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Dell PowerEdge R770: руководство по обслуживанию
Chassis I/O Configuration
Dell Servers offer choices for the
location of Networking Interface and Systems Management cable connections.
Rear I/O (Input/Output) is the most common configuration.
With Rear I/O network connections are at the rear of the Server. Systems management
cables are connected at the rear by a dedicated port or a selectable shared port
with a network interface controller. The power supplies and power cables are at the
rear of the Server.
Figure 1. Rear I/O
configurations. This image shows the Rear I/O configurations for R770 system.
NOTE: Sample chassis
configurations; these may not match your configuration.
Front I/O (Input/Output) is an option where PCIe risers and
OCP network interface controllers are in the front of the Server. Systems management
cables are connected at the front of the server by a dedicated port or a selectable
shared port with a network interface controller. The power button and system status
indicators are at the front of the Server.
Figure 2. Front I/O
configurations. This image shows the Front I/O configurations for R770 system.
NOTE: Sample chassis
configurations; these may not match your configuration.
Both configurations have their benefits, but the most common reason for choosing
Front I/O is the desire to connect I/O and Systems Management cables to the front of
the server. There are certain rack infrastructure products that take advantage of a
front I/O location.
Chassis dimensions
Figure 1. Chassis dimensions
Table 1. PowerEdgeR770 chassis dimensionsThis table provides the dimensions of the system:
Drives
Xa
Xb
Y
Za
Zb
Zc
8 x EDSFF E3.S (Front I/O)
16 x EDSFF E3.S (Front I/O)
482.0 mm (18.97 inches)
434.0 mm (17.08 inches)
86.8 mm (3.41 inches)
42.9 mm (1.68 inches)Without bezel
700.7 mm (27.58 inches)Ear to rear wall
771.62 mm (30.37 inches)Ear to PSU handle
8 x 2.5-inch SATA
8 x 2.5-inch Universal
16 x 2.5-inch SATA
16 x 2.5-inch + 8 x 2.5-inch SATA
24 x 2.5-inch SATA
16 x EDSFF E3.S
32 x EDSFF E3.S
40 x EDSFF E3.S
482.0 mm (18.97 inches)
434.0 mm (17.08 inches)
86.8 mm (3.41 inches)
30.78 mm (1.21 inches) With bezel
29.89 mm (1.18 inches) Without bezel
700.7 mm (27.58 inches)Ear to rear wall
771.62 mm (30.37 inches)Ear to PSU handle
NOTE:Zb is the nominal rear wall
external surface where the system board I/O connectors reside.
System weight
Table 1. PowerEdgeR770system weightThe table below shows the maximum weight of the system.
System configuration
Maximum weight (with all drives/SSDs)
8 x EDSFF E3.S
25.89 kg (57.07 lb)
16 x EDSFF E3.S
28.53 kg (62.89 lb)
8 x 2.5-inch SATA drives
27.2 kg (59.96 lb)
8 x 2.5-inch Universal
27.2 kg (59.96 lb)
16 x 2.5-inch SATA drives
29.5 kg (65.03 lb)
16 x 2.5-inch + 8 x 2.5-inch SATA drives
31.33 kg (69.07 lb)
24 x 2.5-inch SATA drives
32.08 kg (70.72 lb)
32 x EDSFF E3.S
31.24 kg (68.87 lb)
40 x EDSFF E3.S
30.96 kg (68.25 lb)
Table 2. PowerEdgeR770 weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight
Description
40–70 lb
Recommend two people to lift
70–120 lb
Recommend three people to lift
≥ 121 lb
Recommend to use a server-lift
Processor specifications
Table 1. PowerEdgeR770 processor specifications This table provides processor specifications for the system.
Supported processor
Number of processors supported
Intel® Xeon® 6
E-Core processor
Two
Intel® Xeon® 6 P-Core processor
Two
Table 2. Minimum Firmware version
requirement for Intel® Xeon® 6 P-Core ProcessorsThe below table describes the supported firmware version based on
different processors.
Processors
iDRAC
BIOS
FPGA
6787P
1.20.25.00
1.2.6
107.114.104
6767P
6760P
6747P
6740P
6736P
6737P
6730P
6530P
6527P
6520P
6724P
6517P
6515P
6505P
6714P
6507P
Data is not available for the Topic
PSU specifications
The PowerEdgeR770system supports up to two AC or DC power supply units (PSUs).
Table 1. R770 PSU
specificationsThis table describes PSU specifications for the system.
