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Dell PowerEdge R7725: руководство по обслуживанию
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Dell PowerEdge R7725: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge R7725 system.
Table 1. PowerEdgeR7725 chassis dimensionsThis table provides the dimensions of the system:
Drives Xa Xb Y Za Zb Zc
All configurations482.0 mm (18.98 inches)434.0 mm (17.09 inches)86.8 mm (3.42 inches)

30.78 mm (1.21 inches)With bezel

29.89 mm (1.18 inches)Without bezel

700.7 mm (27.59 inches)

Ear to rear wall

771.62 mm (30.38 inches)

Ear to PSU handle

NOTE:Zb is the nominal rear wall external surface where the HPM board I/O connectors reside.

System weight

Table 1. PowerEdge R7725 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
No backplane configuration 25.1 kg (55.34 lb)
8 x 2.5-inch Universal 27.5 kg (60.63 lb)
12 x 3.5-inch SAS/SATA 36.1 kg (69.67 lb)
16 x 2.5-inch SAS/SATA 29.3 kg (64.59 lb)
16 x 2.5-inch SAS/SATA + 8 x U.2 or 2.5-inch NVMe RAID 28.74 kg (63.36 lb)
24 x 2.5-inch SAS/SATA 31.8 kg (70.11 lb)
16 x EDSFF E3.S Gen5 NVMe 25.47 kg (56.15 lb)
8 x EDSFF E3.S Gen5 NVMe 24.33 kg (53.64 lb)
32 x EDSFF E3.S Gen5 NVMe 31.14 kg (68.65 lb)
40 x EDSFF E3.S Gen5 NVMe 29.92 kg (65.96 lb)
Table 2. PowerEdge R7725 weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight Description
40–70 lb Recommend two people to lift.
70–120 lb Recommend three people to lift.
≥ 121 lb Recommend to use a server-lift.

PSU specifications

The PowerEdgeR7725system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) Input voltageCurrent (A)
3200 W AC Titanium1200050/60200-240 Vac16
3200 W HVDC N/A12000N/A240 Vdc14.5
3200 XLACTitanium1200050/60277 Vac12.9
3200 XHVDCN/A12000N/A336 Vdc10.47
2400 W ACTitanium900050/60100-240 Vac16-13.2
2400 W HVDCN/A9000N/A240 Vdc10.9
1800 W ACTitanium 675050/60200-240 Vac9.8-8.2
1800 W HVDCN/A6750N/A240 Vdc8.2
1500 W AC Titanium 5625 50/60 100-240 Vac12-8.2
1500 W HVDCN/A 5625 N/A 240 Vdc6.8
1500 W XLACTitanium 5625 50/60 277 Vac6.1
1500 W XHVDCN/A 5625 N/A 336 Vdc4.91
1400 W -48VN/A5310N/A(-48)-(-60) Vdc 33
1100 W AC Titanium410050/60100-240 Vac12-6.1
1100 W HVDCN/A4100N/A240 Vdc5.1
1100 W ACPlatinum410050/60100-240 Vac12-6.1
1100 W HVDCN/A4100N/A240 Vdc5.1
800 W ACTitanium300050/60100-240 Vac9.2-4.5
800 W HVDCN/A3000N/A240 Vdc3.7
800 W ACPlatinum300050/60100-240 Vac9.2-4.5
800 W HVDCN/A3000N/A240 Vdc3.7
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.
NOTE:If a system with AC 1500 W and 1100 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is degraded to 1050 W.
Figure 1. PSU power cords
this image shows list of PSU power cords
Figure 2. C19 PSU power cord
This image shows the C19 power cord
Figure 3. C16 power cord
This image shows the C16 power cord
Figure 4. DC PSU power cord
This image shows the DC PSU power cord
Table 2. PSU power cablesThe table lists the PSU power cables list .
Form factor Output Power cable
Redundant 73.5 mm3200 W Titanium mixed modeC19
Redundant 73.5 mm3200 W 277 Vac and HVDCAPP/Saf-D-Grid
Redundant 60 mm 2400 W Titanium mixed modeC19
Redundant 60 mm 1800 W Titanium mixed modeC16
Redundant 60 mm 1500 W Titanium mixed mode C13
Redundant 60 mm 1500 W 277 Vac and HVDCAPP/Saf-D-Grid
Redundant 60 mm 1400 W -48 VDC power cable
Redundant 60 mm 1100 W Titanium mixed mode C13
Redundant 60 mm 1100 W Platinum mixed modeC13
Redundant 60 mm 800 W Titanium mixed mode C13
Redundant 60 mm 800 W Platinum mixed modeC13
NOTE:This document provides a comprehensive list of product features. However, features marked with an asterisk (*) may not be available at launch but introduced in future updates. Please note that this document does not confirm the availability or release timeline of any feature. For the most accurate and up-to-date information on feature availability, please refer to the product configurator page on dell.com.

