Dell EMC PowerEdge T430: руководство по обслуживанию

Chassis dimensions

This shows Details the dimensions of Dell powerEdge T430 system — Figure 1. Chassis dimensions of Dell PowerEdge T430 system

Table 1. Dimensions of Dell PowerEdge T430 systemThe dimensions of 8 x 2.5 inch hard drive systems are as follows: X=304.5 mm, Xb=430.3 mm, Ya=434.5 mm, Za (with bezel) =15.9 mm, Za (without bezel) =0.0 mm, Zb=659.9 mm, and Zc=692.8 mm.
System	X	Xa	Y	Ya	Yb	Z	Za	Zb
PowerEdge T430	304.5 mm (11.99 inches)	218 mm (8.58 inches)	471.3 mm (18.55 inches)	430.3 mm (16.94 inches)	443.3 mm (17.45 inches)	594.82 mm (23.42 inches)	578.42 mm (22.77 inches)	542.2 mm (21.35 inches)

Chassis weight

Table 1. Chassis weightThe maximum chassis weight is 36 kg.
System	Maximum weight
PowerEdge T430	36 Kg (79.37 lb)

Processor specifications

The PowerEdge T430 system supports up to two Intel Xeon E5-2600 v4 or Xeon E5-2600 v3 product family processors.

PSU specifications

The PowerEdge T430 system supports up to two AC or DC redundant power supply units (PSUs).

Table 1. PSU specificationsFor 450 W AC, platinum power supply unit, the maximum heat dissipation is 1871 BTU/hr, frequency is 50/60 Hz, and voltage range is 100240 V AC autoranging. For 750 W AC platinum PSU, the maximum heat dissipation is 2891 BTU/hr, frequency is 50/60 Hz, and voltage range is 100240 V AC autoranging. For 750 W AC titanium PSU, the maximum heat dissipation is 2843 BTU/hr, frequency is 50/60 Hz, and voltage range is 200240 V AC autoranging. For 1100 W AC platinum PSU, the maximum heat dissipation is 4100 BTU/hr, frequency is 50/60 Hz, and voltage range is 100-240 V AC autoranging. For 1100 W DC PSU, the maximum heat dissipation is 4416 BTU/hr and the voltage range is – (4860) V DC. For 750 W DC platinum PSU, the maximum heat dissipation is 2902 BTU/hr, frequency is 50/60 Hz, and voltage range is 100240 V AC and 240 DC. The 750 W DC PSU is applicable to China only.
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage
450 W AC	Bronze	1871 BTU/hr	50/60 Hz	100 – 240 V AC, 6.5 A – 3.5 A, autoranging
495 W AC	Platinum	1908 BTU/hr		100 – 240 V AC, 6.5 A – 3 A, autoranging
750 W AC	Platinum	2891 BTU/hr		100 – 240 V AC, 10 A – 5 A, autoranging
1100 W AC	Platinum	4100 BTU/hr		100 – 240 V AC, 12 A – 6.5 A, autoranging

NOTE: Heat dissipation is calculated using the PSU wattage rating.

NOTE: This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 230 V.

System battery specifications

The PowerEdge T430 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The PowerEdge T430 system supports PCI express (PCIe) generation 3 and 2 expansion cards. The following table describes the supported expansion cards:

Table 1. Supported PCI express generation 3 expansion cardsThis table Supported PCI express generation 3 expansion cards.
PCIe Slot	Processor Connection	Height	Length	Link Width	Slot Width
1 (Gen2)	Platform Controller Hub	Full height	Half Length	x4	x8
2 (Gen2)	Platform Controller Hub	Full height	Half length	x1	x1
3 (Gen3)	Processor 1	Full height	Full length	x16	x16
4 (Gen3)	Processor 1	Full height	Full length	x16	x16
5 (Gen3)	Processor 2	Full height	Half length	x8	x8
6 (Gen3)	Processor 2	Full height	Half length	x8	x8

NOTE: To use PCIe slots 5 and 6, both the processors must be installed.

NOTE: The expansion card slots are not hot-swappable.

Memory specifications

The PowerEdge T430 system supports 1866 MT/s, 2133 MT/s or 2400 MT/s DDR4 Registered DIMMs.