PSU
Class
Heat dissipation (maximum) (BTU/hr)
Frequency (Hz)
AC Voltage
DC Voltage
Current (A)
200—240 V
100—120 V
277 V
240 V
- (48—60) V
336 V
800 W mixed mode
Platinum
3000
50/60
800 W
800 W
N/A
N/A
N/A
N/A
9.2—4.5
N/A
3000
N/A
N/A
N/A
N/A
800 W
N/A
N/A
3.7
Titanium
3000
50/60
800 W
800 W
N/A
N/A
N/A
N/A
9.2—4.5
N/A
3000
N/A
N/A
N/A
N/A
800 W
N/A
N/A
3.7
1100 W mixed mode
Platinum
4125
50/60
1100 W
1050 W
N/A
N/A
N/A
N/A
12—6.1
N/A
4125
N/A
N/A
N/A
N/A
1100 W
N/A
N/A
5.1
Titanium
4125
50/60
1100 W
1050 W
N/A
N/A
N/A
N/A
12—6.1
N/A
4125
N/A
N/A
N/A
N/A
1100 W
N/A
N/A
5.1
1400 W -48 VDC*
N/A
5310
N/A
N/A
N/A
N/A
N/A
1400 W
N/A
33
1500 W mixed mode
Titanium
5625
50/60
1500 W
1050 W
N/A
N/A
N/A
N/A
12—8.2
N/A
5625
N/A
N/A
N/A
N/A
1500 W
N/A
N/A
6.8
1500 W 277Vac & HVDC*
Titanium
5625
50/60
N/A
N/A
1500 W
N/A
N/A
N/A
6.1
N/A
5625
N/A
N/A
N/A
N/A
N/A
N/A
1500 W
4.91
1800 W HLAC*
Titanium
6750
50/60
1800 W
N/A
N/A
N/A
N/A
N/A
9.8—8.2
1800 W HVDC
N/A
6750
N/A
N/A
N/A
N/A
1800 W
N/A
N/A
8.2
2400 W mixed mode*
Titanium
9000
50/60
2400 W
1400 W
N/A
N/A
N/A
N/A
16—13.2
N/A
9000
N/A
N/A
N/A
N/A
2400 W
N/A
N/A
10.9
3200 W mixed mode
Titanium
12000
50/60
2900
W**
3200 W***
N/A
N/A
N/A
N/A
N/A
16
N/A
12000
N/A
N/A
N/A
N/A
3200 W
N/A
N/A
14.5
3200 W 277Vac & HVDC*
Titanium
12000
50/60
N/A
N/A
3200 W
N/A
N/A
N/A
12.9
N/A
12000
N/A
N/A
N/A
N/A
N/A
N/A
3200 W
10.47
NOTE:*Feature not available at product launch in June 2025.
Please refer to the product configurator page on Dell.com to confirm feature
availability.
NOTE:
**200-220 V
*** 220.1-240 V
NOTE:PowerEdgeR770 supports up to two mixed mode power supplies with non-redundancy (1+0, 2+0), as the iDRAC does not calculate system power consumption.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at
calc.
Figure 1. PSU power cordsFigure 2. APP 2006G1 power cord
Figure 3. Lotes DC PSU
connector
Table 2. PSU power cordsThe table lists the PSU power cords list .
Form factor
Output
Power cord
60 mm
800 W mixed mode
C13
1100 W mixed mode
C13
1400 W -48 VDC
Lotes RN5T2
1500 W mixed mode
C13
1500 W mixed mode 277Vac & HVDC
APP/Saf-D-Grid
1800 W mixed mode
C13
73.5 mm
2400 W mixed mode
C19
3200 W mixed mode
C19
3200 W mixed mode 277Vac & HVDC
APP/Saf-D-Grid
Cooling fan specifications
The PowerEdgeR770system supports up to six High performance Silver (HPR SLVR) fans
or High performance Gold (HPR GOLD) fans
or High Performance Platinum (HPR Pltm)
fans .
Table 1. Cooling fan specificationsCooling fan specifications
Fan type
Abbreviation
Label color
Label image
High performance Silver (HPR SLVR) fans
HPR SLVR
Silver
High performance Gold (HPR GOLD) fans
HPR GOLD
Gold
High Performance Platinum (HPR Pltm) fans
HPR PLTM
Platinum
x4 E3 Rear Fan
x4 E3 Rear Fan
N/A
NOTE:Cooling fans rotate at a slower speed, even
while the system is in standby mode, and the fan speed varies in response to changes
in the ambient temperature.
Supported operating system
The PowerEdgeR770system supports the following operating systems:
Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
Dell NativeEdge OS*
NOTE:*Features marked with an asterisk (*) may not be available at
product launch. Please refer to the product configurator page on Dell.com to confirm feature
availability.
For specifications and interoperability details, see
OS support.
System battery specifications
The
PowerEdgeR770system uses one
CR 2032 3.0-V lithium coin cell battery.
Memory specifications
The PowerEdgeR770system supports the following memory specifications for
optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type
Rank
Capacity
Dual processors
Intel® Xeon 6 E- core
processor
Intel® Xeon 6 P-
core processor
Minimum system capacity
Maximum system capacity
Minimum system capacity
Maximum system capacity
RDIMM
1 R
16 GB
N/A
N/A
32 GB
256 GB
2 R
32 GB
64 GB
512 GB
64 GB
1 TB
64 GB
1 TB
2 TB
512 GB
2 TB
96 GB
N/A
N/A
1.5 TB
3 TB
128 GB
N/A
N/A
2 TB
4 TB
8 R
256 GB
N/A
N/A
8 TB
8 TB
NOTE:Only 32 GB allowed for 1 DIMM per
processor for E- core processors with limited features.
NOTE:Only 16 GB or 32 GB allowed for 1 DIMM per processor for P-
core processors with limited features.
NOTE: Memory
mirroring is supported only on P- core processors.
NOTE: Fault resilient mode (FRM) is supported only on P- core
processors with 8 or 16 DIMMs per processor.
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets
Speed
32, 288-pin
6400 MT/s
NOTE:Memory DIMM slots are not hot
pluggable.
NOTE:The processor may reduce the
performance of the rated DIMM speed.
NOTE:DIMM mixing configurations are not
allowed. All DIMM slots must be populated with the exact same DIMMs (one Dell PN).
