Dell PowerEdge R7615: руководство по обслуживанию

Chassis dimensions

This image shows chassis dimension for the PowerEge R7525 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR7615 chassis dimensionsThis table provides the dimensions of the system:
Xa	Xb	Y	Za	Zb	Zc
482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	86.8 mm (3.41 inches)	35.84 mm (1.96 inches)With bezel 22.0 mm (0.86 inches) Without bezel	700.7 mm (27.58 inches)Ear to rear wall	736.29 mm (28.98 inches)Ear to PSU handle

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R7615 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
A server with fully populated drives	34.5 kg (76.05 lb)
A server without drives and PSU installed	25.7 kg (56.65 lb)

PSU specifications

The PowerEdgeR7615system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	AC Voltage			DC Voltage			Current (A)
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	200—240 V	100—120 V	277 V	240 V	- (48—60) V	336 V	Current (A)
700 W mixed mode	Titanium	2625	50/60	700 W	N/A	N/A	N/A	N/A	N/A	4.1
700 W mixed mode	Titanium	2625	N/A	N/A	N/A	N/A	700 W	N/A	N/A	3.4
800 W mixed mode	Platinum	3000	50/60	800 W	800 W	N/A	N/A	N/A	N/A	9.2—4.7
800 W mixed mode	Platinum	3000	N/A	N/A	N/A	N/A	800 W	N/A	N/A	3.8
1100 W mixed mode	Titanium	4100	50/60	1100 W	1050 W	N/A	N/A	N/A	N/A	12—6.3
1100 W mixed mode	Titanium	4100	N/A	N/A	N/A	N/A	1100 W	N/A	N/A	5.2
1400 W mixed mode	Platinum	5250	50/60	1400 W	1050 W	N/A	N/A	N/A	N/A	12—8
	Platinum	5250	N/A	N/A	N/A	N/A	1400 W	N/A	N/A	6.6
	Titanium	5250	50/60	1400 W	1050 W	N/A	N/A	N/A	N/A	12—8
	Titanium	5250	N/A	N/A	N/A	N/A	1400 W	N/A	N/A	6.5
	Titanium	5250	50/60	1400 W	1050 W	1400 W	N/A	N/A	N/A	5.8
	Titanium	5250	N/A	N/A	N/A	N/A	1400 W	N/A	N/A	5.17
1800 W mixed mode	Titanium	6750	50/60	1800	N/A	N/A	N/A	N/A	N/A	10
1800 W mixed mode	Titanium	6750	N/A	N/A	N/A	N/A	1800 W	N/A	N/A	8.2
2400 W mixed mode	Platinum	9000	50/60	2400 W	1400 W	N/A	N/A	N/A	N/A	16—13.5
2400 W mixed mode	Platinum	9000	N/A	N/A	N/A	N/A	2400 W	N/A	N/A	11.2
1100 W -48 V DC	N/A	4265	N/A	N/A	N/A	N/A	N/A	1100 W	N/A	27
2800 W mixed mode	Titanium	10500	50/60	2800 W	N/A	N/A	N/A	N/A	N/A	15.6
2800 W mixed mode	N/A	10500	N/A	N/A	N/A	N/A	2800 W	N/A	N/A	13.6

NOTE:If a system with AC 1400 W or 1100 W PSUs operates at low line 100-120 V AC, and then the power rating per PSU is degraded to 1050 W.

NOTE:If a system with AC 2400 W PSUs operates at low line 100-120 V AC, and then the power rating per PSU is degraded to 1400 W.

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

NOTE:

HLAC stands for High-Line AC, with a range of 200 - 240 V AC.
HVDC stands for High-Voltage DC, with 336 V DC.

This image shows the supported PSU power cords. — Figure 1. PSU power cords

this image shows list of PSU power cord — Figure 2. APP 2006G1 power cable

Table 2. PSU power cordsThe table lists the PSU power cords list .
Form factor	Output	Power cable
Redundant 60 mm	700 W mixed mode HLAC	C13
	800 W mixed mode	C13
	1100 W mixed mode	C13
	1400 W mixed mode	C13
	1400 W mixed mode 277 Vac and HVDC	APP 2006G1
	1800 W mixed mode HLAC	C15
Redundant 86 mm	2400 W mixed mode	C19

NOTE:C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Supported operating systemsR7615

The PowerEdge R7615 system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi

NOTE:Intel Xeon® 6300 series CPUs do not support Windows Server 2019.

For more information, go to Operating System Manuals.

Cooling fan specifications

Cooling options

The PowerEdgeR7615 requires various cooling components that based on CPU TDP, storage modules, rear drives, GPU, and persistent memory to maintain optimum thermal performance.

