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Dell PowerEdge R7625: руководство по обслуживанию
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Dell PowerEdge R7625: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge R7625 system.
Table 1. PowerEdgeR7625 chassis dimensionsThis table provides the dimensions of the system:
Xa Xb Y Za Zb Zc
482.0 mm (18.97 inches)434.0 mm (17.08 inches)86.8 mm (3.41 inches)35.84 mm (1.4 inches)With bezel

22.0 mm (0.87 inches)
  Without bezel

700.7 mm (27.58 inches)Ear to Rear wall736.29 mm (28.98 inches)Ear to PSU handle
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R7625 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
A server with fully populated drives 34.4 kg (75.84 lb)
A server without drives and PSU installed 23.3 kg (51.37 lb)

PSU specifications

The PowerEdgeR7625system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) Voltage AC DC Current (A)
High line wattage Low line wattage
800 W Mixed Mode Platinum 3000 50/60 100-240 V AC 800 W 800 W N/A 9.2-4.7
3000 N/A 240 V DC N/A N/A 800 W 3.8
1100 W Mixed Mode Titanium 4125 50/60 100-240 V AC 1100 W 1050 W N/A 12-6.3
4125 N/A 240 V DC N/A N/A 1100 W 5.2
1400 W Mixed Mode Platinum 5250 50/60 100-240 V AC 1400 W 1050 W N/A 12-8
5250 N/A 240 V DC N/A N/A 1400 W 6.6
Titanium 5250 50/60 100-240 V AC 1400 W 1050 W N/A 12-8
5250 N/A 240 V DC N/A N/A 1400 W 6.5
Titanium 5250 50/60 277 V AC 1400 W 1050 W N/A 5.8
5250 N/A 336 V DC N/A N/A 1400 W 5.17
1800 W Mixed Mode Titanium 6610 50/60 200-240 V AC 1800 W N/A N/A 10
6610 N/A 240 V DC N/A N/A 1800 W 8.2
2400 W Mixed Mode Platinum 9000 50/60 100-240 V AC 2400 W 1400 W N/A 16-13.5
9000 N/A 240 V DC N/A N/A 2400 W 11.2
2800 W Mixed Mode Titanium 10500 50/60 200-240 V AC 2800 W N/A N/A 15.6
10500 N/A 240 V DC N/A N/A 2800 W 13.6
3200 W Mixed Mode Titanium 12000 50/60 277 V AC 3200 W N/A N/A 13
12000 N/A 336 V DC N/A N/A 3200 W 11.5
1100 W DC N/A 4265 N/A -48—(-60) V DC N/A N/A 1100 W 27
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.
NOTE:If a system with AC 1400W/1100W PSUs operates at low line 100-120 V AC, then the power rating per PSU is derated to 1050W.
NOTE:If a system with AC 2400W PSUs operates at low line 100-120 V AC, then the power rating per PSU is derated to 1400W.
NOTE:
  • HLAC stands for High-Line AC, with a range of 200 - 240 V AC.
  • HVDC stands for High-Voltage DC, with 336 V DC.
Figure 1. PSU power cords
this image shows list of PSU power cords
Figure 2. APP 2006G1 power cable

this image shows list of PSU power cord

Table 2. PSU power cordsThe table lists the PSU power cords list .
Form factor Output Power cable
Redundant 60 mm 800 W mixed mode C13
1100 W mixed mode C13
1400 W mixed mode C13
1400 W mixed mode 277 Vac and HVDC APP 2006G1
1800 W mixed mode HLAC C15
Redundant 86 mm 2400 W mixed mode C19
2800 W mixed mode HLAC C21
3200 W mixed mode 277 Vac and HVDC APP 2006G1
NOTE:C19 power cord combined with C20 to C21 jumper power cord can be used to adapt 2800 W PSU.
NOTE:C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Cooling fan specifications

The PowerEdgeR7625system supports up to six High Performance Silver and High Performance Gold fans based on configurations.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Label color Label image
High performance Silver fans HPR Silver SilverThis shows the high performance fan (silver grade)
High performance Gold fans HPR Gold GoldThis shows the very high performance fan (gold fan)

Supported operating systems

The PowerEdge R7625 system supports the following operating system:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • RedHat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
  • Citrix XenServer

For more information, go to OS support.