Storage controller specifications
The PowerEdgeR770system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards that are supported on
the system:
Supported storage
controller cards
Internal
controllers:
H965i Front DC-MHS
H365i Front DC-MHS
H975i Front DC-MHS
External controllers
H965e
HBA465e
Internal Boot
Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS): HWRAID 1, 2 x M.2 NVMe SSDs or
M.2 Interposer
board (DC-MHS): 2 x M.2 NVMe SSDs or
USB
Software RAID: N/A
SAS Hot Bus Adapters
(HBA): HBA465e
NOTE: For the ESXi operating system, H975i is supported
on 9.0 or later versions.
Drives
The PowerEdgeR770system supports:
Up to 8 x EDSFF E3.S hot-swappable NVMe drives FIO configuration
Up to 16 x EDSFF E3.S hot-swappable NVMe drives
FIO configuration
Up to 16 x EDSFF E3.S hot-swappable NVMe drives
Up to 32 x EDSFF E3.S hot-swappable NVMe drives
Up to 40 x EDSFF E3.S hot-swappable NVMe drives
Up to 4 x EDSFF E3.S hot-swappable NVMe drives on the rear
Up to 8 x 2.5-inch hot-swappable
SAS/SATA/NVMe drives
Up to 8 x 2.5-inch hot-swappable Universal drives
Up to 16 x 2.5-inch hot-swappable
SAS/SATA drives
Up to 24 x 2.5 inch hot-swappable SAS/SATA/NVMe drives
NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the
Dell Express Flash NVMe PCIe SSD User's Guide at
Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure
> Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product
> Documentation
> Manuals and Documents.
GPU Specifications
The PowerEdgeR770system supports
Up to four NVIDIA L4 24 GB, 72 W
single-width GPUs
Up to six NVIDIA L4 24 GB, 72 W single-width GPUs
Up to two NVIDIA L4 24 GB, 72 W single-width GPUs
Up to two NVIDIA H100 NVL 94 GB, 350 W double-width GPUs
Up to two NVIDIA L40s 48 GB, 350 W double-width GPUs
Up to two NVIDIA A16 64 GB, 250 W double-width GPUs
Up to two NVIDIA H200 NVL 141 GB, 450 W double-width GPUs
Up to two NVIDIA RTX Pro 6000 96 GB, 450 W double-width GPUs
NOTE:
For A16, L40s, L4, and H100 GPUs, RHEL, SLES, Ubuntu, and Windows operating
systems are supported.
For H200 and NVIDIA RTX Pro 6000, only Ubuntu operating system is
supported.
ESXi version 8.0 operating system support is available for all GPUs except
NVIDIA RTX Pro 6000 and H200.
NOTE:See Supported operating system section for information about
the supported operating systems.
NOTE: The NVIDIA H200 NVL and NVIDIA RTX Pro 6000 are designed to
support up to 600 W, however, they are power capped to 450 W support on R770.
NOTE:The NVIDIA H200 NVL and NVIDIA RTX Pro 6000 require Ubuntu
operating system 24.04.02 with Kernel 6.11 or later.
NOTE: Minimum requirements for supporting NVIDIA H200 NVL and
NVIDIA RTX Pro 6000 GPUs and R770 GPU ready configuration with riser configuration
Riser Config 6-2 and Riser Config 11-2:
All fan modules must be High performance Platinum Fan (HPR Platinum)
type.
The iDRAC version must be at least 1.20.60.55; otherwise, a potential FAN
type mismatch error may appear in the LC log, and the FAN speed will be
limited to 50% capacity.
The puck power cables that are required for GPU installations are specific
to the slot: DPN: DCNHT for slot 2 and DPN: K8FW0 for slot 7.
Cables with extended soldering are intended for use with L40S, H100, H200, and RTX Pro 6000
GPUs.
Table 1. Cable connector for
GPUsThe table below shows the connectors for the GPUs.
Cable connector image with extended soldering
Cable connector image without extended soldering
Figure 1. Cable with the extended soldering
supports L40S, H100, H200, and RTX Pro 6000 DW
GPUs.
Figure 2. Cable without the extended soldering
is compatible only with L40S and H100 DW GPUs.
NOTE:The system supports up to 75 W of
PCIe slot power without the use of an extra auxiliary power cable.
NOTE:*Features marked with an asterisk (*) may not be available
at product launch. Please refer to the product configurator page on Dell.com to
confirm feature availability.
DPU Specifications
The PowerEdge R770 platform accommodates Data Processing
Units (DPUs). These units are system-on-chip solutions that combine ARM cores,
high-performance NICs, and programmable acceleration engines to offload and accelerate data
center infrastructure services.
Table 1. Supported Data Processing Units(DPU)
CardsThis table describes the feature and the specifications for the supported DPU cards in
R770
Riser configurations RC 6-2 and RC 11-2 support installation of GPU RTX Pro 6000 and
DPUs on the same system.
For riser configuration RC 11-2, slot 5 supports installation of the NVIDIA BF3 DPU 1
x 400 GbE B3140H when slot 7 and slot 2 are populated with NVIDIA RTX Pro 6000
GPUs.
NIC port specifications
The PowerEdgeR770system supports Network Interface Controller (NIC) ports that are embedded on the Open Compute Project (OCP) NIC cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature
Specifications
OCP NIC 3.0 card
1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4, 100 GbE x 2
NOTE:The OCP NIC card can be installed in front or rear of the system, depending on the system I/O configuration.
Serial connector specifications
The PowerEdgeR770system system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant
.
The optional serial connector card is available only in front I/O configuration.
Top USB port on DC-SCM supports external DB9 Dongle.
