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Сервер Dell PowerEdge T350 210-BBSR
Сервер Dell PowerEdge T350 210-BBSR
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Dell EMC PowerEdge T350: технические характеристики и спецификации

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension.
Table 1. Chassis dimension for the systemThis table provides the dimensions of the system:
Drives Xa Xb Ya Yb Yc Za Zb Zc
8 x 3.5-inch / 4 x 3.5-inch175 mm (6.88 inches) N/A 369.5 mm (14.54 inches) 382.5 mm (15.05 inches) N/A With bezel: 19 mm (0.74 inches) 560.5 mm (22.06 inches) 562.12 mm (22.13 inches)

System weight

Table 1. PowerEdge T350 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
4 x 3.5-inch 19.54 kg (43.07 pound)
8 x 3.5-inch 25.34 kg (55.86 pound)

Processor specifications

Table 1. PowerEdge T350 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
Intel Xeon E-2300 Series processor with up to 8 cores or Intel Pentium processor with up to 2 cores One

PSU specifications

The PowerEdge T350 system supports up to one cabled or two redundant AC power supply units (PSUs).
Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) Frequency Voltage AC DC Current
High line 200 - 240 V Low line 100 - 120 V
450 W AC Bronze 1871 BTU/hr 50/60 Hz 100 - 240 V, autoranging 450 W 450 W N/A 6.5 - 3.5 A
600 W AC Platinum 2250 BTU/hr 50/60 Hz 100 - 240 V, autoranging 600 W 600 W N/A 7.1 - 3.6 A
600 W Mixed Mode HVDC N/A 2250 BTU/hr N/A 240 V N/A N/A 600 W 2.9 A
NOTE This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
NOTE Heat dissipation is calculated using the PSU wattage rating.
NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at Dell.com/calc.

Cooling fan specifications

The PowerEdge T350 system supports up to one cabled fan connected to the system board.

Supported operating systems

The PowerEdge T350 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • VMware ESXi
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server

For more information, go to www.dell.com/ossupport.

System battery specifications

The PowerEdge T350 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge T350 system supports up to two Gen4, and two Gen3 PCI express (PCIe) expansion cards.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Risers Processor connection PCIe slot height PCIe slot length PCIe slot width
Slot 1 (Gen4) N/A Processor 1 Full height Half length x4 link in x8 slot
Slot 2 (Gen4) N/A Processor 1 Full height Full length x16
Slot 3 (Gen3) N/A Platform Controller Hub Full height Half length x1
Slot 4 (Gen3) N/A Platform Controller Hub Full height Half length x4 link in x8 slot
NOTE Slot 1 function is disabled, when using Intel Pentium processor.

Memory specifications

The PowerEdge T350 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor
Minimum system capacity Maximum system capacity
UDIMM Single rank 8 GB 8 GB 32 GB
16 GB 16 GB 64 GB
Dual rank 32 GB 32 GB 128 GB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
4, 288-pin 3200 MT/s, 2933 MT/s, 2666 MT/s
NOTE Memory DIMM slots are not hot pluggable.
NOTE Dual rank UDIMMs with two DIMMs per channel (2DPC) limits the speed to 2933 MT/s.

Storage controller specifications

The PowerEdge T350 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Internal controllers External HBA
  • S150
  • PERC H755
  • PERC H355
  • PERC H345
  • HBA355i
  • HBA355e (non-RAID)

Drives

The PowerEdge T350 system supports:
  • 4 x 3.5-inch hot-swappable SAS, SATA drives.
  • 8 x 3.5-inch hot-swappable SAS, SATA drives.
NOTE Supports 2.5-inch drive in 3.5-inch hybrid drive carrier.

Optical drives

The PowerEdge T350 system supports one Slim SATA DVD-ROM drive or DVD +/- RW drive.
NOTE DVD devices support only data.

USB ports specifications

Table 1. PowerEdge T350 USB specificationsThe following table shows the USB specifications for the system:
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 3.0-compliant port One USB 2.0-compliant port Five Internal USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One USB 3.0-compliant ports One
NOTE The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NIC port specifications

The PowerEdge T350 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on Motherboard.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM 1 GbE x 2

VGA ports specifications

The PowerEdge T350 system supports One DB-15 VGA port on the back panel.

Serial connector specifications

The PowerEdge T350 system supports one serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

IDSDM (optional)

The PowerEdge T350 system supports Internal Dual SD module (IDSDM).

The IDSDM supports two SD cards and is available in the following configurations:

Table 1. Supported SD card storage capacityThis table lists the storage capacity of the supported SD cards
IDSDM card
  • 16 GB
  • 32 GB
  • 64 GB
NOTE One IDSDM card slot is dedicated for redundancy.
NOTE Use Dell EMC branded SD cards that are associated with the IDSDM configured systems.

Video specifications

The PowerEdge T350 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options for the system
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60, 72, 75, 85 8, 16, 32
1280 x 800 60, 75 8, 16, 32
1280 x 1024 60, 75, 85 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60, 75, 85 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60, 65, 70, 75, 85 8, 16, 32
1680 x 1050 60, 75, 85 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60, 75, 85 8, 16, 32

Environmental specifications

NOTE For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on www.dell.com/support/home.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Common Environmental Specifications for ASHRAE A2, A3, and A4 This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE * - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10 min (all x, y, and z axes)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications This table shows the particulate contamination specifications.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications This table shows the gaseous contamination specifications.
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal air restrictions

  • Two PSUs are required in redundant mode, however PSU failure is not supported.
  • Non Dell qualified peripheral cards or peripheral cards greater than 25 W are not supported.
  • GPU is not supported.
  • The operating temperature is for a maximum altitude of 950 m for fresh air cooling.
  • Because of single fan in the system, cooling redundancy is not supported.
NOTE DIMM blank is not required.