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Dell PowerEdge R750: технические характеристики и спецификации
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Сервер Dell PowerEdge R750 210-AYCG
Сервер Dell PowerEdge R750 210-AYCG
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Dell PowerEdge R750: технические характеристики и спецификации

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEdge R750 system.
Table 1. Chassis dimension for the systemThis table provides the dimensions of the Dell EMCPowerEdgeR750 system:
Drives Xa Xb Y Za Zb Zc
0/8/12/16/24 drives 482.0 mm (18.97 inches)434.0 mm (17.0 inches)86.8 mm (3.41 inches)35.84 mm (1.41 inches)with bezel22.0 mm (0.86 inches)without bezel700.7 mm (27.58 inches)Ear to rear wall736.29 mm (28.92 inches)Ear to PSU handle
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

Chassis weight

Table 1. Chassis weightThe table below shows the maximum weight of the Dell EMC PowerEdge R750 system.
System configuration Maximum weight (with all drives/SSDs)
0 27.7 kg (61.06 lb)
12 x 3.5-inch 35.3 kg (77.82 lb)
8 x 2.5-inch 29.6 kg (65.25 lb)
16 x 2.5-inch 32.6 kg (71.87 lb)
24 x 2.5-inch 35.2 kg (77.60 lb)

Processor specifications

Table 1. Dell EMC PowerEdge R750 processor specifications This table provides processor specifications for the PowerEdge R750 system.
Supported processor Number of processors supported
3rd Generation Intel Xeon Scalable processors with up to 40 cores two

PSU specifications

The system supports up to two AC or DC power supply units (PSUs).

WARNING:Instructions for the qualified electricians only:

System using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations in accordance with Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70.

240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units if applicable in the country or region of use.

Power supply cords/jumper cords and the associated plugs/inlets/connectors shall have appropriate electrical ratings referencing the rating label on the system when used for connection.

Table 1. PSU specifications for the systemThis table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) Frequency Voltage Peak power N/A N/A Peak power N/A Current
High line/-72 VDC High line/-72 VDC High line/240 VDC Low line/-40 VDC Low line/-40 VDC
700 W HLAC Titanium2,625 BTU/hr 50/60 Hz200 V AC–240 V AC 1190 W 700 W 700 W N/A N/A 4.1 A
700 W Mixed Mode DC N/A 2,625 BTU/hr N/A 240 V DC 1190 W 700 W 700 W N/A N/A 3.4 A
800 W ACPlatinum3139 BTU/hr50/60 Hz100 - 240 V AC 1360 W 800 W 800 W 1360 W 800 W 9.2 - 4.7 A
800 W Mixed Mode DC N/A 3139 BTU/hrN/A 240 V DC 1360 W 800 W 800 W 1360 W 800 W 3.8 A
1100 WDCTitanium4265 BTU/hrN/A -48 - -60 V DC 1870 W 1100 W N/A 1870 W 1100 W 27.0 A
1100 WACTitanium4299 BTU/hr50/60 Hz100 - 240 V AC 1870 W 1100 W 1100 W 1785 W 1050 W 12 - 6.3 A
1100 WMixed Mode DC N/A 4299 BTU/hrN/A 240 V DC 1870 W 1100 W 1100 W 1870 W 1100 W 5.2 A
1400 W ACPlatinum5459 BTU/hr50/60 Hz100 - 240 V AC 2380 W 1400 W 1400 W 1785 W 1050 W 12 - 8 A
1400 W Mixed Mode DC N/A 5459 BTU/hrN/A 240 V DC 2380 W 1400 W 1400 W 1785 W 1050 W 6.6 A
1800 W HLAC Titanium6,600 BTU/hr 50/60 Hz200 V AC–240 V AC 3060 W 1800 W 1800 W N/A N/A 10 A
1800 W Mixed Mode DC N/A 6,600 BTU/hr N/A 240 V DC 3060 W 1800 W 1800 W N/A N/A 8.2 A
2400 WACPlatinum9213 BTU/hr50/60 Hz100 - 240 V AC 4080 W 2400 W 2400 W 2380 W 1400 W 16 - 13.5 A
2400 WMixed Mode DC N/A 9213 BTU/hrN/A 240 V DC 2380 W 1400 W 1400 W 1785 W 1050 W 11.2 A
2800 W HLAC Titanium10,220 BTU/hr 50/60 Hz200 V AC–240 V AC 4760 W 2800 W 2800 W N/A N/A 15.6 A
2800 W Mixed Mode DC N/A 10,220 BTU/hr N/A 240 V DC 4760 W 2800 W 2800 W N/A N/A 13.6 A
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at Dell.com/calc.
NOTE:If a system with AC 2400 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is degraded to 1400 W.
NOTE:If a system with AC 1400 W or 1100 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is degraded to 1050 W.
NOTE:
  • HLAC stands for High-Line AC, with a range of 200 - 240 V AC.
Figure 1. PSU power cables
this image shows list of PSU power cords
Table 2. PSU power cablesThe table lists the PSU power cables list .
Form factor Output Power cable
Redundant 60 mm 700 W mixed mode C13
800 W mixed mode C13
1100 W mixed mode C13
1400 W mixed mode C13
1800 W mixed mode C15
Redundant 86 mm 2400 W mixed mode C19
2800 W mixed mode C21
NOTE:C19 power cable combined with C20 to C21 jumper power cable can be used to adapt 2800 W PSU.
NOTE:C13 power cable combined with C14 to C15 jumper power cable can be used to adapt 1800 W PSU.

