Dell PowerEdge R960: руководство по обслуживанию

Chassis dimensions

This image shows chassis dimension for the PowerEge R7525 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR960 chassis dimensionsThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za	Zb	Zc
For all drive configurations	482.0 mm (18.97 inches)	444.0 mm (17.48 inches)	174.3 mm (6.86 inches)	36 mm (1.41 inches)With bezel22 mm (0.86 inches)Without bezel	844.74 mm (33.25 inches)Ear to rear wall	847.195 mm (33.35 inches)Ear to PSU handle

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R960 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives)
A server with fully populated drives	60.2 kg (132.71 lbs)
A server without drives and PSU installed	N/A

Processor specifications

Table 1. PowerEdge R960 processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
4^th Gen Intel® Xeon® Scalable Processors ("H" SKUs)	Up to four

PSU specifications

The PowerEdgeR960system supports up to four AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Voltage	AC		DC	Current (A)
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Voltage	High line wattage (200—240 V AC)	Low line wattage (100—120 V AC)	DC	Current (A)
1100 W mixed mode	Titanium	4100	50/60	100—240 V AC	1100 W	1050 W	N/A	12—6.3
1100 W mixed mode	N/A	4100	N/A	240 V DC	N/A	N/A	1100 W	5.2
1400 W mixed mode	Platinum	5250	50/60	100—240 V AC	1400 W	1050 W	N/A	12—8
1400 W mixed mode	N/A	5250	N/A	240 V DC	N/A	N/A	1400 W	6.6
1800 W mixed mode	Titanium	6750	50/60	200—240 V AC	1800	N/A	N/A	10
1800 W mixed mode	N/A	6750	N/A	240 V DC	N/A	N/A	1800 W	8.2
2400 W mixed mode	Platinum	9000	50/60	100—240 V AC	2400 W	1400 W	N/A	16—13.5
2400 W mixed mode	N/A	9000	N/A	240 V DC	N/A	N/A	2400 W	11.2
2800 W mixed mode	Titanium	10500	50/60	200—240 V AC	2800 W	N/A	N/A	15.6
2800 W mixed mode	N/A	10500	N/A	240 V DC	N/A	N/A	2800 W	13.6
1100 W -48 V DC	N/A	4267	N/A	(-48) - (-60) VDC	N/A	N/A	1100 W	27

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

NOTE:If a system with AC 2400 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is degraded to 1400 W.

NOTE:If a system with AC 1400 W or 1100 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is degraded to 1050 W.

this image shows list of PSU power cords — Figure 1. PSU power cords

This image shows the DC power cord — Figure 1. PSU power cords

Table 2. PSU power cordsThe table lists the PSU power cords list .
Form factor	Output	Power cord
Redundant 60 mm	1100 W AC	C13
	1400 W AC	C13
	1800 W AC	C15
	1100 W -48 V DC	LOTES APOW0097
Redundant 86 mm	2400 W AC	C19
Redundant 86 mm	2800 W AC	C21

NOTE:C19 power cord combined with C20 to C21 jumper power cord can be used to adapt 2800 W PSU.

NOTE:C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

NOTE:When installing a 60 mm PSU, a 26 mm PSU adapter is required, see Installing a power supply unit adapter.

Cooling fan specifications

Cooling options

The PowerEdgeR960 requires various cooling components that are based on processor TDP, storage modules, and GPU to maintain optimum thermal performance.

The PowerEdgeR960 offers two types of cooling option:

Air cooling
Direct Liquid Cooling (DLC) (optional)

Cooling fan specifications

The PowerEdgeR960system system supports up to six sets of Standard cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Label color	Label image
Standard (STD) fans	STD	N/A

NOTE:See the Thermal restriction matrix for required fan support with air cooled and DLC configurations.

Supported operating systemsR960

The PowerEdge R960 system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi

NOTE:Intel Xeon® 6300 series CPUs do not support Windows Server 2019.

For more information, go to Operating System Manuals.

System battery specifications

The PowerEdge R960 system uses one CR 2032 3.0 V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R960 system supports up to 12 PCI express (PCIe) Gen5 slots (10 Full Height and 2 Low Profiles) on the system board.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
Expansion card riser	PCIe slots	Processor connection	Height	Length	Slot width
Riser 1A	Slot 1	Processor 3	Full Height	Full Length	x16
Riser 1A	Slot 3	Processor 1	Full Height	Full Length	x16 (Double width GPU)
Riser 1B	Slot 1	Processor 3	Full Height	Half Length	x16
	Slot 2	Processor 1
	Slot 3	Processor 1
Riser 1C	Slot 1	Processor 3	Full Height	Half Length	x16
Riser 1C	Slot 3	Processor 1	Full Height	Half Length	x16
Riser 2	Slot 4	Processor 2	Low Profile	Half Length	x16
Riser 2	Slot 9	Processor 1	Low Profile	Half Length	x16
Riser 3A	Slot 6	Processor 4	Full Height	Full Length	x16 (Double width GPU)
Riser 3A	Slot 8	Processor 3	Full Height	Full Length	x16 (Double width GPU)
Riser 3B	Slot 5	Processor 4	Full Height	Half Length	x16
	Slot 6	Processor 4
	Slot 7	Processor 3
	Slot 8	Processor 3
Riser 3B (In scale out configuration)	Slot 5	Processor 4	Full Height	Half Length	x16
	Slot 6	Processor 2
	Slot 7	Processor 3
	Slot 8	Processor 1
Riser 4A	Slot 10	Processor 4	Full Height	Full Length	x16
Riser 4A	Slot 11	Processor 2	Full Height	Full Length	x16 (Double width GPU)
Riser 4B	Slot 10	Processor 4	Full Height	Half Length	x16
	Slot 11	Processor 2
	Slot 12	Processor 2
Riser 4C	Slot 10	Processor 4	Full Height	Half Length	x16
Riser 4C	Slot 11	Processor 2	Full Height	Half Length	x16

