Dell PowerEdge R7725xd: руководство по обслуживанию

Chassis dimensions

This image shows chassis dimension for the PowerEge R7725 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR7725xd chassis dimensionsThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za	Zb	Zc
24 x 2.5-inch U.2 NVMe drives	482.0 mm (18.98 inches)	434.0 mm (17.09 inches)	86.8 mm (3.42 inches)	30.78 mm (1.21 inches)With bezel 29.89 mm (1.18 inches)Without bezel	700.7 mm (27.59 inches) Ear to rear wall	771.62 mm (30.38 inches) Ear to PSU handle
40 x E3.L NVMe drives	482.0 mm (18.98 inches)	444.0 mm (17.48 inches)	86.8 mm (3.42 inches)	30.78 mm (1.21 inches)With bezel 29.89 mm (1.18 inches)Without bezel	730.15 mm (28.75 inches) Ear to rear wall	801.07 mm (31.54 inches) Ear to PSU handle

NOTE:Zb is the nominal rear wall external surface where the HPM board I/O connectors reside.

System weight

Table 1. PowerEdge R7725xd system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
24 x 2.5-inch U.2 NVMe G5x4 RC1	26.74 kg (58.95 lb)
24 x 2.5-inch U.2 NVMe G5x4 RC3	26.95 kg (59.41 lb)
40 x E3.S/L Gen5 NVMe	29.51 kg (65.05 lb)

Table 2. PowerEdge R7725xd weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight	Description
40–70 lb	Recommend two people to lift.
70–120 lb	Recommend three people to lift.
≥ 121 lb	Recommend to use a server-lift.

Processor specifications

Table 1. PowerEdge R7725xd processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
5^th Generation AMD EPYC 9005 Series processor	Two

PSU specifications

The PowerEdgeR7725xdsystem supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Input voltage	AC Voltage			DC Voltage		Current (A)
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Input voltage	High line 200–240 V	Low line 100–120 V	277 V	240 V	336 V	Current (A)
1500 W mixed mode	Titanium	5625	50/60	100-240 Vac	1500 W	1050 W	N/A	N/A	N/A	12-8.2
1500 W mixed mode	N/A	5625	N/A	240 Vdc	N/A	N/A	N/A	1500 W	N/A	6.8
1800 W mixed mode*	Titanium	6750	50/60	200-240 Vac	1800 W	N/A	N/A	N/A	N/A	9.8-8.2
1800 W mixed mode*	N/A	6750	N/A	240 Vdc	N/A	N/A	N/A	1800 W	N/A	8.2
2400 W mixed mode*	Titanium	9000	50/60	100-240 Vac	2400 W	1400 W	N/A	N/A	N/A	16-13.2
2400 W mixed mode*	N/A	9000	N/A	240 Vdc	N/A	N/A	N/A	2400 W	N/A	10.9
3200 W mixed mode	Titanium	12000	50/60	200-240 Vac	2900 W¹ / 3200 W²	N/A	N/A	N/A	N/A	16
3200 W mixed mode	N/A	12000	N/A	240 Vdc	N/A	N/A	N/A	3200 W	N/A	14.5

NOTE:¹ indicates the power rating for 200–220 Vac and ² indicates the power rating for 220.1–240 Vac.

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

NOTE:If a system with AC 1500 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is degraded to 1050 W.

This image shows the PSU power cord — Figure 1. PSU power cords

Table 2. PSU power cablesThe table lists the PSU power cables list .
Form factor	Output	Power Cord
73.5 mm	2400 W mixed mode*	C19
73.5 mm	3200 W mixed mode	C19
60 mm	1500 W mixed mode	C13
60 mm	1800 W mixed mode*	C15

NOTE:*Feature not available at product launch in June 2025. Please refer to the product configurator page on Dell.com to confirm feature availability.

