Dell PowerEdge R760xd2: руководство по обслуживанию

Chassis dimensions

The image shows system dimensions. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR760xd2 chassis dimensionsThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za	Zb	Zc
12 drives	481.6 mm (18.960 inches)	448.0 mm (17.637 inches)CC: 434.0 mm (17.08 inches)	86.8 mm (3.417 inches)	35 mm (1.378 inches)	837.0 mm (32.952 inches)Ear to PSU Surface	872.74 mm (34.36 inches)Ear to PSU handle

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

NOTE:Xb is unique to this system and has two values for the Storage module (SM) and the Compute Module (CC) .

System weight

Table 1. PowerEdge R760xd2 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
A server with fully populated drives	46.3 kg (102.07 pounds)
A server without drives and PSU installed	23.72 kg (52.29 pounds)

Table 2. PowerEdge R760xd2 weight handling recommendationsThe table below shows the weight handling recommendations.
Chassis weight	Description
40–70 lbs	Recommend two people to lift.
70–120 lbs	Recommend three people to lift.
≥ 121 lbs	Recommend to use a server-lift.

Processor specifications

Table 1. PowerEdge R760xd2 processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
4^th Generation Intel Xeon Scalable processors or 5^th Generation Intel Xeon Scalable processors	Up to two

PSU specifications

The PowerEdgeR760xd2system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU	PSU	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	AC Voltage			DC Voltage			Current (A)
PSU	PSU	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	100–120 V	200–240 V	277 V	240 V	336 V	-48 — (-60) V DC	Current (A)
700 W mixed mode HLAC	Titanium	2625	50/60	N/A	700 W	N/A	N/A	N/A	N/A	4.1
700 W mixed mode HLAC	N/A	2625	N/A	N/A	N/A	N/A	700 W	N/A	N/A	3.4
1100 W mixed mode	Titanium	4125	50/60	1050 W	1100 W	N/A	N/A	N/A	N/A	12-6.3
1100 W mixed mode	N/A	4125	N/A	N/A	N/A	N/A	1100 W	N/A	N/A	5.2
1400 W mixed mode	Platinum	5250	50/60	1050 W	1400 W	N/A	N/A	N/A	N/A	12-8
	N/A		N/A	N/A	N/A	N/A	1400 W	N/A	N/A	6.6
	Titanium		50/60	1050 W	1400 W	N/A	N/A	N/A	N/A	12 - 8
	N/A		N/A	N/A	N/A	N/A	1400 W	N/A	N/A	6.5
1400 W 277 Vac and HVDC	Titanium	5250	50/60	N/A	N/A	1400 W	N/A	N/A	N/A	5.8
1400 W 277 Vac and HVDC	Titanium	5250	N/A	N/A	N/A	N/A	N/A	1400 W	N/A	5.17
1800 W mixed mode HLAC	Titanium	6610	50/60	N/A	1800 W	N/A	N/A	N/A	N/A	10
1800 W mixed mode HLAC	N/A	6610	N/A	N/A	N/A	N/A	1800 W	N/A	N/A	8.2
1100 W -48 V DC	N/A	4265	N/A	N/A	N/A	N/A	N/A	N/A	1100 W	27

NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool at Dell.com/calc.

This image shows the C13 power connector — Figure 1. PSU power cord

This image shows the C15 power connector — Figure 1. PSU power cord

Table 2. PSU power cordsThe table lists the PSU power cords list.
Form factor	Output	Power cord
Redundant 60 mm	700 W mixed mode HLAC	C13
	1100 W mixed mode
	1400 W mixed mode
	1400 W 277 Vac and HVDC	APP 2006G1
	1100 W -48 V DC	LOTES APOW0097
	1800 W mixed mode HLAC	C15

NOTE:HLAC: High-Line AC 200-240 VAC (lower voltages are not supported).

NOTE:HVDC: High - Voltage DC 336 VDC.

Cooling fan specifications

The PowerEdgeR760xd2system supports up to 6 standard (STD) hot-swappable cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Label color	Label image
Standard (STD) fans	STD	No label

Supported operating systems

The PowerEdge R760xd2 system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi

For more information, go to OS support.

