Dell SD630-S–Storage Designed for Scality RING: руководство по обслуживанию

Chassis dimensions

Table 1. Dimensions of the Dell Dell SD630-S systemThis table describes about the dimensions of the Dell SD630-S system.The dimensions of 8 x 2.5 inch hard drive systems are as follows: Xa=482.4 mm, Xb=434.0 mm, Y=42.8 mm, Za (with bezel) =35.0 mm, Za (without bezel) =20.4 mm, Zb=682.7 mm, and Zc=701.3 mm. The dimensions of 10 x 2.5 inch and 24 x 2.5 inch hard drive systems are as follows: Xa=482.4 mm, Xb=434.0 mm, Y=42.8 mm, Za (with bezel) =35.0 mm, Za (without bezel)=20.4 mm, Zb=731.0 mm, and Zc=752.1 mm.
System	Xa	Xb	Y	Za (with bezel)	Za (without bezel)	Zb	Zc
Eight x 2.5-inch hard drive systems	482.4 mm	434.0 mm	42.8 mm	35.0 mm	20.4 mm	682.7 mm	701.3 mm

Chassis weight

Table 1. Chassis weightThe maximum weight of eight x 2.5-inch hard drive systems is 16.9 kg (37. 26 lb). For 8 x 2.5 inch hard drive systems, the maximum chassis weight is 16.9 kg (37.26 lb). For 10 x 2.5 inch hard drive systems, the maximum chassis weight is 18.5 kg (40.79 lb). For 24 x 1.8 inch hard drive systems, the maximum chassis weight is 17.4 kg (38.36 lb).
System	Maximum weight
Eight x 2.5-inch hard drive systems	16.9 kg (37. 26 lb)

Processor specifications

The Dell SD630–S system supports up to two Intel Xeon E5-2600 v3 and v4 product family processors.

PSU specifications

The Dell SD630-S system supports up to two AC or DC redundant power supply units (PSUs).

Table 1. PSU specificationsFor 495 W AC, platinum power supply unit, the maximum heat dissipation is 1908 BTU/hr, frequency is 50/60 Hz, and voltage range is 100240 V AC autoranging. For 750 W AC platinum PSU, the maximum heat dissipation is 2891 BTU/hr, frequency is 50/60 Hz, and voltage range is 100240 V AC autoranging. For 750 W AC titanium PSU, the maximum heat dissipation is 2843 BTU/hr, frequency is 50/60 Hz, and voltage range is 200240 V AC autoranging. For 1100 W AC platinum PSU, the maximum heat dissipation is 4100 BTU/hr, frequency is 50/60 Hz, and voltage range is 100-240 V AC autoranging. For 1100 W DC PSU, the maximum heat dissipation is 4416 BTU/hr and the voltage range is – (4860) V DC. For 750 W DC platinum PSU, the maximum heat dissipation is 2902 BTU/hr, frequency is 50/60 Hz, and voltage range is 100240 V AC and 240 DC. The 750 W DC PSU is applicable to China only.
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage
495 W AC	Platinum	1908 BTU/hr	50/60 Hz	100–240 V AC, autoranging
750 W AC	Platinum	2891 BTU/hr	50/60 Hz	100–240 V AC, autoranging
750 W AC	Titanium	2843 BTU/hr	50/60 Hz	200–240 V AC, autoranging
1100 W AC	Platinum	4100 BTU/hr	50/60 Hz	100–240 V AC, autoranging
1100 W DC	—	4416 BTU/hr	—	–(48–60) V DC
750 W DC (for China only)	Platinum	2902 BTU/hr	50/60 Hz	100–240 V AC and 240 V DC

NOTE: Heat dissipation is calculated by using the PSU wattage rating.

NOTE: This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 230 V.

System battery specifications

The Dell SD630-S system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The Dell SD630-S system supports PCI express (PCIe) generation 3 expansion cards, which must be installed on the system board by using expansion card risers. This system supports three types of expansion card risers. The following table provides detailed information about the expansion card riser specifications:

Table 1. Expansion card riser specificationsThe expansion card riser 1 has two PCIe slots. The dimensions of slot 1 are: Height=Low Profile, Length= Half length, Link Width=x16. The expansion card riser 2 has one PCIe slot. The dimensions of slot 1 are: Height=Low Profile, Length=Half length, Link Width=x8. The expansion card riser 3 has three PCIe slots. The dimensions of slot 1 are: Height=Low Profile, Length=Half length, Link Width=x16. The dimensions of slot 2 are: Height=Full height, Length=Three-fourth length, Link Width=x16. The dimensions of slot 3 are: Height=Low Profile, Length=Half length, Link Width=x16.
Expansion card riser	PCIe slots on the riser	Height	Length	Link
Riser 1	Slot 1	Low Profile	Half Length	x16
Riser 1	Slot 2	Low Profile	Half Length	x8
Riser 2	Slot 1	Low Profile	Half Length	x8
Riser 2	Slot 1	Low Profile	Half Length	x16
Riser 3	Slot 2	Full height	Three-fourth Length	x16
Riser 3	Slot 3	Low Profile	Half Length	x16

NOTE: When using slot 1 on the riser, ensure that both the processors are installed on the system.

NOTE: Only a three-fourth length card is supported for the PCIe expansion card slot (slot 2) on riser 3 when no mini-PERC card is installed. Supported length with mini-PERC card installed is half length.

Memory specifications

The Dell SD630-S system supports DDR4 registered DIMMs (RDIMMs) at 1866 MT/s, 2133 MT/s, or 2400 MT/s registered Error Correcting Code (ECC) DIMMs and supports Advanced ECC or memory-optimized operation.

Table 1. Memory specificationsThis table describes about memory specifications.
Memory module sockets	Memory capacity	Minimum RAM	Maximum RAM
Twenty-four 288-pins	8 GB or 32 GB single-, dual-, or quad-ranked (RDIMMs) 16 GB single- or dual-ranked, or 32 GB dual-ranked (RDIMMs)	8 GB with single processor 16 GB with single processor 32 GB with dual processors	RDIMM: up to 786 GB with dual processors

Hard drives

The Dell SD630-S system supports:

Up to eight 2.5-inch, internal, hot swappable SAS, SATA, or Nearline SAS hard drives

Optical drive

The Dell SD630-S system supports one optional SATA DVD-ROM drive or DVD+/-RW drive.

USB ports

The Dell SD630-S system supports:

USB 2.0-compliant ports on the front panel
USB 3.0-complaint ports on the back panel
Internal USB 3.0-compliant port

Table 1. USB specificationsThe 8 X 2.5 inch hard drive system supports two 4-pin, USB 2.0-compliant ports and a vFlash memory card slot on the front panel. The 24 x2.5 inch and 10x 2.5 inch hard drive systems support one micro USB 2.0-compliant port on the front panel. Your system supports two 9-pin, USB 3.0-compliant ports on the back panel and one 9-pin, USB 3.0-compliant internal port.
System	Front panel	Back panel	Internal
Dell SD630-S	Two 4-pin, USB 2.0-compliant ports vFlash memory card slot	Two 9-pin, USB 3.0-compliant ports	One 9-pin, USB 3.0-compliant

NIC ports

The Dell SD630-S system supports four Network Interface Controller (NIC) ports on the back panel, which is available in one of the following three NIC configurations:

Four 10/100/1000 Mbps
Two 10/100/1000 Mbps and two 100 Mbps/1 Gbps/10 Gbps
Four 10 Gbps

Serial connector

The serial connector connects a serial device to the system. The Dell SD630-S system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The Dell SD630-S system supports two 15-pin VGA ports on the front and back panels.

Video specifications

The Dell SD630-S system supports Integrated VGA controller with 16 MB capacity.

Table 1. Resolution information for video modesFor 640 x 480 resolution, the refresh rate is 60 to 70 Hz and the color depth is 8, 16, 32 bit. For 800 x 600 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 32 bit. For 1024 x 768 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 32 bit. For 1152 x 864 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 32 bit. For 1280 x 1024 resolution, the refresh rate is 60, 75 Hz and color depth is 8, 16, 32 bit. For 1440 x 900 resolution, the refresh rate is 60 Hz and color depth is 8, 16, 32 bit.
Resolution	Refresh rate (Hz)	Color depth (bit)
640 X 480	60, 70	8, 16, 32
800 X 600	60, 75, 85	8, 16, 32
1024 X 768	60, 75, 85	8, 16, 32
1152 X 864	60, 75, 85	8, 16, 32
1280 X 1024	60, 75	8, 16, 32
1440 X 900	60	8, 16, 32

Environmental specifications

NOTE: For additional information about environmental measurements for specific system configurations, see Dell.com/environmental_datasheets.