System battery specifications

The PowerEdge R7625 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R7625 system support up to 6 Full Height or 2 low profile riser slots with up to 6 x16 slots.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
Expansion card riser PCIe slots Processor connection Height Length Slot width
Riser 1B Slot 1 Processor 1 Full Height Half Length x8
Slot 2
Riser 1P Slot 2 Processor 1 Full Height Half Length / Full Length x16
Riser 1Q Slot 1 Processor 1 Full Height Half Length x8
Slot 2
Riser 1S Slot 1 Processor 1 Full Height Half Length / Full Length x16
Slot 2
Riser 2A Slot 3 Processor 1 Low Profile Half Length x16
Slot 6 Processor 2
Riser 3A Slot 5 Processor 2 Full Height Half Length / Full Length x16
Riser 3B Slot 4 Processor 2 Full Height Half Length x8
Slot 5
Riser 4B Slot 7 Processor 2 Full Height Half Length x8
Slot 8
Riser 4Q Slot 7 Processor 2 Full Height Half Length x8
Slot 8
Riser 4P Slot 7 Processor 2 Full Height Half Length / Full Length x16

Storage controller specifications

The PowerEdge R7625 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H965i
  • PERC H755
  • PERC H755N
  • PERC H355
External controllers
  • HBA355e
  • PERC H965e
  • HBA465e
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSD
  • USB
Software RAID
  • S160
SAS Host Bus Adapters (HBA)
  • HBA355i
  • HBA465i

Drives

The PowerEdge R7625 system supports:
  • 8 x 3.5-inch hot-swappable SAS, SATA drives
  • 8 x 2.5-inch hot-swappable SAS, SATA, NVMe drives
  • 12 x 3.5-inch hot-swappable SAS, SATA drives
  • 16 x 2.5-inch hot-swappable SAS, SATA, NVMe drives
  • 24 x 2.5-inch hot-swappable SAS, SATA, NVMe drives
  • 32 x EDSFF E3.S hot-swappable NVMe Gen5 drives
  • 16 x EDSFF E3.S hot-swappable NVMe Gen5 drives
  • 8 x EDSFF E3.S hot-swappable NVMe Gen5 drives
  • 2 x 2.5-inch (rear) hot-swappable SAS/SATA/NVMe drives
  • 4 x 2.5-inch (rear) hot-swappable SAS/SATA/NVMe drives
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

NIC port specifications

The PowerEdge R7625 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card (optional) 1 GbE x 2
OCP card 3.0 (optional) 1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4
Management Interface Card (MIC) to support Dell Data Processing Unit (DPU) card (optional) 25 GbE x 2 or 100 GbE x 2
NOTE:The system allows either LOM card or an OCP card or both to be installed in the system.
NOTE:On the system board, the supported OCP PCIe width is x8; when x16 PCIe width is installed, it is downgraded to x8.
NOTE:The system allows either LOM card or MIC card to be installed in the system.

VGA ports specifications

The PowerEdge R7625 system supports two DB-15 VGA port one each on the front and rear panel (optional for liquid cooling).

Video specifications

The PowerEdge R7625 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Excursion Limited Operation 5-35°C (41-95°F) Continuous Operation
35-40°C (95-104°F) 10% Annual Runtime
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Excursion Limited Operation 5-35°C (41-95°F) Continuous Operation
35-40°C (95-104°F) 10% Annual Runtime
40-45°C (104-113°F) 1% Annual Runtime
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Common Environmental Specifications for ASHRAE A2, A3 and A4 This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-40 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 7. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity
NOTE:This condition applies to data center and non-data center environments.
Table 8. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal air restrictions

ASHRAE A3 environment

  • Two PSUs are required in redundant mode, however single PSU failure is not supported.
  • PCIe SSD is not supported.
  • DIMMs greater than 32 GB are not supported.
  • Both SW and DW GPGPU/FPGA are not supported.
  • CPU TDP greater than 200W are not supported.
  • Rear drives are not supported.
  • PCIe card TDP more than 25 W is not supported.
  • OCP is supported with 85C active optic cable.

