Dell PowerEdge R7715: руководство по обслуживанию

Chassis dimensions

This image shows chassis dimension for the PowerEge R7715 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR7715 chassis dimensionsThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za	Zb	Zc
All drive configurations	482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	86.8 mm (3.41 inches)	30.78 mm (1.21 inches)With bezel 29.89mm (1.18 inches)Without bezel	700.7 mm (27.58 inches)Ear to rear wall	771.62 mm (30.38 inches)Ear to PSU handle

NOTE:Zb is the nominal rear wall external surface where the HPM board I/O connectors reside.

System weight

Table 1. PowerEdge R7715 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
No backplane configuration	22.93 kg (50.55 lb)
2 x U.2 SSD	20.24 kg (44.62 lb)
8 x 2.5-inch Universal drives	26.26 kg (57.89 lb)
8 x EDSFF E3.S Gen5 NVMe drives	27.33 kg (60.25 lb)
12 x 3.5-inch SAS/SATA drives	26.85 kg (59.19 lb)
16 x 2.5-inch SAS/SATA + 8 x U.2 drives	26.58 kg (58.59 lb)
16 x 2.5-inch SAS/SATA drives	26.81 kg (59.10 lb)
16 x EDSFF E3.S Gen5 NVMe drives	28.68 kg (63.22 lb)
24 x 2.5-inch SAS/SATA drives	27.67 kg (61.00 lb)
32 x EDSFF E3.S Gen5 NVMe drives	26.68 kg (58.81 lb)
40 x EDSFF E3.S Gen5 NVMe drives	28.38 kg (62.56 lb)

Table 2. PowerEdge R7715 weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight	Description
40–70 lb	Recommend two people to lift.
70–120 lb	Recommend three people to lift.
≥ 121 lb	Recommend to use a server-lift.

Memory specifications

The PowerEdge R7715 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Dual processor
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity
RDIMM	Single rank	16 GB	16 GB	384 GB
	Dual rank	32 GB	32 GB	768 GB
		64 GB	64 GB	1.5 TB
		96 GB	96 GB	2.3 TB
		128 GB	128 GB	3 TB
	Eight rank	256 GB	256 GB	6 TB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
24 DDR5 DIMM slots	5200 MT/s, 4000 MT/s

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:The processor may reduce the performance of the rated DIMM speed.

Cooling fan specifications

The PowerEdgeR7715 supports up to 6 standard (STD) cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Also known as	Label color
High performance (HPR) silver fans	HPR SLVR	Silver	Silver
Very high performance (VHP) fans	HPR GOLD	Gold	Gold
High Performance Platinum (HPR Pltm) fans	HPR PLTM	Platinum	Platinum

NOTE:Cooling fans rotate at slower speed, even while the system is in standby mode, and the fan speed varies in response to changes in the ambient temperature.

Expansion card riser specifications

The PowerEdge R7715 system supports up two PCI express (PCIe) slots (Gen5 slots), dual OCP NIC, and BOSS on the HPM board.

Table 1. Expansion card slots supported on the HPM boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Expansion card riser	Processor connection	Height	Length	Slot width
Slot 1	R1d	Processor 1	Full Height	Half Length	x8
Slot 2	R1d, R1e, R1e_DW	Processor 1	Full Height	Half Length,Full Length	x8, x16
Slot 3	R2n, R2m	Processor 1	Low Profile , Full Height	Full Length	x16
Slot 4	R3a, R3b, R3b_DW, R3e (OCP)	Processor 1	Full Height,	Half Lenght,Full Length	x8, x16
Slot 5	R3a	Processor 1	Full Height	Half Length	x8
Slot 6	BOSS	Processor 1	N/A	N/A	x4
Slot 7	R5b_DW, R5b, R5f, R5a	Processor 1	Full Height	Half Length , Full Lenght	x8, x16
Slot 8	R5f, R5a	Processor 1	Full Height	Half Length	x8, x16
Slot 9	R4a, R4b	Processor 1	Low Profile, Full Height	Half Length	x16
Slot 10	OCP	Processor 1	N/A	N/A	x16

Storage controller specifications

The PowerEdge R7715 system supports the following controller cards:

Table 1. Storage controller cardsThis table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers PERC H365i PERC H965i PERC H975i HBA465e H965e
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS)
Software RAID N/A

NOTE:For the ESXi operating system, H975i is supported on 9.0 or later versions.

