Dell PowerEdge R920 System: руководство по обслуживанию

Technical Specifications

Table 1. Processor The following table shows the technical specifications for system processor
Processor
Processor type		Two or Four Intel Xeon Processor E7-8800/4800/2800 v2 product family

Table 2. Power SupplyThe following table shows the technical specifications for system power supply
Power
AC Power Supply (per power supply)
	Wattage	750 W, 1100 W, or 1600 W (when available) NOTE:Your system supports a maximum of two 1600 W power supplies.
	Heat dissipation NOTE:Heat dissipation is calculated using the power supply wattage rating.	2891 BTU/hr maximum (750 W power supply) 2780 BTU/hr maximum (750 W Titanium power supply) 4100 BTU/hr maximum (1100 W power supply)
	Voltage NOTE:This system is also designed to be connected to IT power systems with a phase to phase voltage not exceeding 230 V.	100–240 V AC, autoranging, 50/60 Hz or 200–240 V AC, autoranging, 50/60 Hz, for 750 W Titanium power supply
DC Power Supply (per power supply)
	Wattage	1100 W
	Heat dissipation NOTE:Heat dissipation is calculated using the power supply wattage rating.	4416 BTU/hr maximum
	Voltage	–(48–60) V DC
Battery
	Coin-cell battery	3 V CR2032 Lithium coin cell

Table 3. Expansion BusThe following table shows the technical specifications for system expansion bus
Expansion Bus
Bus type		PCI Express Generation 3
Expansion slots using riser card:
	Riser 1 (NDC riser default)	(Slot 2) One full-height, half-length x8 link
	Riser 2 (optional)	(Slot 1/1) One full-height, full-length x4 link
		(Slot 2/2) One full-height, half-length x4 link
		(Slot 3) One full-height, half-length x8 link
		(Slot 4) One full-height, full-length x16 link
		NOTE:To use slots 6 through 10, all four processors must be installed.
		(Slot 5) One full-height, half-length x16 link
		(Slot 6) One full-height, half-length x16 link
		(Slot 7) One full-height, half-length x16 link
		(Slot 8) One full-height, half-length x16 link
	Riser 3 (optional)	(Slot 1/ 9) One full-height, full-length x8 link
		(Slot 2/ 10) One full-height, half-length x8 link

Table 4. MemoryThe following table shows the technical specifications for system memory
Memory
Architecture		1066 MT/s, 1333 MT/s or 1600 MT/s DDR3 registered, load-reduced Error Correcting Code (ECC) DIMMs
Architecture		Support for advanced ECC or memory optimized operation
Memory module sockets		Ninety-six 240-pin
Memory module capacities
LRDIMMs		32 GB quad-ranked
RDIMMs		4 GB, 8 GB, or 32 GB single-, dual-, quad-, or octal-ranked
Minimum RAM		4 GB with a single processor
Maximum RAM
LRDIMMs and RDIMMs		Up to 6 TB

Table 5. DrivesThe following table shows the technical specifications for system drives
Drives
Hard drives
	Four hard-drive systems	Up to four 2.5 inch, internal, hot-swappable SAS hard drives in hard-drive slots 0 through 3. This configuration supports: 3Gb/s, 6Gb/s, and 12Gb/s I/O operations on SAS drives. 3Gb/s and 6Gb/s on SATA drives.
	Twenty four hard-drive systems (SAS/SATA)	Up to twenty four 2.5 inch, internal, hot-swappable SAS/SATA hard-drives. This configuration supports: 3Gb/s, 6Gb/s, and 12Gb/s I/O operations on SAS drives. 3Gb/s and 6Gb/s on SATA drives. NOTE:With single Unified mode daughter card and PERC 9 card the hard-drives are located in hard-drive slots 0 through 24 (bay 1). NOTE:With two Performance mode daughter cards and two PERC 9 cards the hard-drives are located in hard-drive slots 0 through 11(bay 1) and 0 through 11(bay 2)
	Twenty four or sixteen plus eight hard-drive systems	Up to sixteen 2.5 inch, internal, hot-swappable SAS drives and up to eight Dell PowerEdge Express Flash devices (PCIe SSDs) hard drives in hard-drive slots 0 through 4 (bay 1), 0 through 4 (bay 2), and 0 through 15 (bay 3) for SAS/SATA with 2 PCIe Extender Cards, one Unified Mode Daughter Card, and one PERC 9 Card. NOTE:Performance mode daughter cards (hard-drive slots 0 through 7 on SAS/SATA) are not supported.
	Twenty four hard-drive systems (SAS-3 (12Gb/s)) Performance Mode (split-capable)	Up to twenty four 2.5 inch, internal, hot-swappable SAS hard drives. NOTE:When the backplane is NOT in the split mode with single internal PERC, the maximum number of SATA/SSDs are 12 in the right bay (hard drives slots 12 through 23).
	Twenty four or sixteen plus eight hard-drive systems (SATA SSD)	Up to sixteen 2.5 inch, internal, hot-swappable SATA drives and up to eight Dell PowerEdge Express Flash devices (PCIe SSDs) hard drives in hard-drive slots 0 through 4 (bay 1), 0 through 4 (bay 2), and 8 through 15 (bay 3) for SAS/SATA.
Optical drive		One optional SATA DVD-ROM drive or DVD+/-RW drive.

