Dell PowerEdge R860: руководство по обслуживанию

Chassis dimensions

The R860 has the following dimensions:

This image shows chassis dimension for the PowerEge R7525 system. — Figure 1. Chassis dimensions

Table 1. Chassis dimensionsThis table provides the dimensions of the system:
Model number	Xa	Xb	Y	Za with bezel	Za without bezel	Zb	Zc	Mx system Wgt.	Chassis
R860	482.0 mm (18.97 inches)	444.0 mm (17.48 inches)	86.8 mm (3.41 inches)	36.0 mm (1.41 inches)	22.0 mm (0.86 inches)	817.23 mm (32.17 inches)Ear to rear wall	848.3 mm (33.39 inches)Ear to PSU handle	42.97 kg (94.73 lbs)	2U

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

Chassis weight

Table 1. Chassis weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
A server with fully populated drives	42.97 kg (94.73 lbs)
A server without drives and PSU installed	13.09 kg (28.85 lbs)

Cooling fan specifications

Cooling options

The PowerEdgeR860 requires various cooling components that are based on processor TDP and storage modules to maintain optimum thermal performance.

The PowerEdgeR860 offers two types of cooling option:

Air cooling
Direct Liquid Cooling (DLC) (optional)

Cooling fan specifications

The PowerEdgeR860system system supports up to six sets of Standard cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Label color	Label image
Standard (STD) fans	STD	N/A

NOTE:See the Thermal restriction matrix for required fan support with air cooled and DLC configurations.

Supported operating systemsR860

The PowerEdge R860 system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi

NOTE:Intel Xeon® 6300 series CPUs do not support Windows Server 2019.

For more information, go to Operating System Manuals.

System battery specifications

The PowerEdge R860 system uses one CR 2032 3.0 V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R860 system supports up to eight PCI express (PCIe) slots Gen5 (six Full Height and two Low Profiles) on the system board.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
Expansion card riser	PCIe slot	Processor connection	Height	Length	Slot width
Riser 1B	Slot 1	Processor 1	Full Height	Half Length	x8 (Gen 4)
Riser 1B	Slot 2	Processor 1	Full Height	Half Length	x8 (Gen 4)
Riser 1C	Slot 1	Processor 3	Full Height	Half Length	x16
Riser 1C	Slot 2	Processor 1	Full Height	Half Length	x16
Riser 2	Slot 3	Processor 2	Low Profile	Half Length	x16
Riser 2	Slot 6	Processor 1	Low Profile	Half Length	x16
Riser 3	Slot 4	Processor 4	Full Height	Half Length	x16
Riser 3	Slot 5	Processor 3	Full Height	Half Length	x16
Riser 4B	Slot 7	Processor 2	Full Height	Half Length	x8 (Gen 4)
Riser 4B	Slot 8	Processor 2	Full Height	Half Length	x8 (Gen 4)
Riser 4C	Slot 7	Processor 2	Full Height	Half Length	x16
Riser 4C	Slot 8	Processor 4	Full Height	Half Length	x16

Storage controller specifications

The PowerEdge R860 system supports the following controller cards:

Table 1. Storage controller cards
NOTE: The size of the RAID 1 drives must be less than that of the second RAID container.
This table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal controllers PERC H965i PERC H755 PERC H355
External controllers PERC H965e HBA355e HBA465e
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSD USB
Software RAID S160
SAS Host Bus Adapters (HBA) HBA355i HBA465i

Drives

The PowerEdge R860 system supports:

8 x 2.5-inch hot-swappable SAS/SATA (HDD/SSD) drives.
8 x EDSFF E3.S NVMe Gen5 (SSD) drives.
16 x 2.5-inch hot-swappable SAS/SATA/NVMe (HDD/SSD) drives.
24 x 2.5-inch hot-swappable SAS/SATA/NVMe (HDD/SSD) drives.
16 x 2.5-inch hot-swappable SAS/SATA (HDD/SSD) + 8 x 2.5-inch hot-swappable NVMe (SSD) drives.
24 x 2.5-inch SAS/SATA (HDD/SSD) + 2 x 2.5-inch (rear) SAS/SATA/NVMe (HDD/SSD) or 4 x EDSFF E3.S (rear) NVMe Gen5 (SSD) drives.

