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Dell PowerEdge R820: руководство по обслуживанию
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Dell PowerEdge R820: руководство по обслуживанию

Technical Specifications

Processor
Processor type Two or four Intel Xeon processor E5-4600 and E5-4600 v2 product family
Expansion Bus  
Bus type PCI Express Generation 3
Expansion slots using riser card:  
  Riser 1 (Slot 1) One full-height, half-length x16 connector
    (Slot 2) One full-height, half-length x16 connector
  Riser 2 (Slot 3) One low profile, half-length x16 connector
    (Slot 4) One low profile, half-length x16 connector
    (Slot 5) One low profile, half-length x16 connector
  Riser 3 (Slot 6) One full-height, half-length x16 connector
    (Slot 7) One full-height, half-length x8 connector
Memory  
Architecture 800 MT/s, 1066 MT/s , 1333 MT/s, or 1600 MT/s registered or unbuffered Error Correcting Code (ECC) DIMMs
  Support for Advanced ECC or memory-optimized operation
Memory module sockets Forty-eight 240-pin
Memory module capacities  
  LRDIMMS 64 GB quad-rank
  RDIMM 2 GB (single–rank), 4 GB (single- and dual-rank), 8 GB (dual-rank), 16 GB (dual-rank), 32 GB (quad-rank)
  UDIMM 2 GB (single–rank), and 4 GB (dual-rank)
Minimum RAM 2 GB
Maximum RAM  
  LRDIMMS Up to 1.5 TB
  RDIMM Up to 768 GB
  UDIMM Up to 128 GB
Drives  
Hard drives    
  Eight–hard-drive systems Up to eight 2.5 inch, internal, hot-swappable SAS, SATA or Nearline SAS hard drives in hard-drive slots 0 through 7.
  Twelve–hard-drive systems Up to eight 2.5 inch, internal, hot-swappable SAS, SATA, SATA SSD or Nearline SAS hard drives in hard-drive slots 0 through 7 (hard-drive bay 1) and up to four 2.5 inch Dell PowerEdge Express Flash devices (PCIe SSDs) in hard-drive slots 0 through 3 (hard-drive bay 2).
  Sixteen or eight plus eight–hard-drive systems Up to sixteen 2.5 inch, internal, hot-swappable SAS, SATA, SATA SSD or Nearline SAS hard drives in hard-drive slots 0 through 15 or 0 through 7 and 0 through 7.
Optical drive One optional SATA DVD-ROM drive or DVD+/-RW drive.
  • NOTE: DVD devices are data only.
Connectors  
Back  
  NIC Four 10/100/1000 Mbps or two 10/100/1000 Mbps and two 100 Mbps/1 Gbps/10 Gbps
  Serial One 9-pin, DTE, 16550-compatible
  USB Two 4-pin, USB 2.0-compliant
  Video One 15-pin VGA
  iDRAC7 One RJ-45 10/100/1000 Mbps Ethernet
Front  
  USB Two 4-pin, USB 2.0-compliant
  Video One 15-pin VGA
  External vFlash card vFlash memory card slot
  • NOTE: The card slot is available for use only if the iDRAC7 Enterprise license is installed on your system.
Internal  
  USB One 4-pin, USB 2.0-compliant
  Internal Dual SD Module (IDSDM) Two optional flash memory card slots with the internal SD module
  • NOTE: One card slot is dedicated for redundancy.
Video  
Video type Integrated Matrox G200 with iDRAC
Video memory 256 MB
Expanded Operating Temperature  
  • NOTE: When operating in the expanded temperature range, system performance may be impacted.
  • NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD and in the System Event Log.
  < 10% of annual operating hours 5 °C to 40 °C at 5% to 85% RH with 26 °C dew point.
  • NOTE: Outside the standard operating temperature (10 °C to 35 °C), the system can operate down to 5 °C or up to 40 °C for a maximum of 10% of its annual operating hours.

For temperatures between 35 °C and 40 °C, de-rate maximum allowable dry bulb temperature by 1 °C per 175 m above 950 m (1 °F per 319 ft).

  < 1% of annual operating hours –5 °C to 45 °C at 5% to 90% RH with 26 °C dew point.
  • NOTE: Outside the standard operating temperature (10 °C to 35 °C), the system can operate down to –5 °C or up to 45 °C for a maximum of 1% of its annual operating hours.

For temperatures between 40 °C and 45 °C, de-rate maximum allowable dry bulb temperature by 1 °C per 125 m above 950 m (1 °F per 228 ft).

  Expanded Operating Temperature Restrictions
  • Do not perform a cold startup below 5 °C.
  • The operating temperature specified is for a maximum altitude of 3048 m ( 10,000 ft).
  • PCIe SSD is not supported.
  • GPU is not supported.
  • LRDIMM not supported.
  • PCIe cards are not supported on slots 1 and 2.
  • A maximum of eight hard drives are supported.
  • Redundant power supplies are required.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
Environmental  
  • NOTE: For additional information about environmental measurements for specific system configurations, see dell.com/environmental_datasheets.
Temperature  
  Maximum Temperature Gradient (Operating and Storage) 20 °C/h (36 °F/h)
  Storage Temperature Limits –40 °C to 65 °C (–40 °F to 149 °F)
Temperature (Continuous Operation)
  Temperature Ranges (for altitude less than 950 m or 3117 ft) 10 °C to 35 °C (50 °F to 95 °F) with no direct sunlight on the equipment.
  Humidity Percentage Range 10% to 80% Relative Humidity with 26 °C (78.8 °F) maximum dew point.
Relative Humidity  
  Storage 5% to 95% RH with 33 °C (91 °F) maximum dew point. Atmosphere must be non-condensing at all times.
Maximum Vibration  
  Operating 0.26 G rms at 5 Hz to 350 Hz (all operation orientations).
  Storage 1.87 G rms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum Shock  
  Operating One shock pulse in the positive z axis of 31 G for 2.6 ms in all operational orientations.
  Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum Altitude  
  Operating

3,048 m ( 10,000 ft)

  Storage 12,000 m (39,370 ft).
Operating Altitude De-rating
  Up to 35 °C (95 °F) Maximum temperature is reduced by 1 °C/300 m (1 °F/547 ft) above 950 m (3,117 ft).
  35 °C to 40 °C (95 °F to 104 °F) Maximum temperature is reduced by 1 °C/175 m (1 °F/319 ft) above 950 m (3,117 ft).
  40 °C to 45 °C (104 °F to 113 °F) Maximum temperature is reduced by 1 °C/125 m (1 °F/228 ft) above 950 m (3,117 ft).
Particulate Contamination
  • NOTE: This section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous contamination. If it is determined that levels of particulates or gaseous pollution are beyond the limits specified below and are the reason for the damage and/or failures to your equipment, it may be necessary for you to re-mediate the environmental conditions that are causing the damage and/or failures. Re-mediation of environmental conditions will be the responsibility of the customer.
  Air Filtration
  • NOTE: Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
  • NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
  Conductive Dust
  • NOTE: Applies to data center and non-data center environments.
Air must be free of conductive dust, zinc whiskers, or other conductive particles.
  Corrosive Dust
  • NOTE: Applies to data center and non-data center environments.
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
Gaseous Contamination
  • NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
  Copper Coupon Corrosion Rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
  Silver Coupon Corrosion Rate <200 Å/month as defined by AHSRAE TC9.9.