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Dell PowerEdge R760xs: руководство по обслуживанию
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Dell PowerEdge R760xs: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions

The image shows system dimensions.

Table 1. PowerEdgeR760xs chassis dimensionsThis table provides the dimensions of the system:
Xa Xb Y Za Zb Zc
482.0 mm (18.97 inches) 434.0 mm (17.08 inches) 86.8 mm (3.41 inches) 22.0 mm (0.86 inches) Without bezel

35.84 mm (1.41 inches) With bezel

677.44 mm (26.67 inches) Ear to L bracket housing

650.24 mm (25.6 inches) Ear to PSU surface

685.78 mm (26.99 inches) Ear to PSU handle without velcro strap
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R760xs systemweightThe table below shows the maximum weight of the chassis
System configuration Maximum weight (with all drives/SSDs/bezel)
16+8 x 2.5-inch 25.92 kg (57.14 lb)
16 x 2.5-inch 24.58 kg (54.18 lb)
12 x 3.5-inch 28.82 kg (63.53 lb)
8 x 3.5-inch 25.84 kg (54.96 lb)
8 x 2.5-inch 21.56 kg (47.53 lb)
No backplane configuration 19.40 kg (42.76 lb)

Processor specifications

Table 1. PowerEdge R760xs processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
5th Generation Intel Xeon Scalable processors with up to 28 cores Up to two
and 4th Generation Intel Xeon Scalable processors with up to 32 cores

PSU specifications

The PowerEdgeR760xssystem supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) AC Voltage DC Voltage Current (A)
100–120 V 200–240 V 277 V 240 V 336 V - (48 V — 60 V)
600 W mixed mode Platinum 2250 50/60 600 W 600 W N/A N/A N/A N/A 7.1 A - 3.6 A
N/A N/A N/A N/A N/A 600 W N/A N/A 2.9 A
700 W mixed mode HLAC Titanium 2625 50/60 N/A 700 W N/A N/A N/A N/A 4.1 A
N/A N/A N/A N/A N/A 700 W N/A N/A 3.4 A
800 W mixed mode Platinum 3000 50/60 800 W 800 W N/A N/A N/A N/A 9.2 A - 4.7 A
N/A N/A N/A N/A N/A 800 W N/A N/A 3.8 A
1100 W -48 V DC N/A 4265 N/A N/A N/A N/A N/A N/A 1100 W 27 A
1100 W mixed mode Titanium 4125 50/60 1050 W 1100 W N/A N/A N/A N/A 12 A - 6.3 A
N/A N/A N/A N/A N/A 1100 W N/A N/A 5.2 A
1400 W mixed mode Titanium 5250 50/60 1050 W 1400 W N/A N/A N/A N/A 12 A - 8 A
N/A N/A N/A N/A N/A 1400 W N/A N/A 6.5 A
1400 W mixed mode Platinum 5250 50/60 1050 W 1400 W N/A N/A N/A N/A 12 A - 8 A
N/A N/A N/A N/A N/A 1400 W N/A N/A 6.6 A
1400 W 277 V AC and HVDC Titanium 5250 50/60 N/A N/A 1400 W N/A N/A N/A 5.8 A
5250 N/A N/A N/A N/A N/A 1400 W N/A 5.17 A
1800 W mixed mode HLAC Titanium 6610 50/60 N/A 1800 W N/A N/A N/A N/A 10 A
N/A N/A N/A N/A N/A 1800 W N/A N/A 8.2 A
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:HLAC stands for High-Line AC, with a range of 200 - 240 V AC. HVDC stands for High-Voltage DC, with 336 V DC.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.
Figure 1. PSU power cords
this image shows list of PSU power cords
Figure 2. APP 2006G1 power cord

This image shows APP 2006G1power cord.

Figure 3. Lotes DC PSU connector

This images shows Lotes DC PSU connector

Table 2. PSU power cordsThe table lists the PSU power cords list .
Form factor Output Power cord
Redundant 60 mm 600 W Mixed Mode C13
700 W Mixed Mode HLAC C13
800 W Mixed Mode C13
1100 W Mixed Mode C13
1100 W -48 V DC Lotes DC PSU connector
1400 W Mixed Mode C13
1400 W 277 VAC and 336 VDC APP 2006G1
1800 W Mixed Mode HLAC C15
NOTE:C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Supported operating systems

The PowerEdge R760xs system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware vSAN/ESXi

For more information, go to Operating System Manuals.