ASHRAE A4 environment

  • Two PSUs are required in redundant mode, however single PSU failure is not supported.
  • PCIe SSD is not supported.
  • DIMMs greater than 32 GB are not supported.
  • Both SW and DW GPGPU/FPGA are not supported.
  • CPU TDP greater than 200W are not supported.
  • Rear drives are not supported.
  • PCIe card TDP more than 25 W is not supported.
  • OCP is supported with 85C active cable and cards Tier<=4
  • BOSS N1 is not supported.

Liquid cooling: ASHRAE A3 environment

  • Two PSUs are required in redundant mode, however single PSU failure is not supported.
  • PCIe SSD is not supported.
  • DIMMs greater than 32 GB are not supported.
  • Both SW and DW GPGPU/FPGA are not supported.
  • Rear drives are not supported.
  • PCIe card TDP more than 25 W is not supported.
  • OCP is supported with 85C active optic cable.

Liquid cooling: ASHRAE A4 environment

  • Two PSUs are required in redundant mode, however single PSU failure is not supported.
  • PCIe SSD is not supported.
  • DIMMs greater than 32 GB are not supported.
  • Both SW and DW GPGPU/FPGA are not supported.
  • Rear drives are not supported.
  • PCIe card TDP more than 25 W is not supported.
  • OCP is supported with 85C active cable and cards Tier<=5
  • BOSS N1 is not supported.

Other Restrictions

High temp spec(85C) active optics cable is required for cards,

- 25Gb and above PCIe/OCP cards require DAC or 85C active optics cable.

Thermal restriction matrix

Table 1. Air cooling: Thermal restriction matrix(non-GPU) The table describes the thermal restriction matrix for the PowerEdge R7625 system.
Configuration No BP 8 x 2.5" U.2 16 x 2.5" SAS (SmartFlow) 16 x 2.5" U.2 (SmartFlow) 24 x 2.5" SAS 16x2.5" SAS + 8x2.5" U.2 8x3.5" 12x3.5"
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2x Rear 2.5" w/ 2x Rear-Fan 4x Rear 2.5 w/ 3x Rear-Fan No Rear Drives No Rear Drives No Rear Drives 2x Rear 2.5" w/ 2x Rear-Fan 4x Rear 2.5 w/ 3x Rear-Fan
CPU cTDP Max CPU TDP
CPU TDP/cTDP 240 W 210 W HPR SILVER Fan

+ 2U STD HSK

 HPR SILVER Fan [75%]

+ 2U STD HSK

 HPR GOLD Fan [70%]

+ 2U EXT HSK
200 W
300 W 290 W HPR SILVER Fan

+ 2U EXT HSK

 HPR SILVER Fan [75%]

+ 2U EXT HSK

 HPR GOLD Fan [70%]

+ 2U EXT HSK

(Note 1)
280 W
400 W 360 W HPR SILVER Fan

+ 2U EXT HSK

 HPR GOLD Fan

+ 2U EXT HSK

 HPR GOLD Fan [75%]

+ 2U EXT HSK

 Requires LC
320 W
340 W
Memory 16 GB RDIMM HPR SILVER Fan HPR GOLD Fan HPR SILVER Fan [75%] HPR GOLD Fan [70%]
32 GB RDIMM
64 GB RDIMM
96 GB RDIMM
128 GB RDIMM HPR GOLD Fan Not supported Not supported
256 GB RDIMM (Note 2) HPR GOLD Fan (Note 1)

Note 1: Supported ambient temperature is 30°C.