USB ports specifications
Table 1. PowerEdgeR770 USB specificationsThe following table shows the USB specifications for the system:
Front
Rear
Internal
USB port type
No. of ports
USB port type
No. of ports
USB port type
No. of ports
USB 2.0-compliant port
One (optional)
USB 3.1-compliant ports
Two
Internal USB 3.1-compliant port
One
USB 2.0 Type C port
One
VGA ports specifications
The PowerEdgeR770system supports VGA port on the rear I/O of the
Datacenter Secure Control Module (DC-SCM).
Video specifications
The PowerEdgeR770system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution
Refresh rate (Hz)
Color depth (bits)
1024 x 768
60
8, 16, 32
1280 x 800
60
8, 16, 32
1280 x 1024
60
8, 16, 32
1360 x 768
60
8, 16, 32
1440 x 900
60
8, 16, 32
1600 x 900
60
8, 16, 32
1600 x 1200
60
8, 16, 32
1680 x 1050
60
8, 16, 32
1920 x 1080
60
8, 16, 32
1920 x 1200
60
8, 16, 32
Environmental specifications
NOTE:For additional information about environmental certifications, refer to the
Product Environmental Datasheet located with the
Manuals & Documents on
Dell Support.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)
10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)
8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating
Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)
5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)
8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating
Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)
5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)
8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating
Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Continuous Operation Specifications for Rugged Environment This table describes the operational climatic range for category A4.
Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)
5–55°C (41–131°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)
8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating
Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 5. Common Environmental Specifications for ASHRAE A2, A3, A4, and Rugged This table describes the shared requirements across all categories.
Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)
20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits
-40 to 65°C (-104°F to 149°F)
Non-operational humidity limits
5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude
12,000 meters (39,370 feet)
Maximum operational altitude
3,048 meters (10,000 feet)
Table 6. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration
Specifications
Operating
0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage
1.38 Grms at 7 Hz to 250 Hz for 15 minutes (all six sides tested)
Table 7. Maximum shock pulse specificationsThe maximum shock specification of an operational system is shown in the below table.
Maximum shock pulse
Specifications
Operating
Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage
Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination
Specifications
Air filtration: Conventional Data Center only
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)
Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments
Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination
Specifications
Notes
Copper coupon corrosion rate
ISA-71 Class G1: <300 Å/month
Per ANSI/ISA71.04
Silver coupon corrosion rate
ISA-71 Class G1: <200 Å/month
Per ANSI/ISA71.04
Thermal restriction matrix
Table 1. Label referenceThis table describes the label references used in the restriction
tables.
Label
Description
STD
Standard
HPR (Silver)
High performance Silver (HPR SLVR) fan
HPR (Gold)
High performance Gold (HPR GOLD) fan
HSK
Heat sink
LP
Low profile
FH
Full height
EXT
Extend
L-type
L-shaped
Table 2. Processor and heat sink
matrixThis table describes the processor and heat sink restriction matrix.
Heat sink
Processor TDP
2U EXT HSK
For configs without rear GPUs and CPU TDP ≥ 200 W
For all CPUs in FIO RC 1/2 configs
1U EXT HSK
≤ 250 W (GPU shroud should be installed
with rear GPU/FGPA/long PCIe cards)
L-type HSK
> 250 W (GPU shroud should be
installed with rear GPU/FGPA/long PCIe cards)
1U STD HSK
For configs without rear GPUs and CPU TDP < 200
W
DLC Module
Vendor DELTA. For all DLC configs
Vendor COOL-IT. For all DLC configs
NOTE:The configuration's ambient
temperature is dictated by its critical component. For example, if the processor's
ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the
configuration's ambient temperature can only be 30°C.
Table 3. Thermal restriction matrix for
Non-GPU Configurations E-Core processorsThe table describes the thermal restriction matrix for Non-GPU
Configurations E-Core processors:
Configuration
No BP
FIO 8 x EDSFF E3.S NVMe
FIO 16 x EDSFF E3.S NVMe
8 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA + 8 x 2.5 inch U.2
24 x 2.5 inch SAS/SATA
16 x EDSFF E3.S NVMe
32 x EDSFF E3.S NVMe
40 x EDSFF E3.S NVMe
40 x EDSFF E3.S NVMe + 4 x Rear EDSFF E3.S NVMe
Ambient temperature
Storage configuration
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
4 x Rear EDSFF E3.S with 1x Rear-Fan
Storage configuration
number
C0-01
C01-01
C02-01
C04-01~09
C05-01/02
C06-01/02/06/07
C07-01/02
C09-01/03
C08-01/02/04
C10-01
C10-02
Riser configuration
RC 6/7/11
RC 2
RC 1/2/6
RC 0/6/7/11
RC 6/7/11
RC 6/7/11
RC 6/7/11
RC 6/7/11/12
RC 6/7/11/12/15
RC7
RC14
Processor
TDP
Cores
Fan
6710E
205 W
64
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
35°C
6756E
225 W
128
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
35°C
6740E
250 W
96
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
35°C
6746E
250 W
112
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
35°C
6766E
250 W
144
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
35°C
6780E
330 W
144
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR SLVR + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
HPR GOLD + 2U-EXT HSK
35°C
RDIMM
1 DPC power
2 DPC power
DIMM
configuration
32 GB
8 W
N/A
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
64 GB
13 W
10 W
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