Memory specifications

The PowerEdge R960 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Dual processor		Four processors
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity	Minimum system capacity	Maximum system capacity
DDR5 RDIMM	Single rank	16 GB	32 GB	512 GB	64 GB	1 TB
	Dual rank	32 GB	64 GB	1 TB	128 GB	2 TB
	Dual rank	64 GB	128 GB	2 TB	256 GB	4 TB
	Dual rank	96 GB	1.5 TB	3 TB	3 TB	6 TB
	Dual rank	128 GB	256 GB	4 TB	512 GB	8 TB
	Quad rank	128 GB	256 GB	4 TB	512 GB	8 TB
	Octa rank	256 GB	512 GB	8 TB	1 TB	16 TB

NOTE: DDR4 memory DIMMs are not supported in the R960.

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
64 (288-pin)	5600 MT/s, 4800 MT/s, or 4400 MT/s

NOTE:The processor may reduce the performance of the rated DIMM speed.

NOTE:Memory DIMM slots are not hot pluggable.

NOTE: Few processors that are listed in the thermal restriction section support 96 GB RDIMM.

NOTE:Only 8 or 16 DIMMs per processor are compatible with 96 GB RDIMMs.

Storage controller specifications

The PowerEdge R960 system supports the following controller cards:

Table 1. Storage controller cards
NOTE:The size of the RAID 1 drives must be less than that of the second RAID container.
This table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal controllers PERC H965i PERC H755 PERC H355
External controllers HBA355e PERC H965e HBA465e
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSD USB
Software RAID S160
SAS Host Bus Adapters (HBA) HBA355i HBA465i

Drives

The PowerEdge R960 system supports:

8 x 2.5-inch hot-swappable SAS/SATA (HDD/SSD) drives
16 x 2.5-inch hot-swappable SAS/SATA (HDD/SSD) drives
32 x 2.5-inch hot-swappable SAS/SATA (HDD/SSD) drives
24 x 2.5-inch hot-swappable NVMe (SSD) drives
16 x 2.5-inch hot-swappable SAS/SATA (HDD/SSD) + 8 x 2.5-inch hot-swappable NVMe (SSD) drives
Up to 16 x EDSFF E3.S Gen5 NVMe (SSD) drives
Up to 16 x EDSFF E3.S Gen5 NVMe (SSD) + 8 x 2.5-inch SAS/SATA (HDD/SSD) drives

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support > Browse all products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdge R960 USB specificationsThe following table shows the USB specifications for the system:
Front		Rear		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 3.0-compliant port	One	Internal USB 3.0-compliant port	One

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NIC port specifications

The PowerEdge R960 system supports up to two Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) card and up to four ports integrated on the Open Compute Project (OCP) card.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
LOM card (optional)	1 GbE x 2
OCP card (OCP 3.0) (optional)	1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4, 100 GbE x 2

NOTE:The system allows either LOM card or an OCP card or both to be installed in the system.

Serial connector specifications

The PowerEdge R960 system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge R960 system supports DB-15 VGA port on front panel and on rear I/O board (optional for Direct Liquid Cooling configuration).

Video specifications

The PowerEdge R960 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Video specifications for R960This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes < 900 m (< 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Common Environmental Specifications for ASHRAE A2, A3 and A4 This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware NOTE:* Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-40 to 149°F)
Non-operational humidity limits (non-condensing at all times)	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,050 meters (10,006 feet)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 7. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles NOTE:This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust Residual dust present in the air must have a deliquescent point less than 60% relative humidity NOTE:This condition applies to data center and non-data center environments.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened 6 times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.

Table 8. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink	Processor TDP
STD HSK	≤ 185 W
L-type HSK	≥ 195 W

Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard fan
HSK	Heat sink
LP	Low Profile
FH	Full Height
DLC	Direct Liquid Cooling

NOTE:The essential component in the configuration determines the ambient temperature of the configuration. For example, if the processor supported ambient temperature is 35°C (95°F), the DIMM is 35°C (95°F), and the GPU is 30°C (86°F), the combined configuration can only support 30°C (86°F).