Cooling fan specifications

The PowerEdgeR7725xdsystem supports up to six cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Also known as	Label color
High-Performance Silver (HPR Silver) fans	HPR SLVR	Silver	Silver
High-Performance Gold (HPR Gold) fans	HPR GOLD	Gold	Gold
High Performance Platinum (HPR Pltm) fans	HPR PLTM	Platinum	Platinum

Supported operating systems

The PowerEdge R7725xd system supports the following operating systems:

Microsoft Windows Server with Hyper-V*
Canonical Ubuntu Server LTS
RedHat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi*

For specifications and interoperability details, see OS support.

NOTE:*Feature not available at product launch in June 2025. Please refer to the product configurator page on Dell.com to confirm feature availability.

Expansion card riser specifications

The PowerEdge R7725xd system supports up to five* PCI express (PCIe) slots (Gen5 slots), OCP NIC, and BOSS on the HPM board.

Table 1. Expansion card slots supported on the HPM boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Expansion card riser	Processor connection	Height	Length	Slot's Electrical Bandwidth / Physical Connector
Slot 2	R1b	Processor 1	Full Height	Half Length	PCIe Gen5 x16 (x16 connector)
Slot 2	R1b	Processor 1	Full Height	Half Length	PCIe Gen5 x16 (x16 connector)
Slot 3	R2a	Processor 1	Low Profile	Half Length	PCIe Gen5 x16 (x16 connector)
Slot 3	R2a	Processor 1	Full Height	Half Length	PCIe Gen5 x16 (x16 connector)
Slot 4	R3b*	Processor 1	Full Height	Half Length	PCIe Gen5 x16 (x16 connector)
Slot 6	BOSS	Processor 0	N/A	N/A	PCIe Gen3 x4 (1C connector)
Slot 7	R5b	Processor 0	Full Height	Half Length	PCIe Gen5 x16 (x16 connector)
Slot 7	R5e	Processor 0	Full Height	Half Length	PCIe Gen5 x16 (x16 connector)
Slot 8	R5e	Processor 0	Full Height	Half Length	PCIe Gen5 x16 (x16 connector)
Slot 9	R4a	Processor 0	Low Profile	Half Length	PCIe Gen5 x16 (x16 connector)
Slot 10	OCP3	Processor 1	N/A	N/A	PCIe Gen3 x4 (4C+ connector)

NOTE: * Expected to be available during the future releases. Planned Offerings are subject to change and may not be released as originally designed.

Memory specifications

The PowerEdge R7725xd system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Dual processor
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity
RDIMM	Single rank	16 GB	32 GB	384 GB
	Dual rank	32 GB	64 GB	768 GB
		64 GB	128 GB	1.5 TB
		96 GB	192 GB	2.3 TB
		128 GB	256 GB	3 TB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
24, 288-pin	6400 MT/s (1 DPC)

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:Some CPUs/SKUs may reduce the performance of the rated DIMM speed.

Drives

The PowerEdge R7725xd system supports:

Up to 24 x 2.5-inch U.2 Gen5 NVMe

NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

NIC port specifications

The PowerEdge R7725xd system supports one 10/100/1000 Mbps Network BMC Ethernet port and one optional Open Compute Project (OCP) card.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
Datacenter-Secure Control Module (DC-SCM)	1 Gb x 1
OCP NIC 3.0 Gen3 x4 card	10 GbE x 2, 1 GbE x 4

NOTE:The system allows either DC-SCM card or an OCP NIC card or both to be installed in the system.

USB ports specifications

This image shows the front USB port — Figure 1. Front USB Port

This image shows the rear USB port — Figure 2. Rear USB Port

This image shows the internal USB port — Figure 3. Internal USB Port

Table 1. PowerEdgeR7725xd USB specificationsThe following table shows the USB specifications for the system:
Front		Rear		Internal
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port (optional)	One	USB 3.1-compliant port	Two	Internal USB 3.1-compliant port	One
USB type C dual-mode host/BMC Direct port	One	USB 3.1-compliant port	Two	Internal USB 3.1-compliant port	One

Video ports specifications

The PowerEdge R7725xd system supports one DB-15 VGA port on the rear I/O board of the Datacenter Secure Control Module (DC-SCM) and one Mini Display (mDP) port (optional) on the Left Control Panel (LCP).