Note 2: Support SKHYNIX RDIMM only

Table 2. Air cooling: Thermal restriction matrix(GPU Configuration) The table describes the thermal restriction matrix for the PowerEdge R7625 system.
Configuration No BP 8 x 2.5" U.2 16 x 2.5" SAS (SmartFlow) 16 x 2.5" U.2 (SmartFlow) 24 x 2.5" SAS 16x2.5" SAS + 8x2.5" U.2 8x3.5"
Rear storage No Rear Drives
CPU cTDP Max CPU TDP Model
CPU TDP/cTDP 240 W 210 W 9334 HPR GOLD Fan

+ 1U EXT HSK

 HPR GOLD Fan [75%]

+ 1U EXT HSK
200 W 9254
9224
9124
300 W 290 W 9634
280 W 9534
290 W 9454
280 W 9354
400 W 360 W 9654 HPR GOLD Fan

+ 1U EXT HSK

 Not Supported Requires LC
9554 HPR GOLD Fan

+ 1U EXT HSK (Note 1)
9474F
320 W 9374F
9274F HPR GOLD Fan

+ 1U EXT HSK
9174F
Memory 16 GB RDIMM HPR GOLD Fan HPR GOLD Fan [75%]
32 GB RDIMM
64 GB RDIMM
96 GB RDIMM
128 GB RDIMM HPR GOLD Fan Not Supported Not Supported
256 GB RDIMM (Note 3) HPR GOLD Fan (Note 1)
GPU A2 16 GB HPR GOLD Fan HPR GOLD Fan [75%] (Note 1)
A16 64GB HPR GOLD Fan [75%]
A30 24GB
A40 48GB
A100 80GB
H100 80 GB
MI210 64GB

Note 1: Supported ambient temperature is 30°C.

Note 2: Bergmano CPUs.

Note 3: Support SKHYNIX RDIMM only

NOTE:“High-Performance GOLD Fan” to be supported on all GPU configurations.
NOTE:GPU is not supported on 12x3.5-inch configurations and system configurations with rear module installed.
Table 3. Air Cooling: Thermal Guidance(non GPU) The table describes thermal guidance for the PowerEdge R7625 system.
Configuration No BP 8 x 2.5" U.2 16 x 2.5" SAS (SmartFlow) 16 x 2.5" U.2 (SmartFlow) 24 x 2.5" SAS 16x2.5" SAS + 8x2.5" U.2 8x3.5" 12x3.5"
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2x Rear 2.5" w/ 2x Rear-Fan 4x Rear 2.5 w/ 3x Rear-Fan No Rear Drives No Rear Drives No Rear Drives 2x Rear 2.5" w/ 2x Rear-Fan 4x Rear 2.5 w/ 3x Rear-Fan
CPU cTDP Max Model Core Count#
CPU TDP/cTDP 240 W 9334 32 35°C 35°C 35°C
9254 24
9224 24
9124 16
300 W 9634 84 35°C 35°C 30°C
9534 64
9454 48
9354 32
400 W 9654 96 35°C 35°C Requires LC
9554 64
9474F 48
9374F 32
9274F 24
9174F 16
9734 112
9754 128
9684X 96
9384X 32
9184X 16
Memory 16 GB RDIMM 35°C 35°C 35°C
32 GB RDIMM
64 GB RDIMM
96 GB RDIMM
128 GB RDIMM 35°C Not Supported Not Supported
256 GB RDIMM (Note 1) 30°C

