Dell EMC PowerEdge T40 Technical: характеристики и спецификации

Chassis dimensions

The image shows system dimensions. — Figure 1. Chassis dimensions

Table 1. PowerEdge T40 chassis dimensionsThis table provides the dimensions of the PowerEdge T40 system:
X	Y	Z
176.6 mm (6.95 inches)	335 mm (13.18 inches)	359.5 mm (14.15 inches)

System weight

Table 1. PowerEdge T40 system weightChassis weight of PowerEdge T40 system is 10.6 kilograms with 8 x 3.5-inch drives.
System configuration	Maximum weight (with all drives/SSDs)
1x 3.5-inch drive	8.4 Kg (18.52 lb)

Processor specifications

The PowerEdge T40 system supports the following processors:

Table 1. Processor SpecificationsThis table describes Processor Specifications
Supported processor	Model	UMA Graphics
Intel Xeon E	E series	Intel UHD Graphics P630
Intel Core i3	i3-9100	Intel UHD Graphics 630
Intel Pentium Gold	G5400	Intel UHD Graphics 610

NOTE Processor availability is subject to change and may vary by region/country.

Supported operating systems

The PowerEdge T40 supports the following operating systems:

Microsoft Windows Server 2016
Microsoft Windows Server 2019
Ubuntu 18.04 LTS

NOTE For more information, go to www.dell.com/ossupport.

NOTE For more information about the specific versions and additions, go to https://www.dell.com/support/home/Drivers/SupportedOS/poweredge-T40.

PSU specifications

The PowerEdge T40 system supports one cabled AC power supply unit (PSU).

Table 1. PSU specificationsThis table describes the PSU specifications
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	Current
300 W AC	Bronze	1024 BTU/hr	50 – 60 Hz	100 – 240 V AC, autoranging	6A

NOTE Heat dissipation is calculated by using the PSU wattage rating.

NOTE The PowerEdge T40 system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.

System fan specifications

The PowerEdge T40 system supports the following:

One system cooling fan located at the top of the system.
One processor cooling fan located on the heat sink.

NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

System battery specifications

The PowerEdge T40 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card specifications

The PowerEdge T40 system supports up to three PCI express (PCIe) Generation 3 and once PCI card.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots supported on the PowerEdge T40 system board.
PCIe slot	Slot Type	Processor Connection	PCIe slot height	Maximum Add-in Card Length
Slot 1	PCIe x16 Gen3	Processor	Full Height	Half length
Slot 2	PCI	Platform Controller Hub	Full Height	Half length
Slot 3	PCIe x4 Gen 3 (open ended)	Platform Controller Hub	Full Height	Half length
Slot 4	PCIe x4 Gen 3 (open ended)	Platform Controller Hub	Full Height	Half length

NOTE The expansion cards are not hot swappable.

Memory specifications

CAUTION Dell recommends you to use ECC DIMMs to minimize the risk of uncorrectable system error, data loss and/or silent data corruption. Non-ECC DIMM is not used for mission-critical applications.

NOTE Mixing ECC DIMMs and non-ECC DIMMs is not supported.

NOTE Non-ECC DIMMs are supported only in selected countries, for more information contact your sales representative.

Table 1. Memory specificationsThe table below shows the memory specifications for the PowerEdge T40 system:
DIMM Type	DIMM capacity	Minimum RAM	Maximum RAM
UDIMM, DDR4, ECC/Non-ECC	8 GB	8 GB	32 GB
UDIMM, DDR4, ECC/Non-ECC	16 GB	16 GB	64 GB

Table 2. Memory module socketsThe table below shows the memory module sockets for the PowerEdge T40 system:
Memory module sockets	Speed
Four 288-pin	2666 MT/s

NOTE Memory speed maybe downgraded from 2666 MT/s to 2133 MT/s based on processor capability.

Storage controller specifications

The PowerEdge T40 system supports Intel Virtual RAID on CPU (Intel VROC) software RAID.

NOTE Intel VROC supports RAID modes 0, 1, 5, and 10.

NOTE The PowerEdge T40 system does not support RAID 10 as RAID 10 is supported only on systems with 4 drives.

Drives

The PowerEdge T40 system supports the following drive configurations:

Table 1. Drive configurationsThis table list out the supported drive configurations
Configuration	Capacity
Up to 3 x 3.5-inch drive cabled SATA drives.	1 / 2 / 4 TB

NOTE The PowerEdge T40 system only supports entry drives.

Entry Drives : Least expensive drives used in applications where low usage and limited total number of drives are applicable. Due to restrictions on use, these drives are available in a small number of systems and configurations.

Optical drives

The PowerEdge T40 system supports the following optical drives.

