Dell PowerEdge R760: руководство по обслуживанию

Chassis dimensions

This image shows chassis dimension for the PowerEge R760 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR760 chassis dimensionsThis table provides the dimensions of the system:
Xa	Xb	Y	Za	Zb	Zc
482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	86.8 mm (3.41 inches)	35.84 mm (1.41 inches)With bezel 22.0 mm (0.86 inches) Without bezel	700.7 mm (27.58 inches)Ear to rear wall	736.29 mm (28.98 inches)Ear to PSU handle

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R760 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
A server with fully populated drives	36.1 kg (79.58 lb)
A server without drives and PSU installed	25.1 kg (55.33 lb)

Processor specifications

Table 1. PowerEdge R760 processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
4^th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors or 5^th Gen Intel® Xeon® Scalable Processors	Up to two

Table 2. Minimum Firmware version requirement for 4th Gen Intel® Xeon® Scalable ProcessorsThe below table describes the supported firmware version based on different processors.
Processors	iDRAC	BIOS	CPLD
8462Y+	6.10.39.00	1.2.1	1.0.5
6458Q
6448Y
6444Y
6442Y
6438Y+
6438N
6438M
6434
6428N
6426Y
6421N
5420+
5418Y
5418N
5416S
5415+
5412U
5411N
4416+
4410Y
3408U
9480	6.10.80.00	1.3.2	1.0.5
9470
9460
9462

Table 3. Minimum Firmware version requirement for 5th Gen Intel® Xeon® Scalable ProcessorsThe below table describes the supported firmware version based on different processors.
Processors	iDRAC	BIOS	CPLD
5th Gen Intel® Xeon® Scalable Processors	7.10.05.00	2.0.0	N/A

PSU specifications

The PowerEdgeR760system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	AC Voltage			DC Voltage			Current (A)
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	200—240 V	100—120 V	277 V	240 V	- (48—60) V	336 V	Current (A)
700 W mixed mode HLAC	Titanium	2625	50/60	700 W	N/A	N/A	N/A	N/A	N/A	4.1
700 W mixed mode HLAC	N/A	2625	N/A	N/A	N/A	N/A	700 W	N/A	N/A	3.4
800 W mixed mode	Platinum	3000	50/60	800 W	800 W	N/A	N/A	N/A	N/A	9.2—4.7
800 W mixed mode	N/A	3000	N/A	N/A	N/A	N/A	800 W	N/A	N/A	3.8
1100 W mixed mode	Titanium	4100	50/60	1100 W	1050 W	N/A	N/A	N/A	N/A	12—6.3
1100 W mixed mode	N/A	4100	N/A	N/A	N/A	N/A	1100 W	N/A	N/A	5.2
1400 W mixed mode	Platinum	5250	50/60	1400 W	1050 W	N/A	N/A	N/A	N/A	12—8
1400 W mixed mode	N/A	5250	N/A	N/A	N/A	N/A	1400 W	N/A	N/A	6.6
1400 W mixed mode	Titanium	5250	50/60	1400 W	1050 W	N/A	N/A	N/A	N/A	12—8
1400 W mixed mode	N/A	5250	N/A	N/A	N/A	N/A	1400 W	N/A	N/A	6.5
1400 W mixed mode 277 Vac and HVDC	Titanium	5250	50/60	N/A	N/A	1400 W	N/A	N/A	N/A	5.8
1400 W mixed mode 277 Vac and HVDC	Titanium	5250	N/A	N/A	N/A	N/A	N/A	N/A	1400 W	5.17
1800 W mixed mode HLAC	Titanium	6750	50/60	1800	N/A	N/A	N/A	N/A	N/A	10
1800 W mixed mode HLAC	N/A	6750	N/A	N/A	N/A	N/A	1800 W	N/A	N/A	8.2
2400 W mixed mode	Platinum	9000	50/60	2400 W	1400 W	N/A	N/A	N/A	N/A	16—13.5
2400 W mixed mode	N/A	9000	N/A	N/A	N/A	N/A	2400 W	N/A	N/A	11.2
2800 W mixed mode HLAC	Titanium	10500	50/60	2800 W	N/A	N/A	N/A	N/A	N/A	15.6
2800 W mixed mode HLAC	N/A	10500	N/A	N/A	N/A	N/A	2800 W	N/A	N/A	13.6
1100 W -48 V DC	N/A	4265	N/A	N/A	N/A	N/A	N/A	1100 W	N/A	27
3200 W mixed mode 277 Vac and HVDC	Titanium	12000	50/60	N/A	N/A	3200 W	N/A	N/A	N/A	13
3200 W mixed mode 277 Vac and HVDC	Titanium	12000	N/A	N/A	N/A	N/A	N/A	N/A	3200 W	11.5