Cooling fan specifications

The PowerEdgeR7725system supports up to six cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
High Performance Silver (HPR Silver) fans HPR SLVR Silver SilverThis shows the High Performance Silver (HPR SLVR) fan
High Performance Gold (HPR Gold) fansHPR GOLD Gold GoldThis shows the High Performance Gold (HPR GOLD) fan
High Performance Platinum (HPR Pltm) fans HPR PLTM Platinum Platinum
The image shows the HPR platinum (HPR PLTM) fan

NOTE: Cooling fans rotate at slower speed, even while the system is in standby mode, and the fan speed varies in response to changes in the ambient temperature.

Supported operating systems

The PowerEdge R7725 system supports the following operating systems:

  • Microsoft Windows Server with Hyper-V
  • Canonical Ubuntu Server LTS
  • RedHat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
For specifications and interoperability details, see OS support.

System battery specifications

The PowerEdge R7725 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R7725 system supports up to four PCI express (PCIe) slots (Gen5 slots), dual OCP NIC, and BOSS on the HPM board.
Table 1. Expansion card slots supported on the HPM boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Expansion card riser Processor connection Height Length Slot width
Slot 1 R1a Processor 2 Full Height Half Length x8
Slot 2 R1a, R1b, R1b_DW Processor 2 Full Height Half Length x8, x16
Slot 3 R2a, R2b Processor 2 Full Height

Low-Profile in liquid cooling configuration.

 Half Length x16
Slot 4 R2b, R3a, R3b, R3e (OCP) Processor 2 Full Height Half Length x8, x16
Slot 5 R3a Processor 2 Full Height Half Length x8
Slot 6 BOSS Processor 1 N/A N/A x4
Slot 7 R5a, R5b, R5b_DW, R5e Processor 1 Full Height Half Length x8, x16
Slot 8 R5a, R5e Processor 1 Full Height Half Length x8, x16
Slot 9 R4a, R4b Processor 1 Full Height

Low-Profile in liquid cooling configuration.

 Half Length x16
Slot 10 OCP Processor 1 N/A N/A x16

Memory specifications

The PowerEdge R7725 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Dual processor
Minimum system capacity Maximum system capacity
RDIMM Dual rank 16 GB 32 GB 384 GB
32 GB 64 GB 768 GB
64 GB 128 GB 1.5 TB
96 GB 192 GB 2.3 TB
128 GB 256 GB 3.0 TB
256 GB 512 GB 6.14 TB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
24, 288-pin 6400 MT/s (1 DPC)
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The processor may reduce the performance of the rated DIMM speed.

Storage controller specifications

The PowerEdge R7725 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H975i
  • PERC H965i
  • PERC H365i
  • H965e
  • HBA465e
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS)
Software RAID
  • N/A
NOTE:For the ESXi operating system, H975i is supported on 9.0 or later versions.

Drives

The PowerEdge R7725 system supports:
  • No backplane configuration
  • Up to 8 x 2.5-inch SAS/SATA/NVMe
  • Up to 12 x 3.5-inch SAS/SATA
  • Up to 16 x 2.5-inch SAS/SATA
  • Up to 24 x 2.5-inch SAS/SATA
  • Up to 16 x 2.5-inch SAS/SATA + 8 x U.2 or 2.5-inch NVMe
  • Up to 8 x EDSFF E3.S Gen5 NVMe
  • Up to 16 x EDSFF E3.S Gen5 NVMe
  • Up to 32 x EDSFF E3.S Gen5 NVMe
  • Up to 40 x EDSFF E3.S Gen5 NVMe
NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

GPU Specifications

The PowerEdge R7725 system supports
  • Up to two 450 W double-width GPUs
  • Up to six single-width GPUs

DPU Specifications

The PowerEdge R7725 platform accommodates Data Processing Units (DPUs). These units are system-on-chip solutions that combine ARM cores, high-performance NICs, and programmable acceleration engines to offload and accelerate data center infrastructure services.