Supported operating systems

The PowerEdge R750 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • VMware ESXi
  • Microsoft Windows Server with Hyper-V
  • SUSE Linux Enterprise Server
  • Red Hat Enterprise Linux
  • VMware ESXi

For more information, go to Operating System Manuals.

Cooling fan specifications

Cooling options

The Dell EMCPowerEdgeR750 requires various cooling components based on CPU TDP, storage modules, rear drives, GPU, and persistent memory to maintain optimum thermal performance.

The Dell EMCPowerEdgeR750 offers two types of cooling options:

  • Air cooling
  • Processor liquid cooling (optional)

Cooling fan specifications

The Dell EMCPowerEdgeR750 system supports up to six standard (STD), high-performance silver grade (HPR SLVR), or high-performance gold grade (HPR GOLD) cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
Standard fan STD STD No label This shows the Standard fan image.
High-performance fan (Silver grade) fanHPR SLVR HPR Silver
NOTE:New cooling fans come with the High-Performance Silver Grade label. While the older cooling fans have the High-Performance label.
Figure 1. High performance fan
This shows the high performance fan
Figure 2. High performance (Silver grade) fan
This shows the high performance fan (silver grade)
High-performance fan (Gold grade) fanHPR GOLD VHPR - Very High Performance Gold
NOTE:New cooling fans come with the High-Performance Gold Grade label. While the older cooling fans have the High-Performance label.
Figure 3. Very high performance fan
This shows the very high performance fan
Figure 4. High performance (Gold grade) fan
This shows the very high performance fan (gold fan)
NOTE:Mixing of STD, HPR SLVR, or HPR GOLD fan is not supported.
NOTE:The STD, HPR SLVR, or HPR GOLD fan installation depends on the system configuration. For more information about the supported fan configuration or matrix, see Thermal restriction matrix.

System battery specifications

The PowerEdge R750 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The Dell EMC PowerEdge R750 system supports up to six full-height, or eight low-profile riser PCI express (PCIe) Gen 4 expansion cards.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the PowerEdge R750 system.
PCIe slot With Regular shroud With GPGPU shroud R1a R1b R1c R2a R2b R3a R3b R4a R4b
Slot 1 Full height- Half length Full height-Full length - x8 x16 (single-width (SW) GPU) - - - - - -
Slot 2 Full height- Half length Full height-Full length x16(double-width (DW) GPU) x8 x16 (SW GPU) - - - - - -
Slot 3 Low profile- Half length Low profile- Half length - - - x16 - - - - -
Slot 3 SNAPI Low profile- Half length Low profile- Half length - - - - x16 - - - -
Slot 4 Full height- Half length N/A - - - - - - x8 - -
Slot 5 Full height- Half length Full height- Half length - - - - - x16 x8 - -
Slot 6 Low profile- Half length Low profile- Half length - - - x16 x8 - - - -
Slot 7 Full height- Half length Full height-Full length - - - - - - - x16 (DW GPU) x8
Slot 8 Full height- Half length N/A - - - - - - - - x8
WARNING: Consumer-Grade GPU should not be installed or used in the Enterprise Server products.