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

NOTE:If a system with AC 2400 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is degraded to 1400 W.

NOTE:If a system with AC 1400 W or 1100 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is degraded to 1050 W.

NOTE:

HLAC stands for High-Line AC, with a range of 200 - 240 V AC.
HVDC stands for High-Voltage DC, with 336 V DC.

this image shows list of PSU power cords — Figure 1. PSU power cables

this image shows list of PSU power cord — Figure 2. 277VAC/HVDC power cable

Table 2. PSU power cablesThe table lists the PSU power cables list .
Form factor	Output	Power cable
Redundant 60 mm	700 W mixed mode HLAC	C13
	800 W mixed mode	C13
	1100 W mixed mode	C13
	1400 W mixed mode	C13
	1400 W mixed mode 277 Vac and HVDC	277VAC/HVDC
	1800 W mixed mode HLAC	C15
Redundant 86 mm	2400 W mixed mode	C19
	2800 W mixed mode HLAC	C21
	3200 W mixed mode 277 Vac and HVDC	277VAC/HVDC

NOTE:C19 power cable combined with C20 to C21 jumper power cable can be used to adapt 2800 W PSU.

NOTE:C13 power cable combined with C14 to C15 jumper power cable can be used to adapt 1800 W PSU.

Supported operating systemsR760

The PowerEdge R760 system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi

NOTE:Intel Xeon® 6300 series CPUs do not support Windows Server 2019.

For more information, go to Operating System Manuals.

Cooling fan specifications

Cooling options

The PowerEdgeR760 requires various cooling components that are based on processor TDP, storage modules, rear drives, and GPU to maintain optimum thermal performance.

The PowerEdgeR760 offers two types of cooling options:

Air cooling
Direct Liquid Cooling (DLC) (optional)

Cooling fan specifications

The PowerEdgeR760system system supports up to six standard (STD), High performance Silver (HPR Silver) grade , or High performance Gold (HPR Gold) grade cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Label color
Standard (STD) fans	STD	No label
High performance Silver (HPR Silver) fans	HPR Silver	Silver
High performance Gold (HPR Gold) fans	HPR Gold	Gold

NOTE:See the Thermal restriction matrix for required fan support with air cooled and DLC configurations.