Table 6. ConnectorsThe following table shows the technical specifications for system connectors
Connectors
Back
	NIC	Four RJ-45 10/100/1000 Mbps Ethernet
	Serial	9-pin, DTE, 16550-compatible
	USB	Two 4-pin, USB 2.0-compliant
	Video	15-pin VGA
	iDRAC7	One RJ-45 10/100/1000 Mbps Ethernet
Front
	USB	Two 4-pin, USB 2.0-compliant
	Video	15-pin VGA
	External vFlash card	vFlash memory card slot NOTE:The card slot is available for use only if the iDRAC7 Enterprise license is installed on your system.
Internal
	USB	One 4-pin, USB 2.0-compliant
	Internal Dual SD Module	Two optional flash memory card slots with the internal SD module NOTE:One card slot is dedicated for redundancy.

Table 7. VideoThe following table shows the technical specifications for system video
Video
Video type		Integrated Matrox G200 with iDRAC7
Video memory		16 MB shared with iDRAC7 application memory

Table 8. Expanded Operating TemperatureThe following table shows the system expanded operating temperature
Expanded Operating Temperature
NOTE:When operating in the expanded temperature range, system performance may be impacted. NOTE:When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD and in the System Event Log.
	< 10% of annual operating hours	5 °C to 40 °C at 5% to 85% RH with 26 °C dew point. NOTE:Outside the standard operating temperature (10 °C to 35 °C), the system can operate down to 5 °C or up to 40 °C for a maximum of 10% of its annual operating hours. For temperatures between 35 °C and 40 °C, de-rate maximum allowable dry bulb temperature by 1 °C per 175 m above 950 m (1 °F per 319 ft).
	< 1% of annual operating hours	–5 °C to 45 °C at 5% to 90% RH with 26 °C dew point. NOTE:Outside the standard operating temperature (10 °C to 35 °C), the system can operate down to –5 °C or up to 45 °C for a maximum of 1% of its annual operating hours. For temperatures between 40 °C and 45 °C, de-rate maximum allowable dry bulb temperature by 1 °C per 125 m above 950 m (1 °F per 228 ft).
	Expanded Operating Temperature Restrictions	Do not perform a cold startup below 5 °C. The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft). 130 W (4 core) processor is not supported. Redundant power supplies are required. Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
NOTE:Your system is capable of 40 °C and 45 °C excursion operation for fresh air cooled data centers. NOTE:For additional information about environmental measurements for specific system configurations, see dell.com/environmental_datasheets.
Temperature
	Maximum Temperature Gradient (Operating and Storage)	20 °C/h (36 °F/h)
	Storage Temperature Limits	–40 °C to 65 °C (–40 °F to 149 °F)
Temperature (Continuous Operation)
	Temperature Ranges (for altitude less than 950 m or 3117 ft)	10 °C to 35 °C (50 °F to 95 °F) with no direct sunlight on the equipment.
	Humidity Percentage Range	10% to 80% Relative Humidity with 26 °C (78.8 °F) maximum dew point.
Relative Humidity
	Storage	5% to 95% RH with 33 °C (91 °F) maximum dew point. Atmosphere must be non-condensing at all times.
Maximum Vibration
	Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations).
	Storage	1.87 G_rms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum Shock
	Operating	One shock pulse in the positive z axis of 40 G for 2.3 ms in all operational orientations.
	Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum Altitude
	Operating	3048 m (10,000 ft).
	Storage	12,000 m (39,370 ft).
Operating Altitude De-rating
	Up to 35 °C (95 °F)	Maximum temperature is reduced by 1 °C/300 m (1 °F/547 ft) above 950 m (3,117 ft).
	35 °C to 40 °C (95 °F to 104 °F)	Maximum temperature is reduced by 1 °C/175 m (1 °F/319 ft) above 950 m (3,117 ft).
	40 °C to 45 °C (104 °F to 113 °F)	Maximum temperature is reduced by 1 °C/125 m (1 °F/228 ft) above 950 m (3,117 ft).
Particulate Contamination NOTE:This section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous contamination. If it is determined that levels of particulates or gaseous pollution are beyond the limits specified below and are the reason for the damage and/or failures to your equipment, it may be necessary for you to re-mediate the environmental conditions that are causing the damage and/or failures. Re-mediation of environmental conditions will be the responsibility of the customer.
	Air Filtration NOTE:Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
	Conductive Dust NOTE:Applies to data center and non-data center environments.	Air must be free of conductive dust, zinc whiskers, or other conductive particles.
	Corrosive Dust NOTE:Applies to data center and non-data center environments.	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
Gaseous Contamination
NOTE:Maximum corrosive contaminant levels measured at ≤50% relative humidity.
	Copper Coupon Corrosion Rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
	Silver Coupon Corrosion Rate	<200 Å/month as defined by AHSRAE TC9.9.