Drives

The PowerEdge R7715 system supports:

No backplane configuration
2 x U.2 SSDs
8 x 2.5-inch SAS/SATA/NVME drives
8 x EDSFF E3.S Gen5 NVMe drives
12 x 3.5-inch SAS/SATA drives
16 x 2.5-inch SAS/SATA SSD + 8 x U.2 NVMe drives
16 x 2.5-inch SAS/SATA drives
16 x EDSFF E3.S Gen5 NVMe drives
24 x 2.5-inch SAS/SATA drives
32 x EDSFF E3.S Gen5 NVMe drives
40 x EDSFF E3.S Gen5 NVMe drives

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

GPU Specifications

The PowerEdge R7715 system supports the following GPU configurations:

Up to three 450 W Double wide or six 75 W single wide GPUs

DPU Specifications

The PowerEdge R7715 platform accommodates Data Processing Units (DPUs). These units are system-on-chip solutions that combine ARM cores, high-performance NICs, and programmable acceleration engines to offload and accelerate data center infrastructure services.

Table 1. Supported Data Processing Units(DPU) CardsThis table describes the feature and the specifications for the supported DPU cards in R7715
Feature	NVIDIA BlueField-3 2x200 GbE B3220	NVIDIA BlueField-3 1x400 GbE B3140H *
Type	Data Processing Units (DPU)	Data Processing Units (DPU)
Networking	2 x 200 GbE	1x400 GbE
Form Factor	FHHL	FHHL
Interface	PCIe Gen5 x16	PCIe Gen5 x16
Power Consumption	150 W	75 W
Compatible Risers	RC 1(Slot 7), RC 2(Slot 7), RC 3(Slots 2,7), RC 4(Slots 2,7), RC 5(Slots 2,7), RC 8(Slots 2,7)	TBD

NOTE: This document provides a comprehensive list of product features. However, features marked with an asterisk (*) may not be available at launch but introduced in future updates. Please note that this document does not confirm the availability or release timeline of any feature. For the most accurate and up-to-date information on feature availability, please refer to the product configurator page on dell.com.

NOTE:* Feature not available at product launch in November,2025. Please refer to the product configurator page on Dell.com to confirm feature availability.

Supported operating systems

The PowerEdge R7715 system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
RedHat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi

For more information, go to Operating System Manuals.

NIC port specifications

The PowerEdge R7715 system supports one 10/100/1000 Mbps BMC Ethernet, up to eight PCIe Add-in cards, up to two fibre channel HBA cards, and two optional Open Compute Project (OCP) cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
Datacenter-Secure Control Module (DC-SCM)	1 Gb Dedicated BMC Ethernet port x1
OCP NIC 3.0 card	200GbE x 2 (configurable to 400GbE x1), 100 GbE x 2, 25 GbE x 2, 25 GbE x 4 , 10 GbE x 4, 10 GbE x 2, 1 GbE x 4
PCIe Add-in Card (AIC) NIC	400 GbE x 1, 100 Gbe x 2
Fibre channel HBA	FC32, FC64

USB ports specifications

Table 1. PowerEdge R7715 USB specificationsThe following table shows the USB specifications for the system:
Front		Rear		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-Type A compliant port	One (optional-LCP KVM)	USB 3.1-Type A compliant port	Two	Internal USB 3.1-Type A compliant port	One
USB Type C dual-mode host/iDRAC Direct Port	One	USB 3.1-Type A compliant port	Two	Internal USB 3.1-Type A compliant port	One

VGA ports specifications

The PowerEdge R7715 system supports DB-15 VGA port on the rear DC-SCM.