System battery specifications

The PowerEdge R760xd2 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
-	With Regular shroud	Config 1 Sas_SATA	Config 1 NVME	Config 2a_2b_2c	Config 3a_riser_FL	Config 3b_3C_riser_FL
Slot-1	Half Length, Low Profile	X16	X16	X16	X16	-
Slot-2	Half Length, Low Profile	-	-	X16	-	-
Slot-2	Full Length, Full Height	-	-	-	X16	X16
Slot-2	Half Length, Full Height	-	-	-	-	-
Slot-3	Half Length, Low Profile	-	-	X16	-	-
Slot-3	Full Length, Full Height	-	-	-	X16	X16
Slot-3	Half Length, Full Height	-	-	-	-	-
Slot-4	Half Length, Low Profile	X16	X16	X16	X16	X16
Slot-5	Half Length, Low Profile	X16	X16	X16	X16	X16

Memory specifications

The PowerEdge R760xd2 system supports the following memory specifications for optimized operation.

Table 1. Memory specifications for 4^th Generation Intel Xeon Scalable processorsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity	Minimum system capacity	Maximum system capacity
DDR5 RDIMM	Single rank	16 GB	16 GB	128 GB	32 GB	256 GB
	Dual rank	32 GB	32 GB	256 GB	64 GB	512 GB
	Dual rank	64 GB	64 GB	512 GB	128 GB	1 TB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
16, 288-pin	4800 MT/s

NOTE:Memory DIMM slots are not hot pluggable.

The PowerEdge R760xd2 system supports the following memory specifications for optimized operation.

Table 3. Memory specifications for 5^th Generation Intel Xeon Scalable processorsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity	Minimum system capacity	Maximum system capacity
DDR5 RDIMM	Single rank	16 GB	16 GB	128 GB	32 GB	256 GB
	Dual rank	32 GB	32 GB	256 GB	64 GB	512 GB
		64 GB	64 GB	512 GB	128 GB	1 TB
		96 GB	96 GB	768 GB	192 GB	1.53 TB

Table 4. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
16, 288-pin	5600 MT/s

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:The maximum memory speed the system will support is 4800 MT/s due to the limitation of the processor.

NOTE:5600 MT/s RDIMMs are applicable for 5^th Gen Intel Xeon Scalable Processors.

Storage controller specifications

The PowerEdge R760xd2 system supports the following controller cards:

Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers PERC H755 PERC H965i PERC H355
External controllers H965e HBA355e HBA465e
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs
SAS Hot Bus Adapters (HBA) HBA355i, HBA465i

Drives

The PowerEdge R760xd2 system supports:

Front Drives

24 x 3.5-inch hot-swappable SAS,SATA drives.

Rear Drives

4 x 3.5 inch SAS,SATA or 2.5 inch NVMe (with 3.5" to 2.5" Adapter in 3.5" carrier) drives
2 x 2.5-inch NVMe drives
4 x E3.S NVMe drives

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

NIC port specifications

The PowerEdge R760xd2 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) card.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
LOM	1 Gb x 2
OCP card (OCP 3.0)	1 GbE x 4, 10 GbE x 2, 10 GbE x 4 , 25 GbE x 2, 25 GbE x 4

USB ports specifications

Table 1. PowerEdge R760xd2 USB specificationsThe following table shows the USB specifications for the system:
Front		Rear		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 3.0-compliant ports	One	Internal USB 3.0-compliant port	One

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

VGA ports specifications

The PowerEdge R760xd2 system supports DB-15 VGA port on rear of the system

Video specifications

The PowerEdge R760xd2 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
-	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
-	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
-	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Common Environmental Specifications for ASHRAE A2, A3, and A4 This table describes the shared requirements across all categories.
-	Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-104 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6G for up to 11 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal air restrictions

Fresh air environment

Two PSUs are required in redundant mode. Single PSU failure is not supported.
BOSS-N1 (M.2) module is not supported.
GPU and FPGA are not supported.
Rear storage module is not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
OCP card with transmission rate higher than 25G is not supported.
OCP transceiver spec less than or equal to 70°C ( 158°F) is not supported.

ASHRAE A3 environment

Two PSUs are required in redundant mode. Single PSU failure is not supported.
BOSS-N1 (M.2) module is not supported.
GPU and FPGA are not supported.
Rear storage module is not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
OCP card with transmission rate higher than 25G is not supported.
OCP transceiver spec less than or equal to 70°C ( 158°F) is not supported.

