Dell PowerEdge R770AP: руководство по обслуживанию

Chassis dimensions

This image shows chassis dimension for the PowerEge R7525 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR770AP chassis dimensionsThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za	Zb	Zc
8 x 2.5-inch NVMe (SSD) drives 16 x 2.5-inch NVMe (SSD) drives 32 x EDSFF E3.S	482.0 mm (18.98inches)	434.0mm (17.09 inches)	86.80 mm (3.42 inches)	30.78 mm (1.21 inches) With bezel 29.89 mm (1.18 inches) Without bezel	700.7mm (27.59 inches Ear to rear wall)	771.62 mm (30.38 inches) Ear to PSU handle

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R770AP system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
8 x 2.5-inch NVMe (SSD)	24.74 kg (54.54 lb)
16 x 2.5-inch NVMe (SSD)	27.34 kg (60.27 lb)
32 x EDSFF E3.S	29.30 kg (64.59 lb)

Table 2. PowerEdge R770AP weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight	Description
40–70 lb	Recommend two people to lift
70–120 lb	Recommend three people to lift
≥ 121 lb	Recommend to use a server-lift

Processor specifications

Table 1. PowerEdge R770AP processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
Intel^® Xeon^® 6 P-Core processor	Two

Cooling fan specifications

The PowerEdgeR770APsystem supports up to six hot-swappable High performance Gold (HPR GOLD) fans .

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Label color	Label image
High performance Gold (HPR GOLD) fans	HPR GOLD	Gold
High performance Platinum Fan (HPR Platinum)	HPR Platinum	Platinum

NOTE:Cooling fans rotate at slower speed, even while the system is in standby mode, and the fan speed varies in response to changes in the ambient temperature.

Supported operating system

The PowerEdge R770AP system supports the following operating systems:

Canonical Ubuntu Server LTS
Windows Server
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware vSAN/ ESXi*
Microsoft Windows 2025

For specifications and interoperability details, see OS support.

NOTE:* Feature not available at product launch. Please refer to the product configurator page on Dell.com to confirm feature availability.

System battery specifications

The PowerEdge R770AP system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R770AP system supports up to five PCI express (PCIe) slots (Gen5 slots), on the system board.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Expansion card riser	Processor connection	Height	Length	Slot width
Slot 2	R1b	Processor 1	Full Height	Half Length	x16
Slot 3	R2b	Processor 1	Full Height	Half Length	x16
Slot 3	R2a	Processor 1	Low Profile	Half Length	x16
Slot 4	R3e (OCP)	Processor 1	N/A	N/A	x16
Slot 4	R3g (OCP)	Processor 1	N/A	N/A	x8
Slot 5	R3g	Processor 1	Full Height	Half Length	x16
Slot 6	BOSS	Processor 0	N/A	N/A	x4
Slot 7	R5b	Processor 0	Full Height	Half Length	x16
Slot 9	R4b	Processor 0	Full Height	Half Length	x16
Slot 9	R4a	Processor 0	Low Profile	Half Length	x16
Slot 10	OCP	Processor 0	N/A	N/A	x16

Memory specifications

The PowerEdge R770AP system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	Rank	Capacity	Single processors		Dual processors
			Intel^® Xeon 6 P- core processor		Intel^® Xeon 6 P- core processor
			Minimum system capacity	Maximum system capacity	Minimum system capacity	Maximum system capacity
RDIMM	2 R	32 GB	32 GB	384 GB	64 GB	768 GB
		64 GB	64 GB	768 GB	128 GB	1.5 TB
		96 GB	96 GB	1.1 TB	192 GB	2.3 TB
		128 GB	128 GB	1.5 TB	256 GB	3 TB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
24, 288-pin	6400 MT/s

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:The processor may reduce the performance of the rated DIMM speed.

NOTE:DIMM mixing configurations are not allowed. All DIMM slots must be populated with the exact same DIMMs (one Dell PN).

Storage controller specifications

The PowerEdge R770AP system supports the following controller cards:

Table 1. Storage controller cards This table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal controllers: PERC H975i DC-MHS front
External controllers N/A
Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS): HWRAID 1, 2 x M.2 NVMeSSDs USB
Software RAID: N/A

Drives

The PowerEdge R770AP system supports:

Up to 8 x 2.5-inch hot-swappable NVMe(SSD) drives
Up to 16 x 2.5-inch hot-swappable NVMe(SSD) drives
Up to 32 x EDSFF E3.S hot-swappable NVMe(SSD) drives

NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

NIC port specifications

The PowerEdge R770AP system supports Network Interface Controller (NIC) ports that are embedded on the PCIe network cards and Open Compute Project (OCP) NIC cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
PCIe Network card	25 GbE x 2, 100 GbE x 2, 200 GbE x 2, 400 GbE x 1
OCP NIC 3.0 card	1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4, 100 GbE x 2, 200 GbE x 2

USB ports specifications

Table 1. PowerEdge R770AP USB specificationsThe following table shows the USB specifications for the system:
Front		Rear		Internal
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0 compliant. Type - C port	One	USB 3.1 compliant ports	Two	Internal USB 3.1 compliant port.	One

VGA ports specifications

The PowerEdge R770AP system supports DB-15 VGA port on the rear I/O of the Datacenter Secure Control Module (DC-SCM).

Video specifications

The PowerEdge R770AP system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Specifications	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Specifications	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Specifications	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Continuous Operation Specifications for Rugged Environment This table describes the operational climatic range for category A4.
Specifications	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–55°C (41–131°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 5. Common Environmental Specifications for ASHRAE A2, A3, A4, and Rugged This table describes the shared requirements across all categories.
Specifications	Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-104°F to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 6. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz (all operation orientations)
Storage	1.38 G_rms at 7 Hz to 250 Hz for 15 minutes (all six sides tested)

Table 7. Maximum shock pulse specificationsThe maximum shock specification of an operational system is shown in the below table.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal restriction Air cooling

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
HPR (Gold)	High-performance Gold (HPR GOLD) fan
HPR (Platinum)	High performance (HPR Platinum) fan
HSK	Heat sink
LP	Low profile
FH	Full height
EXT	Extend
L-type	L-shaped

Table 2. Air cooling configurationThe table lists the Air cooling configuration
Label	Air Cooling Configurations
Storage Configuration	No BP C00-01	8 x 2.5-inch NVMe C01-01,C02-01	16 x 2.5-inch NVMe C04-01,C04-02	32 x E3.S C05-01
Riser Configuration	RC1	RC0	RC0, RC1	RC0, RC1
Air Shroud Type	Regular shroud	Regular shroud	Regular shroud	Regular shroud

Table 3. ProcessorsThermal restriction for processors
Processor	TDP	Core Count	No BP C00-01	8 x 2.5-inch NVMe C01-01,C02-01	16 x 2.5-inch NVMe C04-01,C04-02	32 x E3.S C05-01
6952P	400 W	96	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan	HPR Gold Fan
6960P	500 W	72	HPR Platinum Fan	HPR Platinum Fan	HPR Platinum Fan	HPR Platinum Fan
6972P	500 W	96	HPR Platinum Fan	HPR Platinum Fan	HPR Platinum Fan	HPR Platinum Fan
6978P	500 W	120	HPR Platinum Fan	HPR Platinum Fan	HPR Platinum Fan	HPR Platinum Fan
6980P	500 W	128	HPR Platinum Fan	HPR Platinum Fan	HPR Platinum Fan	HPR Platinum Fan

Other Restrictions

For rear I/O configurations, 25Gb and above 25Gb PCIe/OCP cards require DAC or 85° C active optics.

–85° C active optics: 4WGYD(QSFP+)