Memory specifications

The Dell EMC PowerEdge R750 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processor
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
RDIMM Single rank 8 GB 8 GB 128 GB 16 GB 256 GB
Dual rank 16 GB 16 GB 256 GB 32 GB 512 GB
32 GB 32 GB 512 GB 64 GB 1 TB
64 GB 64 GB 1 TB 128 GB 2 TB
LRDIMM Quad rank 128 GB 128 GB 2 TB 256 GB 4 TB
Octa rank 256 GB 256 GB 4 TB 512 GB 8 TB
Intel Persistent Memory 200 series (BPS) Dual rank 128 GB 128 GB 1 TB 256 GB 2 TB
256 GB 256 GB 2 TB 512 GB 4 TB
512 GB 512 GB 4 TB 1 TB 8 TB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
32, 288-pin 3200 MT/s, 2933 MT/s

Storage controller specifications

The Dell EMC PowerEdge R750 system supports the following controller cards:
Table 1. Storage controller cards for the systemThis table provides the controller cards that are supported on the Dell EMC PowerEdge R750 system:
Internal controllers External controllers
  • S150
  • PERC H745
  • PERC H755
  • PERC H755N
  • PERC H345
  • HBA355I
  • Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs 240 GB or 480 GB
  • Boot Optimized Storage Subsystem (BOSS-S1):HWRAID 2 x M.2 SSDs 240 GB or 480
  • PERC H840
  • HBA355E
NOTE:The software RAID S150 is supported on either SATA drives with chipset SATA only backplane or NVMe drives in universal slots with processor direct PCIe cable connected backplane.

Drives

The Dell EMC PowerEdge R750 system supports:
  • 12 x 3.5-inch hot-swappable SAS or SATA drives
  • 8 x 2.5-inch hot-swappable NVMe drives
  • 16 x 2.5-inch hot-swappable SAS, SATA, or NVMe drives
  • 24 x 2.5-inch hot-swappable SAS, SATA, or NVMe drives
  • 2 x 2.5-inch rear hot-swappable SAS, SATA, or NVMe drives
  • 4 x 2.5-inch rear hot-swappable SAS, SATA, or NVMe drives
  • 0 drive
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. USB specificationsPowerEdge R750 system USB specifications
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One Internal USB 3.0-compliant port One
Micro-USB 2.0, iDRAC Direct One USB 3.0-compliant ports One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
NOTE:The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.
NOTE:The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

NIC port specifications

The Dell EMC PowerEdge R750 system supports up to two Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional OCP cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the Dell EMC PowerEdge R750 system.
Feature Specifications
LOM card 1 GbE x 2
OCP card (OCP 3.0) 1 GbE x 4, 10 GbE x 2, 10 Gbe x 4, 25 GbE x 2, 25 GbE x 4

Serial connector specifications

The Dell EMC PowerEdge R750 system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA ports specifications

The Dell EMC PowerEdge R750 system supports One DB-15 VGA port one each on the front and back (optional for liquid cooling) panels.

IDSDM (optional)

The Dell EMC PowerEdge R750 system supports Internal Dual SD module (IDSDM).

The IDSDM supports two SD cards and is available in the following configurations:

Table 1. Supported SD card storage capacityThis table lists the storage capacity of the supported SD cards
IDSDM card
  • 16 GB
  • 32 GB
  • 64 GB
NOTE:One IDSDM card slot is dedicated for redundancy.
NOTE:Use Dell EMC branded SD cards that are associated with the IDSDM configured systems.