Table 1. Supported optical drive typeThis table shows the supported optical drive type
Supported drive type	Supported number of drives
Slim 9.5 mm SATA DVD+/-RW drive	One

NOTE External optical drives can be connected through the USB ports.

USB ports specifications

The PowerEdge T40 system supports the USB ports mentioned below:

Table 1. PowerEdge T40 system USB specificationsThe following table shows the USB specifications for the PowerEdge system.
Front Panel	Rear Panel
Two USB 2.0-compliant Type-A ports One USB 3.0 Type-A compliant port One USB 3.1-compliant Type-C port	Four USB 3.0 Type-A compliant ports Two USB 2.0 Type-A compliant ports

NIC port specifications

The PowerEdge T40 system supports a Network Interface Controller (NIC) port on the back panel, which is available in 10/100/1000 Mbps NIC configurations.

Serial connector specifications

The PowerEdge T40 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

DisplayPort specifications

The PowerEdge T40 system supports two DisplayPorts located on the back panel of the system.

Video specifications

The PowerEdge T40 system supports:

Intel UHD Graphics P630 for Intel Xeon E processor
Intel UHD Graphics 630 for Intel Core i3 processor
Intel UHD Graphics 610 for Intel Pentium Gold processor

Environmental specifications

NOTE For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/support/home.

Table 1. Temperature specifications When the system is in continuous operation (for altitude less than 950 m or 3117 feet), the temperature specification ranges 10°C to 35°C (50–95°F) with no direct sunlight on the equipment. When the system is not in operation, the temperature specification is -40°C to 65°C (-40°F to149°F). For more information about fresh air, see the Expanded operating temperature section. The maximum temperature gradient for both operation and nonoperational systems is 20°C/h (36°F/h). Information about fresh air specification is described in the Expanded operating temperature section.
Temperature	Specifications
Storage	-40–65°C (-40–149°F)
Continuous operation (for altitude less than 900 m or 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Fresh air	T40 do not support Fresh air (Expanded operating temperature)
Maximum temperature gradient (operating and storage)	20°C/h (36°F/h)

Table 2. Relative humidity specificationsFor a nonoperational system, the ambient relative humidity ranges from 5% to 95% with 33°C (91°F) maximum dew point. Atmosphere must be noncondensing at all times. For an operational system, the ambient relative humidity ranges from 10% to 80% with 29°C (84.2°F) maximum dew point.
Relative humidity	Specifications
Storage	5% to 95% RH with 27°C (80.6°F) maximum dew point. Atmosphere must be noncondensing at all times.
Operating	20% to 80% RH with 21°C ( 69.8 °F ) maximum dew point.

Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Table 5. Maximum altitude specificationsThe maximum altitude specification for an operational system is 3048 m (10,000 ft). The maximum altitude specification for a nonoperational system is 12,000 m (39,370 ft).
Maximum altitude	Specifications
Operating	3048 m (10,000 ft)
Storage	12,000 m (39,370 ft)

Table 6. Operating temperature derating specificationsIf the operating temperature of a system is up to 35°C (95°F), the maximum temperature is reduced by 1°C/300 m (1°F/547 feet) above 950 m (3,117 feet). If the operating temperature of a system is 35°C to 40°C (95°F to 104°F), the maximum temperature is reduced by 1°C/175 m (1°F/319 feet) above 950 m (3,117 feet). If the operating temperature of a system is 40°C to 45°C (104°F to 113°F), the maximum temperature is reduced by 1°C/125 m (1°F/228 feet) above 950 m (3,117 feet).
Operating temperature derating	Specifications
Up to 35°C (95°F)	Maximum temperature is reduced by 1°C/300 m (1°F/547 ft), above 900 m (2,953 ft).

Thermal restriction matrix

Table 1. Thermal restrictions matrixThe following table describes the thermal restriction matrix for the Dell EMC PowerEdge T40 system.
Ambient	25°C	30°C	35°C
Processor	No restriction	No restriction	No restriction
DIMM	No restriction	No restriction	No restriction
Drive	Limited to entry drives with power less than 6.8W Or No restriction to 1 / 2 TB 7200 rpm and 4 TB 5400 rpm NOTE The PowerEdge T40 does not support enterprise-class drives.
Card	Limited to Tier 2 PCIe cards Or PCIe cards do not require system level cooling assistance up to a local ambient temperature of 55°C

Particulate and gaseous contamination specifications

Table 1. Particulate contamination specificationsThe following table shows the particulate contamination specifications:
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe following table shows the gaseous contamination specifications:
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate	<200 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Dell EMC PowerEdge T40 Technical: технические характеристики и спецификации