Table 1. Memory specificationsYour system supports 12 memory module sockets of 288-pins each. The system supports RDIMMs of memory capacity 4 GB, 8 GB, 16 GB and 32 GB single rank, and RDIMMs of memory capacity 8 GB, 16 GB, or 32 GB dual rank. For system with single processor, the minimum RAM is 4 GB and the maximum RAM is up to 192 GB (RDIMM). For system with dual processor, the minimum RAM is 8 GB (minimum one memory module per processor) and the maximum RAM is up to 384 GB (RDIMM).
Memory module sockets	Memory capacity	Minimum RAM	Maximum RAM
Twelve 288–pin	4 GB single-rank (RDIMMs) 8 GB, 16 GB, and 32 GB single and dual-rank (RDIMMs)	4 GB with single processor 8 GB with dual processors (minimum one memory module per processor)	Up to 256 GB with a single processor Up to 384 GB with dual processors

Drive specifications

Your system supports up to four 3.5 inch cabled hard drives or eight 3.5 inch hot swappable hard drives or sixteen 2.5 inch hot swappable hard drives

Hard drives

The PowerEdge T430 system supports:

Table 1. Hard Drive SpecificationUp to eight 3.5 inch, internal, hot-swappable SAS, SATA, SSD, or Nearline SAS hard drives or Up to eight 2.5 inch, internal, hot-swappable SAS, SATA, SSD, or Nearline SAS hard drives in a 3.5 inch hard-drive carrier.
Drives
Hard drives
	Four–hard-drive systems	Up to four 3.5 inch, internal, cabled SATA, or nearline SAS hard drives.
	Eight–hard-drive systems	Up to eight 3.5 inch, internal, hot-swappable SATA, or nearline SAS hard drives. NOTE: 2.5 inch hard drives in 3.5 inch carriers are supported for SAS, and SATA SSD hard drives.
	Sixteen–hard-drive systems	Up to sixteen 2.5 inch, internal, hot-swappable SATA, nearline SAS, SAS, or SATA SSD hard drives.

Optical drive

The PowerEdge T430 system supports one optional SATA DVD-ROM drive or DVD+/-RW drive or One optional slim SATA DVD-ROM drive or DVD +/-RW drive.

Table 1. Optical Drive SpecificationsOne optional SATA DVD-ROM drive or DVD+/-RW drive.
Drives
Optical drive		One optional SATA DVD-ROM drive or DVD+/-RW drive. NOTE: If your system is installed with a double-width GPU card, the system supports only one 5.25 inch removable media storage device.

Tape drive

The PowerEdge T430 system supports up to two optional 5.25 inch tape drive.

NOTE: If your system is installed with a double-width GPU card, the system supports only one 5.25 inch removable media storage device.

Serial connector

The serial connector connects a serial device to the system. The PowerEdge T430 system supports DB-9 Serial Port connector.

Internal Dual SD Module

The PowerEdge RT430 system supports two optional flash memory card slots with an internal SD module.

NOTE: One card slot is dedicated for redundancy.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge T430 system with 2.5-inch and 3.5-inch hot-swappable hard-drive chassis supports two 15-pin VGA ports on the front and back panels. The PowerEdge T430 system with 3.5-inch cabled hard-drive chassis supports one 15-pin VGA port on the back panel.

USB ports

The PowerEdge T430 system supports:

USB 2.0-compliant ports and USB 3.0-complaint ports on the front and back panel
Internal USB 3.0-compliant port

The following table provides more information about the USB specifications:

Table 1. USB specificationsThe T430 system supports two Hi-Speed USB Host and One USB 2.0-compliant ports and one USB 3.0-complaint ports. You system supports Six Hi-Speed USB Host, Four USB 2.0 compliant ports and one 9-pin, USB 3.0-compliant internal port.
System	Front panel	Back panel	Internal
PowerEdge T430	One USB 2.0-compliant port and one USB 3.0-complaint port	Six Hi-Speed USB Host Five USB 2.0 compliant ports one USB 3.0-complaint ports	One 9-pin, USB 3.0-compliant port

NIC ports

The PowerEdge T430 system supports two Network Interface Controller (NIC) ports on the back panel, which is available in the following NIC configurations:

Two 10/100/1000 Mbps

iDRAC 8

The PowerEdge R430 system supports one optional 1 GbE Ethernet

SD vFlash

The PowerEdge R430 system supports one optional SD vFlash memory card

Video specifications

The PowerEdge T430 system supports Integrated Matrox G200 with iDRAC8 and 16 MB application memory.