ASHRAE A4 environment

Two PSUs are required in redundant mode. Single PSU failure is not supported.
BOSS-N1 (M.2) module is not supported.
GPU and FPGA are not supported.
CPU TDP equal or greater than 185 W are not supported.
Rear storage module is not supported.
OCP card with transmission rate higher than 25G is not supported.
OCP transceiver spec less than or equal to 70°C ( 158°F) is not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.

Thermal restriction matrix

Table 1. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink	Configuration No
2U HSK	Configuration 1, Configuration 2, and Configuration 3

NOTE:All GPU/FGPA cards require 2U L-type HSK and GPU shroud.

Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
LP	Low profile
FH	Full height

Table 3. Thermal restriction matrix Thermal restriction matrix for air cooled configuration (non - GPU):
Configuration		Configuration 1 24 x 3.5 inch SAS/SATA		Configuration 2 24 x 3.5 inch SAS/SATA	Configuration 3 24 x 3.5 inch SAS/SATA	Ambient temperature
Rear storage		4 x 3.5 inch SAS/SATA	4 x 2.5 inch NVMe in Carrier Adapter	2 x 2.5 inch	2 x 2.5 inch	Ambient temperature
CPU TDP/cTDP	125 W	STD Fan 2U STD HSK	STD Fan 2U STD HSK	STD Fan 2U STD HSK	STD Fan 2U STD HSK	35°C (95°F)
	150 W	STD Fan 2U STD HSK	STD Fan 2U STD HSK	STD Fan 2U STD HSK	STD Fan 2U STD HSK	35°C (95°F)
	165 W	NA	NA	STD Fan 2U STD HSK	STD Fan 2U STD HSK	35°C (95°F)
	185 W	NA	NA	STD Fan 2U STD HSK	STD Fan 2U STD HSK	35°C (95°F)

NOTE:DDR5 DIMM blank is required for Configuration 3.

NOTE:HDD blank is required for all configurations.

NOTE: Restrict HDD capacity up to 7.68TB of 2 x 2.5 inch and 4 x 2.5 inch rear storage

NOTE:System cannot support same type of 2.5 inch drive in front and rear storage (4 x 2.5 inch) when using 2.5 inch HDD adapter in configuration 1

NOTE:System can support PCIe card with cooling Tier equal or lower than Tier 5 (300LFM at 55°C) requirement .

NOTE: Need optical transceiver with higher temperature spec (>85°C) supporting in rear OCP.

NOTE:Need 30C ambient restriction for 960G BOSS module in Configuration 2 and Configuration 3.

NOTE:Need 30C ambient restriction for 96 GB memory supporting of all configurations.

NOTE:Maximum CPU TDP supported is 185 W in configuration 2 and configuration 3.

NOTE:Single CPU support is there only for configuration 1, configuration 2A and configuration 2B.

NOTE: Need to restrict PERC H965e support to slot 3 for configuration 2.

NOTE:Need DAC or optical transceiver with 85C temperature spec and is supported in slot 3.

Table 4. GPU/FPGA thermal restriction matrix The table describes GPU/FPGA thermal restriction matrix for air cooled configuration.
Configuration		Configuration 1 24 x 3.5 inch SAS/SATA		Configuration 2 24 x 3.5 inch SAS/SATA	Configuration 3 24 x 3.5 inch SAS/SATA	Ambient temperature
Rear storage		4 x 3.5 inch SAS/SATA	4 x 2.5 inch NVMe in Carrier Adapter	2 x 2.5 inch	2 x 2.5 inch	Ambient temperature
CPU TDP/cTDP	125 W	NA	NA	NA	STD Fan 2U STD HSK	30°C (86°F)
	150 W	NA	NA	NA	STD Fan 2U STD HSK	30°C (86°F)
	165 W	NA	NA	NA	STD Fan 2U STD HSK	30°C (86°F)
	185 W	NA	NA	NA	STD Fan 2U STD HSK	30°C (86°F)

NOTE:Can support GPU in Configuration 3 Only .

NOTE:Support LP A2 GPU up to 30°C (86°F) ambient.