOTE Valid TBU configurations:
  • HBA330 adapter can be connected to TBU and the PERC H740P, H730P, H330, HBA330 can be connected to the drive backplane.
  • HBA350i adapter can be connected to TBU and the PERC H750, H350, HBA350i can be connected to the drive backplane.

Drives

The Dell EMC PowerEdge T440 system supports:
  • 4x3.5 configuration (no longer offering): Up to 4 SAS or SATA drives/Nearline SAS drives
  • 8x3.5 configuration: Up to 8 SAS or SATA drives/Nearline SAS drives
  • 16x2.5 configuration: Up to 16 SAS or SATA drives

Optical drive and tape drive

The Dell EMC PowerEdge T440 system supports:
  • one optional slim SATA DVD-ROM drive or DVD +/-RW drive
  • internal tape drives LTO5, LTO6, LTO7 and external SAS drives.
Your system supports one of the following configurations:
  • Systems with cabled drives support one optical drive and one tape drive.
  • Systems with hot-swappable drives support up to one optical drive and two tape drives.

USB ports

Dell EMC PowerEdge T440 system
Table 1. USB specificationsThe table below lists the USB specifications for the Dell EMC PowerEdge T440 system:
Front panel Back panel
  • One USB 2.0-compliant port
  • One USB 3.0-compliant port
  • 4 USB 2.0-compliant rear ports
  • 2 USB 3.0-compliant rear ports

NIC ports

The Dell EMC PowerEdge T440 system supports two Network Interface Controller (NIC) ports on the back panel each with 1 Gbps configuration.
NOTE You can install up to five PCIe add-on cards.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The Dell EMC PowerEdge T440 system supports one 15-pin VGA ports on the back of the system.

Serial connector

The Dell EMC PowerEdge T440 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

IDSDM or vFlash card

The Dell EMC PowerEdge T440 systemIDSDM module contains both Internal Dual SD Module (IDSDM) and vFlash card that are combined into a single card module. The following are options available for PowerEdge T440 system:
  • VFlash only
  • IDSDM only
  • vFlash + IDSDM

Video specifications

The Dell EMC PowerEdge T440 system supports Matrox G200eW3 graphics card with 16 MB capacity.
Table 1. Supported video resolution optionsThis table describes the supported video resolution options for Dell EMC PowerEdge T440 system:
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/poweredgemanuals
Table 1. Temperature specifications

The table below shows the optimal working temperature specifications:
Temperature Specifications
Storage –40°C–65°C (–40°F–149°F)
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C–35°C (50°F–95°F) with no direct sunlight on the equipment.
Maximum temperature gradient (operating and storage) 20°C/h (68°F/h)
Table 2. Relative humidity specifications

The table below shows the relative humidity specification during operations and storage:
Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be noncondensing always.
Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.
Table 3. Maximum vibration specifications

The table below shows the maximum vibration specifications during operations and storage:
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all 3 axes).
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Table 4. Maximum shock specifications

The table below shows the maximum shock specifications during operations and storage:

Maximum shock Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
Storage 6 consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Table 5. Maximum altitude specifications

The table below shows the maximum altitude specifications during operations and storage.
Maximum altitude Specifications
Operating

3048 m (10,000 ft)
Storage 12,000 m (39,370 ft)
Table 6. Operating temperature derating specifications

The table below shows the operating temperature derating specifications:
Operating temperature derating Specifications
Up to 35°C (95°F) Maximum temperature reduces by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35 °C–40°C (95 °F–104°F) Maximum temperature reduces by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40 °C–45°C (104 °F–113°F) Maximum temperature reduces by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Standard operating temperature

Table 1. Standard operating temperature specifications

The standard operating temperature for altitude less than 950 m or 3117 ft ranges 10°C–35°C with no direct sunlight on the equipment.

NOTE The 2.5-inch hard drive chassis supports a maximum of 145 W processors.
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C–35°C (50°F–95°F) with no direct sunlight on the equipment.

Expanded operating temperature

Table 1. Expanded operating temperature specifications

When the system is in continuous operation, the expanded operating temperature ranges from 5°C–40°C at 5% to 85% RH with 29°C dew point.

NOTE Outside the standard operating temperature (10°C–35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures 35°C–40°C, derate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is –5°C–45°C at 5% to 90% RH with 29°C dew point.
NOTE Outside the standard operating temperature (10°C–35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures 40°C–45°C, derate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature Specifications
Continuous operation 5°C–40°C at 5% to 85% RH with 29°C dew point.
NOTE Outside the standard operating temperature (10°C–35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C.

For temperatures between 35°C-40°C, derate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours –5°C–45°C at 5% to 90% RH with 29°C dew point.
NOTE Outside the standard operating temperature (10–35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours.

For temperatures 40°C–45°C, derate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
NOTE When operating in the expanded temperature range, system performance may be impacted.
NOTE When operating in the expanded temperature range, ambient temperature warnings may be reported in the System Event Log.

Expanded operating temperature restrictions

  • Do not perform a cold startup below 5°C.
  • The operating temperature specified is for a maximum altitude of 3048 m (10,000 ft).
  • Two nonredundant power supply units are required.
  • Two nonredundant system fans are required.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • GPU is not supported.
  • Tape backup unit is not supported.

Thermal restriction matrix

Table 1. Thermal restriction matrix for Dell EMC PowerEdge T440 systemThis table describes the thermal restriction for Dell EMC PowerEdge T440 system:
Storage configuration 8x 3.5-inch drive 16x 2.5-inch drive
Processor number TDP (W) Core count Ambient support = 35°C
Intel Xeon Gold 5215 85 10 Yes Yes
Intel Xeon Gold 5222 105 4 Yes Yes
Intel Xeon Gold 5120 105 14 Yes Yes
Intel Xeon Gold 5118 105 12 Yes Yes
Intel Xeon Silver 4208 85 8 Yes Yes
Intel Xeon Silver 4210 85 10 Yes Yes
Intel Xeon Silver 4210R 100 10 Yes Yes
Intel Xeon Silver 4214 85 12 Yes Yes
Intel Xeon Silver 4214R 100 12 Yes Yes
Intel Xeon Silver 4215 85 8 Yes Yes
Intel Xeon Silver 4216 100 16 Yes Yes
Intel Xeon Silver 4114 85 10 Yes Yes
Intel Xeon Silver 4110 85 8 Yes Yes
Intel Xeon Silver 4112 85 4 Yes Yes
Intel Xeon Bronze 3204 85 6 Yes Yes
Intel Xeon Bronze 3206R 85 8 Yes Yes

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications

Air filtration specification: Data center air filtration defines, ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have the MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and nondata center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and nondata center environments.
Particulate contamination Specifications
Air filtration Data center air filtration defines, ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE This condition applies to data center and nondata center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and nondata center environments.
Table 2. Gaseous contamination specifications

The copper coupon corrosion rate is <300 Å/month per Class G1 defines, ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month defines, ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 defines, ANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month defines, ANSI/ISA71.04-2013.
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.