Video specifications

Table 1. Supported video resolution optionsThis table describes the supported front video resolution options for the system.
Resolution	Refresh Rate	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Continuous Operation Specifications for Rugged Environment This table describes the operational climatic range for category A4.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–55°C (41–131°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 5. Common Environmental Specifications for ASHRAE A2, A3, A4 and Rugged This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40°C to 65°C (-40°F to 149°F) applicable for air cooling configuration -40°C to -5°C (-40°F to 23°F) applicable for DLC configuration NOTE: Liquid filled components, or systems/solutions containing liquid filled components are limited to approximately 5°C above their freeze point. At this time the only authorized liquid coolant is Recohem PG25 with a freeze point between -9°C and -13°C, therefore the lower non-operational temperature limit is -5°C. Components and systems/solutions that can contain liquid but do not at the time of testing shall be tested to the -40°C lower non-operational temperature limit.
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 6. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz (all operation orientations)
Storage	1.38 G_rms at 7 Hz to 250 Hz for 15 minutes (all six sides tested)

Table 7. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
HPR (Silver)	High performance Silver (HPR SLVR) fan
HPR (Gold)	High performance Gold (HPR GOLD) fan
HSK	Heat sink
LP	Low profile
FH	Full height
DLC	Direct Liquid Cooling

Table 2. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink	Processor TDP
2U-Ext	Regular cooling

NOTE:The configuration's ambient temperature is dictated by its critical component. For example, if the processor's ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the configuration's ambient temperature can only be 30°C.

Table 3. CPU thermal restriction matrix for Air cooling Non-GPU configurationThe following table shows the CPU thermal restriction matrix for Air cooling Non-GPU configuration.
CPU thermal restriction matrix for Air cooling Non-GPU configuration
2U-Ext HSK (5XD0R) ; Silver Fan (6R09C) ; HPR Gold Fan (7F0CF) , HPR P Fan (5337J)
CPU	cTDP	Max cTDP	Core Count	24 x 2.5-inch	16 x 2.5-inch	16 x EDSFF E3.S NVMe	32 x EDSFF E3.S NVMe	No Backplane/ 2 x U.2	16 x EDSFF E3.S NVMe
				Regular Air shroud
				Supported at 35°C
9015	125	155	8	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan
9115	125	155	16	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan
9135	200	240	16	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan
9255	200	240	24	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan
9335	280	300	32	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan
9355P	280	300	32	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan
9455	300	300	48	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan
9535	300	300	64	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan	2U-Ext HSK Silver Fan
9175F	320	400	16	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan
9275F	320	400	24	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan
9375F	320	400	32	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan
9475F	400	400	48	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan
9555P	360	400	64	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan
9575F	400	400	64	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan
9655P	320	400	96	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan
9745	400	400	128	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan
9825	390	400	144	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan
9845	390	400	160	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan	2U-Ext HSK HPR Gold Fan

Table 4. Memory thermal restriction matrix for Air Cooling Non-GPU configurationThe following table shows the memory thermal restriction matrix for Air Cooling Non-GPU configuration
Memory thermal restriction matrix for Air Cooling Non-GPU configuration
2U-Ext HSK (5XD0R) ; Silver Fan (6R09C) ; HPR Gold Fan (7F0CF) , HPR P Fan (5337J)
memory	24 x 2.5-inch	16 x 2.5-inch	16 x EDSFF E3.S NVMe	32 x EDSFF E3.S NVMe	No Backplane/ 2 x U.2	16 x EDSFF E3.S NVMe
	Regular Air shroud
	Supported at 35°C
16 GB RDIMM	Silver Fan	Silver Fan	Silver Fan	Silver Fan	Silver Fan	Silver Fan
32 GB RDIMM	Silver Fan	Silver Fan	Silver Fan	Silver Fan	Silver Fan	Silver Fan
64 GB RDIMM	Silver Fan	Silver Fan	Silver Fan	Silver Fan	Silver Fan	Silver Fan
96 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan
128 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan
256 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan

Table 5. GPU thermal restriction matrix for Air Cooling Non-GPU configurationThe following table shows the memory thermal restriction matrix for Air Cooling Non-GPU configuration
GPU thermal restriction matrix for Air Cooling Non-GPU configuration
2U-Ext HSK (5XD0R) ; Silver Fan (6R09C) ; HPR Gold Fan (7F0CF) , HPR P Fan (5337J)
GPU	24 x 2.5-inch	16 x 2.5-inch	16 x EDSFF E3.S NVMe	32 x EDSFF E3.S NVMe	No Backplane/ 2 x U.2	16 x EDSFF E3.S NVMe
	Regular Air shroud
	NOTE: Components that support max 30°C. NOTE:Components without support max 35°C.
L4 24 GB	HPR Gold Fan**	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan

Table 6. CPU thermal restriction matrix for Air cooling GPU configurationThe following table shows the CPU thermal restriction matrix for Air cooling GPU configuration.
CPU thermal restriction matrix for Air cooling GPU configuration
1U GPU HSK (2K16D) , HPR P Fan (5337J)
CPU	cTDP	Max cTDP	Core Count	16 x 2.5-inch	8 x 2.5-inch	8 x EDSFF E3.S NVMe
				GPU Air shroud
				Supported at 35°C
9015	125	155	8	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9115	125	155	16	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9135	200	240	16	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9255	200	240	24	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9335	280	300	32	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9355P	280	300	32	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9455	300	300	48	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9535	300	300	64	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9175F	320	400	16	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9275F	320	400	24	Not Support	Not Support	Not Support
9375F	320	400	32	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9475F	400	400	48	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9555P	360	400	64	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9575F	400	400	64	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9655P	320	400	96	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9745	400	400	128	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9825	390	400	144	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan
9845	390	400	160	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan	1U GPU HSK HPR P Fan

Table 7. Memory thermal restriction matrix for Air Cooling GPU configurationThe following table shows the memory thermal restriction matrix for air cooling configuration.
Memory thermal restriction matrix for Air Cooling GPU configuration
2U-Ext HSK (5XD0R) ; Silver Fan (6R09C) ; HPR Gold Fan (7F0CF) , HPR P Fan (5337J)
memory	16 x 2.5-inch	8 x 2.5-inch	8 x EDSFF E3.S NVMe
	Regular Air shroud
	Supported at 35°C
16 GB RDIMM	HPR P Fan	HPR P Fan	HPR P Fan
32 GB RDIMM	HPR P Fan	HPR P Fan	HPR P Fan
64 GB RDIMM	HPR P Fan	HPR P Fan	HPR P Fan
96 GB RDIMM	HPR P Fan	HPR P Fan	HPR P Fan
128 GB RDIMM	HPR P Fan	HPR P Fan	HPR P Fan
256 GB RDIMM	HPR P Fan	HPR P Fan	HPR P Fan

Table 8. CPU thermal restriction matrix for Direct Liquid Cooling Non-GPU configurationThe following table shows the CPU thermal restriction matrix for Direct Liquid Cooling Non-GPU configuration.
CPU thermal restriction matrix for Direct Liquid Cooling Non-GPU configuration
DLC Module (4JWWY) ; Silver Fan (6R09C) ; HPR Gold Fan (7F0CF)
CPU	cTDP	Max cTDP	Core Count	24 x U.2	8 x 2.5-inch	16 x 2.5-inch	8 x EDSFF E3.S NVMe
				Regular Air shroud
				NOTE:Components support max 35°C.
9015	125	155	8	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9115	125	155	16	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9135	200	240	16	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9255	200	240	24	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9335	280	300	32	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9355P	280	300	32	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9455	300	300	48	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9535	300	300	64	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9175F	320	400	16	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9275F	320	400	24	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9375F	320	400	32	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9475F	400	400	48	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9555P	360	400	64	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9575F	400	400	64	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9655P	320	400	96	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9745	400	400	128	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9825	390	400	144	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan
9845	390	400	160	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan	DLC Module Silver Fan

Table 9. Memory thermal restriction matrix for Direct Liquid Cooling Non-GPU configurationThe following table shows the Memory thermal restriction matrix for Direct Liquid Cooling Non-GPU configuration.
Memory thermal restriction matrix for Direct Liquid Cooling Non-GPU configuration
DLC Module (4JWWY) ; Silver Fan (6R09C), HPR Gold Fan (7F0CF)
Memory	24 x U.2	8 x 2.5-inch	16 x 2.5-inch	8 x EDSFF E3.S NVMe
	Regular Air shroud
	NOTE:Components support max 35°C.
16 GB RDIMM	Silver Fan	Silver Fan	Silver Fan	Silver Fan
32 GB RDIMM	Silver Fan	Silver Fan	Silver Fan	Silver Fan
64 GB RDIMM	Silver Fan	Silver Fan	Silver Fan	Silver Fan
96 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan
128 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan
256 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan

Table 10. GPU thermal restriction matrix for Direct Liquid Cooling Non-GPU configurationThe following table shows the GPU thermal restriction matrix for Direct Liquid Cooling Non-GPU configuration.
GPU thermal restriction matrix for Direct Liquid Cooling Non-GPU configuration
DLC Module (4JWWY) ; Silver Fan (6R09C), HPR Gold Fan (7F0CF)
GPU	24 x U.2	8 x 2.5-inch	16 x 2.5-inch	8 x EDSFF E3.S NVMe
	Regular Air shroud
	NOTE: Components that support max 30°C. NOTE:Components without support max 35°C.
L4 24 GB	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan

Table 11. CPU thermal restriction matrix for Direct Liquid Cooling GPU configurationThe following table shows the CPU thermal restriction matrix for Direct Liquid Cooling GPU configuration
CPU thermal restriction matrix for Direct Liquid Cooling GPU configuration
DLC Module(4JWWY), HPR Gold Fan (7F0CF)
CPU	cTDP	Max cTDP	Core Count	8 x 2.5-inch	16 x 2.5-inch	8 x EDSFF E3.S NVMe
				GPU Air shroud
				Supported at 35°C
9015	125	155	8	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9115	125	155	16	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9135	200	240	16	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9255	200	240	24	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9335	280	300	32	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9355P	280	300	32	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9455	300	300	48	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9535	300	300	64	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9175F	320	400	16	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9275F	320	400	24	TBD	TBD	TBD
9375F	320	400	32	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9475F	400	400	48	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9555P	360	400	64	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9575F	400	400	64	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9655P	320	400	96	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9745	400	400	128	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9825	390	400	144	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan
9845	390	400	160	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan	DLC Module HPR Gold Fan

Table 12. Memory thermal restriction matrix for Liquid Cooling GPU configurationThe following table shows the memory thermal restriction matrix for Liquid cooling GPU configuration.
Memory thermal restriction matrix for Liquid Cooling GPU configuration
DLC Module(4JWWY), HPR Gold Fan (7F0CF)
memory	16 x 2.5-inch	8 x 2.5-inch	8 x EDSFF E3.S NVMe
	GPU Air shroud
	Supported at 35°C
16 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan
32 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan
64 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan
96 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan
128 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan
256 GB RDIMM	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan

Thermal air restrictions

Fresh air environment

Two PSUs are required in redundant mode, however a single PSU failure is not supported.
PCIe SSD is not supported.
128 GB or greater capacity DIMMs are not supported.
GPU and FPGA are not supported.
CPU TDP equal or greater than 180 W are not supported.
Rear drives are not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.

Table 1. Air cooling configuration thermal restriction for AHSRAE A3 and A4This table provides information about ASHRAE A3 and A4 restrictions for air cooling configuration.
ASHRAE	A3/40°C (104°F)	A4/45°C (113°F)
Front storage	12 x 3.5” SAS is not supported
Fan type	HPR Sliver Fan 6R09C is required
CPU	CPU TDP ≥ 165W are not supported	CPU TDP ≥ 125 W are not supported
Memory	128 GB and higher capacity RDIMMS are not supported.
PCIe card	Non-Dell qualified peripheral cards and consuming power greater than 25 W are not supported.
GPU	GPU cards are not supported.
Rear storage	Not supported
OCP	Supported with 85°C (185°F) active optic cable.	Supported with 85°C (185°F) active optic cable and card Tier <4
PSU	Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
BOSS	Support BOSS-N1

Table 2. Liquid cooling configuration thermal restriction for AHSRAE A3 and A4This table provides information about ASHRAE A3 and A4 restrictions for air cooling configuration.
ASHRAE	A3/40°C (104°F)	A4/45°C (113°F)
Front storage	3.5’’ / E.3 config is not supported
Fan type	HPR Gold Fan (7F0CF) or up are required
PCISSD	Not Supported
Memory	128GB and higher Capacity RDIMMS are not supported.
PCIe card	Non-Dell qualified peripheral cards and consuming power greater than 25 W are not supported.
GPU	GPU cards are not supported.
Rear storage	Not supported
OCP	Supported with 85°C (185°F) active optic cable.	Not supported
PSU	Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
BOSS	Supported	Not supported