Table 4. Thermal restriction matrix for
Non-GPU Configurations P-Core processorsThermal restriction matrix for Non-GPU Configurations P-Core
processors
Configuration
No BP
FIO 8 x EDSFF E3.S NVMe
FIO 16 x EDSFF E3.S NVMe
8 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA + 8 x 2.5 inch U.2
24 x 2.5 inch SAS/SATA
16 x EDSFF E3.S NVMe
32 x EDSFF E3.S NVMe
40 x EDSFF E3.S NVMe
40 x EDSFF E3.S NVMe + 4 x Rear EDSFF E3.S NVMe
Ambient temperature
Storage configuration
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
4 x Rear EDSFF E3.S with 1x Rear-Fan
Storage configuration
number
C0-01
C01-01
C02-01
C04-01~09
C05-01/02
C06-01/02/06/07
C07-01/02
C09-01/03
C08-01/02/04
C10-01
C10-02
Riser configuration
RC 6/7/11
RC 2
RC 1/2/6
RC 0/6/7/11
RC 6/7/11
RC 6/7/11
RC 6/7/11
RC 6/7/11/12
RC 6/7/11/12/15
RC7
RC14
Processor
TDP
Cores
Fan
6507P
150 W
8
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
35°C
6505P
150 W
12
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
35°C
6515P
150 W
16
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
35°C
6714P
165 W
8
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
35°C
6517P
190W
16
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR SILVER Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
HPR GOLD Fan+ 1U STD HSK
35°C
6736P
205 W
36
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
6724P
210 W
16
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
6520P
210 W
24
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
6530P
225 W
32
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
6730P
250 W
32
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
6527P
255 W
24
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
6737P
270 W
32
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
6740P
270 W
48
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
6747P
330 W
48
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
6760P
330 W
64
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
6767P
350 W
64
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
6787P
350 W
86
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR SILVER Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
HPR GOLD Fan+ 2U-EXT HSK
35°C
RDIMM
1 DPC power
2 DPC power
DIMM
configuration
16 GB
6 W
N/A
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
32 GB
8 W
6
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
64 GB
13 W
10 W
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
96 GB
15
11
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
128 GB
16
12
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
N/A
256 GB
N/A
15
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
HPR GOLD 35°C
N/A
NOTE:“High-Performance GOLD” is required for DIMM ≥ 128 GB
NOTE: Both Front I/O and Rear I/O
configurations are supported, using the same chassis.
Table 5. Thermal Restriction for GPU
Configurations for E-core processorsThermal Restriction for GPU Configurations for E-core processors
Configuration
No BP
FIO 8 x EDSFF E3.S NVMe
FIO 16 x EDSFF E3.S
NVMe
8 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA + 8 x 2.5 inch U.2
24 x 2.5 inch SAS/SATA
16 x EDSFF E3.S
NVMe
32 x EDSFF E3.S NVMe
40 x EDSFF E3.S NVMe
40 x EDSFF E3.S NVMe + 4 x Rear EDSFF E3.S NVMe
Ambient temperature
Storage configuration
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
4 x Rear EDSFF E3.S with 1x Rear-Fan
Storage configuration
number
C0-01
C01-01
C02-01/02
C04-01~09
C05-01/02
C06-01/02/06/07
C07-01/02
C09-01
C09-03
C08-01/02/04
C10-01
C10-02
Riser configuration
RC 6/7/11
RC 2NOTE 1
RC1/2 NOTE 1
RC 6
RC 6/7/11
RC 6/7/11
RC 6/7/11
RC 6/7/11
RC 6/7/11
RC 7/11/12
RC 6/12/15
RC 7
RC 14
Air shroud type
GPU
Regular
Regular
GPU
GPU
GPU
GPU
GPU
GPU
GPU
GPU
GPU
GPU
Processor
TDP
Cores
Heat-sink
6710E
205 W
64
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6756E
225 W
128
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6740E
250 W
96
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6746E
250 W
112
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6766E
250 W
144
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6780E
330 W
144
1U L-TYPE HSK
2U-EXT HSK
2U-EXT HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
35°C
RDIMM
1 DPC power
2 DPC power
DIMM ambient
temperature
32 GB
8 W
N/A
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
64 GB
13 W
10 W
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
GPU
TDP
GPU ambient
temperature
L4 24 GB
72 W
CPU>=300 W, 30°C
35°C
35°C
CPU>=300 W, 30°C
CPU>300 W, 30°C
30°C NOTE 4
30°C NOTE 2
30°C NOTE 2
CPU>300 W, 30°C
CPU>300 W, 30°C NOTE 4
30°C NOTE 3
30°C
30°C
N/A
H100 NVL 94 GB
400 W
35°C
Not supported
Not supported
35°C
35°C
35°C
30°C
35°C
35°C
35°C
35°C
Not supported
Not supported
N/A
L40S 48 GB
350 W
35°C
Not supported
Not supported
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
Not supported
Not supported
35°C
A16 64 GB
250 W
35°C
Not supported
Not supported
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
Not supported
Not supported
35°C
Nvidia H200 NVLNOTE 6
450 W
HPR PLTM Fan
Not supported
Not supported
HPR PLTM Fan
HPR PLTM Fan
HPR PLTM Fan
HPR PLTM Fan, 30°C
HPR PLTM Fan, 30°C
HPR PLTM Fan
HPR PLTM Fan
HPR PLTM Fan
Not supported
Not supported
35°C
RTX Pro 6000NOTE 6
450 W
HPR PLTM Fan
Not supported
Not supported
HPR PLTM Fan
HPR PLTM Fan
HPR PLTM Fan, 30°C
HPR PLTM Fan, 30°C
HPR PLTM Fan, 30°C
HPR PLTM Fan
HPR PLTM Fan
HPR PLTM Fan, 30°C
Not supported
Not supported
35°C
DPUNOTE 5
Cable
DPU ambient
temperature
B3140H (400G x
1P)
Active (70C)
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
N/A
Passive
35°C
35°C
35°C
35°C
35°C
35°C
30°C
30°C
35°C
35°C
35°C
Not supported
Not supported
N/A
B3220 (200G x 2P)
Active (70C)
35°C
35°C
35°C
35°C
35°C
35°C
CPU ≤ 300 W, 30°C
CPU ≤ 300 W, 30°C
30°C
30°C
30°C
Not supported
Not supported
N/A
Passive
35°C
35°C
35°C
35°C
35°C
35°C
CPU ≤ 300 W, 30°C
CPU ≤ 300 W, 30°C
30°C
30°C
30°C
Not supported
Not supported
N/A
NOTE:
Riser configurations RC 6-2 and RC 11-2 are the GPU ready
configurations.