The PowerEdgeR7615 offers two types of cooling options:

Air cooling
Processor liquid cooling (optional)

Cooling fan specifications

The PowerEdgeR7615system system supports up to six high-performance silver grade (HPR SLVR) or high-performance gold (HPR Gold) cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Label color	Label image
High performance Silver (HPR) fans	HPR SLVR	Silver
High performance Gold (HPR Gold) fans	HPR Gold	Gold Grade

System battery specifications

The PowerEdge R7615 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R7615 system supports up to eight PCI express (PCIe) slots (six full lengths and two low profiles) on the system board.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the PowerEdge R7615 system.
PCIe slot	With Regular shroud	With GPGPU shroud	R1U	R1T	R2A	R2T	R3A	R3B	R4A	R4P	R4Q	R4S
Slot 1	Full height - Half length	Full height - Full length	x8 (Gen5)	-	-	x16	-	-	-	-	-	-
Slot 2	Full height - Half length	Full height - Full length	x8 (Gen5)	x16 (Gen5) (Double width GPU)	-	x16	-	-	-	-	-	-
Slot 3	Low profile - Half length	Low profile - Half length	-	-	x8	-	-	-	-	-	-	-
Slot 4	Full height - Half length	Full height - Half length	-	-	-	-	-	x8	-	-	-	-
Slot 5	Full height - Half length	Full height - Full length	-	-	-	-	x16	x8	-	-	-	-
Slot 6	Low profile - Half length	Low profile - Half length	-	-	x8	-	-	-	-	-	-	-
Slot 7	Full height - Half length	Full height - Full length	-	-	-	-	-	-	x16	x16 (Gen5) (Double width GPU)	x8 (Gen5)	x16 (Gen5)
Slot 8	Full height - Half length	Full height - Half length	-	-	-	-	-	-	-	-	x8 (Gen5)	x16 (Gen5)

Memory specifications

The PowerEdge R7615 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity
DDR5 RDIMM	Single rank	16 GB	16 GB	196 GB
	Dual rank	32 GB	32 GB	384 GB
	Dual rank	64 GB	64 GB	768 GB
	Dual rank	96 GB	96 GB	1152 GB
	Quad rank	128 GB	128 GB	1536 GB
	Octa rank	256 GB	256 GB	3072 GB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
12 (288-pin)	6400 MT/s

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:Memory DIMMs used must be of the same type and capacity. Mixing of different capacity DIMMs are not supported.

NOTE:The speed of 6400 MT/s will be clocked down to match the system CPU max DDR frequency (1 DPC) at 4800 MT/s. For more information, refer R7615 Technical Guide at PowerEdge Manuals.

Storage controller specifications

The PowerEdge R7615 system supports the following controller card:

Table 1. Storage controller cards This table provides the controller cards that are supported on the system:
Supported storage controller card
Software RAID S160
Internal controllers PERC H965i PERC H755 PERC H755N PERC H355
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 SSDs
External controllers HBA355e PERC H965e HBA465e
SAS Host Bus Adapters HBA355i HBA465i

Drives

The PowerEdge R7615 system supports:

8 x 3.5-inch hot-swappable SAS or SATA drives
12 x 3.5-inch hot-swappable SAS or SATA drive
8 x 2.5-inch hot-swappable NVMe drives
16 x 2.5-inch hot-swappable SAS, SATA, or NVMe drives
24 x 2.5-inch hot-swappable SAS or SATA drives
32 x EDSFF E3.S hot-swappable NVMe Gen5 drives
16 x EDSFF E3.S hot-swappable NVMe Gen5 drives
8 x EDSFF E3.S hot-swappable NVMe Gen5 drives
2 x 2.5-inch rear hot-swappable SAS, SATA, or NVMe drives
4 x 2.5-inch rear hot-swappable SAS, SATA, or NVMe drives
4 x EDSFF E3.S rear hot-swappable NVMe Gen5 drives
Zero drive

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdge R7615 USB specificationsThe following table shows the USB specifications for the system:
Front		Rear		Internal (optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 3.0-compliant port	One	Internal USB 3.0-compliant port	One

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

Serial connector specifications

The PowerEdge R7615 system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

Environmental specifications

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Common Environmental Specifications for ASHRAE A2, A3 and A4 This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-40 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,050 meters (10,000 feet)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 7. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles NOTE:This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust Residual dust present in the air must have a deliquescent point less than 60% relative humidity NOTE:This condition applies to data center and non-data center environments.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened 6 times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.

Table 8. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal air restrictions

ASHRAE A3 environment for air cooling configuration

Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU and FPGA are not supported.
128 GB, and higher capacity RDIMMs are not supported.
PCIe SSD is not supported.
Front storage is not supported in 12 x 3.5-inch SAS configuration.
Rear drives are not supported.
Processor TDP greater than or equal to 240 W are not supported.
OCP card is supported with 85°C active optic cable.
BOSS N1 is supported.

ASHRAE A4 environment for air cooling configuration

Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU and FPGA are not supported.
128 GB, and higher capacity RDIMMs are not supported.
PCIe SSD is not supported.
Front storage is not supported in 12 x 3.5-inch SAS configuration.
Rear drives are not supported.
Processor TDP greater than or equal to 200 W are not supported.
OCP card is not supported.
BOSS N1 is not supported.

ASHRAE A3 environment for liquid cooling configuration

Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU and FPGA are not supported.
Intel Persistent memory 300 series, NVDIMM, 128 GB, or greater capacity DIMMs are not supported.
PCIeSSD is not supported.
Rear drives are not supported.
HPR SLVR fans are required in 2.5-inch configurations systems.
OCP card is supported with 85°C active optic cable.
BOSS N1 is supported.

ASHRAE A4 environment for liquid cooling configuration

Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU and FPGA are not supported.
Intel Persistent memory 300 series, NVDIMM, 128 GB, or greater capacity DIMMs are not supported.
PCIeSSD is not supported.
Front storage is not supported in 12 x 3.5-inch SAS configuration.
Rear drives are not supported.
HPR SLVR fans are required in 2.5-inch configurations systems.
OCP card is supported with 85°C active optic cable and cards tier ≤4.
BOSS N1 is not supported.