Video specifications

The Dell EMC PowerEdge R750 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported resolution options for the systemThis table describes the supported video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.
Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <900 m (<2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes < 900 m (< 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Operational climatic range category A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes < 900 m (< 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR High performance
HSK Heat sink
LP Low profile
FH Full height
DW Double Wide
BPS Intel Persistent Memory 200 series (BPS)
DPC DIMM per channel
Table 2. Processor and heat sink matrixThe table describes processor and heat sink matrix:
Heat sink Processor TDP
1U STD HSK ≤ 165 W (for non-GPU)
T-Type HSK For all TDP with GPU, and 256 GB LRDIMM configurations
2U HPR HSK >165 W (for non-GPU configurations)
Table 3. Thermal restriction matrix with ≤64 GB RDIMM (Non-GPU)The table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe 12 x 3.5-inch SAS/SATA Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan No Rear Drives No Rear Drives No Rear Drives 2 x Rear2.5-inch, no rear fan 4 x Rear 2.5-inch with fan
CPU TDP/cTDP 105 W STD fan HPR SLVR fan STD fan HPR GOLD fan HPR SLVR fan HPR SLVR fan 35°C
120 W 35°C
125 W 35°C
135 W 35°C
140 W 35°C
150 W 35°C
165 W 35°C
185 W HPR SLVR fan HPR GOLD fan 30°C
195 W 35°C
205 W HPR GOLD fan 35°C
225 W 35°C
230 W HPR SLVR fan* 30°C
235 W HPR SLVR fan* 30°C
240 W HPR SLVR fan* 30°C
250 W HPR SLVR fan* 30°C
265 W STD fan HPR SLVR fan HPR SLVR fan* 30°C
270 W STD fan HPR SLVR fan 30°C
NOTE:* Supported ambient temperature is 30°C.
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
Table 4. Thermal restriction matrix with 128 GB LRDIMM (Non-GPU)The table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.4-inch NVMe 12 x 3.5-inch SAS/SATA Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan No Rear Drives No Rear Drive No Rear Drives 2 x Rear2.5-inch, no rear fan 4 x Rear 2.5-inch with fan
CPU TDP/cTDP 105 W STD fan HPR SLVR fan HPR SLVR fan HPR SLVR fan HPR GOLD fan HPR SLVR fan HPR SLVR fan* 35°C
120 W 35°C
125 W 35°C
135 W 35°C
140 W 35°C
150 W 35°C
165 W 35°C
185 W 30°C
195 W HPR SLVR fan* 30°C
205 W HPR GOLD fan 30°C
225 W Not supported 30°C
230 W 30°C
235 W 30°C
240 W 30°C
250 W 30°C
265 W STD fan HPR SLVR fan Not supported 30°C
270 W STD fan HPR SLVR fan 30°C
NOTE:* Supported ambient temperature is 30°C.
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
Table 5. Thermal restriction matrix with 256 GB LRDIMM (Non-GPU)The table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe 12 x 3.5-inch SAS/SATA Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan No Rear Drives No Rear Drives No Rear Drives 2 x Rear2.5-inch, no rear fan 4 x Rear 2.5-inch with fan
CPU TDP/cTDP 105 W 1DPC/2DPC 1DPC 1DPC Not supported 35°C
120 W 35°C
125 W 35°C
135 W 35°C
140W 35°C
150 W 35°C
165 W 35°C
185 W 30°C
195 W 30°C
205 W 30°C
225 W 30°C
230 W 30°C
235 W 30°C
240 W 30°C
250 W 30°C
265 W 30°C
270 W 30°C
NOTE:For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch configurations.