Note 1: Support SKHYNIX RDIMM only

NOTE:Not all backplanes/risers support liquid cooling; these are listed as "No Support."
NOTE:Inlet temperature is determined by lowest degree requirement.
Table 4. Air Cooling: Thermal Guidance (GPU Configuration) The table describes thermal guidance (GPU) for the PowerEdge R7625 system.
Configuration No BP 8 x 2.5" U.2 16 x 2.5" SAS (SmartFlow) 16 x 2.5" U.2 (SmartFlow) 24 x 2.5" SAS 16x2.5" SAS + 8x2.5" U.2 8x3.5"
Rear storage No Rear Drives
CPU cTDP Max Model Core Count#
CPU TDP/cTDP 240 W 9334 32 35°C 35°C
9254 24
9224 24
9124 16
300 W 9634 84 35°C
9534 64
9454 48
9354 32
400 W 9654 96 35°C Not Supported Requires LC
9554 64 30°C
9474F 48
9374F 32
9274F 24 35°C
9174F 16
Memory 16 GB RDIMM 35°C 35°C
32 GB RDIMM
64 GB RDIMM
128 GB RDIMM 35°C Not Supported Not Supported Not Supported
256 GB RDIMM (Note 1) 30°C
GPU A2 16 GB 35°C 30°C
A16 64 GB 35°C
A30 24 GB
A40 48 GB
A100 80 GB
H100 80 GB
MI210 64 GB

Note 1: Support SKHYNIX RDIMM only

NOTE:Not all backplanes/risers support liquid cooling; these are listed as "No Support."
NOTE:Inlet temperature is determined by lowest degree requirement.
Table 5. Liquid cooling: Thermal restriction matrix(non-GPU)The table describes the thermal restriction matrix for the PowerEdge R7625 system.
Configuration No BP 8 x 2.5" U.2 24 x 2.5" SAS 8x3.5" 12x3.5"
Rear storage No Rear Drives No Rear Drives 2x Rear 2.5" w/ 2x Rear-Fan 4x Rear 2.5 w/ 3x Rear-Fan No Rear Drives No Rear Drives 2x Rear 2.5" w/ 2x Rear-Fan 4x Rear 2.5 w/ 3x Rear-Fan
CPU All CPU TDP SKUs HPR SILVER Fan HPR SILVER Fan [75%] HPR GOLD Fan [70%]
Memory 16 GB RDIMM HPR SILVER Fan HPR SILVER Fan [75%] HPR GOLD Fan [70%]
32 GB RDIMM
64 GB RDIMM
96 GB RDIMM
128 GB RDIMM HPR GOLD Fan Not supported
256 GB RDIMM (Note 1)

Note 1: Support SKHYNIX RDIMM only

NOTE:Use “High-Performance Silver” fan for all 2.5” and 8x3.5” configurations.
NOTE:Use “High-Performance GOLD” fan for all 12x3.5” configurations.
Table 6. Liquid cooling: Thermal restriction matrix(GPU Configuration)The table describes the thermal restriction matrix for the PowerEdge R7625 system.
Configuration No BP 8 x 2.5" U.2 8x3.5"
Rear storage No Rear Drives No Rear Drives No Rear Drives
CPU All CPU TDP SKUs HPR GOLD Fan HPR GOLD Fan [75%]
Memory 16 GB RDIMM HPR GOLD Fan HPR GOLD Fan [75%]
32 GB RDIMM
64 GB RDIMM
96 GB RDIMM
128 GB RDIMM HPR GOLD Fan Not supported
256 GB RDIMM (Note 2)
GPU A2 16 GB HPR GOLD Fan HPR GOLD Fan [75%] Note 1
A16 64 GB HPR GOLD Fan [75%]
A30 24 GB
A40 48 GB
A100 80 GB
H100 80 GB
MI210 64 GB

Note 1: Supported ambient temperature is 30°C.

Note 2: Support SKHYNIX RDIMM only

NOTE:“High-Performance GOLD Fan” to be supported on all GPU configurations.
NOTE:GPU is not supported on 12x3.5” configurations and system configurations with rear module installed.
Table 7. Label referenceThis table describes the label references used in the restriction tables.
Label Description
HPR SILVER (Silver) High performance (silver grade)
HPR GOLD (Gold) High performance (gold grade)
HSK Heat sink
LP Low profile
FH Full height