HPR Platinum FAN is required for GPU-ready configurations RC 6-2 and RC 11-2.
NOTE 1: RC 1/2 supports front half-length GPU with power lower than 75 W with regular
shroud and 2U EXT HSK.
NOTE 2: L4 GPU supported on slot7/9 for riser config 6, supports CPU<300 W and slot9
only for riser config 7 and, supports on slot5/7 for riser config 11.
NOTE 3: L4 GPU supported on slot2/7/9 for riser config 6.
NOTE 4: L4 GPU support on slot2/5/7/9 for riser config 11.
NOTE 5: A full-length riser is required, and the blanks on the GPU shroud must be removed
when DPU cards are installed.
NOTE 6: The HPR Platinum Fan is required when either the Nvidia H200 NVL or RTX Pro 6000
is installed.
Table 6. Thermal Restriction for GPU
Configurations for P-core processorsThermal Restriction for GPU Configurations for P-core processors
Configuration
No BP
FIO 8 x EDSFF E3.S NVMe
FIO 16 x EDSFF E3.S
NVMe
8 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA + 8 x 2.5 inch U.2
24 x 2.5 inch SAS/SATA
16 x EDSFF E3.S
NVMe
32 x EDSFF E3.S NVMe
40 x EDSFF E3.S NVMe
40 x EDSFF E3.S NVMe + 4 x Rear EDSFF E3.S NVMe
Ambient temperature
Storage configuration
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
4 x Rear EDSFF E3.S with 1x Rear-Fan
Storage configuration
number
C0-01
C01-01
C02-01/02
C04-01~09
C05-01/02
C06-01/02/06/07
C07-01/02
C09-01
C09-03
C08-01/02/04
C10-01
C10-02
Riser configuration
RC 6/7/11
RC 2NOTE 1
RC1/2 NOTE 1
RC 6
RC 6/7/11
RC 6/7/11
RC 6/7/11
RC 6/7/11
RC 6/7/11
RC 7/11/12
RC 6/12/15
RC 7
RC 14
Air shroud type
GPU
Regular
Regular
GPU
GPU
GPU
GPU
GPU
GPU
GPU
GPU
GPU
GPU
Processor
TDP
Cores
Heat-sink
6507P
150 W
8
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6505P
150 W
12
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6515P
150 W
16
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6714P
165 W
8
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6517P
190W
16
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6736P
205 W
36
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6724P
210 W
16
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6520P
210 W
24
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6530P
225 W
32
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6730P
250 W
32
1U-EXT HSK
2U-EXT HSK
2U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
1U-EXT HSK
35°C
6527P
255 W
24
1U L-TYPE HSK
2U-EXT HSK
2U-EXT HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
35°C
6737P
270 W
32
1U L-TYPE HSK
2U-EXT HSK
2U-EXT HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
35°C
6740P
270 W
48
1U L-TYPE HSK
2U-EXT HSK
2U-EXT HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
35°C
6747P
330 W
48
1U L-TYPE HSK
2U-EXT HSK
2U-EXT HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
35°C
6760P
330 W
64
1U L-TYPE HSK
2U-EXT HSK
2U-EXT HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
35°C
6767P
350 W
64
1U L-TYPE HSK
2U-EXT HSK
2U-EXT HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
35°C
6787P
350 W
86
1U L-TYPE HSK
2U-EXT HSK
2U-EXT HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
1U L-TYPE HSK
35°C
RDIMM
1 DPC power
2 DPC power
DIMM ambient
temperature
16 GB
6 W
N/A
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
32 GB
8 W
6 W
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
64 GB
13 W
10 W
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
96 GB
15 W
11 W
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
128 GB
16 W
12 W
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
256 GB
N/A
15 W
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
N/A
GPU
TDP
GPU ambient
temperature
L4 24 GB
72 W
CPU>=300 W, 30°C
35°C
35°C
CPU>300 W, 30°C
CPU>=300 W, 30°C
30°C NOTE 4
30°C NOTE 2
30°C NOTE 2
CPU>300 W, 30°C