System battery specifications

The PowerEdge R760 system uses one CR 2032 3.0 V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R760 system supports up to eight PCI express (PCIe) slots (six full lengths and two low profiles) on the system board.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the PowerEdge R760 system.
PCIe slot	With Regular shroud	With GPGPU shroud	R1B	R1P	R1Q	R1R	R2A	R3A	R3B	R4B	R4P	R4Q	R4R
Slot 1	Full height - Half length	Full height - Full length	x8	-	x8 (Gen5)	x16	-	-	-	-	-	-	-
Slot 2	Full height - Half length	Full height - Full length	x8	x16 (Gen5) (Double width GPU)	x8 (Gen5)	x16 (Gen5)	-	-	-	-	-	-	-
Slot 3	Low profile - Half length	Low profile - Half length	-	-	-	-	x16	-	-	-	-	-	-
Slot 4	Full height - Half length	Full height - Half length	-	-	-	-	-	-	x8	-	-	-	-
Slot 5	Full height - Half length	Full height - Full length	-	-	-	-	-	x16	x8	-	-	-	-
Slot 6	Low profile - Half length	Low profile - Half length	-	-	-	-	x16	-	-	-	-	-	-
Slot 7	Full height - Half length	Full height - Full length	-	-	-	-	-	-	-	x8	x16 (Gen5) (Double width GPU)	x8 (Gen5)	-
Slot 7 SNAPI	Full height- Half length	Full height - Full length	-	-	-	-	-	-	-	-	-	-	x8+x8 (Gen5)
Slot 8	Full height - Half length	Full height - Half length	-	-	-	-	-	-	-	x8	-	x8 (Gen5)	x8 (Gen5)

Memory specifications

The PowerEdge R760 system supports the following memory specifications for optimized operation.

Table 1. Memory specifications for 4^th Gen Intel® Xeon® Scalable or Intel® Xeon® Max ProcessorsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity	Minimum system capacity	Maximum system capacity
DDR5 RDIMM	Single rank	16 GB	16 GB	256 GB	32 GB	512 GB
	Dual rank	32 GB	32 GB	512 GB	64 GB	1 TB
	Dual rank	64 GB	64 GB	1 TB	128 GB	2 TB
	Quad rank	128 GB	128 GB	2 TB	256 GB	4 TB
	Octa rank	256 GB	256 GB	4 TB	512 GB	8 TB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Rated DIMM speed
32 (288-pin)	4800 MT/s

NOTE:The processor may reduce the performance of the rated DIMM speed.

Table 3. Memory specifications for 5^th Gen Intel® Xeon® Scalable ProcessorsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity	Minimum system capacity	Maximum system capacity
DDR5 RDIMM	Single rank	16 GB	16 GB	256 GB	32 GB	512 GB
	Dual rank	32 GB	32 GB	512 GB	64 GB	1 TB
	Dual rank	64 GB	64 GB	1 TB	128 GB	2 TB
	Dual rank	96 GB	96 GB	1.5 TB	192 GB	3 TB
	Quad rank	128 GB	128 GB	2 TB	256 GB	4 TB
	Octa rank	256 GB	256 GB	4 TB	512 GB	8 TB

NOTE: DDR4 memories are not supported in the R760.

Table 4. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Rated DIMM speed
32 (288-pin)	6400 MT/s, or 5600 MT/s

NOTE:The processor may reduce the performance of the rated DIMM speed.

NOTE:6400/5600 MT/s RDIMMs are applicable for 5^th Gen Intel® Xeon® Scalable Processors..

NOTE:Memory DIMM slots are not hot pluggable.

NOTE: Quad rank (4R) 128 GB has reached EOL.

Storage controller specifications

The PowerEdge R760 system supports the following controller cards:

Table 1. Storage controller cards This table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal controllers PERC H965i PERC H755 PERC H755N PERC H355
External controllers PERC H965e
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSD USB
Software RAID S160
SAS Host Bus Adapters (HBA) non-RAID HBA355e HBA355i HBA465i

Drives

The PowerEdge R760 system supports:

12 x 3.5-inch hot-swappable SAS or SATA drives
8 x 2.5-inch hot-swappable SAS, SATA, or NVMe drives
16 x 2.5-inch hot-swappable SAS, SATA, or NVMe drives
24 x 2.5-inch hot-swappable SAS or SATA, or NVMe drives
16 x EDSFF E3.S hot-swappable NVMe drives
2 x 2.5-inch rear hot-swappable SAS, SATA, or NVMe drives
4 x 2.5-inch rear hot-swappable SAS, SATA, or NVMe drives
4 x EDSFF E3.S rear hot-swappable NVMe drives