Table 1. Supported Data Processing Units(DPU) CardsThis table describes the feature and the specifications for the supported DPU cards in R7725
Feature NVIDIA BlueField-3 2x200 GbE B3220 NVIDIA BlueField-3 1x400 GbE B3140H * NVIDIA BlueField3- B3240
Type Data Processing Units (DPU) Data Processing Units (DPU) Data Processing Units (DPU)
Networking 2 x 200 GbE 1x400 GbE 1x400 GbE
Form Factor FHHL FHHL FHHL
Interface PCIe Gen5 x16 PCIe Gen5 x16 PCIe Gen5 x16
Power Consumption 150 W 75 W 150 W
Compatible Risers RC 2(Slots2,7), RC 3(Slots2,7), RC 4(Slots 2,7), RC 5(Slots2,7), RC 8(Slots2,7) TBD RC 2(2,7), RC 3(2,7), RC 4(2,7), RC 5(2,7), RC 8 (2,7)
NOTE: This document provides a comprehensive list of product features. However, features marked with an asterisk (*) may not be available at launch but introduced in future updates. Please note that this document does not confirm the availability or release timeline of any feature. For the most accurate and up-to-date information on feature availability, please refer to the product configurator page on dell.com.

NIC port specifications

The PowerEdge R7725 system supports one 10/100/1000 Mbps BMC Ethernet, up to eight PCIe Add-in cards, up to two fiber channel HBA cards, and two optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
Datacenter-Secure Control Module (DC-SCM) 1 GbE x 2
OCP NIC 3.0 card 200 GbE x 2 (configurable as 400 GbE x 1), 100 GbE x 2, 25 GbE x 2, 25 GbE x 4, 10 GbE x 2, 1 GbE x 4, 10 GbE x 4
PCIe Add-in Card (AIC) NIC 200 GbE x 2 (configurable as 400 GbE x 1), 100 GbE x 2, 25 GbE x 2
Fiber channel HBA FC64, FC32

USB ports specifications

Table 1. PowerEdge R7725 USB specificationsThe following table shows the USB specifications for the system:
Front Rear Internal
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port (optional)One USB 3.1-compliant portTwo Internal USB 3.1-compliant portOne
USB type C dual-mode host/BMC Direct portOne

VGA ports specifications

The PowerEdge R7725 system supports DB-15 DB-15 port on the rear I/O board of the Datacenter Secure Control Module (DC-SCM).