NOTE:Both ports cannot be used together. The mDP port overrides the VGA port.

Video specifications

The PowerEdge R7725xd system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
640 x 480	60	8, 16, 32
800 x 600	60	8, 16, 32
1024 x 768	60	8, 16, 32
1152 x 864	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1400 x 1050	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Parameters	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Parameters	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Parameters	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Common Environmental Specifications for ASHRAE A2, A3, and A4 This table describes the shared requirements across all categories.
Parameters	Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40°C to 65°C (-40°F to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 ft)
Maximum operational altitude	3,048 meters (10,000 ft)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz for 10 min (all x, y, and z axes)
Storage	1.38 G_rms at 7 Hz to 250 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a non-operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
HPR Silver	High-performance (HPR) Silver fan
HPR Gold	High-Performance (HPR) Gold fan
HPR Pltm	High-Performance Platinum (HPR Pltm) fan
HSK	Heat sink
LP	Low profile
FH	Full height
EXT	Extended

Table 2. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink	Processor TDP
STD HSK	<= 400 W
2U T-wing HSK	401 W~500 W

NOTE:The configuration's ambient temperature is dictated by its critical component. For example, if the processor's ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the configuration's ambient temperature can only be 30°C.

Table 3. Thermal restriction matrix for air coolingThe table describes the thermal restriction matrix for air cooling:
Configuration				24x2.5" U.2 Gen5	Ambient temperature
Rear storage				No rear drives
Shroud				CPU ≤400W Regular Shroud CPU 500W T-wing Shroud
GPU				No GPU
TDP	cTDP Max	Processor	Cores	HSK/Fan
125 W	155 W	9015	8	HPR Silver fan STD HSK	35 °C
125 W	155 W	9115	16	HPR Silver fan STD HSK	35 °C
210 W	240 W	9335	32	HPR Silver fan STD HSK	35 °C
200 W	240 W	9255	24	HPR Silver fan STD HSK	35 °C
200 W	240 W	9135	16	HPR Silver fan STD HSK	35 °C
300 W	300 W	9455	48	HPR Silver fan STD HSK	35 °C
300 W	300 W	9535	64	HPR Silver fan STD HSK	HPR Silver fan STD HSK
280 W	300 W	9355	32	HPR Silver fan STD HSK	35 °C
320 W	400 W	9175F	16	HPR Gold fan STD HSK	35 °C
320 W	400 W	9275F	24	HPR Gold fan STD HSK	35 °C
320 W	400 W	9375F	32	HPR Gold fan STD HSK	35 °C
400 W	400 W	9475F	48	HPR Gold fan STD HSK	35 °C
360 W	400 W	9555	64	HPR Gold fan STD HSK	35 °C
320 W	400 W	9575F	64	HPR Gold fan STD HSK	35 °C
400 W	400 W	9655	96	HPR Gold fan STD HSK	35 °C
400 W	400 W	9745	128	HPR Gold fan STD HSK	35 °C
390 W	400 W	9825	144	HPR Gold fan STD HSK	35 °C
390 W	400 W	9845	160	HPR Gold fan STD HSK	35 °C
500 W	500 W	9965	192	HPR pltm fan 2U T-wing HSK	35 °C
500 W	500 W	9755	128	HPR Pltm fan 2U T-wing HSK	35 °C
Memory				Ambient Temperature
16 GB RDIMM				35 °C
32 GB RDIMM				35 °C
64 GB RDIMM				35 °C
96 GB RDIMM				35 °C
128 GB RDIMM				35 °C

NOTE:Six fan modules are required for a dual-processor system.