CPU>300 W, 30°C NOTE 4
30°C NOTE 3
30°C
30°C
N/A
H100 NVL 94 GB
400 W
35°C
35°C
35°C
35°C
35°C
35°C
30°C
35°C
35°C
35°C
35°C
Not supported
Not supported
35°C
L40S 48 GB
350 W
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
Not supported
Not supported
35°C
A16 64 GB
250 W
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
Not supported
Not supported
35°C
Nvidia H200 NVLNOTE
6
450 W
HPR PLTM Fan
Not supported
Not supported
HPR PLTM Fan
HPR PLTM Fan
HPR PLTM Fan
HPR PLTM Fan, 30°C
HPR PLTM Fan, 30°C
HPR PLTM Fan
HPR PLTM Fan
HPR PLTM Fan
Not supported
Not supported
35°C
RTX Pro 6000NOTE 6
450 W
HPR PLTM Fan
Not supported
Not supported
HPR PLTM Fan
HPR PLTM Fan
HPR PLTM Fan, 30°C
HPR PLTM Fan, 30°C
HPR PLTM Fan, 30°C
HPR PLTM Fan
HPR PLTM Fan
HPR PLTM Fan, 30°C
Not supported
Not supported
35°C
DPUNOTE 5
Cable
DPU ambient
temperature
B3140H (400G x
1P)
Active (70C)
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
Not supported
N/A
Passive
35°C
35°C
35°C
35°C
35°C
35°C
30°C
30°C
35°C
35°C
35°C
Not supported
Not supported
N/A
B3220 (200G x 2P)
Active (70C)
35°C
35°C
35°C
35°C
35°C
35°C
CPU ≤ 300 W, 30°C
CPU ≤ 300 W, 30°C
30°C
30°C
30°C
Not supported
Not supported
N/A
Passive
35°C
35°C
35°C
35°C
35°C
35°C
CPU ≤ 300 W, 30°C
CPU ≤ 300 W, 30°C
30°C
30°C
30°C
Not supported
Not supported
N/A
NOTE:
Riser configurations RC 6-2 and RC 11-2 are the GPU ready
configurations.
HPR Platinum FAN is required for GPU-ready configurations RC 6-2 and RC
11-2.
NOTE 1: RC 1/2 supports front half-length GPU with power lower than 75 W with regular
shroud and 2U EXT HSK.
NOTE 2: L4 GPU supported on slot7/9 for riser config 6, supports CPU<300 W and slot9
only for riser config 7 and, supports on slot5/7 for riser config 11.
NOTE 3: L4 GPU supported on slot2/7/9 for riser config 6.
NOTE 4: L4 GPU support on slot2/5/7/9 for riser config 11.
NOTE 5: A full-length riser is required, and the blanks on the GPU shroud must be removed
when DPU cards are installed.
NOTE 6: The HPR Platinum Fan is required when either the Nvidia H200 NVL or
RTX Pro 6000 is installed.
Table 7. Thermal restriction for
Liquid-Cooling for Non-GPU Configurations (ALL processors).The table describes the Thermal restriction for Liquid-Cooling for
Non-GPU Configurations (ALL processors).
Configuration
No BP
8 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA + 8 x 2.5 inch U.2
24 x 2.5 inch SAS/SATA
16 x EDSFF E3.S NVMe
32 x EDSFF E3.S NVMe
40 x EDSFF E3.S NVMe + 4 x Rear EDSFF E3.S NVMe
Storage configuration
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
4 x Rear EDSFF E3.S with 1x Rear-Fan
Storage configuration
number
C0-01
C04-01/08
C05-01/02
C06-01/02/06/07
C07-01/02
C09-01/03
C08-02
C10-02
Riser configuration
RC 11
RC 0/ 11
RC 11
RC 11
RC 11
RC 11
RC 11
RC14
Air Shroud Type
Regular shroud
Regular shroud
Regular shroud
Regular shroud
Regular shroud
Regular shroud
Regular shroud
Regular shroud
Processors
All
HPR SILVER Fan 35°C
HPR SILVER Fan 35°C
HPR SILVER Fan 35°C
HPR SILVER Fan 35°C
HPR SILVER Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
DDR5 Memory
16 GB RDIMM
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
32 GB RDIMM
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
64 GB RDIMM
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
96 GB RDIMM
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
128 GB RDIMM(3DS)
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
256 GB RDIMM(3DS)
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
NOTE:“High-Performance GOLD” is required for DIMM ≥ 128
GB.
Table 8. Thermal restriction for
Liquid-Cooling for GPU Configurations (ALL processors).The table describes the Thermal restriction for Liquid-Cooling for GPU
Configurations (ALL processors).