Table 1. Supported video resolution optionsFor 640 x 480 resolution, the refresh rate is 60 to 70 Hz and the color depth is 8, 16, 32 bit. For 800 x 600 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 32 bit. For 1024 x 768 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 32 bit. For 1152 x 864 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 32 bit. For 1280 x 1024 resolution, the refresh rate is 60, 75 Hz and color depth is 8, 16, 32 bit. For 1440 x 900 resolution, the refresh rate is 60 Hz and color depth is 8, 16, 32 bit.
Resolution	Refresh Rate (Hz)	Color Depth (bit)
640 x 480	60, 70	8, 16, 32
800 x 600	60, 75, 85	8, 16, 32
1024 x 768	60, 75, 85	8, 16, 32
1280 x 1024	60	8, 16, 32
1440 x 900	60	8, 16, 32

Environmental specifications

NOTE: For additional information about environmental measurements for specific system configurations, see Dell.com/environmental_datasheets.

Table 1. Environmental specificationsThe following table contains the temperature, relative humidity, vibration, shock, altitude and particulate contamination specifications.
Type	Condition	Temperature or Specification

Temperature
	Maximum Temperature Gradient (Operating and Storage)	20 °C/h (36 °F/h)
	Storage Temperature Limits	–40 °C to 65 °C (–40 °F to 149 °F)
	Continuous operation (for altitude less than 950 m or 3117 ft)	10 °C to 35 °C (50 °F to 95 °F) with no direct sunlight on the equipment.
Relative Humidity
	Storage	5% to 95% RH with 33 °C (91 °F) maximum dew point. Atmosphere must be non-condensing at all times.
	Operating	10% to 80% Relative Humidity with 29 °C (84.2 °F) maximum dew point.
Maximum Vibration
	Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations).
	Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum Shock
	Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 40 G for up to 2.3 ms.
	Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum Altitude
	Operating	3,0482000 m (10,0006560 ft)
	Storage	12,000 m (39,370 ft)
Operating Altitude De-rating
	Up to 35 °C (95 °F)	Maximum temperature is reduced by 1 °C/300 m (1 °F/547 ft) above 950 m (3,117 ft).
	35 °C to 40 °C (95 °F to 104 °F)	Maximum temperature is reduced by 1 °C/175 m (1 °F/319 ft) above 950 m (3,117 ft).
	40 °C to 45 °C (104 °F to 113 °F)	Maximum temperature is reduced by 1 °C/125 m (1 °F/228 ft) above 950 m (3,117 ft).

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.

NOTE: This section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous contamination. If it is determined that levels of particulates or gaseous pollution are beyond the limits specified in the following table and are the reason for the damage and/or failures to your equipment, it may be necessary for you to re-mediate the environmental conditions that are causing the damage and/or failures. Re-mediation of environmental conditions will be the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination		Specifications
Air Filtration NOTE: Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.		Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive Dust NOTE: Applies to data center and non-data center environments.		Air must be free of conductive dust, zinc whiskers, or other conductive particles.
Corrosive Dust NOTE: Applies to data center and non-data center environments.		Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination		Specifications

Copper Coupon Corrosion Rate		<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver Coupon Corrosion Rate		<200 Å/month as defined by AHSRAE TC9.9.

Expanded operating temperature

NOTE: For additional information about environmental measurements for specific system configurations, see Dell.com/environmental_datasheets.

Table 1. Expanded Operating TemperatureWhen the system is in continuous operation, the expanded operating temperature ranges from 5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, derate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is –5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, derate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Condition		Temperature
Continuous operation		5 °C to 40 °C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate continuously down to 5°C or as high as 40°C. For temperatures between 35°C and 40°C, derate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
< 1% of annual operating hours		–5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10 °C to 35 °C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, derate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded Operating Temperature Restrictions		For low-power CPUs (55 W/ 65 W), both the internal cooling fan and the external cooling fan must be installed. The operating temperature that is specified is for a maximum altitude of 30482000 m (10,0006560 ft). GPU card is not supported. LRDIMM is not supported. Nonredundant power supplies are not supported. Cabled power supply units are not supported. Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.

NOTE: When operating in the expanded temperature range, system performance may be impacted.

NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported in the System Event Log.