NOTE:For CPU TDP >165 W and riser configuration 1, 2, 3, or 4 supports maximum of four PCIe cards in Riser 1 or 2. This restriction is applicable for 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA and 16 x 2.5-inch NVMe system configurations.
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
Table 6. Thermal restriction matrix with BPS + ≤128 GB DIMM (Non-GPU)The table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe 12 x 3.5-inch SAS/SATA Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan
CPU TDP/cTDP 105 W HPR GOLD fan Not supported 35°C
120 W 35°C
125 W 35°C
135 W 35°C
140 W 35°C
150 W 35°C
165 W 35°C
185 W 30°C
195 W 35°C
205 W 35°C
225 W 35°C
230 W 35°C
235 W 35°C
240 W 35°C
250 W 35°C
265 W 35°C
270 W 35°C
Table 7. Thermal restriction matrix with BPS + 256 GB LRDIMM(Non-GPU)
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
The table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe 12 x 3.5-inch SAS/SATA Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan
CPU TDP/cTDP 105 W HPR GOLD fan Not supported 30°C
120 W 30°C
125 W 30°C
135 W 30°C
140 W 30°C
150 W 30°C
165 W 30°C
185 W 30°C
195 W
205 W
225 W
230 W
235 W
240 W
250 W
265 W
270 W 30°C
NOTE:For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch configurations.
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
Table 8. Thermal restriction with ≤128 GB DIMM (GPU)The table describes GPU thermal restriction matrix for the system.
Configuration (Front storage) Fan type CPU TDP/cTDP GPU (Ambient temperature)
A100 (80G) A100 A40 (max 2) A30 A10 M10 (max 2) T4 (max 6)
8 x 2.5-inch NVMe and No Backplane HPR SLVR fan 270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
16 x 2.5-inch SAS HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
16 x 2.5-inch NVMe HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
24 x 2.5-inch SAS HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
16 x 2.5-inch SAS + 8 x 2.5-inch NVMe HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
24 x 2.5-inch NVMe HPR GOLD fan 270 W 30°C 35°C 30°C 30°C 35°C 35°C 30°C
NOTE:GPU cards are not supported in 12 x 3.5-inch drive and rear drive configuration systems.
NOTE:All GPU cards require 1U T-type HSK and GPU shroud.
NOTE: T4 GPU is not supported on riser 2 in 8 x 3.5-inch configuration
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
Table 9. Thermal restriction with BPS + ≤128 GB DIMM (GPU)The table describes GPU thermal restriction matrix for the system.
Configuration (Front storage) Fan type CPU TDP/cTDP GPU (Ambient temperature)
A100 (80G) A100 A30 A10 T4 (max 4) M10 (max 2) A40 (max 2)
8 x 2.5-inch NVMe and No Backplane HPR GOLD fan 270 W 30°C 30°C 30°C 30°C 30°C 30°C 30°C
16 x 2.5-inch SAS HPR GOLD fan 270 W 30°C 30°C 30°C 30°C 30°C 30°C 30°C
16 x 2.5-inch NVMe HPR GOLD fan 270 W 30°C 30°C 30°C 30°C 30°C 30°C 30°C
24 x 2.5-inch SAS HPR GOLD fan 270 W Not supported 30°C Not supported
16 x 2.5-inch SAS + 8 x 2.5-inch NVMe HPR GOLD fan 270 W 30°C
24 x 2.5-inch NVMe HPR GOLD fan 270 W 30°C
NOTE:GPU cards are not supported in 12 x 3.5-inch drive and rear drive configuration systems.
NOTE:All GPU cards require 1U T-type HSK and GPU shroud.
NOTE:T4 GPU card is not supported in Riser 2 slots.
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.