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support > Browse all products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdge R760 USB specificationsThe following table shows the USB specifications for the system:
Front		Rear		Internal (optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 3.0-compliant port	One	Internal USB 3.0-compliant port	One

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NIC port specifications

The PowerEdge R760 system supports up to two Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) card and up to four ports integrated on the Open Compute Project (OCP) NIC card.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
LOM card (optional)	1 GbE x 2
OCP NIC card (OCP NIC 3.0) (optional)	1GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4, 100GbE x 2
Management Interface Card (MIC) to support Dell Data Processing Unit (DPU) card (optional)	25 GbE x 2, 100 GbE x 2 or 200 GbE x 2

NOTE:The system allows either LOM card or an OCP NIC card or both to be installed in the system.

NOTE:On the MS system board, the supported OCP NIC PCIe width is x8; when x16 PCIe width is installed, it is downgraded to x8.

NOTE:A 100 GbE OCP NIC card of PCIe width x16 can be used by connecting the OCP NIC cable from SL11_CPU1_PB7 to SL13_CPU1_PB7 on the MAX system board.

NOTE:For storage configurations that already use the SL11_CPU1_PB7 or SL13_CPU1_PB7 connector on the Max system board, there is a restriction on supporting OCP NIC cable.

NOTE:The system allows either LOM card or MIC card to be installed in the system.

Serial connector specifications

The PowerEdge R760 system supports one serial port on the system board, which is Data Terminal Equipment (DTE), 16550-compliant.

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge R760 system supports DB-15 VGA port on front panel and on rear I/O board (optional for Direct Liquid Cooling configuration).

Video specifications

The PowerEdge R760 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
	Excursion Limited Operation	5-35°C (41-95°F) Continuous Operation
	Excursion Limited Operation	35-40°C (95-104°F) 10% Annual Runtime
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature	Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
	Excursion Limited Operation	5-35°C (41-95°F) Continuous Operation
		35-40°C (95-104°F) 10% Annual Runtime
		40-45°C (104-113°F) 1% Annual Runtime
Humidity percent range (non-condensing at all times)	8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Common Environmental Specifications for ASHRAE A2, A3 and A4 This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-40 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,050 meters (10,006 feet)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 7. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles NOTE:This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust Residual dust present in the air must have a deliquescent point less than 60% relative humidity NOTE:This condition applies to data center and non-data center environments.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened 6 times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.

Table 8. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal air restrictions

Table 1. Air cooling configurations thermal restriction for AHSRAE A3 and A4This table provides information about ASHRAE A3 and A4 restrictions for air cooling configuration.
ASHRAE	A3/40°C (104°F)	A4/45°C (113°F)
PSU	Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe card	Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA	Not supported
DIMM	128 GB, or greater capacity DIMMs are not supported.
PCIe SSD	Not supported
Front storage	Not supported in 12 x 3.5-inch SAS configuration.
Rear storage	Not supported
Fan	HPR SLVR fans are required.
Processor	≤ 165 W	≤ 125 W
OCP	Supported with 85°C (185°F) active optic cable.	Supported with 85°C (185°F) active optic cable and cards tier ≤4.
BOSS	BOSS-N1 is supported.	BOS-N1 is not supported.

Table 2. Liquid cooling configurations thermal restriction for AHSRAE A3 and A4This table provides information about ASHRAE A3 and A4 restrictions for air cooling configuration.
ASHRAE	A3/40°C (104°F)	A4/45°C (113°F)
PSU	Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe card	Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA	Not supported
DIMM	128 GB, or greater capacity DIMMs are not supported.
PCIe SSD	Not supported
Front storage	Not supported in 12 x 3.5-inch SAS configuration.
Rear storage	Not supported
Fan	HPR SLVR fans are required in 2.5-inch configurations systems.
OCP	Supported with 85°C (185°F) active optic cable.	Supported with 85°C (185°F) active optic cable and cards tier ≤4.
BOSS	BOSS-N1 is supported.	BOSS-N1 is not supported.