Dell PowerEdge R830: руководство по обслуживанию

System dimensions

Figure 1. Dimensions of the PowerEdge R830 system

Table 1. Dimensions of the PowerEdge R830 systemThis table gives details of the dimensions of the Dell PowerEdge system
X	Xa	Y	Z (with bezel)	Zb (without bezel)	Za (with bezel)	Za (without bezel)
482.4 mm (18.99 inches)	434.0 mm (17.08 inches)	86.8 mm (3.42 inches)	777.6 mm (30.61 inches)	740.6 mm (29.16 inches)	35.7 mm (1.41 inches)	20.4 mm (0.80 inches)

Chassis weight

Table 1. Chassis weightThe table below shows the minimum and maximum weight of the R830
System	Maximum weight (with all hard drives/SSDs)	Minimum weight (without any hard drives)
PowerEdge R830	31.7 kg (69.89 lb)	10.5 kg (23.15 lb)

Processor specifications

The PowerEdge R830 system supports up to four Intel Xeon E5-4600 v4 product family processors.

PSU specifications

The PowerEdge R830 system supports up to two AC redundant power supply units (PSU).

Table 1. PSU specificationsThe table below are the specifications for 750W and 1600W power supplies.
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage
750 W AC	Platinum		50/60 Hz	100–240 V AC, autoranging
1600 W AC	Platinum		50/60 Hz	100–240 V AC, autoranging NOTE: If a system with 1600 W PSUs operates from 100 to 120 V, then the power rating per PSU is derated to 800 W.

NOTE: Heat dissipation is calculated using the PSU wattage rating.

NOTE: This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 230 V.

NOTE: PSUs rated for 1600 W and higher require high-line voltage (200-240 V) to supply their rated capacity.

System battery specifications

The PowerEdge R830 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The PowerEdge R830 system supports PCI express (PCIe) generation 3 expansion cards, which need to be installed on the system board using expansion card risers. This system supports three types of expansion card risers.

Memory specifications

The PowerEdge R830 system supports DDR4 registered DIMMs (RDIMMs) and load-reduced DIMMs (LRDIMMs).

Table 1. Memory specificationsThe table below shows the memory specifications for the R830.
Memory module sockets	Memory capacity	Minimum RAM	Maximum RAM
Forty-eight DIMM sockets	64 GB quad rank (LRDIMMs) 8 GB single rank (RDIMMs) 16 GB or 32 GB dual rank (RDIMMs)	8 GB with dual processors (minimum one memory module per processor)	LRDIMM up to 6144 GB with four processors

Hard drives

The PowerEdge R830 system supports SAS, SATA, or Nearline SAS hard drives.

Table 1. Supported hard drive options for the PowerEdge R830 systemThis table lists out the supported hard drive and SSD options for the PowerEdge R830 system.
Sixteen hard drive systems	Up to sixteen 2.5-inch, internal, hot-swappable SAS, SATA, SAS/SATA SSD, or Nearline SAS hard drives

Optical drive

The system supports one optional SATA DVD-ROM drive or DVD+/-RW drive.

USB ports

The PowerEdge R830 system supports:

USB 2.0-compliant ports on the front and back panel
USB 3.0-complaint port on the back panel

The following table provides more information about the USB specifications:

Table 1. USB specificationsThe table below shows the USB specifications for the PowerEdge R830 system.
System	Front panel	Back panel
PowerEdge R830	One 4-pin, USB 2.0-compliant port One USB management port/iDRAC Direct	One 4-pin, USB 2.0-compliant port One 4-pin, USB 3.0-compliant port

NIC ports

The PowerEdge R830 system supports four Network Interface Controller (NIC) ports on the back panel, which are available in the following two configurations:

four 1 Gbps, or
two 10 Gbps

NOTE: You can install up to six PCIe add-on NIC cards.

Serial connector

The serial connector connects a serial device to the system. The PowerEdge R830 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge R830 system supports two 15-pin VGA ports on the front and back panels.

Internal Dual SD Module

The PowerEdge R830 system supports two optional flash memory card slots with an internal dual SD module.

NOTE: One card slot is dedicated for redundancy.

Video specifications

The PowerEdge R830 system supports Matrox G200eR2 graphics card with 16 MB capacity.

Table 1. Supported video resolution optionsThis table describes the supported video resolution options
Resolution	Refresh rate (Hz)	Color depth (bits)
640x480	60,70	8, 16, 32
800x600	60,75, 85	8, 16, 32
1024x768	60,75, 85	8, 16, 32
1152x864	60,75, 85	8, 16, 32
1280x1024	60,75	8, 16, 32
1440x900	60	8, 16, 32

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate	<200 Å/month as defined by AHSRAE TC9.9.

NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Standard operating temperature

Table 1. Standard operating temperature specificationsThe standard operating temperature for altitude less than 950 metres or 3117 feet ranges from 5°C to 40°C (41°F to 104°F) with no direct sunlight on the equipment. Note: The chassis supports a maximum of 135 W processors.
Standard operating temperature	Specifications
Continuous operation (for altitude less than 950 m or 3117 ft)	5°C to 40°C (41°F to 104°F) with no direct sunlight on the equipment. NOTE: The chassis supports a maximum of 135 W processors.

Expanded operating temperature

Table 1. Expanded operating temperature specificationsWhen the system is in continuous operation, the expanded operating temperature ranges from 5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is –5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature	Specifications
Continuous operation	5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours	–5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE: When operating in the expanded temperature range, system performance may be impacted.

NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD panel and in the System Event Log.

Expanded operating temperature restrictions

Do not perform a cold startup below 5°C.
The operating temperature specified is for a maximum altitude of 950 m.
PCIe Cards are not supported on slot 1 and 2.
A maximum of eight hard drives are supported on systems with a 135 W processor.
Redundant power supplies are required.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.