Other restrictions for air cooling configurations

  • Kioxia CM6/CD6 NVMeSSD are not supported on rear drive module.
  • Samsung 1733v2/1735v2 NVMeSSD are not supported on 12 x 3.5-inch rear drive module.
  • ICX XCC Platinum 8368Q 270W-38C CPU in air cooling system is not supported.
  • 25 Gb and above PCIe or OCP cards require high temperature (85°C) active optics cable.
  • Requires 2U-HPR HSK(8F34X) to support "ICX HCC Gold 6334 165W-8C CPU" in non-GPU configuration.
  • Requires HPR GOLD fan to support BOSS-S1 on 2.5-inch configuration and not supported on 3.5-inch configuration.

Thermal restriction for liquid cooling systems

Table 10. Thermal restriction matrix for liquid cooling systemsThe table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe 12 x 3.5-inch SAS/SATA
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives No Rear Drives No Rear Drives No Rear Drives
Memory 8 GB RDIMM STD fan¹ STD fan³ STD fan¹ STD fan² STD fan¹ STD fan¹ HPR SLVR fan²
16 GB RDIMM
32 GB RDIMM
64 GB RDIMM
128 GB LRDIMM STD fan¹ STD fan¹ HPR SLVR fan¹
256 GB LRDIMM HPR GOLD fan¹ Not supported Not supported
BPS + RDIMM or LRDIMM 8 GB RDIMM HPR GOLD fan¹ Not supported
16 GB RDIMM
32 GB RDIMM
64 GB RDIMM
128 GB LRDIMM
256 GB LRDIMM
GPU + ≤128 GB DIMM A100 (max 2) HPR SLVR fan¹ HPR GOLD fan¹ Not supported
T4 (max 6)
M10 (max 2)
A40 (max 2)
GPU + 256 GB LRDIMM A100 (max 2) HPR GOLD fan¹ Not supported
T4 (max 6) HPR GOLD fan4 Not supported
M10 (max 2) Not supported
A40 (max 2)
GPU + BPS + ≤128 GB DIMM A100 (max 2) HPR GOLD fan4 Not supported
T4 (max 6)
M10 (max 2)
A40 (max 2)
GPU + BPS + 256 GB LRDIMM A100 (max 2) HPR GOLD fan4 Not supported
T4 (max 6)
M10 (max 2)
A40 (max 2)
NOTE:¹ for ASHRAE A2 category (35°C), ² for ASHRAE A3 category (40°C), ³ for ASHRAE A4 (45°C) and 4 for ASHRAE A2 category with 30°C ambient temperature restriction.
NOTE:Liquid cooling is not supported on rear drive configurations.
NOTE:DIMM blank is not required for liquid cooling configurations.
NOTE:All the configuration are required to have six fans installed.
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.

Other restriction for liquid cooling configurations

  • 25 Gb and above PCIe or OCP cards require high temperature (85°C) active optics cable.

Shroud, heat sink, and riser cage restriction

Table 11. Restrictions with shroud, heat sink, and riser cageThe table describes restriction matrix:
PCIe card type Form factor Fan Processor heat sink Shroud Riser cage
GPU FL Configuration dependency T-type (1U-EXT) GPU shroud long
HL short
long
short
long
Non-GPU FL
HL 1U-STD or 2U-HPR STD shroud short

Thermal air restrictions

ASHRAE A3 environment for air cooling configuration

  • Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
  • PCIe SSD is not supported.
  • BPS, 128 GB or greater capacity DIMMs are not supported.
  • GPU and FPGA are not supported.
  • Processor TDP greater than 165 W are not supported.
  • HPR SLVR fans are required.
  • Front storage is not supported in 12x3.5-inch SAS configuration.
  • Rear drives are not supported.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • OCP 3.0 card is supported with 85°C active optic cable.
  • BOSS 1.5 card is supported.

ASHRAE A4 environment for air cooling configuration

  • Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
  • PCIe SSD is not supported.
  • BPS, 128 GB or greater capacity DIMMs are not supported.
  • GPU and FPGA are not supported.
  • Processor TDP greater than 120 W are not supported.
  • HPR SLVR fans are required.
  • Front storage is not supported in 12x3.5-inch SAS configuration.
  • Rear drives are not supported.
  • BOSS 1.5 is not supported.
  • OCP 3.0 card is supported with 85°C active optic cable and cards tier ≤4.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.

ASHRAE A3 environment for liquid cooling configuration

  • Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
  • PCIe SSD is not supported.
  • BPS, 128 GB or greater capacity DIMMs are not supported.
  • GPU and FPGA are not supported.
  • Rear drives are not supported.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • OCP 3.0 card is supported with 85°C active optic cable.
  • BOSS 1.5 card is supported.

ASHRAE A4 environment for liquid cooling configuration

  • Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
  • PCIe SSD is not supported.
  • BPS, 128 GB or greater capacity DIMMs are not supported.
  • GPU and FPGA are not supported.
  • Front storage is not supported in 12x3.5-inch SAS configuration.
  • Rear drives are not supported.
  • BOSS 1.5 is not supported.
  • OCP 3.0 card is supported with 85°C active optic cable and cards tier ≤4.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specificationsParticulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE:The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsGaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013.