Table 1. Temperature specificationsWhen the system is in continuous operation (for altitude less than 950 m or 3117 ft), the temperature specification ranges from 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment. NOTE: Maximum of 145 W 22 core processor is supported in systems with eight 2.5-inches drives, two PCI slot chassis, and 75 W single wide active GPU. When the system is not in operation, the temperature specification is –40°C to 65°C (–40°F to 149°F). The Maximum temperature gradient for both opertaion and non-opertaional systems is 20°C/h (36°F/h). For information about fresh air, view the Expanded Operating Temperature section.
Temperature	Specifications
Storage	–40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment. NOTE: Maximum of 145 W 22 core processor is supported in systems with eight 2.5-inches drives, two PCI slot chassis, and 75 W single wide active GPU.
Maximum temperature gradient (operating and storage)	20°C/h (36°F/h)

Table 2. Relative humidity specificationsFor a non-operational system, the ambient relative humidity ranges from 5% to 95% with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times. For an operational system, the ambient relative humidity ranges from 10% to 80% with 29°C (84.2°F) maximum dew point.
Relative humidity	Specifications
Storage	5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating	10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.

Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a non-operational system is 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations).
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Table 4. Maximum shock specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axes of 40 G for up to 2.3 ms. The maximum shock specification of a non-operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 40 G for up to 2.3 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.

Table 5. Maximum altitude specificationsThe maximum altitude of an operational system is 3048 m (10,000 ft). The maximum altitude of a non- operational system is 12,000 m (39,370 ft).
Maximum altitude	Specifications
Operating	30482000 m (10,0006560 ft)
Storage	12,000 m (39,370 ft)

Table 6. Operating temperature de-rating specificationsIf the operating temerature of a system is up to 35 °C (95 °F), the maximum temperature is reduced by 1 °C/300 m (1 °F/547 ft) above 950 m (3,117 ft). If the operating temperature of a system ranges from 35 °C to 40 °C (95 °F to 104 °F), the maximum temperature is reduced by 1 °C/175 m (1 °F/319 ft) above 950 m (3,117 ft). If the operating temperature of a system ranges from 40 °C to 45 °C (104 °F to 113 °F), the maximum temperature is reduced by 1 °C/125 m (1 °F/228 ft) above 950 m (3,117 ft).
Operating temperature de-rating	Specifications
Up to 35°C (95°F)	Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F)	Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F)	Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the level of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate	<200 Å/month as defined by AHSRAE TC9.9.

NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Standard operating temperature

Table 1. Standard operating temperature specificationsThe standard operating temperature for altitude less than 950 metres or 3117 feet ranges from 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment. Note: Maximum of 145 W 22–core processor is supported in systems with eight 2.5-inch drives 2–PCI slot chassis, and 75 W single wide active GPU. The standard operating temperature restrictions are as follows: Ambient temperature is restricted to 30°C for systems with eight 2.5-inches drives or ten 2.5-inch drives chassis, with no PCIe SSD and a maximum of 160 W workstation processor. Ambient temperature is restricted to 30°C for systems with ten 2.5-inch drives chassis, PCIe SSD and a maximum of 135 W processor. Ambient temperature is restricted to 35°C for systems with ten 2.5-inch drives chassis, PCIe SSD and a maximum of 120 W processor. Ambient temperature is restricted to 35°C for systems with twenty-four 1.8-inch drives chassis, PCIe SSD, and a maximum of 135 W processor.
Standard operating temperature	Specifications
Temperature ranges (for altitude less than 950 metres or 3117 feet)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment. NOTE: Maximum of 145 W 22–core processor is supported in systems with eight 2.5-inch drives 2–PCI slot chassis, and 75 W single wide active GPU.
Standard operating temperature restrictions	Ambient temperature is restricted to 30°C for systems with eight 2.5-inches drives.

Expanded operating temperature

Table 1. Expanded operating temperature specificationsWhen the system is in continuous operation, the expanded operating temperature ranges from 5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is –5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature	Specifications
Continuous operation	5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours	–5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE: When operating in the expanded temperature range, system performance may be impacted.

NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD panel and in the System Event Log.

Expanded operating temperature restrictions

Do not perform a cold startup below 5°C.
The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
145 W and Workstation CPU (160 W) processors are not supported.
Two power supply units (PSUs) are needed and one PSU failure is not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
PCIe SSD and 1.8-inch SSDs are not supported.
GPU is not supported.