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Parameters Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Parameters Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Parameters Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Common Environmental Specifications for ASHRAE A2, A3, and A4 This table describes the shared requirements across all categories.
Parameters Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits
  • -40°C to 65°C (-40°F to 149°F) applicable for air cooling configuration
  • -40°C to -5°C (-40°F to 23°F**) applicable for DLC configuration
NOTE:** Liquid filled components, or systems/solutions containing liquid filled components are limited to approximately 5°C above their freeze point. At this time the only authorized liquid coolant is Recohem PG25 with a freeze point between -9°C and -13°C, therefore the lower non-operational temperature limit is -5°C. Components and systems/solutions that can contain liquid but do not at the time of testing shall be tested to the -40°C lower non-operational temperature limit.
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 ft)
Maximum operational altitude 3,048 meters (10,000 ft)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10 min (all x, y, and z axes)
Storage 1.38 Grms at 7 Hz to 250 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a non-operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR (Silver) High performance Silver (HPR SLVR) fan
HPR (Gold) High performance Gold (HPR GOLD) fan
HSK Heat sink
LP Low profile
FH Full height
DLC Direct Liquid Cooling
Table 2. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
STD HSK < 180 W
2U HPR HSK >= 180 W
T-wing HSK Supports all TDP (system should be installed with GPU/FGPA/long PCIe cards)
NOTE:The configuration's ambient temperature is dictated by its critical component. For example, if the processor's ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the configuration's ambient temperature can only be 30°C.
Table 3. CPU thermal restriction matrix for air cooling configurationThe following table shows the CPU thermal restriction matrix for air cooling configuration.
Configuration 16x2.5"SAS+8xNVMe 16xE3.S 8xE3.S 32xE3.S 16x2.5"SAS 8x2.5" Universal No BP
Shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud DW GPU shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud DW GPU shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud DW GPU shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud DW GPU shroud
DW GPU (riser config RC4) No Yes No No Yes No No Yes No No Yes
PPCM config C05-01, 02, 03 C05-02, 03 C07-01 C06-01 C08-01 C02-01, 02 C04-02 C0
GPU group TDP (W) cTDP (W) Model Core count Production OPN
C 125 120-155 9015 8 100-000001553 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
125 120-155 9115 16 100-000001552 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
B 210 200-240 9335 32 100-000001149 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
200 200-240 9255 24 100-000000694 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
200 200-240 9135 16 100-000001150 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
A 280 240-300 9355 32 100-000001148 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
E 320 320-400 9175F 16 100-000001145 Standard HSK

HPR Gold Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
320 320-400 9275F 24 100-000001144 Standard HSK

HPR Gold Fan

 DLC only Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 DLC only Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 **1U T-type HSK

HPR Pltm Fan
320 320-400 9375F 32 100-000001197 Standard HSK

HPR Gold Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
360 320-400 9475F 48 100-000001143 Standard HSK

HPR Gold Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
360 320-400 9555 64 100-000001142 Standard HSK

HPR Gold Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
320 320-400 9575F 64 100-000001554 Standard HSK

HPR Gold Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
400 320-400 9655 96 100-000000674 Standard HSK

HPR Gold Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
400 320-400 9745 128 100-000001460 Standard HSK

HPR Gold Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
390 320-400 9825 144 100-000000837 Standard HSK

HPR Gold Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
390 320-400 9845 160 100-000001458 Standard HSK

HPR Gold Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 **1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
G 500 450-500 9965 192 100-000000976 1U T-type HSK

HPR Pltm Fan

 DLC only 1U T-type HSK

HPR Pltm Fan

 1U T-type HSK

HPR Pltm Fan

 DLC only 1U T-type HSK

HPR Pltm Fan

 1U T-type HSK

HPR Pltm Fan

 DLC only 1U T-type HSK

HPR Pltm Fan

 1U T-type HSK

HPR Pltm Fan

 DLC only
500 450-500 9755 128 100-000001443 1U T-type HSK

HPR Pltm Fan

 DLC only 1U T-type HSK

HPR Pltm Fan

 1U T-type HSK

HPR Pltm Fan

 DLC only 1U T-type HSK

HPR Pltm Fan

 1U T-type HSK

HPR Pltm Fan

 DLC only 1U T-type HSK

HPR Pltm Fan

 1U T-type HSK

HPR Pltm Fan

 DLC only
Table 4. Memory thermal restriction matrix for air cooling configurationThe following table shows the memory thermal restriction matrix for air cooling configuration.
Configuration 16x2.5"SAS+8xNVMe 16xE3.S 8xE3.S 32xE3.S 16x2.5"SAS 8x2.5" Universal No BP
16 GB RDIMM 35°C
32 GB RDIMM 35°C
64 GB RDIMM 35°C
96 GB RDIMM 35°C
128 GB RDIMM HPR Gold Fan 35°C HPR Gold Fan 35°C HPR Gold Fan HPR Gold Fan 35°C
256 GB RDIMM 7F0CF (HPR Gold Fan) 7F0CF (HPR Gold Fan) 35°C 7F0CF (HPR Gold Fan) 7F0CF (HPR Gold Fan) HPR Gold Fan HPR Gold Fan 35°C
Table 5. GPU thermal restriction matrix for air cooling configurationThe following table shows the GPU thermal restriction matrix for air cooling configuration.
GPU TDP (W) 16x2.5"SAS+8xNVMe 16xE3.S 8xE3.S 32xE3.S
Shroud