Cooling fan specifications

Cooling fan specifications

The PowerEdgeR760xs system supports up to six Standard (STD) fans , High performance (HPR) gold fans , or Very high performance fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
Standard fan STD STD No label This shows the Standard fan image.
High-performance fan (Silver grade) fanHPR SLVR HPR Silver
NOTE:New cooling fans come with the High-Performance Silver Grade label. While the older cooling fans have the High-Performance label.
Figure 1. High performance fan
This image shows High Performance fan
Figure 2. High performance (Silver grade) fan
This image shows High performance fan - Silver Grade
High-performance fan (Gold grade) fanHPR GOLD VHPR - Very High Performance Gold
NOTE:New cooling fans come with the High-Performance Gold Grade label. While the older cooling fans have the High-Performance label.
Figure 3. Very high performance fan
This image shows Very High performance fan
Figure 4. High performance (Gold grade) fan
This image shows Very High Performance fan - Gold Grade

System battery specifications

The PowerEdge R760xs system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R760xs system supports up to four PCIe Gen5 cards on the system board.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
Slot no Card support CPU1 CPU2
R1C R1D Integrated Integrated R1C
PCIe Slot-1 SW-HL-LP N/A N/A x16 N/A N/A
PCIe Slot-2 SW-HL-LP N/A N/A x8 N/A N/A
PCIe Slot-3 SW-HL-LP x16 (Gen5) x8 (Gen5) N/A N/A N/A
PCIe Slot-4 SW-HL-LP N/A x8 (Gen5) N/A N/A x16 (Gen5)
PCIe Slot-5 SW-HL-LP N/A N/A N/A x16 N/A
PCIe Slot-6 SW-HL-LP N/A N/A N/A x16 N/A
Table 2. Label referenceThis table describes the label references used in the expansion table.
Label Description
SW Single Width
DW Double Wide (Xilinx FPGA accelerator)
FH Full height
HL Half length

Memory specifications

The PowerEdge R760xs system supports the following memory specifications for optimized operation.
Table 1. Memory specifications for 4th Generation Intel Xeon Scalable Processors The table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum memory capacity Maximum memory capacity Minimum memory capacity Maximum memory capacity
RDIMM Single rank 16 GB 16 GB 128 GB 32 GB 256 GB
Dual rank 32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
Table 2. Memory module sockets or 4th Generation Intel Xeon Scalable Processors The table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 4000 MT/s, 4400 MT/s, 4800 MT/s
Table 3. Memory specifications for 5th Generation Intel Xeon Scalable Processors The table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum memory capacity Maximum memory capacity Minimum memory capacity Maximum memory capacity
RDIMM Single rank 16 GB 16 GB 128 GB 32 GB 256 GB
Dual rank 32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
96 GB 96 GB 768 GB 192 GB 1.5 TB
Table 4. Memory module sockets for 5th Generation Intel Xeon Scalable ProcessorsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 4000 MT/s, 4400 MT/s, 4800 MT/s, 5200 MT/s, 5600 MT/s
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The speed of the rated DIMM may reduce depending on the processor installed.

Storage controller specifications

The PowerEdge R760xs system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H965i
  • PERC H755N
  • PERC H755
  • PERC H355
  • HBA355i
  • HBA465i
External controllers
  • HBA355E adapter
  • HBA965e
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 1, 2 x M.2 SSDs
  • USB
Software RAID
  • S160

Drives

The PowerEdge R760xs system supports:
  • 8 x 3.5-inch SAS/SATA drives
  • 12 x 3.5-inch SAS/SATA drives
  • 8 x 2.5-inch SAS/SATA (HDD/SSD) drives
  • 8 x 2.5-inch NVMe drives
  • 16 x 2.5-inch SAS/SATA (HDD/SSD) drives
  • 16 x 2.5-inch SAS/SATA (HDD/SSD) drives + 8 x 2.5-inch NVMe drives
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdge R760xs USB specifications The following table shows the USB specifications :
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One Internal USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0- compliant port) One USB 3.0-compliant port One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
NOTE:The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.
NOTE:The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

Serial connector specifications

The PowerEdge R760xs system supports one serial port on the system board, which is Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

NIC port specifications

The PowerEdge R760xs supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM 1 GB x 2
OCP card (OCP 3.0) (optional) 1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4

VGA ports specifications

The PowerEdge R760xs system supports two DB-15 VGA ports, one each on the front and rear panels of the system.