Configuration
No BP
8 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA
16 x 2.5 inch SAS/SATA + 8 x 2.5 inch
U.2
24 x 2.5 inch SAS/SATA
16 x EDSFF E3.S
NVMe
32 x EDSFF E3.S
NVMe
40 x EDSFF E3.S NVMe + 4 x Rear EDSFF E3.S NVMe
Storage configuration
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
No rear drives
4 x Rear EDSFF E3.S with 1x Rear-Fan
Storage configuration
number
C0-01
C04-01/08
C05-01/02
C06-01/02/06/07
C07-01/02
C09-01/03
C08-02
C10-02
Riser configuration
RC 11-1 (HL)
RC 11-2 (FL)
RC 11-1 (HL)
RC 11-2 (FL)
RC 11-1 (HL)
RC 11-2 (FL)
RC 11-1 (HL)
RC 11-2 (FL)
RC 11-1 (HL)
RC 11-2 (FL)
RC 11-1 (HL)
RC 11-2 (FL)
RC 11-1 (HL)
RC 11-2 (FL)
RC14
Air Shroud Type
GPU shroud
GPU shroud
GPU shroud
GPU shroud
GPU shroud
GPU shroud
GPU shroud
GPU shroud
GPU shroud
GPU shroud
GPU shroud
GPU shroud
GPU shroud
GPU shroud
GPU shroud
Processors
All
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
HPR GOLD Fan 35°C
DDR5 Memory
16 GB RDIMM
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
32 GB RDIMM
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
64 GB RDIMM
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
96 GB RDIMM
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
128 GB RDIMM(3DS)
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
256 GB RDIMM(3DS)
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
GPU
L4 24 GB
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
35°C
H100 NVL 94 GB
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
L40S 48 GB
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
A16 64 GB
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
Nvidia H200 NVLNOTE
6
Not supported
HPR PLTM Fan, 35°C
Not supported
HPR PLTM Fan, 35°C
Not supported
HPR PLTM Fan, 35°C
Not supported
HPR PLTM Fan, 30°C
Not supported
HPR PLTM Fan, 30°C
Not supported
HPR PLTM Fan, 35°C
Not supported
HPR PLTM Fan, 35°C
Not supported
RTX Pro 6000NOTE 6
Not supported
HPR PLTM Fan, 35°C
Not supported
HPR PLTM Fan, 35°C
Not supported
HPR PLTM Fan, 30°C
Not supported
HPR PLTM Fan, 30°C
Not supported
HPR PLTM Fan, 30°C
Not supported
HPR PLTM Fan, 35°C
Not supported
HPR PLTM Fan, 30°C
Not supported
DPU
B3140H (400G x1P)
Active (70C)
Not supported
30°C
Not supported
30°C
Not supported
30°C
Not supported
30°C
Not supported
30°C
Not supported
30°C
Not supported
30°C
Not supported
Passive
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
B3220 (200Gx 2P)
Active (70C)
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
30°C
Not supported
30°C
Not supported
35°C
Not supported
35°C
Not supported
Passive
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
35°C
Not supported
NOTE:
“High-Performance GOLD” is required for DIMM ≥ 128 GB.
A full-length riser is required, and the blanks on the GPU shroud must be
removed when DPU cards are installed.
NOTE 6: The HPR Platinum Fan is required when either the Nvidia H200 NVL or
RTX Pro 6000 is installed.
Other Restrictions
NOTE:In front I/O configuration, RC 1/2
use regular air shroud and 2U EXT HSK, regardless of GPU presence.
For rear IO configurations, 25Gb and
above 25Gb PCIe/OCP cards require DAC or 85degC active optics.
85degC active optics are
M14MK(SFP28), 4WGYD(QSFP+)
L4 GPU
Support up to 30degC system ambient when CPU≥300W in system configs No
BP(C0), 8x2.5”(C04).
Support up to 30degC system ambient when CPU>300W in system configs
FIO 16xE3.s(C02+RC6) and 16xE3.s(C09).
L4 GPU support on slot2/5/7/9 for riser config 11 in
16xE3.s(C09-03).
Support up to 30degC system ambient for all CPUs in system config
16x2.5”(C05); Support slot 2/5/7/9 only for riser config 11
Support up to 30degC system ambient in system config (16+8)x2.5”(C06)
and 24x2.5”(C07); Support on slot 7/9 only for riser config 6; Support
CPU<300 W and slot 9 only for riser config 7; Support on slot 5/7 for
riser config 11
Support up to 30degC system ambient in system config 32xE3.s(C08);
Support on slot 2/7/9 only for riser config 6
DPU restrictions
“Long” riser cage is requested and “Removed” blanks on GPU shroud , when DPU cards
installed.
DPUs are supported on designated riser configs of RC1, RC2, RC6-2 and
RC11-2.
DPU BF-3 B3140H (6CMW1/KK4NR) restrictions
Required DAC(passive cable), not support 70degC active optics
until 85degC active optics available.
Support up to 30degC system ambient with DAC(passive cable) in
system configs (16+8)x2.5”(C06) and 24x2.5”(C07)
DPU BF-3 B3220 restrictions
Support both active/passive cables
Support up to 30degC system ambient and CPU up to 300 W in
system configs (16+8)x2.5”(C06) and 24x2.5”(C07)
Support up to 30degC system ambient for all CPUs in system
configs 16xE3.s(C09) and 32xE3.s(C08)
Single Port Network card restrictions
Support up to 35degC system ambient with DAC(passive cable)
Support up to 30degC system ambient with active cable
FIO 8xE3(C01) and FIO 16xE3(C02) with RC1/2 which can support up
to 35degC with active cable
(16+8)x2.5"(C06)+(RC11-2): support on slot 3/5 only
24x2.5"(C07)+(RC11-2): support on slot 3/5 only
Thermal restriction for liquid
cooling configurations
Liquid cooling imposes no thermal restrictions and supports all available CPU SKUs.
DPU restrictions
“Long” riser cage is requested and “Removed” blanks on GPU shroud , when DPU cards
installed.
DPUs are supported on designated riser configs of RC1, RC2, RC6-2 and
RC11-2.
DPU BF-3 B3140H (6CMW1/KK4NR) restrictions
Support up to 30degC system ambient with temperature spec is
70degC active optics until 85degC active optics available.
Support up to 35degC system ambient with DAC(passive cable)
DPU BF-3 B3220 restrictions
Support up to 30degC system ambient with temperature spec is
70degC active optics in system configs (16+8)x2.5”(C06) and
24x2.5”(C07).
Support up to 35degC system ambient in system configs
8x2.5”(C04), 16x2.5”(C06) and 16xE3.s(C09).
Support up to 35degC system ambient with DAC(passive
cable).