CPU ≤400W Regular Shroud

CPU 500W T-wing Shroud

 DW GPU Shroud

CPU ≤400W Regular Shroud

CPU 500W T-wing Shroud

 DW GPU Shroud

CPU ≤400W Regular Shroud

CPU 500W T-wing Shroud

 DW GPU Shroud

CPU ≤400W Regular Shroud

CPU 500W T-wing Shroud

 DW GPU Shroud
L4 24 GB 72

HPR Gold fan

30°C

 35°C 35°C 35°C 35°C 35°C 35°C 35°C
H100 NVL 94 GB 400 N/A 35°C N/A 35°C N/A 35°C N/A 35°C
H200 NVL 141G 450 N/A 30°C N/A 35°C N/A 35°C N/A 35°C
NVIDIA RTX Pro 6000 BSE 450 N/A 30°C N/A 30°C N/A 30°C N/A 30°C
L40s 48 GB 350 N/A 35°C N/A 35°C N/A 35°C N/A 35°C
A16 64 GB 250 N/A 35°C N/A 35°C N/A 35°C N/A 35°C
MI350P 450 N/A 30°C N/A 30°C N/A 30°C N/A 30°C
Table 6. GPU thermal restriction matrix for air cooling configuration (continuation)The following table shows the GPU thermal restriction matrix for air cooling configuration.
GPU TDP (W) 16x2.5"SAS 8x2.5" Universal 24x2.5" SAS 40x E3.S No BP
Shroud

CPU ≤400W Regular Shroud

CPU 500W T-wing Shroud

 DW GPU Shroud

CPU ≤400W Regular Shroud

CPU 500W T-wing Shroud

CPU ≤400W Regular Shroud

CPU 500W T-wing Shroud

CPU ≤400W Regular Shroud

CPU 500W T-wing Shroud

CPU ≤400W Regular Shroud

CPU 500W T-wing Shroud

 DW GPU Shroud
L4 24 GB 72

HPR Gold fan

30°C

 35°C

HPR Gold fan

35°C

HPR Gold fan

30°C

 35°C

HPR Gold fan

35°C

 35°C
H100 NVL 94 GB 400 N/A 35°C N/A N/A N/A N/A 35°C
H200 NVL 141G 450 N/A 35°C N/A N/A N/A N/A 35°C
NVIDIA RTX Pro 6000 BSE 450 N/A 30°C N/A N/A N/A N/A 35°C
L40s 48 GB 350 N/A 35°C N/A N/A N/A N/A 35°C
A16 64 GB 250 N/A 35°C N/A N/A N/A N/A 35°C
MI350P 450 N/A 30°C N/A N/A N/A N/A 35°C
NOTE:** Components that support max 30°C.
NOTE:Components without ** support max 35°C.
NOTE:RTX Pro 6000 and H200 NVL will operate with a power cap of 450W, not 600W.
NOTE: A puck cable is required to ensure compatibility of the RTX Pro 6000 GPU with the R7725 system.
NOTE:Three fan modules are required for a single processor, and six fan modules are required for a dual processor system.
Table 7. CPU thermal restriction matrix for Direct Liquid Cooling (DLC) configurationThe following table shows the CPU thermal restriction matrix for liquid cooling configuration.
Configuration 16x2.5"SAS+8xNVMe 16xE3.S 8xE3.S 32xE3.S 16x2.5"SAS 8x2.5" Universal No BP
Shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud DW GPU shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud DW GPU shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud DW GPU shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud CPU ≤400 W regular shroud, CPU500 W T-wing shroud DW GPU shroud
DW GPU (riser config RC4) No Yes No No Yes No No Yes No No Yes
PPCM config C05-01, 02, 03 C05-02, 03 C07-01 C06-01 C08-01 C02-01, 02 C04-02 C0
GPU group TDP (W) cTDP (W) Model Core count Production OPN
All CPU SKUs Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Gold Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Gold Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan

 Standard HSK

HPR Slvr Fan

 Standard HSK

HPR Slvr Fan

 1U T-type HSK

HPR Pltm Fan
Table 8. Memory thermal restriction matrix for Direct Liquid Cooling (DLC) configurationThe following table shows the memory thermal restriction matrix for liquid cooling configuration.
Configuration 16x2.5"SAS+8xNVMe 16xE3.S 8xE3.S 32xE3.S 16x2.5"SAS 8x2.5" Universal No BP
16 GB RDIMM 35°C
32 GB RDIMM 35°C
64 GB RDIMM 35°C
96 GB RDIMM 35°C
128 GB RDIMM HPR Gold Fan 35°C HPR Gold Fan 35°C HPR Gold Fan HPR Gold Fan 35°C
256 GB RDIMM 7F0CF (HPR Gold Fan) 7F0CF (HPR Gold Fan) 35°C 7F0CF (HPR Gold Fan) 7F0CF (HPR Gold Fan) HPR Gold Fan HPR Gold Fan 35°C
Table 9. GPU thermal restriction matrix for Direct Liquid Cooling (DLC) configurationThe following table shows the GPU thermal restriction matrix for liquid cooling configuration.
GPU TDP (W) 16x2.5"SAS+8xNVMe 16xE3.S 8xE3.S 32xE3.S
Shroud Regular Shroud DW GPU Shroud Regular Shroud DW GPU Shroud Regular Shroud DW GPU Shroud Regular Shroud DW GPU Shroud
L4 24 GB 72

HPR Gold fan

30°C

 35°C 35°C 35°C 35°C 35°C 35°C 35°C
H100 NVL 94 GB 400 N/A 35°C N/A 35°C N/A 35°C N/A 35°C
H200 NVL 141G 450 N/A 30°C N/A 35°C N/A 35°C N/A 35°C
NVIDIA RTX Pro 6000 BSE 450 N/A 30°C N/A 30°C N/A 30°C N/A 30°C
L40s 48 GB 350 N/A 35°C N/A 35°C N/A 35°C N/A 35°C
A16 64 GB 250 N/A 35°C N/A 35°C N/A 35°C N/A 35°C
MI350P 450 N/A 30°C N/A 30°C N/A 30°C N/A 30°C
Table 10. GPU thermal restriction matrix for Direct Liquid Cooling (DLC) configuration (continuation)The following table shows the GPU thermal restriction matrix for liquid cooling configuration.
GPU TDP (W) 16x2.5"SAS 8x2.5" Universal 24x2.5" SAS 40x E3.S No BP
Shroud Regular Shroud DW GPU Shroud Regular Shroud Regular Shroud Regular Shroud

CPU ≤400W Regular Shroud

CPU 500W T-wing Shroud

 DW GPU Shroud
L4 24 GB 72

HPR Gold fan

30°C

 35°C

HPR Gold fan

35°C

HPR Gold fan

30°C

 35°C

HPR Gold fan

35°C

 35°C
H100 NVL 94 GB 400 N/A 35°C N/A N/A N/A N/A 35°C
H200 NVL 141G 450 N/A 35°C N/A N/A N/A N/A 35°C
NVIDIA RTX Pro 6000 BSE 450 N/A 30°C N/A N/A N/A N/A 35°C
L40s 48 GB 350 N/A 35°C N/A N/A N/A N/A 35°C
A16 64 GB 250 N/A 35°C N/A N/A N/A N/A 35°C
MI350P 450 N/A 30°C N/A N/A N/A N/A 35°C
NOTE:** Components that support max 30°C.
NOTE:RTX Pro 6000 and H200 NVL will operate with a power cap of 450W, not 600W
NOTE: A puck cable is required to ensure compatibility of the RTX Pro 6000 GPU with the R7725 system.
NOTE:Low Profile and Full Height T4 cards are installed in order to support maximum 6 pcs T4 in x 16 slots.
NOTE:All GPU/FGPA cards require 1U L-type HSK and GPU shroud.