Video specifications

The PowerEdge R760xs system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Thermal restriction matrix

Table 1. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
STD HSK < 185 W CPU SKUs
HPR HSK 185 W-250 W CPU SKUs (12 x 3.5-inch drive configuration not supported)
125W-250W CPU SKUs (12 x 3.5-inch drive configuration supported)
Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR (Silver) High Performance Silver (HPR) fan
HPR (Gold) High Performance Gold (VHP) fan
HSK Heat sink
NOTE:The ambient temperature of the configuration is determined by the critical component in that configuration. For example, if the processor's supported ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the combined configuration can only support 30°C.
Table 3. Supported ambient temperature for processors for R760xsThis table describes Supported ambient temperature for processors for R760xs.
R760xs
configuration No backplane 8 x 3.5-inch SAS configuration 12 x 3.5-inch SAS configuration 12 x 3.5-inch configuration with rear drive module 8 x 2.5-inch SAS configuration 8 x 2.5-inch NVMe configuration 16 x 2.5-inch SAS configuration 16 x 2.5-inch + 8 x 2.5-inch NVMe configuration
EMR MCC CPU 4514Y 150 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
5512U 185 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
6526Y/6534 195 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6548Y+/6542Y/6548N 250 W 35°C 35°C 30°C 30°C 35°C 35°C 35°C 35°C
SPR LCC CPU 4509Y 125 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
4510 150 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
SPR MCC CPU 3408U 125 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
5416S/4410T/4410Y/5415+ 150 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
4416 165 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
5418Y/5412U/6426Y 185 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
5420+/6438Y+ 205 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6448Y/6442Y 225 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6414U 250 W 35°C 35°C 30°C 30°C 35°C 35°C 35°C 35°C
Memory 96 GB RDIMM 5200 8.1 W, 1DPC 35°C 35°C 30°C 30°C 35°C 35°C 35°C 35°C
64 GB RDIMM 5200 7.7 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
32 GB RDIMM 5200 5.1 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
64 GB RDIMM 4800 12 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
32 GB RDIMM 4800 10 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
PCIe 45°C 40°C 35°C1 35°C1 40°C 40°C 40°C 40°C
A2 GPU6 35°C 30°C Not supported Not supported 35°C 35°C 30°C 30°C
OCP 45°C 40°C 35°C2 35°C2 40°C 40°C 40°C 40°C
BOSS 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
NOTE:
  1. Max supported thermal tier of PCIe card is Tier 5.
  2. Max supported thermal tier of OCP is Tier 5.
  3. HPR Sliver fan is required from fan zone 2 to fan zone 6 for 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA + 8 x 2.5-inch NVMe, 12 x 3.5-inch drives or GPU configurations.
  4. Optional fan zone 1 has to be populated with HPR Gold fan is for BOSS, GPU or rear drive module populations.
  5. PCIe slot priority of Nvidia A2 GPU is constrained on slot #3, #4, #6.
  6. HPR heatsink is required for ≥ 185 W CPUs, 12 x 3.5-inch drives or 12 x 3.5-inch drives with rear storage module configurations.
  7. DIMM blank is required for 12 x 3.5-inch SAS/SATA with rear storage module.
  8. Fan blank is required on fan zone 1 when no fan population.
  9. OCP shroud is required for OCP card population without PCIe riser module installed.
  10. CPU blank is required for single processor configuration.
  11. Rear drive module does not support Kioxia CM6 series, Samsung PM1735 series, Hynix PE8010/PE8110 ≥ 7.68 TB, Samsung PM1733a > 1.92 TB, Samsung PM1735a > 1.6 TB and Redtail NVMe drive.
NOTE: The fan speed in the 3.5-inch chassis is limited to 90% due to the drive dynamic profile.
Table 4. Fan population rule for R760xsThis table shows fan population rule for R760xs.
configuration No backplane 8 x 3.5-inch SAS 12 x 3.5-inch SAS 8 x 2.5-inch SAS 8 x 2.5-inch NVMe 16 x 2.5-inch SAS 24 x 2.5-inch (16 x 2.5-inch + 8 x 2.5-inch NVMe)
Optional HW
Default Fan 2 to Fan 6 with STD fan Fan 2 to Fan 6 with STD fan Fan 2 to Fan 6 with HPR Silver fan Fan 2 to Fan 6 with STD fan Fan 2 to Fan 6 with HPR Silver fan Fan 2 to Fan 6 with STD fan Fan 2 to Fan 6 with HPR Silver fan
Rear Module Not supported Not supported