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support > Browse all products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdge R860 USB specificationsThe following table shows the USB specifications for the system:
Front		Rear		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 3.0-compliant port	One	Internal USB 3.0-compliant port	One

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NIC port specifications

The PowerEdge R860 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
LOM card (optional)	1 GbE x 2
OCP card (OCP 3.0) (optional)	1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4, 100 GbE x 2

NOTE:The system allows either LOM card or an OCP card or both to be installed in the system.

Serial connector specifications

The PowerEdge R860 system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge R860 system supports DB-15 VGA port on front panel and on rear I/O board (optional for Direct Liquid Cooling configuration).

Video specifications

The PowerEdge R860 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution optionsThis table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support page.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Common Environmental Specifications for ASHRAE A2, A3 and A4 This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware NOTE:*Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-40 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,050 meters (10,006 feet)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 7. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles NOTE:This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust Residual dust present in the air must have a deliquescent point less than 60% relative humidity NOTE:This condition applies to data center and non-data center environments.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened 6 times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.

Table 8. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink	Processor TDP
STD HSK	≤ 185 W
L-type HPR HSK	195 W–250 W
L-type VHPR HSK	≥ 270 W

Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
HPR	High performance
VHPR	Very High Performance
HSK	Heat sink
LP	Low Profile
FH	Full Height

NOTE:The ambient temperature of the configuration is determined by the critical component in that configuration. For example, if the processor's supported ambient temperature is 35°C (95°F), the DIMM is 35°C (95°F), and the GPU is 30°C (86°F), the combined configuration can only support 30°C (86°F).

Table 3. Thermal restriction matrix for air cooled configurationsThe table describes the thermal restriction matrix for the air-cooled configurations:
Configuration			24 x 2.5-inch NVMe	16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	24 x 2.5-inch SAS			16 x 2.5-inch NVMe	16 x 2.5-inch SAS	8 x 2.5-inch SAS	8 x EDSFF E3.S
Rear storage			No Rear Drives	No Rear Drives	No Rear Drives	2 x 2.5-inch SAS/NVMe	Rear 4 x EDSFF E3.S	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives
CPU SKUs	TDP	T-Case max center (°C)	Ambient temperature
6416H	165 W	82	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	45°C (113°F)	35°C (95°F)
6418H	185 W	81	35°C (95°F)	35°C (95°F)	40°C (104°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)	40°C (104°F)	35°C (95°F)
6434H	195 W	64	35°C (95°F)	35°C (95°F)	40°C (104°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	40°C (104°F)	40°C (104°F)	35°C (95°F)
6448H	250 W	83	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
8450H¹	250 W	76	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
8444H¹	270 W	72	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
8454H¹	270 W	71	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
8460H¹	330 W	76	30°C (86° F)	30°C (86° F)	30°C (86° F)	30°C (86° F)	30°C (86° F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
8468H¹	330 W	77	30°C (86° F)	30°C (86° F)	30°C (86° F)	30°C (86° F)	30°C (86° F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
8490H¹	350 W	79	30°C (86° F)	30°C (86° F)	30°C (86° F)	30°C (86° F)	30°C (86° F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
Memory			Ambient temperature
256 GB RDIMM			35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
128 GB RDIMM			35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
96 GB RDIMM¹			35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
64 GB RDIMM			N/A*
32 GB RDIMM			N/A*
16 GB RDIMM			N/A*

NOTE:DIMM blanks must be installed in empty DIMM slots.

NOTE:*Memory has the same thermal restrictions of the processor used.

NOTE:¹ Only the processors that are listed above can support 96 GB RDIMM.