Table 3. Thermal restriction matrix for air cooled configurationsThe table describes the thermal restriction matrix:
Configuration			32 x 2.5-inch SAS	16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	24 x 2.5-inch NVMe	16 x 2.5-inch SAS	16 x EDSFF E3.S NVMe	8 x 2.5-inch SAS + 16 x E3.S NVMe	EDSFF 8 x 2.5-inch SAS
Rear storage			No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives
Processor SKU	TDP	T-Case max center (°C)	Ambient temperature
6416H	165 W	82	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
6418H	185 W	81	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
6434H	195 W	64	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
6448H	250 W	83	40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)
8450H¹	250 W	76	40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)
8444H¹	270 W	72	40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)
8454H¹	270 W	71	40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)
8460H¹	330 W	76	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
8468H¹	330 W	77	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
8490H¹	350 W	79	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
Memory			Ambient temperature
256 GB RDIMM			35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
128 GB RDIMM			35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
96 GB RDIMM¹			40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)
64 GB RDIMM			N/A*	N/A*	N/A*	N/A*	N/A*	N/A*	N/A*
32 GB RDIMM			N/A*	N/A*	N/A*	N/A*	N/A*	N/A*	N/A*
16 GB RDIMM			N/A*	N/A*	N/A*	N/A*	N/A*	N/A*	N/A*
GPU			Ambient temperature
Double width (300 W)			N/A	N/A	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)

NOTE:*Memory has the same thermal restrictions of the processor used.

NOTE:Up to six standard (STD) dual fan modules must be installed in all the configurations.

NOTE:GPU air shroud is required when the GPU is installed in the system.

NOTE:DIMM blanks must be installed in empty DIMM slots.

NOTE:¹Only the processors that are listed above can support 96 GB RDIMM.

NOTE:When riser slots four and nine are used in processors 6416H, 6418H, 6434H, 6448H, 8450H, 8444H, and 8454H, the supported ambient temperature is 35°C.

Table 4. Thermal restriction matrix for Direct Liquid Cooled configurationsThe table describes the thermal restriction matrix:
Configuration			32 x 2.5-inch SAS	16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	24 x 2.5-inch NVMe	16 x 2.5-inch SAS	16 x EDSFF E3.S NVMe	8 x 2.5-inch SAS + 16 x EDSFF E3.S NVMe	8 x 2.5-inch SAS
Rear storage			No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives
Processor SKU	TDP	T-Case max center (°C)	Ambient temperature
6416H	165 W	82	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
6418H	185 W	81	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
6434H	195 W	64	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
6448H	250 W	83	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
8450H¹	250 W	76	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
8444H¹	270 W	72	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
8454H¹	270 W	71	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
8460H¹	330 W	76	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
8468H¹	330 W	77	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
8490H¹	350 W	79	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)
Memory			Ambient temperature
256 GB RDIMM			35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
128 GB RDIMM			35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
96 GB RDIMM¹			40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)
64 GB RDIMM			N/A*	N/A*	N/A*	N/A*	N/A*	N/A*	N/A*
32 GB RDIMM			N/A*	N/A*	N/A*	N/A*	N/A*	N/A*	N/A*
16 GB RDIMM			N/A*	N/A*	N/A*	N/A*	N/A*	N/A*	N/A*
GPU			Ambient temperature
Double width (300 W)			N/A	N/A	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)

NOTE:*Memory has the same thermal restrictions of the processor used.

NOTE:Up to six standard (STD) dual fan modules must be installed in all the configurations.

NOTE:DIMM blanks must be installed in empty DIMM slots.

NOTE:¹Only the processors that are listed above can support 96 GB RDIMM.

Thermal air restrictions

Table 1. Air cooling configurations thermal restriction for AHSRAE A3 and A4This table provides information about ASHRAE A3 and A4 restrictions for air cooling configuration.
ASHRAE	A3/40°C (104°F)	A4/45°C (113°F)
Processor	Processors with a TDP greater than or equal to 330 W are not supported.	Processors with a TDP greater than or equal to 250 W are not supported.
PSU	Four PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card	Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA	Not supported
DIMM	128 GB, or greater capacity DIMMs are not supported.
NVMe storage	2.5-inch NVMe storage is not supported.
OCP	Supported with 85°C (185°F) active optic cable and cards tier >5 are not supported.
BOSS	BOSS-N1 is not supported.
PCIe slot	Slot numbers four and nine are not supported.

Table 2. Liquid cooling configurations thermal restriction for AHSRAE A3 and A4This table provides information about ASHRAE A3 and A4 restrictions for air cooling configuration.
ASHRAE	A3/40°C (104°F)	A4/45°C (113°F)
PSU	Four PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card	Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA	Not supported
DIMM	128 GB, or greater capacity DIMMs are not supported.
NVMe storage	2.5-inch NVMe storage is not supported.
OCP	Supported with 85°C (185°F) active optic cable and cards tier >5 are not supported.	Supported with 85°C (185°F) active optic cable and cards tier >4 are not supported.
BOSS	BOSS-N1 is not supported.