Thermal air restrictions

Fresh air environment

  • Two PSUs are required in redundant mode, however a single PSU failure is not supported.
  • PCIe SSD is not supported.
  • GPU and FPGA are not supported.
  • CPU TDP equal or greater than 180 W are not supported.
  • Rear drives are not supported.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
Table 1. Air cooling configuration thermal restriction for AHSRAE A2, A3, and A4 - No backplane configurationThis table provides information about Air cooling configuration thermal restriction for AHSRAE A2, A3, and A4 - No backplane configuration.
ASHRAE A2 A3/40°C (104 °F) A4/45°C (113 °F)
CPU T-wing HSK and HPR platinum fan are required for CPU >401 W. CPUs > 240 W are not supported. CPUs > 195 W are not supported.
PSU N/A Two PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card N/A Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA N/A Not supported
DIMM N/A DIMMs ≥ 64 GB are not supported.
OCP N/A Supported with 85 °C (185 °F) active optic cable. OCP NICs are not supported. 85°C active optics or DAC cable is required.
BOSS N/A N/A BOS-N1 is not supported.
Table 2. Air cooling configuration thermal restriction for AHSRAE A2, A3, and A4 - 8 x 2.5-inch Universal drive configurationThis table provides information about Air cooling configuration thermal restriction for AHSRAE A2, A3, and A4 - 8 x 2.5-inch Universal drive configuration.
ASHRAE A2 A3/40 °C (104 °F) A4/45 °C (113 °F)
CPU T-wing HSK and HPR platinum fan are required for CPU >401 W. CPUs > 240 W are not supported. CPUs > 195 W are not supported.
PSU N/A Two PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card N/A Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
NVMe N/A Not supported
GPU/FPGA N/A Not supported
DIMM N/A DIMMs ≥ 64 GB are not supported.
OCP N/A Supported with 85 °C (185 °F) active optic cable. OCP NICs are not supported. 85 °C active optics or DAC cable is required.
BOSS N/A N/A BOS-N1 is not supported.
Table 3. Air cooling configuration thermal restriction for AHSRAE A2, A3, and A4 - 16 x 2.5-inch Universal drive configurationThis table provides information about Air cooling configuration thermal restriction for AHSRAE A2, A3, and A4 - 16 x 2.5-inch Universal drive configuration.
ASHRAE A2 A3/40 °C (104 °F) A4/45 °C (113 °F)
CPU T-wing HSK and HPR platinum fan are required for CPU >401 W. CPUs > 240 W are not supported. CPUs > 195 W are not supported.
PSU N/A Two PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card N/A Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA N/A Not supported
DIMM N/A DIMMs ≥ 64 GB are not supported.
OCP N/A Supported with 85 °C (185 °F) active optic cable. OCP NICs are not supported. 85 °C active optics or DAC cable is required.
BOSS N/A N/A BOS-N1 is not supported.
Table 4. Air cooling configuration thermal restriction for AHSRAE A2, A3, and A4 - 32 x EDSFF E3.S Gen5 NVMe drive configurationThis table provides information about Air cooling configuration thermal restriction for AHSRAE A2, A3, and A4 - 32 x EDSFF E3.S Gen5 NVMe drive configuration.
ASHRAE A2 A3/40°C (104 °F) A4/45°C (113 °F)
CPU T-wing HSK and HPR platinum fan are required for CPU >401 W. Not supported Not supported
DIMM DIMM ≥ 96G are not supported. Not supported
Table 5. Liquid cooling configuration thermal restriction for AHSRAE A2, A3, and A4 - All storage configurationThis table provides information about liquid cooling configuration thermal restriction for AHSRAE A2, A3, and A4 - All storage configuration.
ASHRAE A2 A3/40 °C (104 °F) A4/45 °C (113 °F)
CPU T-wing HSK and HPR platinum fan are required for CPU >401 W. N/A N/A
PSU N/A Two PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card N/A Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA N/A Not supported
DIMM N/A DIMMs ≥ 64 GB are not supported.
Drives N/A E3.S drives are not supported. NVMe and E3.S drives are not supported.
OCP N/A Supported with 85 °C (185 °F) active optic cable. OCP NICs are not supported. 85 °C active optics or DAC cable is required.
BOSS N/A N/A BOS-N1 is not supported.

Other thermal restrictions

  • 25 Gb and above 25 Gb PCIe/OCP cards require DAC or 85 °C active optics, M14MK (SFP28) or 4WGYD(QSFP+).
  • L4 GPU: NG3PY(FH) / V9XT2(LP) slot restriction.
  • C05 with RC3: Slot 3 , 9 only.