Table 4. Thermal restriction matrix for Direct Liquid Cooled configurationsThe table describes the thermal restriction matrix for the Direct Liquid Cooled configurations:
Configuration			24 x 2.5-inch NVMe	16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	24 x 2.5-inch SAS			16 x 2.5-inch NVMe	16 x 2.5-inch SAS	8 x 2.5-inch SAS	8 x EDSFF E3.S
Rear storage			No Rear Drives	No Rear Drives	No Rear Drives	2 x 2.5-inch SAS/NVMe	Rear 4 x EDSFF E3.S	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives
CPU SKUs	TDP	T-Case max center (°C)	Ambient temperature
6416H	165 W	82	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	45°C (113°F)	35°C (95°F)
6418H	185 W	81	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	45°C (113°F)	35°C (95°F)
6434H	195 W	64	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	45°C (113°F)	35°C (95°F)
6448H	250 W	83	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	45°C (113°F)	35°C (95°F)
8450H¹	250 W	76	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	45°C (113°F)	35°C (95°F)
8444H¹	270 W	72	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	45°C (113°F)	35°C (95°F)
8454H¹	270 W	71	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	45°C (113°F)	35°C (95°F)
8460H¹	330 W	76	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	45°C (113°F)	35°C (95°F)
8468H¹	330 W	77	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	45°C (113°F)	35°C (95°F)
8490H¹	350 W	79	35°C (95°F)	35°C (95°F)	45°C (113°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	45°C (113°F)	45°C (113°F)	35°C (95°F)
Memory			Ambient temperature
256 GB RDIMM			35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
128 GB RDIMM			35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
96 GB RDIMM¹			35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)
64 GB RDIMM			N/A*
32 GB RDIMM			N/A*
16 GB RDIMM			N/A*

NOTE:DIMM blanks must be installed in empty DIMM slots.

NOTE:*Memory has the same thermal restrictions of the processor used.

NOTE:¹ Only the processors that are listed above can support 96 GB RDIMM.

Thermal air restrictions

Table 1. Air cooling thermal restriction for 24 x 2.5-inch NVMe/16 x 2.5-inch + 8 x NVMe/16 x NVMe Storage ConfigurationsThis table provides information about ASHRAE A2, A3 and A4 restrictions for air cooling configuration.
ASHRAE	A2/35°C (95°F)	A3/40°C (104°F)	A4/45°C (113°F)
Processor	CPUs ≥ 330 W are not supported. Maximum 30°C for CPU ≥ 330 W	CPUs ≤ 195 W are supported.	Only 165 W is supported
PSU	Two PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card	Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA	Not supported
DIMM	256 GB RDIMMs only support 1DPC Maximum 35°C for 128 GB RDIMM or greater capacity RDIMMs	128 GB, or greater capacity DIMMs are not supported.
NVMe storage	2.5-inch NVMe storage is supported.	2.5-inch NVMe storage is not supported.
OCP	OCP cooling tier >5 is supported	OCP cooling tier >5 is not supported 85°C active optics cable is required
BOSS	BOSS-N1 is supported.	BOSS-N1 is not supported.

Table 2. Air cooling configurations thermal restriction for 8 x 2.5-inch/16 x 2.5-inch Storage ConfigurationThis table provides information about ASHRAE A2, A3 and A4 restrictions for air cooling configuration.
ASHRAE	A2/35°C (95°F)	A3/40°C (104°F)	A4/45°C (113°F)
Processor	CPUs ≥ 330 W are not supported. Maximum 30°C for CPU ≥ 330 W	CPUs ≤ 195 W are supported.	Only 165 W is supported
PSU	Two PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card	Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA	Not supported
DIMM	256 GB RDIMMs only support 1DPC Maximum 35°C for 128 GB RDIMM or greater capacity RDIMMs	128 GB, or greater capacity DIMMs are not supported.
NVMe storage	2.5-inch NVMe storage is not supported.
OCP	OCP cooling tier >5 is supported	OCP cooling tier >5 is not supported 85°C active optics cable is required
BOSS	BOSS-N1 is supported.	BOSS-N1 is not supported.