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

 Not supported Not supported Not supported Not supported
BOSS N1

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan
GPU

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

 Not supported

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Thermal Restrictions for PCIe adapter NIC and other network cards with iDRAC

  • Cannot support PCIe cards with the cooling requirement more than 300LFM at 55C in a 12 x 3.5-inch SAS/SATA configuration.
  • Solarflare Melrose DP 25 GBE SFP28 (TTKWY) not supported with 12 x 3.5-inch SAS/SATA configuration.
  • 100 Gb network adapter or 100 Gb OCP is not supported in the 12 x 3.5-inch SAS/SATA configuration.
  • Few 25 GB OCP cards with the cooling requirement more than 250LFM at 55C (3Y64D/4TRD3 / GGGDF/R1KTR / Y4VV5) is not supported in 12x3.5" SAS/SATA configuration.
  • The 12 x 3.5-inch SAS/SATA configuration requires the optical transceiver with higher temperature spec (≥ 85°C) to support (M14MK / N8TDR).
  • Quad port OCP (3Y64D/Y4VV5) requires the optical transceiver with higher temperature spec (≥ 85°C) to support (M14MK).
  • 100 Gb network adapter cannot support the transceivers as 14NV5/9JKK2 / QSFP56 (MFS1S00-VxxxE/HxxxE).
  • The H965e is limited to populate in PCI slot 3 in a 12 x 3.5-inch SAS/SATA configuration.
  • Mellanox CX7 NDR200 card has few limitations of PCI slot locations.
    Table 5. Mellanox CX7 NDR200 slot location limitationsThis table shows Mellanox CX7 NDR200 slot location limitations.
    Storage configuration Slots on 3.5-inch configuration Slots on 2.5-inch configuration
    Gen5 PCIe sloit support for CX7 NDR200 3, 4 3, 4
    Gen4 PCIe sloit support for CX7 NDR200 6 5, 6

Thermal restrictions for extended ambient support (ASHRAE A3/A4)

  • Two PSUs are required in redundant mode. Single PSU failure is not supported.
  • 12 x 3.5-inch SAS/SATA configuration is not supported.
  • BOSS(M.2) module is not supported.
  • CPU TDP > 185 W is not supported.
  • PCIe card TDP > 25 W is not supported.
  • OCP cards with transmission rate higher than 25 GB is not supported.
  • OCP transceiver spec ≤ 75°C is not supported.
  • 8 x 3.5-inch SAS/SATA, 8 x 2.5-inch SAS/SATA, 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA, 16 x 2.5-inch SAS/SATA + 8x 2.5-inch NVMe configurations are limited to support A3.
  • 128 GB+ memory is not supported .
  • The rear drive is not supported.

Thermal air restrictions

Table 1. Air cooling configurations thermal restriction for AHSRAE A3 and A4This table provides information about ASHRAE A3 and A4 restrictions for air cooling configuration.
ASHRAE A3/40°C (104°F) A4/45°C (113°F)
PSU Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe card Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
Processor CPU TDP > 185W is not supported
Front storage 12 x 3.5-inch SAS/SATA config is not supported 12 x 3.5-inch SAS/SATA configuration is not supported
8 x 3.5-inch SAS/SATA, 8 x 2.5-inch SAS/SATA, 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA, 16 x 2.5-inch SAS/SATA+ 8 x 2.5-inch NVMe configs are limited in A3 0 drive configuration is supported
Rear storage Not supported
OCP OCP card with transmission rate higher than 25G is not supported
OCP transceiver spec ≤ 75C is not supported
BOSS Not supported